CN100588648C - 硫醇化合物和使用该硫醇化合物的光敏组合物 - Google Patents

硫醇化合物和使用该硫醇化合物的光敏组合物 Download PDF

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Publication number
CN100588648C
CN100588648C CN200580036422A CN200580036422A CN100588648C CN 100588648 C CN100588648 C CN 100588648C CN 200580036422 A CN200580036422 A CN 200580036422A CN 200580036422 A CN200580036422 A CN 200580036422A CN 100588648 C CN100588648 C CN 100588648C
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CN
China
Prior art keywords
meth
acrylate
group
black matrix
compound
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Expired - Fee Related
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CN200580036422A
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English (en)
Chinese (zh)
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CN101048373A (zh
Inventor
镰田博稔
大西美奈
室伏克己
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Resonac Holdings Corp
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Showa Denko KK
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    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C323/00—Thiols, sulfides, hydropolysulfides or polysulfides substituted by halogen, oxygen or nitrogen atoms, or by sulfur atoms not being part of thio groups
    • C07C323/50—Thiols, sulfides, hydropolysulfides or polysulfides substituted by halogen, oxygen or nitrogen atoms, or by sulfur atoms not being part of thio groups containing thio groups and carboxyl groups bound to the same carbon skeleton
    • C07C323/51—Thiols, sulfides, hydropolysulfides or polysulfides substituted by halogen, oxygen or nitrogen atoms, or by sulfur atoms not being part of thio groups containing thio groups and carboxyl groups bound to the same carbon skeleton having the sulfur atoms of the thio groups bound to acyclic carbon atoms of the carbon skeleton
    • C07C323/52—Thiols, sulfides, hydropolysulfides or polysulfides substituted by halogen, oxygen or nitrogen atoms, or by sulfur atoms not being part of thio groups containing thio groups and carboxyl groups bound to the same carbon skeleton having the sulfur atoms of the thio groups bound to acyclic carbon atoms of the carbon skeleton the carbon skeleton being acyclic and saturated
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
    • G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C2603/00—Systems containing at least three condensed rings
    • C07C2603/02—Ortho- or ortho- and peri-condensed systems
    • C07C2603/04—Ortho- or ortho- and peri-condensed systems containing three rings
    • C07C2603/06—Ortho- or ortho- and peri-condensed systems containing three rings containing at least one ring with less than six ring members
    • C07C2603/10—Ortho- or ortho- and peri-condensed systems containing three rings containing at least one ring with less than six ring members containing five-membered rings
    • C07C2603/12—Ortho- or ortho- and peri-condensed systems containing three rings containing at least one ring with less than six ring members containing five-membered rings only one five-membered ring
    • C07C2603/18—Fluorenes; Hydrogenated fluorenes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0076—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the composition of the mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions

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  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials For Photolithography (AREA)
  • Non-Silver Salt Photosensitive Materials And Non-Silver Salt Photography (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Indole Compounds (AREA)
CN200580036422A 2004-10-26 2005-10-25 硫醇化合物和使用该硫醇化合物的光敏组合物 Expired - Fee Related CN100588648C (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2004311276 2004-10-26
JP311276/2004 2004-10-26
JP2004311234 2004-10-26
JP311234/2004 2004-10-26

Publications (2)

Publication Number Publication Date
CN101048373A CN101048373A (zh) 2007-10-03
CN100588648C true CN100588648C (zh) 2010-02-10

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CN200580036422A Expired - Fee Related CN100588648C (zh) 2004-10-26 2005-10-25 硫醇化合物和使用该硫醇化合物的光敏组合物

Country Status (8)

Country Link
US (2) US7622613B2 (enExample)
EP (1) EP1805137B1 (enExample)
KR (1) KR101225525B1 (enExample)
CN (1) CN100588648C (enExample)
AT (1) ATE390410T1 (enExample)
DE (1) DE602005005710T2 (enExample)
TW (1) TW200631930A (enExample)
WO (1) WO2006046736A1 (enExample)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5043516B2 (ja) * 2007-06-04 2012-10-10 太陽ホールディングス株式会社 光硬化性・熱硬化性樹脂組成物及びそれを用いて得られるプリント配線
JP5173528B2 (ja) 2008-03-28 2013-04-03 富士フイルム株式会社 感光性樹脂組成物、遮光性カラーフィルター及びその製造方法、並びに、固体撮像素子
JP5528677B2 (ja) * 2008-03-31 2014-06-25 富士フイルム株式会社 重合性組成物、固体撮像素子用遮光性カラーフィルタ、固体撮像素子および固体撮像素子用遮光性カラーフィルタの製造方法
KR20110138263A (ko) * 2009-03-30 2011-12-26 바스프 에스이 중합성 조성물
SG179379A1 (en) * 2010-09-21 2012-04-27 Rohm & Haas Elect Mat Improved method of stripping hot melt etch resists from semiconductors
JP5674399B2 (ja) * 2010-09-22 2015-02-25 富士フイルム株式会社 重合性組成物、感光層、永久パターン、ウエハレベルレンズ、固体撮像素子、及び、パターン形成方法
WO2013084282A1 (ja) 2011-12-05 2013-06-13 日立化成株式会社 樹脂硬化膜パターンの形成方法、感光性樹脂組成物及び感光性エレメント
WO2013084283A1 (ja) 2011-12-05 2013-06-13 日立化成株式会社 タッチパネル用電極の保護膜の形成方法、感光性樹脂組成物及び感光性エレメント
JP6417669B2 (ja) * 2013-03-05 2018-11-07 東レ株式会社 感光性樹脂組成物、保護膜及び絶縁膜並びにタッチパネルの製造方法
CN104031459B (zh) * 2014-06-09 2016-05-11 京东方科技集团股份有限公司 一种Cu2Zn0.14Sn0.25Te2.34纳米晶溶液及制备方法、光敏树脂溶液、黑矩阵的制备方法、彩膜基板
US9618841B2 (en) * 2014-06-09 2017-04-11 Boe Technology Group Co., Ltd. Cu2Zn0.14Sn0.25Te2.34 nanocrystalline solution, its preparation method, photosensitive resin solution, method for forming black matrix, and color filter substrate
EP3194498B1 (en) 2014-08-14 2020-05-27 Hrl Laboratories, Llc Microlattice structures including flame retardant materials and compositions and methods for forming the same
CN108027561B (zh) 2015-09-30 2021-10-08 东丽株式会社 负型感光性树脂组合物、固化膜、具备固化膜的元件及显示装置、以及其制造方法
JP6889151B2 (ja) * 2016-03-31 2021-06-18 株式会社Adeka 感光性組成物及び新規化合物
WO2020238862A1 (zh) * 2019-05-30 2020-12-03 常州强力先端电子材料有限公司 芴类引发剂、包含其的光固化组合物及应用
TWI779259B (zh) * 2020-01-20 2022-10-01 新應材股份有限公司 樹脂組成物以及濾光元件
US12163086B2 (en) * 2021-05-25 2024-12-10 Samsung Electro-Mechanics Co., Ltd. Dispersant and composition
CN117447652A (zh) * 2023-05-15 2024-01-26 深圳市华星光电半导体显示技术有限公司 光学薄膜材料、光学薄膜的制备方法及显示面板

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0987567A1 (en) * 1998-09-08 2000-03-22 Mitsui Chemicals, Inc. A sulfur-containing (thio)ether (co)polymer and a use thereof
EP1057808A2 (en) * 1999-06-01 2000-12-06 Mitsui Chemicals, Inc. Sulfur-containing unsaturated carboxylate compound and its use

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JPH0859775A (ja) * 1994-08-19 1996-03-05 Kyoeisha Chem Co Ltd メルカプト化合物、メルカプト化合物とイソシアネート化合物からなる硫黄含有ウレタン樹脂、および高屈折率プラスチックレンズ
JP3882254B2 (ja) 1997-03-12 2007-02-14 三菱化学株式会社 カラーフィルター用光重合性組成物及びカラーフィルター
JP3641895B2 (ja) 1997-03-12 2005-04-27 三菱化学株式会社 カラーフィルター用光重合性組成物及びカラーフィルター
JP3641894B2 (ja) 1997-03-12 2005-04-27 三菱化学株式会社 カラーフィルター用黒色光重合性組成物
AUPP155998A0 (en) * 1998-01-29 1998-02-19 Sola International Holdings Ltd Coating composition
JP2000249822A (ja) 1999-02-26 2000-09-14 Showa Denko Kk カラーフィルタ用光重合開始剤、感光性着色組成物およびカラーフィルタ
JP4218828B2 (ja) 2002-02-28 2009-02-04 昭和電工株式会社 チオール化合物、光重合開始剤組成物および感光性組成物
JP2004198717A (ja) * 2002-12-18 2004-07-15 Showa Denko Kk カラーフィルターブラックマトリックスレジスト組成物及びその組成物に用いるカーボンブラック分散液組成物

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0987567A1 (en) * 1998-09-08 2000-03-22 Mitsui Chemicals, Inc. A sulfur-containing (thio)ether (co)polymer and a use thereof
EP1057808A2 (en) * 1999-06-01 2000-12-06 Mitsui Chemicals, Inc. Sulfur-containing unsaturated carboxylate compound and its use

Non-Patent Citations (1)

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Title
Synthesis of fluorenebisphenoxy Derivatives byAcid-sulfurCompound Catalyzed. Mitsuaki Yamada , et al.Chemistry Letters,Vol.10 . 1998 *

Also Published As

Publication number Publication date
KR101225525B1 (ko) 2013-01-23
CN101048373A (zh) 2007-10-03
KR20070073788A (ko) 2007-07-10
DE602005005710T2 (de) 2009-04-16
US7714032B2 (en) 2010-05-11
TWI350794B (enExample) 2011-10-21
EP1805137A1 (en) 2007-07-11
US20080286690A1 (en) 2008-11-20
EP1805137B1 (en) 2008-03-26
TW200631930A (en) 2006-09-16
DE602005005710D1 (de) 2008-05-08
US7622613B2 (en) 2009-11-24
WO2006046736A1 (en) 2006-05-04
ATE390410T1 (de) 2008-04-15
US20080139688A1 (en) 2008-06-12

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