CN100561694C - 用于深槽的掺杂硅填充的工艺步骤 - Google Patents

用于深槽的掺杂硅填充的工艺步骤 Download PDF

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Publication number
CN100561694C
CN100561694C CNB2005800429745A CN200580042974A CN100561694C CN 100561694 C CN100561694 C CN 100561694C CN B2005800429745 A CNB2005800429745 A CN B2005800429745A CN 200580042974 A CN200580042974 A CN 200580042974A CN 100561694 C CN100561694 C CN 100561694C
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China
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amorphous silicon
deposition
arsenic
wafer
silicon layer
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Expired - Fee Related
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CNB2005800429745A
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Chinese (zh)
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CN101084574A (zh
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阿吉特·帕仁吉佩
萨默纳斯·内奇
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Applied Materials Inc
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Applied Materials Inc
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/04—Coating on selected surface areas, e.g. using masks
    • C23C16/045—Coating cavities or hollow spaces, e.g. interior of tubes; Infiltration of porous substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00—Resistors, capacitors or inductors
    • H10D1/01—Manufacture or treatment
    • H10D1/045—Manufacture or treatment of capacitors having potential barriers, e.g. varactors
    • H10D1/047—Manufacture or treatment of capacitors having potential barriers, e.g. varactors of conductor-insulator-semiconductor capacitors, e.g. trench capacitors
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/24—Deposition of silicon only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/76224—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using trench refilling with dielectric materials
    • H01L21/76232—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using trench refilling with dielectric materials of trenches having a shape other than rectangular or V-shape, e.g. rounded corners, oblique or rounded trench walls

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Power Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Semiconductor Memories (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Semiconductor Integrated Circuits (AREA)
CNB2005800429745A 2004-12-14 2005-12-13 用于深槽的掺杂硅填充的工艺步骤 Expired - Fee Related CN100561694C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/011,550 2004-12-14
US11/011,550 US7109097B2 (en) 2004-12-14 2004-12-14 Process sequence for doped silicon fill of deep trenches

Publications (2)

Publication Number Publication Date
CN101084574A CN101084574A (zh) 2007-12-05
CN100561694C true CN100561694C (zh) 2009-11-18

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CNB2005800429745A Expired - Fee Related CN100561694C (zh) 2004-12-14 2005-12-13 用于深槽的掺杂硅填充的工艺步骤

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Country Link
US (3) US7109097B2 (enExample)
EP (1) EP1829095A2 (enExample)
JP (1) JP5252417B2 (enExample)
KR (1) KR100930140B1 (enExample)
CN (1) CN100561694C (enExample)
WO (1) WO2006065776A2 (enExample)

Cited By (2)

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CN109904057A (zh) * 2017-12-11 2019-06-18 中芯国际集成电路制造(北京)有限公司 半导体装置的制造方法
TWI768860B (zh) * 2021-04-29 2022-06-21 力晶積成電子製造股份有限公司 沉積製程控制方法

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US7109097B2 (en) * 2004-12-14 2006-09-19 Applied Materials, Inc. Process sequence for doped silicon fill of deep trenches
US8012847B2 (en) 2005-04-01 2011-09-06 Micron Technology, Inc. Methods of forming trench isolation in the fabrication of integrated circuitry and methods of fabricating integrated circuitry
US7344975B2 (en) * 2005-08-26 2008-03-18 Micron Technology, Inc. Method to reduce charge buildup during high aspect ratio contact etch
US7608195B2 (en) * 2006-02-21 2009-10-27 Micron Technology, Inc. High aspect ratio contacts
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KR20100040455A (ko) * 2008-10-10 2010-04-20 주식회사 동부하이텍 반도체 소자의 제조 방법
US7943463B2 (en) * 2009-04-02 2011-05-17 Micron Technology, Inc. Methods of semiconductor processing involving forming doped polysilicon on undoped polysilicon
CN101859700B (zh) * 2009-04-09 2012-05-30 上海先进半导体制造股份有限公司 多晶硅淀积工艺
JP2010272758A (ja) * 2009-05-22 2010-12-02 Hitachi High-Technologies Corp 被エッチング材のプラズマエッチング方法
US8105956B2 (en) 2009-10-20 2012-01-31 Micron Technology, Inc. Methods of forming silicon oxides and methods of forming interlevel dielectrics
US8293625B2 (en) 2011-01-19 2012-10-23 International Business Machines Corporation Structure and method for hard mask removal on an SOI substrate without using CMP process
KR20130087929A (ko) * 2012-01-30 2013-08-07 에스케이하이닉스 주식회사 트랜치 소자분리층을 갖는 반도체소자 및 그 제조방법
JP6059085B2 (ja) * 2013-05-27 2017-01-11 東京エレクトロン株式会社 トレンチを充填する方法及び処理装置
JP6150724B2 (ja) * 2013-12-27 2017-06-21 東京エレクトロン株式会社 凹部を充填する方法
US9704708B2 (en) 2014-07-11 2017-07-11 Applied Materials, Inc. Halogenated dopant precursors for epitaxy
US20160020094A1 (en) * 2014-07-18 2016-01-21 Asm Ip Holding B.V. Process for forming silicon-filled openings with a reduced occurrence of voids
KR102318197B1 (ko) 2014-09-22 2021-10-26 삼성전자주식회사 씨모스 이미지 센서의 픽셀 및 이를 포함하는 이미지 센서
US9401410B2 (en) * 2014-11-26 2016-07-26 Texas Instruments Incorporated Poly sandwich for deep trench fill
CN105826312B (zh) * 2015-01-04 2019-01-11 旺宏电子股份有限公司 半导体元件及其制造方法
KR101706747B1 (ko) * 2015-05-08 2017-02-15 주식회사 유진테크 비정질 박막의 형성방법
US10468263B2 (en) 2015-12-19 2019-11-05 Applied Materials, Inc. Tungsten deposition without barrier layer
US10991586B2 (en) 2015-12-19 2021-04-27 Applied Materials, Inc. In-situ tungsten deposition without barrier layer
US10480066B2 (en) 2015-12-19 2019-11-19 Applied Materials, Inc. Metal deposition methods
US9768072B1 (en) 2016-06-30 2017-09-19 International Business Machines Corporation Fabrication of a vertical fin field effect transistor with reduced dimensional variations
KR102499035B1 (ko) 2016-07-25 2023-02-13 삼성전자주식회사 반도체 장치의 제조 방법
US20180076026A1 (en) 2016-09-14 2018-03-15 Applied Materials, Inc. Steam oxidation initiation for high aspect ratio conformal radical oxidation
CN110431661B (zh) * 2017-03-31 2023-09-22 应用材料公司 用于用非晶硅膜对高深宽比沟槽进行间隙填充的两步工艺
WO2019013891A1 (en) * 2017-07-12 2019-01-17 Applied Materials, Inc. CYCLIC CONFORMAL DEPOSITION / REINFORCEMENT / ETCHING FOR FILLING INS
WO2019074877A1 (en) * 2017-10-09 2019-04-18 Applied Materials, Inc. DOPED AMORPHOUS SILICON CONFORMS AS A METAL DEPOSITION NUCLEATION LAYER
JP6968011B2 (ja) 2018-03-19 2021-11-17 東京エレクトロン株式会社 成膜方法及び成膜装置
CN109300781B (zh) * 2018-09-11 2020-08-11 上海华虹宏力半导体制造有限公司 Ono膜层的制造方法
CN113628959B (zh) * 2021-07-19 2024-06-14 华虹半导体(无锡)有限公司 应用于功率器件的沟槽填充方法
CN116110777A (zh) * 2021-11-10 2023-05-12 长江存储科技有限责任公司 掺杂有杂质的硅薄膜、其制备方法以及半导体器件
CN114267642A (zh) * 2021-12-01 2022-04-01 福建省晋华集成电路有限公司 半导体存储装置及其制备方法
CN117238839B (zh) * 2023-11-10 2024-02-09 合肥晶合集成电路股份有限公司 一种浅沟槽隔离结构及其形成方法

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Publication number Priority date Publication date Assignee Title
CN109904057A (zh) * 2017-12-11 2019-06-18 中芯国际集成电路制造(北京)有限公司 半导体装置的制造方法
TWI768860B (zh) * 2021-04-29 2022-06-21 力晶積成電子製造股份有限公司 沉積製程控制方法

Also Published As

Publication number Publication date
EP1829095A2 (en) 2007-09-05
US7446366B2 (en) 2008-11-04
JP5252417B2 (ja) 2013-07-31
WO2006065776A3 (en) 2006-11-30
KR20070086885A (ko) 2007-08-27
US7713881B2 (en) 2010-05-11
CN101084574A (zh) 2007-12-05
US20060128139A1 (en) 2006-06-15
KR100930140B1 (ko) 2009-12-07
JP2008523640A (ja) 2008-07-03
WO2006065776A2 (en) 2006-06-22
US20080318441A1 (en) 2008-12-25
US20060234470A1 (en) 2006-10-19
US7109097B2 (en) 2006-09-19

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