CN100586633C - 激光加工装置 - Google Patents
激光加工装置 Download PDFInfo
- Publication number
- CN100586633C CN100586633C CN200410008634A CN200410008634A CN100586633C CN 100586633 C CN100586633 C CN 100586633C CN 200410008634 A CN200410008634 A CN 200410008634A CN 200410008634 A CN200410008634 A CN 200410008634A CN 100586633 C CN100586633 C CN 100586633C
- Authority
- CN
- China
- Prior art keywords
- light
- laser
- light beam
- mentioned
- combination mechanism
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000003754 machining Methods 0.000 title abstract description 26
- 230000010287 polarization Effects 0.000 claims abstract description 21
- 230000007246 mechanism Effects 0.000 claims description 64
- 230000008595 infiltration Effects 0.000 claims description 13
- 238000001764 infiltration Methods 0.000 claims description 13
- 230000003287 optical effect Effects 0.000 abstract description 37
- 230000005540 biological transmission Effects 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 11
- 230000008569 process Effects 0.000 description 10
- 101710171220 30S ribosomal protein S12 Proteins 0.000 description 7
- 101710171187 30S ribosomal protein S10 Proteins 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 230000002194 synthesizing effect Effects 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000008676 import Effects 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000003786 synthesis reaction Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000011514 reflex Effects 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000000844 transformation Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
- B23K26/0613—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams having a common axis
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
- B23K37/0408—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work for planar work
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laser Beam Processing (AREA)
- Mechanical Optical Scanning Systems (AREA)
Abstract
Description
Claims (1)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003070256 | 2003-03-14 | ||
JP2003070256A JP4662411B2 (ja) | 2003-03-14 | 2003-03-14 | レーザ加工装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1530200A CN1530200A (zh) | 2004-09-22 |
CN100586633C true CN100586633C (zh) | 2010-02-03 |
Family
ID=33287051
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200410008634A Expired - Fee Related CN100586633C (zh) | 2003-03-14 | 2004-03-12 | 激光加工装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7521650B2 (zh) |
JP (1) | JP4662411B2 (zh) |
KR (1) | KR101091748B1 (zh) |
CN (1) | CN100586633C (zh) |
TW (1) | TW200422131A (zh) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI382795B (zh) * | 2005-03-04 | 2013-01-11 | Hitachi Via Mechanics Ltd | A method of opening a printed circuit board and an opening device for a printed circuit board |
KR20080079828A (ko) * | 2007-02-28 | 2008-09-02 | 주식회사 이오테크닉스 | 레이저 가공 장치 및 방법 |
KR100817825B1 (ko) * | 2007-05-02 | 2008-03-31 | 주식회사 이오테크닉스 | 레이저 가공장치 |
TWI395630B (zh) * | 2009-06-30 | 2013-05-11 | Mitsuboshi Diamond Ind Co Ltd | 使用雷射光之玻璃基板加工裝置 |
JP6457472B2 (ja) * | 2016-12-14 | 2019-01-23 | ファナック株式会社 | 制御システム及び機械学習装置 |
US11325399B2 (en) * | 2017-12-20 | 2022-05-10 | Sony Corporation | Laser device and laser processing method |
Family Cites Families (39)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5833803A (ja) | 1981-08-21 | 1983-02-28 | 日本電気株式会社 | 高速レ−ザトリミング装置 |
JPS61207088A (ja) * | 1985-03-12 | 1986-09-13 | Nippon Hoso Kyokai <Nhk> | レ−ザ出力合成装置 |
JPS6286839A (ja) * | 1985-10-14 | 1987-04-21 | Nec Corp | トリミング装置 |
DE3750174T2 (de) * | 1986-10-30 | 1994-11-17 | Canon K.K., Tokio/Tokyo | Belichtungseinrichtung. |
US4787747A (en) * | 1987-11-13 | 1988-11-29 | Zygo Corporation | Straightness of travel interferometer |
JPH01289586A (ja) * | 1988-05-13 | 1989-11-21 | Nec Corp | レーザートリミング装置 |
JPH03184687A (ja) * | 1989-12-15 | 1991-08-12 | Mitsubishi Electric Corp | レーザ加工装置 |
DE4035266C2 (de) * | 1990-11-02 | 1995-11-16 | Jenoptik Jena Gmbh | Verfahren und Anordnung zur Thermowellenanalyse |
JPH05327100A (ja) * | 1992-05-26 | 1993-12-10 | Hoya Corp | 固体レーザ装置 |
JP2588281Y2 (ja) * | 1992-11-25 | 1999-01-06 | 株式会社小松製作所 | レーザマーキング装置 |
US5521628A (en) | 1993-08-30 | 1996-05-28 | Lumonics Corporation | Laser system for simultaneously marking multiple parts |
US5453814A (en) * | 1994-04-13 | 1995-09-26 | Nikon Precision Inc. | Illumination source and method for microlithography |
JP3150850B2 (ja) * | 1994-07-08 | 2001-03-26 | シャープ株式会社 | 光磁気ディスク原盤の製造方法 |
US5689367A (en) * | 1995-10-13 | 1997-11-18 | E-Tek Dynamics, Inc. | Polarization beam splitter |
US5825043A (en) * | 1996-10-07 | 1998-10-20 | Nikon Precision Inc. | Focusing and tilting adjustment system for lithography aligner, manufacturing apparatus or inspection apparatus |
US5822211A (en) * | 1996-11-13 | 1998-10-13 | International Business Machines Corporation | Laser texturing apparatus with dual laser paths having an independently adjusted parameter |
JP3063688B2 (ja) * | 1997-07-30 | 2000-07-12 | 日本電気株式会社 | レーザ加工装置及びその制御方法並びにその制御プログラムを記録した記録媒体 |
JP3642930B2 (ja) * | 1997-08-25 | 2005-04-27 | 松下電器産業株式会社 | 複数軸レーザ加工方法およびその装置 |
JP3194250B2 (ja) | 1998-12-25 | 2001-07-30 | 住友重機械工業株式会社 | 2軸レーザ加工機 |
US6535535B1 (en) * | 1999-02-12 | 2003-03-18 | Semiconductor Energy Laboratory Co., Ltd. | Laser irradiation method, laser irradiation apparatus, and semiconductor device |
JP3622557B2 (ja) | 1999-02-23 | 2005-02-23 | セイコーエプソン株式会社 | 偏光変換光学系及び照明光学系、並びに投写型表示装置 |
JP3714003B2 (ja) | 1999-03-02 | 2005-11-09 | セイコーエプソン株式会社 | 投写型表示装置及びこれに用いられるプリズム |
US6635849B1 (en) | 1999-03-05 | 2003-10-21 | Mitsubishi Denki Kabushiki Kaisha | Laser beam machine for micro-hole machining |
US6393042B1 (en) * | 1999-03-08 | 2002-05-21 | Semiconductor Energy Laboratory Co., Ltd. | Beam homogenizer and laser irradiation apparatus |
JP3237832B2 (ja) | 1999-03-12 | 2001-12-10 | 住友重機械工業株式会社 | レーザ加工装置及びレーザ穴あけ加工方法 |
JP2002542043A (ja) | 1999-04-27 | 2002-12-10 | ジーエスアイ ルモニクス インコーポレイテッド | 多重レーザビームを使用する材料処理システム及び方法 |
JP3817970B2 (ja) * | 1999-05-31 | 2006-09-06 | ウシオ電機株式会社 | 偏光ビームスプリッタおよびそれを用いた液晶表示素子の配向膜光配向用偏光光照射装置 |
JP3479878B2 (ja) * | 2000-03-27 | 2003-12-15 | 住友重機械工業株式会社 | レーザ加工方法及び加工装置 |
JP2002006510A (ja) * | 2000-06-19 | 2002-01-09 | Ntn Corp | 欠陥修正装置 |
CN1159129C (zh) * | 2000-08-29 | 2004-07-28 | 三菱电机株式会社 | 激光加工装置 |
TW523791B (en) * | 2000-09-01 | 2003-03-11 | Semiconductor Energy Lab | Method of processing beam, laser irradiation apparatus, and method of manufacturing semiconductor device |
US6792175B2 (en) * | 2000-11-30 | 2004-09-14 | Board Of Supervisors Of Louisiana State University And Agricultural And Mechanical College | Optical crossbar switch |
TW528879B (en) * | 2001-02-22 | 2003-04-21 | Ishikawajima Harima Heavy Ind | Illumination optical system and laser processor having the same |
US6804269B2 (en) | 2001-06-19 | 2004-10-12 | Hitachi Via Mechanics, Ltd. | Laser beam delivery system with trepanning module |
JP3903761B2 (ja) * | 2001-10-10 | 2007-04-11 | 株式会社日立製作所 | レ−ザアニ−ル方法およびレ−ザアニ−ル装置 |
US6977775B2 (en) * | 2002-05-17 | 2005-12-20 | Sharp Kabushiki Kaisha | Method and apparatus for crystallizing semiconductor with laser beams |
US6876784B2 (en) * | 2002-05-30 | 2005-04-05 | Nanoopto Corporation | Optical polarization beam combiner/splitter |
JP4223340B2 (ja) * | 2003-06-30 | 2009-02-12 | フジノン株式会社 | 光記録媒体用対物レンズおよびこれを用いた光ピックアップ装置 |
US6917012B2 (en) * | 2003-07-03 | 2005-07-12 | General Electric Company | Reducing electromagnetic feedback during laser shock peening |
-
2003
- 2003-03-14 JP JP2003070256A patent/JP4662411B2/ja not_active Expired - Fee Related
-
2004
- 2004-03-02 TW TW093105360A patent/TW200422131A/zh not_active IP Right Cessation
- 2004-03-10 US US10/796,278 patent/US7521650B2/en not_active Expired - Fee Related
- 2004-03-12 KR KR1020040016956A patent/KR101091748B1/ko not_active IP Right Cessation
- 2004-03-12 CN CN200410008634A patent/CN100586633C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
TW200422131A (en) | 2004-11-01 |
KR101091748B1 (ko) | 2011-12-08 |
JP4662411B2 (ja) | 2011-03-30 |
US20050127051A1 (en) | 2005-06-16 |
KR20040081066A (ko) | 2004-09-20 |
TWI323682B (zh) | 2010-04-21 |
JP2004276063A (ja) | 2004-10-07 |
US7521650B2 (en) | 2009-04-21 |
CN1530200A (zh) | 2004-09-22 |
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Legal Events
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C56 | Change in the name or address of the patentee |
Owner name: VIA MECHANICS LTD. Free format text: FORMER NAME: HITACHI BIA MACINE CO., LTD. |
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CP01 | Change in the name or title of a patent holder |
Address after: Kanagawa, Japan Patentee after: Via Mechanics Ltd. Address before: Kanagawa, Japan Patentee before: Hitachi Bia Macine Co., Ltd. |
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CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100203 Termination date: 20150312 |
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EXPY | Termination of patent right or utility model |