CN100541841C - 产生辐射的半导体芯片和发光二极管 - Google Patents
产生辐射的半导体芯片和发光二极管 Download PDFInfo
- Publication number
- CN100541841C CN100541841C CNB2006101059281A CN200610105928A CN100541841C CN 100541841 C CN100541841 C CN 100541841C CN B2006101059281 A CNB2006101059281 A CN B2006101059281A CN 200610105928 A CN200610105928 A CN 200610105928A CN 100541841 C CN100541841 C CN 100541841C
- Authority
- CN
- China
- Prior art keywords
- semiconductor chip
- active layer
- substrate
- described semiconductor
- radiation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
- H10H20/821—Bodies characterised by their shape, e.g. curved or truncated substrates of the light-emitting regions, e.g. non-planar junctions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Led Devices (AREA)
- Led Device Packages (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE10039433.7A DE10039433B4 (de) | 2000-08-11 | 2000-08-11 | Halbleiterchip für die Optoelektronik |
| DE10039433.7 | 2000-08-11 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB01814019XA Division CN1276522C (zh) | 2000-08-11 | 2001-07-24 | 产生辐射的半导体芯片和发光二极管 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1913184A CN1913184A (zh) | 2007-02-14 |
| CN100541841C true CN100541841C (zh) | 2009-09-16 |
Family
ID=7652222
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006101059281A Expired - Lifetime CN100541841C (zh) | 2000-08-11 | 2001-07-24 | 产生辐射的半导体芯片和发光二极管 |
| CNB01814019XA Expired - Lifetime CN1276522C (zh) | 2000-08-11 | 2001-07-24 | 产生辐射的半导体芯片和发光二极管 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB01814019XA Expired - Lifetime CN1276522C (zh) | 2000-08-11 | 2001-07-24 | 产生辐射的半导体芯片和发光二极管 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US6891199B2 (enExample) |
| EP (1) | EP1307927B1 (enExample) |
| JP (2) | JP2004507095A (enExample) |
| CN (2) | CN100541841C (enExample) |
| DE (2) | DE10039433B4 (enExample) |
| TW (1) | TW502464B (enExample) |
| WO (1) | WO2002015287A1 (enExample) |
Families Citing this family (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10019665A1 (de) * | 2000-04-19 | 2001-10-31 | Osram Opto Semiconductors Gmbh | Lumineszenzdiodenchip und Verfahren zu dessen Herstellung |
| JP4294295B2 (ja) | 2002-11-06 | 2009-07-08 | 株式会社小糸製作所 | 車両用前照灯 |
| US6869812B1 (en) * | 2003-05-13 | 2005-03-22 | Heng Liu | High power AllnGaN based multi-chip light emitting diode |
| ITTO20030610A1 (it) * | 2003-08-05 | 2005-02-06 | Fiat Ricerche | Disposizione di illuminamento a profondita' ridotta per |
| KR20050034936A (ko) * | 2003-10-10 | 2005-04-15 | 삼성전기주식회사 | 형광체를 이용한 파장변환형 발광 다이오드 패키지 및제조방법 |
| US20060255349A1 (en) * | 2004-05-11 | 2006-11-16 | Heng Liu | High power AllnGaN based multi-chip light emitting diode |
| JP4599111B2 (ja) * | 2004-07-30 | 2010-12-15 | スタンレー電気株式会社 | 灯具光源用ledランプ |
| GB2417126A (en) * | 2004-08-09 | 2006-02-15 | Qinetiq Ltd | Method for fabricating lateral semiconductor device |
| US7829909B2 (en) * | 2005-11-15 | 2010-11-09 | Verticle, Inc. | Light emitting diodes and fabrication methods thereof |
| JP2009530798A (ja) | 2006-01-05 | 2009-08-27 | イルミテックス, インコーポレイテッド | Ledから光を導くための独立した光学デバイス |
| JP2007201361A (ja) * | 2006-01-30 | 2007-08-09 | Shinko Electric Ind Co Ltd | 半導体装置及び半導体装置の製造方法 |
| KR100735311B1 (ko) * | 2006-04-21 | 2007-07-04 | 삼성전기주식회사 | 발광 다이오드 칩 |
| JP2008016565A (ja) * | 2006-07-04 | 2008-01-24 | Shinko Electric Ind Co Ltd | 発光素子収容体及びその製造方法、及び発光装置 |
| TW200810148A (en) * | 2006-08-09 | 2008-02-16 | Everlight Electronics Co Ltd | Side-emitting diode package |
| KR20090064474A (ko) | 2006-10-02 | 2009-06-18 | 일루미텍스, 인크. | Led 시스템 및 방법 |
| WO2009048076A1 (ja) * | 2007-10-09 | 2009-04-16 | Alps Electric Co., Ltd. | 半導体発光装置 |
| EP2240968A1 (en) | 2008-02-08 | 2010-10-20 | Illumitex, Inc. | System and method for emitter layer shaping |
| TW201034256A (en) | 2008-12-11 | 2010-09-16 | Illumitex Inc | Systems and methods for packaging light-emitting diode devices |
| JP5182231B2 (ja) * | 2009-06-09 | 2013-04-17 | 豊田合成株式会社 | Ledランプ |
| US8449128B2 (en) | 2009-08-20 | 2013-05-28 | Illumitex, Inc. | System and method for a lens and phosphor layer |
| US8585253B2 (en) | 2009-08-20 | 2013-11-19 | Illumitex, Inc. | System and method for color mixing lens array |
| CN101692475A (zh) * | 2009-10-26 | 2010-04-07 | 无锡瑞威光电科技有限公司 | 非正方形led芯片的组合式封装方法 |
| CN101976715B (zh) * | 2010-10-05 | 2011-10-05 | 厦门市三安光电科技有限公司 | 倒梯形铝镓铟磷系发光二极管的制作工艺 |
| CN104241262B (zh) | 2013-06-14 | 2020-11-06 | 惠州科锐半导体照明有限公司 | 发光装置以及显示装置 |
| CN105393372B (zh) * | 2013-07-26 | 2018-06-15 | 亮锐控股有限公司 | 具有内部高折射率柱的led圆顶 |
Family Cites Families (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3576586A (en) * | 1968-08-05 | 1971-04-27 | Bell & Howell Co | Variable area injection luminescent device |
| JPS5113621B2 (enExample) * | 1972-08-10 | 1976-05-01 | ||
| JPS552751B2 (enExample) | 1972-08-16 | 1980-01-22 | ||
| JPS4990494A (enExample) | 1972-12-28 | 1974-08-29 | ||
| FR2378324A1 (fr) * | 1977-01-20 | 1978-08-18 | Radiotechnique Compelec | Perfectionnement a la realisation de dispositifs d'affichage |
| DE2813930A1 (de) * | 1978-03-31 | 1979-10-04 | Agfa Gevaert Ag | Lumineszenzdiode |
| JPS594088A (ja) | 1982-06-30 | 1984-01-10 | Toshiba Corp | 発光ダイオ−ド |
| JPS6293985A (ja) | 1985-10-21 | 1987-04-30 | Masayoshi Umeno | 高速応答性可視光発光ダイオ−ド |
| JPH0531957A (ja) * | 1991-05-23 | 1993-02-09 | Canon Inc | 発光装置、これを用いた光書き込みプリンターヘツド並びに該光書き込みプリンターヘツドによる光プリンター装置 |
| US5309001A (en) | 1991-11-25 | 1994-05-03 | Sharp Kabushiki Kaisha | Light-emitting diode having a surface electrode of a tree-like form |
| JPH05226781A (ja) | 1992-02-12 | 1993-09-03 | Fujitsu Ltd | 半導体発光素子の製造方法 |
| JPH05327012A (ja) | 1992-05-15 | 1993-12-10 | Sanyo Electric Co Ltd | 炭化ケイ素発光ダイオード |
| JPH06224469A (ja) | 1993-01-26 | 1994-08-12 | Kyocera Corp | 半導体発光装置 |
| US5523589A (en) | 1994-09-20 | 1996-06-04 | Cree Research, Inc. | Vertical geometry light emitting diode with group III nitride active layer and extended lifetime |
| JP3326545B2 (ja) * | 1994-09-30 | 2002-09-24 | ローム株式会社 | 半導体発光素子 |
| JPH08139366A (ja) * | 1994-11-11 | 1996-05-31 | Ricoh Co Ltd | 発光素子およびアレイ状光源並びにその製造方法および光信号送信装置 |
| JP3153727B2 (ja) * | 1995-04-11 | 2001-04-09 | 株式会社リコー | スーパールミネッセントダイオード |
| ID16181A (id) * | 1995-12-25 | 1997-09-11 | Sony Corp | Alat semi konduktor dengan permukaan terbelah |
| JP3504079B2 (ja) * | 1996-08-31 | 2004-03-08 | 株式会社東芝 | 半導体発光ダイオード素子の製造方法 |
| JPH10150223A (ja) * | 1996-11-15 | 1998-06-02 | Rohm Co Ltd | チップ型発光素子 |
| JPH10326910A (ja) | 1997-05-19 | 1998-12-08 | Song-Jae Lee | 発光ダイオードとこれを適用した発光ダイオードアレイランプ |
| EP2169733B1 (de) | 1997-09-29 | 2017-07-19 | OSRAM Opto Semiconductors GmbH | Halbleiterlichtquelle |
| JP3707279B2 (ja) * | 1998-03-02 | 2005-10-19 | 松下電器産業株式会社 | 半導体発光装置 |
| JPH11340576A (ja) * | 1998-05-28 | 1999-12-10 | Sumitomo Electric Ind Ltd | 窒化ガリウム系半導体デバイス |
| JP2000208822A (ja) * | 1999-01-11 | 2000-07-28 | Matsushita Electronics Industry Corp | 半導体発光装置 |
| JP2000269551A (ja) * | 1999-03-18 | 2000-09-29 | Rohm Co Ltd | チップ型発光装置 |
| JP2002359437A (ja) * | 2001-03-29 | 2002-12-13 | Toshiba Electronic Engineering Corp | 光半導体素子および光半導体素子の製造方法 |
-
2000
- 2000-08-11 DE DE10039433.7A patent/DE10039433B4/de not_active Expired - Fee Related
-
2001
- 2001-07-24 CN CNB2006101059281A patent/CN100541841C/zh not_active Expired - Lifetime
- 2001-07-24 CN CNB01814019XA patent/CN1276522C/zh not_active Expired - Lifetime
- 2001-07-24 WO PCT/DE2001/002801 patent/WO2002015287A1/de not_active Ceased
- 2001-07-24 DE DE50115638T patent/DE50115638D1/de not_active Expired - Lifetime
- 2001-07-24 US US10/343,851 patent/US6891199B2/en not_active Expired - Lifetime
- 2001-07-24 JP JP2002520316A patent/JP2004507095A/ja active Pending
- 2001-07-24 EP EP01964845A patent/EP1307927B1/de not_active Expired - Lifetime
- 2001-08-10 TW TW090119655A patent/TW502464B/zh not_active IP Right Cessation
-
2006
- 2006-12-14 JP JP2006337515A patent/JP2007073998A/ja not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| DE10039433A1 (de) | 2002-02-28 |
| TW502464B (en) | 2002-09-11 |
| US6891199B2 (en) | 2005-05-10 |
| DE10039433B4 (de) | 2017-10-26 |
| US20040056263A1 (en) | 2004-03-25 |
| CN1913184A (zh) | 2007-02-14 |
| EP1307927B1 (de) | 2010-09-22 |
| WO2002015287A1 (de) | 2002-02-21 |
| JP2007073998A (ja) | 2007-03-22 |
| CN1276522C (zh) | 2006-09-20 |
| JP2004507095A (ja) | 2004-03-04 |
| DE50115638D1 (de) | 2010-11-04 |
| EP1307927A1 (de) | 2003-05-07 |
| CN1446380A (zh) | 2003-10-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20090916 |