JPWO2007023692A1 - Electronic component mounting apparatus and mounting method - Google Patents

Abstract

A holding table (12) for holding the substrate, X, Y and θ drive sources (14, 19, 20) for driving the holding table in the horizontal direction, and holding the electronic component (4) and placing the electronic component on the side of the substrate A mounting tool (5) to be mounted on the upper surface, a backup tool (22) which is provided so as to be driven in the vertical direction and supports the lower surface of the side portion of the substrate when mounting electronic components on the upper surface of the side portion of the substrate by the mounting tool An imaging camera (24) for imaging the board and the electronic component before mounting the electronic component on the board, and aligning the board and the electronic component based on the imaging signal from the imaging camera, and then raising the backup tool A control device (2) that supports the lower surface of the side portion, causes the image pickup camera to pick up an image again in that state, and realigns the substrate and the electronic component when the substrate and the electronic component are misaligned. ); And a.

Description

  The present invention relates to an electronic component mounting apparatus and mounting method for mounting an electronic component on a side surface of a substrate.

  For example, an electronic component such as a TCP (Tape Carrier Package) is pressure-bonded to a substrate such as a liquid crystal cell via an anisotropic conductive member as an adhesive material. The substrate is formed by adhering two glass plates at a predetermined interval via a sealant, enclosing liquid crystal between these glass plates, and attaching a polarizing plate to the outer surface of each glass plate. The And in the board | substrate of the said structure, on the upper surface (inner surface when bonded) of the side part of one glass plate which protruded outward from the side part of the other glass plate in the longitudinal direction of the side part The anisotropic conductive member having a double-sided adhesive property is adhered along a tape, and the electronic component is mounted through the anisotropic conductive member.

  When an electronic component is mounted on the upper surface of the side part of the substrate, the outer lead formed on the electronic component must be precisely aligned with the cell-side lead formed on the substrate. Recently, for example, the lead pattern has a width of 20 μm, and the interval between adjacent outer leads is about 50 μm, and the wiring pattern has been densified. In this case, it may be impossible to electrically connect the leads to each other.

  A mounting apparatus for mounting the electronic component on the board has a holding table for holding the board. The board protrudes outward from the side edge of the holding table to the side where the electronic component is mounted, and the electronic component held by the mounting tool is held in the state where the lower surface of the side is held by the backup tool. Mounting on the upper surface of the side portion of the substrate.

  Before mounting the electronic component on the substrate, a pair of alignment marks provided on the substrate and the electronic component are imaged by an imaging camera, and the substrate and the electronic component are aligned according to the imaging result. . When the substrate and the electronic component are aligned in the vertical direction, the lower side surface of the substrate is supported by the backup tool, and the mounting tool is lowered in this state to mount the electronic component on the substrate. I am doing so.

  By the way, the board and the electronic component are positioned on the basis of an imaging signal imaged by the imaging camera before the side lower surface of the board is supported by the backup tool. Before the electronic component is mounted on the upper surface of the side portion of the positioned substrate, the lower surface of the side portion is supported by the backup tool. At that time, the side of the substrate is pushed up by the backup tool.

  When the side portion of the substrate is pushed up by the backup tool, the side portion of the substrate may be displaced with respect to the electronic component before being pushed up. The positional deviation may be caused by the bending of the substrate, or when the substrate is held in a state where stress remains on the holding table, the state of stress may be changed by being pushed up.

  However, conventionally, before supporting the side of the board with the backup tool, the board and the electronic component are imaged by the imaging camera, and these are aligned based on the imaging signal, and then the lower side of the side of the board is backed up by the backup tool. If supported, the electronic component was mounted by the mounting tool.

  In other words, if the side of the board is supported by being pushed up and supported by the backup tool, even if the side of the board is misaligned with respect to the electronic component, the electronic component can be mounted without correcting the misalignment. Was. For this reason, the mounting accuracy of the electronic component is lowered, and there is a possibility that the lead between the substrate and the electronic component cannot be electrically connected reliably.

  The present invention provides a mounting apparatus and mounting method for an electronic component that enables mounting of an electronic component on a substrate by correcting the positional shift if a positional shift occurs by supporting the substrate with a backup tool. It is to provide.

The present invention is a mounting apparatus for mounting electronic components on the upper side surface of a substrate,
Holding means for holding the substrate;
Driving means for driving the holding means in the horizontal direction;
Mounting means for holding the electronic component and mounting the electronic component on the side surface of the substrate;
A backup tool provided so as to be driven in the vertical direction, and supporting the lower surface of the side portion of the substrate when the electronic component is mounted on the upper surface of the side portion of the substrate by the mounting means;
Imaging means for imaging these substrates and electronic components before mounting the electronic components on the substrate;
After aligning the board and the electronic component based on the imaging signal from the imaging means, the backup tool is raised to support the lower side surface of the board, and in that state, the board is imaged again by the imaging means. An electronic component mounting apparatus comprising: a control means for re-aligning the substrate and the electronic component when the substrate and the electronic component are misaligned.

This invention is a mounting method for mounting an electronic component on the side surface of the substrate,
A portion of the substrate on which the electronic component is mounted, a step of imaging the electronic component, a step of aligning the substrate and the electronic component based on the imaging,
Supporting the lower side surface of the positioned substrate with a backup tool;
Re-imaging the substrate supported by the backup tool and determining whether there is a misalignment between the substrate and the electronic component;
A step of re-aligning the substrate when there is a misalignment;
And mounting the electronic component on the side surface of the substrate supported by the backup tool when there is no displacement between the substrate and the electronic component. is there.

FIG. 1 is a schematic configuration diagram showing a mounting apparatus and a supply apparatus for supplying electronic components to the mounting apparatus according to an embodiment of the present invention. FIG. 2 is a side view showing the mounting apparatus. FIG. 3 is a side view showing a backup tool portion of the mounting apparatus. FIG. 4 is a perspective view showing alignment marks provided on the substrate and the electronic component. FIG. 5 is a block diagram of a control circuit for controlling the mounting apparatus. FIG. 6 is a flowchart showing a part of the process when the electronic component is mounted on the substrate. FIG. 7 is a flowchart showing a step subsequent to the step shown in FIG.

An embodiment of the present invention will be described below with reference to the drawings.
FIG. 1 shows an electronic component supply apparatus and a mounting apparatus for mounting an electronic component supplied from the supply apparatus on a substrate. The supply apparatus includes a component supply table 1. The component supply table 1 is provided with four mounting portions 2 (only three are shown) at intervals of 90 degrees in the circumferential direction, and is rotationally driven by a first drive source 3 by a predetermined angle, for example, 90 degrees. ing. An electronic component 4 such as TCP is supplied to each mounting unit 2 by a suction arm or the like (not shown).

  The electronic component 4 supplied and mounted on the mounting portion 2 of the component supply table 1 is delivered to the mounting tool 5 constituting the mounting apparatus. The mounting tool 5 is provided at intervals of 90 degrees in the circumferential direction of the index table 7 that is rotated 90 degrees by the second drive source 6. The mounting tool 5 includes a cylinder 8 and a suction head 11 attached to a rod 9 of the cylinder 8.

  The suction head 11 is positioned above the mounting portion 2 of the component supply table 1 by the rotational drive of the component supply table 1 and the index table 7 in synchronization. In this state, when the cylinder 8 is driven, the suction head 11 is lowered to suck and hold the electronic component 4 supplied and placed on the placement portion 2.

  The electronic component 4 sucked and held by the suction head 11 is mounted on the upper surface of the side portion of the substrate W such as a liquid crystal display panel. The substrate W is adsorbed and held on the upper surface of a holding table 12 as holding means with a side portion on which the electronic component 4 is mounted protruding outward from the side edge of the holding table 12.

  As shown in FIG. 2, the holding table 12 can be driven in the XY and θ directions. That is, the holding table 12 is provided on the X table 13 so that it can be driven by the X drive source 14 along the X direction indicated by the arrow. A pair of receiving members 13a are provided on the lower surface of the X table 13 along the Y direction orthogonal to the X direction. These receiving members 13a are supported on the base 15 so as to be movable along a pair of Y guides 16 provided along the Y direction.

  A female screw body 17 is provided on the lower surface of the X table 13, and a screw shaft 18 is screwed onto the female screw body 17. The screw shaft 18 is rotationally driven by a Y drive source 19. Thereby, the X table 13 is driven in the Y direction. Further, the portion of the holding table 12 that holds the substrate W is driven in the rotational direction on the horizontal plane by the θ drive source 20. Thereby, the holding table 12 can be driven in the X, Y and θ directions.

  A support 21 is erected on one end of the base 15 along the X direction. A backup tool 22 having the same width as that of the support 21 is provided at the upper end of the support 21. The backup tool 22 is driven in a vertical direction indicated by an arrow Z in FIGS. 1 to 3 by a Z drive source 23 such as a cylinder built in the support 21 shown in FIGS. . FIG. 3 shows a state where the backup tool 22 is lowered, and FIGS. 1 and 2 show a state where the backup tool 22 is raised.

  As shown in FIG. 3, a pair of imaging cameras 24 constituting imaging means are provided on both sides of the support 21 in the width direction. As shown in FIG. 4, the pair of imaging cameras 24 is provided on both sides of the pair of first alignment marks m1 provided on the electronic component 4 and the terminal portion 27 on which the electronic component 4 of the substrate W is mounted. The pair of second alignment marks m2 is imaged in the same field of view.

  That is, a pair of the first alignment marks m1 is formed on one side of the electronic component 4 at a predetermined interval, and a pair of the first alignment marks m1 is formed on the substrate W at the same interval. The second alignment mark m2 is formed.

  As shown in FIG. 5, the imaging signals of the pair of imaging cameras 24 are input to the control device 25. The control device 25 converts the signal from the imaging camera 24 into a digital signal, and the positions of the first alignment mark m1 of the pair of electronic components 4 and the second alignment mark m2 of the substrate W, respectively, based on the conversion. The amount of deviation is calculated.

  Based on the calculation, the X drive source 14, the Y drive source 19 and the θ drive source 20 are driven to drive the holding table 12 in the X, Y and θ directions, and the substrate W, the electronic component 4, and the like. Align. That is, the substrate W is aligned with the electronic component 4 held by the mounting tool 5.

  When the substrate W is aligned with the electronic component 4, the control device 25 drives the Z drive source 23 in the upward direction so that the lower surface of the end of the substrate W on which the electronic component 4 is mounted is moved by the backup tool 22. Support.

  As shown in FIG. 3, the width dimension of the backup tool 22 is set slightly smaller than the distance between the pair of first alignment marks m1 provided on the electronic component 4. That is, the width dimension of the electronic component 4 is larger than the width dimension of the backup tool 22. The width dimension of the mounting tool 5 is set to be substantially the same as the width dimension of the backup tool 22.

  Accordingly, the substrate W is positioned at the teaching position, and when the electronic component 4 held by the mounting tool 5 is positioned above the substrate W by the rotation of the index table 7, both sides of the support 21 in the width direction are positioned. The second alignment mark m2 of the substrate W positioned in the vertical direction and the first alignment mark m1 of the electronic component 4 can be imaged from below with the same visual field by the pair of imaging cameras 24 provided in the vertical direction. It has become.

Next, the operation when mounting the electronic component on the upper surface of the side portion of the substrate W by the mounting apparatus having the above configuration will be described with reference to the flowcharts shown in FIGS.
First, in step 1 (hereinafter, step is referred to as S), the substrate W is supplied to the holding table 12, and the substrate W is sucked and held on the holding table 12. In S2, the holding table 12 is driven to a previously taught position. Accordingly, the side portion on which the electronic component 4 of the substrate W is mounted is positioned above the backup tool 22. Next, in S3, the index table 7 is rotationally driven, and the mounting tool 5 holding the electronic component 4 by suction is positioned in the vicinity of the side portion of the substrate W.

  When the electronic component 4 and the substrate W are positioned at a preset teaching position, a pair of first and second alignment marks provided on the electronic component 4 and the substrate W by the pair of imaging cameras 24 in S4. m1 and m2 are respectively imaged. That is, each imaging camera 24 images the first and second alignment marks m1 and m2 that are located close to each other with a slight height difference in the same field of view.

  The imaging signal of the imaging camera 24 is input to the control device 25 and subjected to image processing. Thereby, in S5, the amount of displacement between the first alignment mark m1 and the second alignment mark m2 is calculated. That is, the amount of positional deviation between the electronic component 4 and the substrate W in the X, Y, and θ directions is calculated.

  Next, in S <b> 6, the holding table 12, that is, the substrate W is driven in the X, Y, and θ directions based on the displacement amount calculated by the control device 25, and the substrate W is aligned with the electronic component 4. When the substrate W is aligned with the electronic component 4, the backup tool 22 is driven in the upward direction by the Z drive source 23 in S7. Thereby, the lower surface of the part on which the electronic component 4 is mounted is pushed up and supported by the backup tool 22.

  When the side portion of the substrate W is supported by the backup tool 22, the second alignment mark m2 provided on the substrate W is imaged again by the pair of imaging cameras 24 in S8. That is, the coordinates of the second alignment mark m2 of the substrate W and the first alignment mark m1 of the electronic component 4 are calculated and compared in a state where the side portion of the substrate W is pushed up by the backup tool 22. . Next, in S9, it is determined whether or not a positional deviation has occurred between the substrate W and the electronic component 4 based on the calculated coordinates of the first and second alignment marks m1 and m2.

If there is no positional deviation between the electronic component 4 and the substrate W, the process proceeds to S10, and the mounting tool 5 is driven in the downward direction to mount the electronic component 4 held by suction on the substrate W.
If the electronic component 4 and the substrate W are misaligned by pushing up the substrate W by the backup tool 22, the process proceeds to S <b> 11 and the backup tool 22 is driven in the downward direction. Next, the substrate W is driven in the X, Y, and θ directions, and the position of the substrate W with respect to the electronic component 4 is corrected according to the amount of displacement obtained in S8. When the positional deviation of the substrate W is corrected, the process returns to S7 and the above-described operation is repeated.

  When aligning the substrate W again in S11, the backup tool 22 is lowered. Therefore, even if the substrate W is driven in the X, Y, and θ directions, the lower surface of the substrate W does not slide on the upper end surface of the backup tool, so that the alignment of the substrate W can be performed smoothly and reliably. Can do.

  As described above, when the electronic component 4 is mounted on the substrate W, the electronic component 4 and the substrate W are aligned based on the imaging result of the imaging camera 24, and the lower side surface of the substrate W is supported by the backup tool 22. Then, before the electronic component 4 is mounted on the substrate W, the substrate W is imaged again by the imaging camera 24. As a result, if the electronic component 4 and the substrate W are misaligned, the backup tool 22 is lowered to reposition the substrate W again.

  In other words, when the electronic component 4 is mounted on the substrate W, even if the position of the electronic component 4 is displaced by pushing up the substrate W with the backup tool 22 and the substrate W is deflected, the positional displacement is corrected. The electronic component 4 is mounted. For this reason, the electronic component 4 can be mounted on the substrate W with high positioning accuracy.

  In the above embodiment, if the electronic component and the substrate are imaged by the imaging camera after the side surface of the substrate is supported by the backup tool, the positioning correction of the substrate is repeatedly performed based on the imaging. However, the misalignment caused by supporting the substrate by the backup tool is normally corrected by one correction, and the misalignment hardly occurs when the substrate is then pushed up and supported by the backup tool.

  Therefore, when the substrate is supported by the backup tool, the positional deviation correction is performed only once, and when the substrate is supported by the backup tool for the second time, the electronic component is mounted on the substrate without detecting the positional deviation between the electronic component and the substrate. You may make it mount.

  When the electronic component and the substrate are misaligned, the alignment is performed after the backup tool is driven in the downward direction in S11. However, the alignment is performed without lowering the backup tool. There is no problem.

  If alignment is performed without lowering the backup tool, the positioned substrate will not be pushed up again by the backup tool, so that it is possible to eliminate the possibility that the substrate is displaced due to the pushing-up.

  Furthermore, if alignment is performed without lowering the backup tool, the position of the board and the electronic component in the X, Y, and θ directions is corrected, and then the backup tool is raised without performing the operation of moving the electronic component to the board. Therefore, the tact time required for mounting can be shortened.

  Further, the substrate is driven in the X, Y, and θ directions to perform alignment with the electronic component. However, a mounting tool that supplies the electronic component to the substrate is not provided in the index table, and the X, Y, and θ are not provided. As long as it can be driven in the direction, the position of the electronic component may be corrected without correcting the position of the substrate.

  If the electronic components are driven and aligned in the X, Y and θ directions instead of the substrate, it is possible to reduce the generation of inertial force and vibration compared to the case where the substrate is moved together with the holding table for alignment. Not only can the time required for alignment be shortened, but also the alignment accuracy and mounting accuracy can be improved, and further, the productivity can be improved by reducing the tact time.

  According to the present invention, when the substrate and the electronic component are aligned and the side portion of the substrate is supported by the backup tool, the substrate is imaged again to check whether there is a displacement, and there is a displacement. Therefore, the electronic component can be mounted on the substrate with high accuracy.

Claims (7)

A mounting device for mounting electronic components on the side surface of a substrate,
Holding means for holding the substrate;
Driving means for driving the holding means in the horizontal direction;
Mounting means for holding the electronic component and mounting the electronic component on the side surface of the substrate;
A backup tool provided so as to be driven in the vertical direction, and supporting the lower surface of the side portion of the substrate when the electronic component is mounted on the upper surface of the side portion of the substrate by the mounting means;
Imaging means for imaging these substrates and electronic components before mounting the electronic components on the substrate;
After aligning the board and the electronic component based on the imaging signal from the imaging means, the backup tool is raised to support the lower side surface of the board, and in that state, the board is imaged again by the imaging means. An electronic component mounting apparatus comprising: control means for re-aligning the substrate and the electronic component when the substrate and the electronic component are misaligned.   2. The electronic component according to claim 1, wherein the control unit lowers the backup tool and repositions the substrate and the electronic component when the substrate and the electronic component are misaligned. 3. Mounting device. The substrate is provided with a pair of first alignment marks at a predetermined interval at a position where the electronic component is mounted, and the electronic component has a pair of second alignment marks at an interval corresponding to the first alignment mark. An alignment mark is provided, and the backup tool is set to have a width dimension smaller than the interval between the pair of second alignment marks,
The imaging means is a pair of imaging cameras for imaging the first and second alignment marks at opposite positions and the other first and second alignment marks in the same field of view. The electronic component mounting apparatus according to claim 1.   The mounting means is a plurality of mounting heads provided at predetermined intervals in the circumferential direction of the index table, and the positioning of the board and the electronic component is performed by driving the board in the horizontal direction by the driving means. The electronic component mounting apparatus according to claim 1. A mounting method for mounting electronic components on a side surface of a substrate,
A portion of the substrate on which the electronic component is mounted, a step of imaging the electronic component, a step of aligning the substrate and the electronic component based on the imaging,
Supporting the bottom side surface of the aligned substrate with a backup tool;
Re-imaging the substrate supported by the backup tool and determining whether there is a misalignment between the substrate and the electronic component;
A step of re-aligning the substrate when there is a misalignment;
Mounting the electronic component on the side surface of the substrate supported by the backup tool when there is no positional deviation between the substrate and the electronic component.   6. The electronic component mounting method according to claim 5, wherein when the substrate is aligned again, the backup tool is lowered.   The substrate is provided with a pair of first alignment marks, and the electronic component is provided with a pair of second alignment marks. The first alignment mark and the second alignment mark are 5. The electronic component mounting method according to claim 4, wherein imaging is performed in the same field of view.

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