TW200715436A - Electronic component mounting device and method - Google Patents

Electronic component mounting device and method

Info

Publication number
TW200715436A
TW200715436A TW095130633A TW95130633A TW200715436A TW 200715436 A TW200715436 A TW 200715436A TW 095130633 A TW095130633 A TW 095130633A TW 95130633 A TW95130633 A TW 95130633A TW 200715436 A TW200715436 A TW 200715436A
Authority
TW
Taiwan
Prior art keywords
substrate
electronic component
side section
camera
holding
Prior art date
Application number
TW095130633A
Other languages
Chinese (zh)
Other versions
TWI311792B (en
Inventor
Keigou Hirose
Original Assignee
Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Publication of TW200715436A publication Critical patent/TW200715436A/en
Application granted granted Critical
Publication of TWI311792B publication Critical patent/TWI311792B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/757—Means for aligning
    • H01L2224/75743—Suction holding means
    • H01L2224/75745—Suction holding means in the upper part of the bonding apparatus, e.g. in the bonding head
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/758—Means for moving parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/166—Alignment or registration; Control of registration

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Wire Bonding (AREA)

Abstract

An electronic component mounting device has a holding table (12) for holding a substrate; X, Y, and θ Drive sources (14, 19, 20) for driving the holding table in horizontal directions; a mounting tool (5) for holding an electronic component (4) and mounting it on the upper surface of a side section of the substrate, a backup tool (22) provided so that it can be driven in the vertical direction and supporting the lower surface of the side section of the substrate when the electronic component is mounted on the upper surface of the side section of the substrate; a camera (24) for imaging the substrate and the electronic component before the electronic component is mounted on the substrate; and a control device (25) positionally aligning the substrate and the electronic component based on an image signal from the camera, causing the backup tool to be lifted to support the lower surface of the side section of the substrate, making the camera re-image the substrate in that state, and causing the substrate and the electronic component to be positionally re-aligned if there is a positional displacement between the substrate and the electronic component.
TW095130633A 2005-08-24 2006-08-21 Electronic component mounting device and method TW200715436A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005243085 2005-08-24

Publications (2)

Publication Number Publication Date
TW200715436A true TW200715436A (en) 2007-04-16
TWI311792B TWI311792B (en) 2009-07-01

Family

ID=37771443

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095130633A TW200715436A (en) 2005-08-24 2006-08-21 Electronic component mounting device and method

Country Status (5)

Country Link
JP (1) JP4664366B2 (en)
KR (1) KR101014292B1 (en)
CN (1) CN100596266C (en)
TW (1) TW200715436A (en)
WO (1) WO2007023692A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI404179B (en) * 2007-05-25 2013-08-01 Shibaura Mechatronics Corp Assembly device and assembling method of electronic parts
TWI665752B (en) * 2015-04-22 2019-07-11 德商先進裝配系統有限責任兩合公司 Wiederholtes vermessen eines in einem bestuckbereich eines bestuckautomaten befindlichen bauelementetragers

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4829813B2 (en) * 2007-03-01 2011-12-07 芝浦メカトロニクス株式会社 Electronic component mounting apparatus and mounting method
JP4937857B2 (en) * 2007-08-03 2012-05-23 芝浦メカトロニクス株式会社 Electronic component mounting apparatus and mounting method
JP4852513B2 (en) * 2007-11-01 2012-01-11 パナソニック株式会社 Component mounting system
JP4918015B2 (en) * 2007-11-01 2012-04-18 パナソニック株式会社 Component mounting method
US8319831B2 (en) * 2009-03-25 2012-11-27 Fuji Xerox Co., Ltd. Component manipulating method, component extracting method, component assembling method, component manipulating apparatus, component extracting apparatus, and component assembling apparatus
JP2011035028A (en) * 2009-07-30 2011-02-17 Juki Corp Electronic component-mounting apparatus
KR101096460B1 (en) 2010-10-01 2011-12-20 다래비젼주식회사 Substrate attachment attaching method using substrate attachment attaching apparatus
JP6675356B2 (en) * 2016-08-16 2020-04-01 芝浦メカトロニクス株式会社 Electronic component mounting equipment
US11477927B2 (en) * 2017-02-20 2022-10-18 Fuji Corporation Component mounting system and component mounting method
JP7285303B2 (en) * 2017-09-28 2023-06-01 芝浦メカトロニクス株式会社 Mounting equipment for electronic components and method for manufacturing display members

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10284891A (en) * 1997-04-02 1998-10-23 Matsushita Electric Ind Co Ltd Component mounter and mounting method
JP2000277991A (en) * 1999-03-25 2000-10-06 Shibaura Mechatronics Corp Apparatus and method for mounting component
JP3941767B2 (en) * 2003-10-16 2007-07-04 松下電器産業株式会社 Work mounting apparatus and work mounting method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI404179B (en) * 2007-05-25 2013-08-01 Shibaura Mechatronics Corp Assembly device and assembling method of electronic parts
TWI665752B (en) * 2015-04-22 2019-07-11 德商先進裝配系統有限責任兩合公司 Wiederholtes vermessen eines in einem bestuckbereich eines bestuckautomaten befindlichen bauelementetragers

Also Published As

Publication number Publication date
CN100596266C (en) 2010-03-24
JPWO2007023692A1 (en) 2009-02-26
KR101014292B1 (en) 2011-02-16
WO2007023692A1 (en) 2007-03-01
TWI311792B (en) 2009-07-01
JP4664366B2 (en) 2011-04-06
KR20080046614A (en) 2008-05-27
CN101223840A (en) 2008-07-16

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