KR101014292B1 - 전자 부품의 실장 장치 및 실장 방법 - Google Patents

전자 부품의 실장 장치 및 실장 방법 Download PDF

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Publication number
KR101014292B1
KR101014292B1 KR1020077030773A KR20077030773A KR101014292B1 KR 101014292 B1 KR101014292 B1 KR 101014292B1 KR 1020077030773 A KR1020077030773 A KR 1020077030773A KR 20077030773 A KR20077030773 A KR 20077030773A KR 101014292 B1 KR101014292 B1 KR 101014292B1
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KR
South Korea
Prior art keywords
substrate
electronic component
mounting
imaging
backup tool
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KR1020077030773A
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English (en)
Korean (ko)
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KR20080046614A (ko
Inventor
게이고 히로세
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시바우라 메카트로닉스 가부시키가이샤
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Publication of KR20080046614A publication Critical patent/KR20080046614A/ko
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Publication of KR101014292B1 publication Critical patent/KR101014292B1/ko
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/757—Means for aligning
    • H01L2224/75743—Suction holding means
    • H01L2224/75745—Suction holding means in the upper part of the bonding apparatus, e.g. in the bonding head
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/758—Means for moving parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/166—Alignment or registration; Control of registration

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Wire Bonding (AREA)
KR1020077030773A 2005-08-24 2006-08-10 전자 부품의 실장 장치 및 실장 방법 Active KR101014292B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005243085 2005-08-24
JPJP-P-2005-00243085 2005-08-24

Publications (2)

Publication Number Publication Date
KR20080046614A KR20080046614A (ko) 2008-05-27
KR101014292B1 true KR101014292B1 (ko) 2011-02-16

Family

ID=37771443

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020077030773A Active KR101014292B1 (ko) 2005-08-24 2006-08-10 전자 부품의 실장 장치 및 실장 방법

Country Status (5)

Country Link
JP (1) JP4664366B2 (enExample)
KR (1) KR101014292B1 (enExample)
CN (1) CN100596266C (enExample)
TW (1) TW200715436A (enExample)
WO (1) WO2007023692A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101096460B1 (ko) 2010-10-01 2011-12-20 다래비젼주식회사 기판 부착물 부착장치를 이용한 기판 부착물 부착방법

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4829813B2 (ja) * 2007-03-01 2011-12-07 芝浦メカトロニクス株式会社 電子部品の実装装置及び実装方法
KR101095189B1 (ko) * 2007-05-25 2011-12-16 시바우라 메카트로닉스 가부시끼가이샤 전자 부품의 실장 장치 및 실장 방법
JP4937857B2 (ja) * 2007-08-03 2012-05-23 芝浦メカトロニクス株式会社 電子部品の実装装置及び実装方法
JP4918015B2 (ja) * 2007-11-01 2012-04-18 パナソニック株式会社 部品実装方法
JP4852513B2 (ja) * 2007-11-01 2012-01-11 パナソニック株式会社 部品実装システム
US8319831B2 (en) * 2009-03-25 2012-11-27 Fuji Xerox Co., Ltd. Component manipulating method, component extracting method, component assembling method, component manipulating apparatus, component extracting apparatus, and component assembling apparatus
JP2011035028A (ja) * 2009-07-30 2011-02-17 Juki Corp 電子部品実装装置
DE102015106224B4 (de) * 2015-04-22 2022-09-01 Asm Assembly Systems Gmbh & Co. Kg Verfahren zum wiederholten Vermessen eines in einem Bestückbereich eines Bestückautomaten befindlichen Bauelementeträgers sowie Bestückautomat und Computerprogramm zur Durchführung dieses Verfahrens
JP6675356B2 (ja) * 2016-08-16 2020-04-01 芝浦メカトロニクス株式会社 電子部品実装装置
WO2018150573A1 (ja) * 2017-02-20 2018-08-23 株式会社Ｆｕｊｉ 部品実装システムおよび部品実装方法
JP7285303B2 (ja) * 2017-09-28 2023-06-01 芝浦メカトロニクス株式会社 電子部品の実装装置と表示用部材の製造方法
TWI871033B (zh) * 2022-09-29 2025-01-21 日商芝浦機械電子裝置股份有限公司 安裝裝置及基板製造裝置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000277991A (ja) * 1999-03-25 2000-10-06 Shibaura Mechatronics Corp 部品実装装置およびその方法
JP2005123372A (ja) * 2003-10-16 2005-05-12 Matsushita Electric Ind Co Ltd ワークの装着装置およびワークの装着方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR0152879B1 (ko) * 1995-10-10 1998-12-15 이희종 표면실장기의 부품인식방법 및 장치
JP3618439B2 (ja) * 1996-01-29 2005-02-09 三星テクウィン株式会社 部品搭載装置
JPH10284891A (ja) * 1997-04-02 1998-10-23 Matsushita Electric Ind Co Ltd 部品実装方法及びその装置
JP4322092B2 (ja) * 2002-11-13 2009-08-26 富士機械製造株式会社 電子部品実装装置における校正方法および装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000277991A (ja) * 1999-03-25 2000-10-06 Shibaura Mechatronics Corp 部品実装装置およびその方法
JP2005123372A (ja) * 2003-10-16 2005-05-12 Matsushita Electric Ind Co Ltd ワークの装着装置およびワークの装着方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101096460B1 (ko) 2010-10-01 2011-12-20 다래비젼주식회사 기판 부착물 부착장치를 이용한 기판 부착물 부착방법

Also Published As

Publication number Publication date
JP4664366B2 (ja) 2011-04-06
CN101223840A (zh) 2008-07-16
CN100596266C (zh) 2010-03-24
TW200715436A (en) 2007-04-16
WO2007023692A1 (ja) 2007-03-01
JPWO2007023692A1 (ja) 2009-02-26
KR20080046614A (ko) 2008-05-27
TWI311792B (enExample) 2009-07-01

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