TWI311792B - - Google Patents

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Publication number
TWI311792B
TWI311792B TW095130633A TW95130633A TWI311792B TW I311792 B TWI311792 B TW I311792B TW 095130633 A TW095130633 A TW 095130633A TW 95130633 A TW95130633 A TW 95130633A TW I311792 B TWI311792 B TW I311792B
Authority
TW
Taiwan
Prior art keywords
substrate
electronic component
mounting
support
electronic
Prior art date
Application number
TW095130633A
Other languages
English (en)
Chinese (zh)
Other versions
TW200715436A (en
Inventor
Keigou Hirose
Original Assignee
Shibaura Mechatronics Corporatio
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corporatio filed Critical Shibaura Mechatronics Corporatio
Publication of TW200715436A publication Critical patent/TW200715436A/zh
Application granted granted Critical
Publication of TWI311792B publication Critical patent/TWI311792B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/757—Means for aligning
    • H01L2224/75743—Suction holding means
    • H01L2224/75745—Suction holding means in the upper part of the bonding apparatus, e.g. in the bonding head
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/758—Means for moving parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/166—Alignment or registration; Control of registration

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Wire Bonding (AREA)
TW095130633A 2005-08-24 2006-08-21 Electronic component mounting device and method TW200715436A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005243085 2005-08-24

Publications (2)

Publication Number Publication Date
TW200715436A TW200715436A (en) 2007-04-16
TWI311792B true TWI311792B (enExample) 2009-07-01

Family

ID=37771443

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095130633A TW200715436A (en) 2005-08-24 2006-08-21 Electronic component mounting device and method

Country Status (5)

Country Link
JP (1) JP4664366B2 (enExample)
KR (1) KR101014292B1 (enExample)
CN (1) CN100596266C (enExample)
TW (1) TW200715436A (enExample)
WO (1) WO2007023692A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI642337B (zh) * 2016-08-16 2018-11-21 芝浦機械電子裝置股份有限公司 Electronic component mounting device

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4829813B2 (ja) * 2007-03-01 2011-12-07 芝浦メカトロニクス株式会社 電子部品の実装装置及び実装方法
KR101095189B1 (ko) * 2007-05-25 2011-12-16 시바우라 메카트로닉스 가부시끼가이샤 전자 부품의 실장 장치 및 실장 방법
JP4937857B2 (ja) * 2007-08-03 2012-05-23 芝浦メカトロニクス株式会社 電子部品の実装装置及び実装方法
JP4918015B2 (ja) * 2007-11-01 2012-04-18 パナソニック株式会社 部品実装方法
JP4852513B2 (ja) * 2007-11-01 2012-01-11 パナソニック株式会社 部品実装システム
US8319831B2 (en) * 2009-03-25 2012-11-27 Fuji Xerox Co., Ltd. Component manipulating method, component extracting method, component assembling method, component manipulating apparatus, component extracting apparatus, and component assembling apparatus
JP2011035028A (ja) * 2009-07-30 2011-02-17 Juki Corp 電子部品実装装置
KR101096460B1 (ko) 2010-10-01 2011-12-20 다래비젼주식회사 기판 부착물 부착장치를 이용한 기판 부착물 부착방법
DE102015106224B4 (de) * 2015-04-22 2022-09-01 Asm Assembly Systems Gmbh & Co. Kg Verfahren zum wiederholten Vermessen eines in einem Bestückbereich eines Bestückautomaten befindlichen Bauelementeträgers sowie Bestückautomat und Computerprogramm zur Durchführung dieses Verfahrens
WO2018150573A1 (ja) * 2017-02-20 2018-08-23 株式会社Ｆｕｊｉ 部品実装システムおよび部品実装方法
JP7285303B2 (ja) * 2017-09-28 2023-06-01 芝浦メカトロニクス株式会社 電子部品の実装装置と表示用部材の製造方法
TWI871033B (zh) * 2022-09-29 2025-01-21 日商芝浦機械電子裝置股份有限公司 安裝裝置及基板製造裝置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR0152879B1 (ko) * 1995-10-10 1998-12-15 이희종 표면실장기의 부품인식방법 및 장치
JP3618439B2 (ja) * 1996-01-29 2005-02-09 三星テクウィン株式会社 部品搭載装置
JPH10284891A (ja) * 1997-04-02 1998-10-23 Matsushita Electric Ind Co Ltd 部品実装方法及びその装置
JP2000277991A (ja) * 1999-03-25 2000-10-06 Shibaura Mechatronics Corp 部品実装装置およびその方法
JP4322092B2 (ja) * 2002-11-13 2009-08-26 富士機械製造株式会社 電子部品実装装置における校正方法および装置
JP3941767B2 (ja) * 2003-10-16 2007-07-04 松下電器産業株式会社 ワークの装着装置およびワークの装着方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI642337B (zh) * 2016-08-16 2018-11-21 芝浦機械電子裝置股份有限公司 Electronic component mounting device

Also Published As

Publication number Publication date
KR101014292B1 (ko) 2011-02-16
JP4664366B2 (ja) 2011-04-06
CN101223840A (zh) 2008-07-16
CN100596266C (zh) 2010-03-24
TW200715436A (en) 2007-04-16
WO2007023692A1 (ja) 2007-03-01
JPWO2007023692A1 (ja) 2009-02-26
KR20080046614A (ko) 2008-05-27

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