CN100586633C - 激光加工装置 - Google Patents

激光加工装置 Download PDF

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Publication number
CN100586633C
CN100586633C CN200410008634A CN200410008634A CN100586633C CN 100586633 C CN100586633 C CN 100586633C CN 200410008634 A CN200410008634 A CN 200410008634A CN 200410008634 A CN200410008634 A CN 200410008634A CN 100586633 C CN100586633 C CN 100586633C
Authority
CN
China
Prior art keywords
light
laser
light beam
mentioned
combination mechanism
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN200410008634A
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English (en)
Chinese (zh)
Other versions
CN1530200A (zh
Inventor
森贞雄
菅原弘之
青山博志
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Via Mechanics Ltd
Original Assignee
Hitachi Via Mechanics Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Via Mechanics Ltd filed Critical Hitachi Via Mechanics Ltd
Publication of CN1530200A publication Critical patent/CN1530200A/zh
Application granted granted Critical
Publication of CN100586633C publication Critical patent/CN100586633C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0613—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams having a common axis
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass
    • B23K37/04—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work
    • B23K37/0408—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work for planar work
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laser Beam Processing (AREA)
  • Mechanical Optical Scanning Systems (AREA)
CN200410008634A 2003-03-14 2004-03-12 激光加工装置 Expired - Fee Related CN100586633C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003070256A JP4662411B2 (ja) 2003-03-14 2003-03-14 レーザ加工装置
JP2003070256 2003-03-14

Publications (2)

Publication Number Publication Date
CN1530200A CN1530200A (zh) 2004-09-22
CN100586633C true CN100586633C (zh) 2010-02-03

Family

ID=33287051

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200410008634A Expired - Fee Related CN100586633C (zh) 2003-03-14 2004-03-12 激光加工装置

Country Status (5)

Country Link
US (1) US7521650B2 (enExample)
JP (1) JP4662411B2 (enExample)
KR (1) KR101091748B1 (enExample)
CN (1) CN100586633C (enExample)
TW (1) TW200422131A (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI382795B (zh) * 2005-03-04 2013-01-11 Hitachi Via Mechanics Ltd A method of opening a printed circuit board and an opening device for a printed circuit board
KR20080079828A (ko) * 2007-02-28 2008-09-02 주식회사 이오테크닉스 레이저 가공 장치 및 방법
KR100817825B1 (ko) * 2007-05-02 2008-03-31 주식회사 이오테크닉스 레이저 가공장치
TWI395630B (zh) * 2009-06-30 2013-05-11 Mitsuboshi Diamond Ind Co Ltd 使用雷射光之玻璃基板加工裝置
JP6457472B2 (ja) * 2016-12-14 2019-01-23 ファナック株式会社 制御システム及び機械学習装置
DE112018006546T5 (de) * 2017-12-20 2020-08-27 Sony Corporation Laservorrichtung und laserverarbeitungsverfahren

Family Cites Families (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5833803A (ja) 1981-08-21 1983-02-28 日本電気株式会社 高速レ−ザトリミング装置
JPS61207088A (ja) * 1985-03-12 1986-09-13 Nippon Hoso Kyokai <Nhk> レ−ザ出力合成装置
JPS6286839A (ja) * 1985-10-14 1987-04-21 Nec Corp トリミング装置
EP0266203B1 (en) * 1986-10-30 1994-07-06 Canon Kabushiki Kaisha An illumination device
US4787747A (en) * 1987-11-13 1988-11-29 Zygo Corporation Straightness of travel interferometer
JPH01289586A (ja) * 1988-05-13 1989-11-21 Nec Corp レーザートリミング装置
JPH03184687A (ja) * 1989-12-15 1991-08-12 Mitsubishi Electric Corp レーザ加工装置
DE4035266C2 (de) * 1990-11-02 1995-11-16 Jenoptik Jena Gmbh Verfahren und Anordnung zur Thermowellenanalyse
JPH05327100A (ja) * 1992-05-26 1993-12-10 Hoya Corp 固体レーザ装置
JP2588281Y2 (ja) * 1992-11-25 1999-01-06 株式会社小松製作所 レーザマーキング装置
US5521628A (en) * 1993-08-30 1996-05-28 Lumonics Corporation Laser system for simultaneously marking multiple parts
US5453814A (en) * 1994-04-13 1995-09-26 Nikon Precision Inc. Illumination source and method for microlithography
JP3150850B2 (ja) * 1994-07-08 2001-03-26 シャープ株式会社 光磁気ディスク原盤の製造方法
US5689367A (en) * 1995-10-13 1997-11-18 E-Tek Dynamics, Inc. Polarization beam splitter
US5825043A (en) * 1996-10-07 1998-10-20 Nikon Precision Inc. Focusing and tilting adjustment system for lithography aligner, manufacturing apparatus or inspection apparatus
US5822211A (en) * 1996-11-13 1998-10-13 International Business Machines Corporation Laser texturing apparatus with dual laser paths having an independently adjusted parameter
JP3063688B2 (ja) * 1997-07-30 2000-07-12 日本電気株式会社 レーザ加工装置及びその制御方法並びにその制御プログラムを記録した記録媒体
JP3642930B2 (ja) * 1997-08-25 2005-04-27 松下電器産業株式会社 複数軸レーザ加工方法およびその装置
JP3194250B2 (ja) 1998-12-25 2001-07-30 住友重機械工業株式会社 ２軸レーザ加工機
US6535535B1 (en) * 1999-02-12 2003-03-18 Semiconductor Energy Laboratory Co., Ltd. Laser irradiation method, laser irradiation apparatus, and semiconductor device
JP3622557B2 (ja) 1999-02-23 2005-02-23 セイコーエプソン株式会社 偏光変換光学系及び照明光学系、並びに投写型表示装置
JP3714003B2 (ja) 1999-03-02 2005-11-09 セイコーエプソン株式会社 投写型表示装置及びこれに用いられるプリズム
WO2000053365A1 (en) 1999-03-05 2000-09-14 Mitsubishi Denki Kabushiki Kaisha Laser machining apparatus
US6393042B1 (en) * 1999-03-08 2002-05-21 Semiconductor Energy Laboratory Co., Ltd. Beam homogenizer and laser irradiation apparatus
JP3237832B2 (ja) 1999-03-12 2001-12-10 住友重機械工業株式会社 レーザ加工装置及びレーザ穴あけ加工方法
JP2002542043A (ja) 1999-04-27 2002-12-10 ジーエスアイ ルモニクス インコーポレイテッド 多重レーザビームを使用する材料処理システム及び方法
JP3817970B2 (ja) * 1999-05-31 2006-09-06 ウシオ電機株式会社 偏光ビームスプリッタおよびそれを用いた液晶表示素子の配向膜光配向用偏光光照射装置
JP3479878B2 (ja) * 2000-03-27 2003-12-15 住友重機械工業株式会社 レーザ加工方法及び加工装置
JP2002006510A (ja) * 2000-06-19 2002-01-09 Ntn Corp 欠陥修正装置
KR100500343B1 (ko) * 2000-08-29 2005-07-12 미쓰비시덴키 가부시키가이샤 레이저 가공 장치
TW523791B (en) * 2000-09-01 2003-03-11 Semiconductor Energy Lab Method of processing beam, laser irradiation apparatus, and method of manufacturing semiconductor device
US6792175B2 (en) * 2000-11-30 2004-09-14 Board Of Supervisors Of Louisiana State University And Agricultural And Mechanical College Optical crossbar switch
TW528879B (en) * 2001-02-22 2003-04-21 Ishikawajima Harima Heavy Ind Illumination optical system and laser processor having the same
US6804269B2 (en) * 2001-06-19 2004-10-12 Hitachi Via Mechanics, Ltd. Laser beam delivery system with trepanning module
JP3903761B2 (ja) * 2001-10-10 2007-04-11 株式会社日立製作所 レ−ザアニ−ル方法およびレ−ザアニ−ル装置
US6977775B2 (en) * 2002-05-17 2005-12-20 Sharp Kabushiki Kaisha Method and apparatus for crystallizing semiconductor with laser beams
US6876784B2 (en) * 2002-05-30 2005-04-05 Nanoopto Corporation Optical polarization beam combiner/splitter
JP4223340B2 (ja) * 2003-06-30 2009-02-12 フジノン株式会社 光記録媒体用対物レンズおよびこれを用いた光ピックアップ装置
US6917012B2 (en) * 2003-07-03 2005-07-12 General Electric Company Reducing electromagnetic feedback during laser shock peening

Also Published As

Publication number Publication date
TWI323682B (enExample) 2010-04-21
KR101091748B1 (ko) 2011-12-08
CN1530200A (zh) 2004-09-22
US20050127051A1 (en) 2005-06-16
KR20040081066A (ko) 2004-09-20
JP4662411B2 (ja) 2011-03-30
JP2004276063A (ja) 2004-10-07
US7521650B2 (en) 2009-04-21
TW200422131A (en) 2004-11-01

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