TW200631930A - Thiol compound and photosensitive composition using the compound - Google Patents

Thiol compound and photosensitive composition using the compound

Info

Publication number
TW200631930A
TW200631930A TW094137311A TW94137311A TW200631930A TW 200631930 A TW200631930 A TW 200631930A TW 094137311 A TW094137311 A TW 094137311A TW 94137311 A TW94137311 A TW 94137311A TW 200631930 A TW200631930 A TW 200631930A
Authority
TW
Taiwan
Prior art keywords
compound
photosensitive composition
thiol
thiol compound
represented
Prior art date
Application number
TW094137311A
Other languages
English (en)
Other versions
TWI350794B (zh
Inventor
Hirotoshi Kamata
Mina Onishi
Katsumi Murofushi
Original Assignee
Showa Denko Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko Kk filed Critical Showa Denko Kk
Publication of TW200631930A publication Critical patent/TW200631930A/zh
Application granted granted Critical
Publication of TWI350794B publication Critical patent/TWI350794B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C323/00—Thiols, sulfides, hydropolysulfides or polysulfides substituted by halogen, oxygen or nitrogen atoms, or by sulfur atoms not being part of thio groups
    • C07C323/50—Thiols, sulfides, hydropolysulfides or polysulfides substituted by halogen, oxygen or nitrogen atoms, or by sulfur atoms not being part of thio groups containing thio groups and carboxyl groups bound to the same carbon skeleton
    • C07C323/51—Thiols, sulfides, hydropolysulfides or polysulfides substituted by halogen, oxygen or nitrogen atoms, or by sulfur atoms not being part of thio groups containing thio groups and carboxyl groups bound to the same carbon skeleton having the sulfur atoms of the thio groups bound to acyclic carbon atoms of the carbon skeleton
    • C07C323/52—Thiols, sulfides, hydropolysulfides or polysulfides substituted by halogen, oxygen or nitrogen atoms, or by sulfur atoms not being part of thio groups containing thio groups and carboxyl groups bound to the same carbon skeleton having the sulfur atoms of the thio groups bound to acyclic carbon atoms of the carbon skeleton the carbon skeleton being acyclic and saturated
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
    • G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C2603/00—Systems containing at least three condensed rings
    • C07C2603/02—Ortho- or ortho- and peri-condensed systems
    • C07C2603/04—Ortho- or ortho- and peri-condensed systems containing three rings
    • C07C2603/06—Ortho- or ortho- and peri-condensed systems containing three rings containing at least one ring with less than six ring members
    • C07C2603/10—Ortho- or ortho- and peri-condensed systems containing three rings containing at least one ring with less than six ring members containing five-membered rings
    • C07C2603/12—Ortho- or ortho- and peri-condensed systems containing three rings containing at least one ring with less than six ring members containing five-membered rings only one five-membered ring
    • C07C2603/18—Fluorenes; Hydrogenated fluorenes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0076—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the composition of the mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials For Photolithography (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Non-Silver Salt Photosensitive Materials And Non-Silver Salt Photography (AREA)
  • Indole Compounds (AREA)
TW094137311A 2004-10-26 2005-10-25 Thiol compound and photosensitive composition using the compound TW200631930A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004311276 2004-10-26
JP2004311234 2004-10-26

Publications (2)

Publication Number Publication Date
TW200631930A true TW200631930A (en) 2006-09-16
TWI350794B TWI350794B (zh) 2011-10-21

Family

ID=38121350

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094137311A TW200631930A (en) 2004-10-26 2005-10-25 Thiol compound and photosensitive composition using the compound

Country Status (8)

Country Link
US (2) US7622613B2 (zh)
EP (1) EP1805137B1 (zh)
KR (1) KR101225525B1 (zh)
CN (1) CN100588648C (zh)
AT (1) ATE390410T1 (zh)
DE (1) DE602005005710T2 (zh)
TW (1) TW200631930A (zh)
WO (1) WO2006046736A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI779259B (zh) * 2020-01-20 2022-10-01 新應材股份有限公司 樹脂組成物以及濾光元件

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5043516B2 (ja) * 2007-06-04 2012-10-10 太陽ホールディングス株式会社 光硬化性・熱硬化性樹脂組成物及びそれを用いて得られるプリント配線
JP5173528B2 (ja) 2008-03-28 2013-04-03 富士フイルム株式会社 感光性樹脂組成物、遮光性カラーフィルター及びその製造方法、並びに、固体撮像素子
JP5528677B2 (ja) * 2008-03-31 2014-06-25 富士フイルム株式会社 重合性組成物、固体撮像素子用遮光性カラーフィルタ、固体撮像素子および固体撮像素子用遮光性カラーフィルタの製造方法
EP2414324A1 (en) * 2009-03-30 2012-02-08 Basf Se Polymerizable compositions
SG179379A1 (en) * 2010-09-21 2012-04-27 Rohm & Haas Elect Mat Improved method of stripping hot melt etch resists from semiconductors
JP5674399B2 (ja) * 2010-09-22 2015-02-25 富士フイルム株式会社 重合性組成物、感光層、永久パターン、ウエハレベルレンズ、固体撮像素子、及び、パターン形成方法
WO2013084283A1 (ja) 2011-12-05 2013-06-13 日立化成株式会社 タッチパネル用電極の保護膜の形成方法、感光性樹脂組成物及び感光性エレメント
WO2013084282A1 (ja) 2011-12-05 2013-06-13 日立化成株式会社 樹脂硬化膜パターンの形成方法、感光性樹脂組成物及び感光性エレメント
JP6417669B2 (ja) * 2013-03-05 2018-11-07 東レ株式会社 感光性樹脂組成物、保護膜及び絶縁膜並びにタッチパネルの製造方法
CN104031459B (zh) * 2014-06-09 2016-05-11 京东方科技集团股份有限公司 一种Cu2Zn0.14Sn0.25Te2.34纳米晶溶液及制备方法、光敏树脂溶液、黑矩阵的制备方法、彩膜基板
US9618841B2 (en) * 2014-06-09 2017-04-11 Boe Technology Group Co., Ltd. Cu2Zn0.14Sn0.25Te2.34 nanocrystalline solution, its preparation method, photosensitive resin solution, method for forming black matrix, and color filter substrate
WO2016025774A1 (en) * 2014-08-14 2016-02-18 Hrl Laboratories, Llc Microlattice structures including flame retardant materials and compositions and methods for forming the same
US10802401B2 (en) 2015-09-30 2020-10-13 Toray Industries, Inc. Negative-type photosensitive resin composition, cured film, element and display apparatus that include cured film, production method for the same
WO2017170182A1 (ja) * 2016-03-31 2017-10-05 株式会社Adeka 感光性組成物及び新規化合物
WO2020238862A1 (zh) * 2019-05-30 2020-12-03 常州强力先端电子材料有限公司 芴类引发剂、包含其的光固化组合物及应用
US20220403247A1 (en) * 2021-05-25 2022-12-22 Samsung Electro-Mechanics Co., Ltd. Dispersant and composition

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JPH0859775A (ja) * 1994-08-19 1996-03-05 Kyoeisha Chem Co Ltd メルカプト化合物、メルカプト化合物とイソシアネート化合物からなる硫黄含有ウレタン樹脂、および高屈折率プラスチックレンズ
JP3641894B2 (ja) 1997-03-12 2005-04-27 三菱化学株式会社 カラーフィルター用黒色光重合性組成物
JP3641895B2 (ja) 1997-03-12 2005-04-27 三菱化学株式会社 カラーフィルター用光重合性組成物及びカラーフィルター
JP3882254B2 (ja) 1997-03-12 2007-02-14 三菱化学株式会社 カラーフィルター用光重合性組成物及びカラーフィルター
AUPP155998A0 (en) * 1998-01-29 1998-02-19 Sola International Holdings Ltd Coating composition
US6320020B1 (en) * 1998-09-08 2001-11-20 Mitsui Chemicals, Inc. Sulfur-containing (thio)ether (co)polymer and a use thereof
JP2000249822A (ja) 1999-02-26 2000-09-14 Showa Denko Kk カラーフィルタ用光重合開始剤、感光性着色組成物およびカラーフィルタ
US6458908B1 (en) 1999-06-01 2002-10-01 Mitsui Chemicals, Inc. Sulfur-containing unsaturated carboxylate compound and its cured products
JP4218828B2 (ja) 2002-02-28 2009-02-04 昭和電工株式会社 チオール化合物、光重合開始剤組成物および感光性組成物
JP2004198717A (ja) * 2002-12-18 2004-07-15 Showa Denko Kk カラーフィルターブラックマトリックスレジスト組成物及びその組成物に用いるカーボンブラック分散液組成物

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI779259B (zh) * 2020-01-20 2022-10-01 新應材股份有限公司 樹脂組成物以及濾光元件
US11999868B2 (en) 2020-01-20 2024-06-04 Echem Solutions Corp. Resin composition and filter element

Also Published As

Publication number Publication date
US7714032B2 (en) 2010-05-11
EP1805137B1 (en) 2008-03-26
US7622613B2 (en) 2009-11-24
TWI350794B (zh) 2011-10-21
ATE390410T1 (de) 2008-04-15
KR101225525B1 (ko) 2013-01-23
DE602005005710D1 (de) 2008-05-08
WO2006046736A1 (en) 2006-05-04
DE602005005710T2 (de) 2009-04-16
EP1805137A1 (en) 2007-07-11
CN101048373A (zh) 2007-10-03
CN100588648C (zh) 2010-02-10
US20080286690A1 (en) 2008-11-20
US20080139688A1 (en) 2008-06-12
KR20070073788A (ko) 2007-07-10

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees