CN100539092C - 半导体器件及其制造方法 - Google Patents

半导体器件及其制造方法 Download PDF

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Publication number
CN100539092C
CN100539092C CNB200580008837XA CN200580008837A CN100539092C CN 100539092 C CN100539092 C CN 100539092C CN B200580008837X A CNB200580008837X A CN B200580008837XA CN 200580008837 A CN200580008837 A CN 200580008837A CN 100539092 C CN100539092 C CN 100539092C
Authority
CN
China
Prior art keywords
semiconductor device
curable liquid
liquid silicone
mold
mould
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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CNB200580008837XA
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English (en)
Chinese (zh)
Other versions
CN1934699A (zh
Inventor
森田好次
中西淳二
峰胜利
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Toray Specialty Materials KK
Original Assignee
Dow Corning Toray Co Ltd
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Publication date
Application filed by Dow Corning Toray Co Ltd filed Critical Dow Corning Toray Co Ltd
Publication of CN1934699A publication Critical patent/CN1934699A/zh
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Publication of CN100539092C publication Critical patent/CN100539092C/zh
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    • H10W74/40—
    • H10W74/017—
    • H10W72/0198—
    • H10W74/01—
    • H10W74/476—
    • H10W72/5522—
    • H10W74/00—
    • H10W74/114—
    • H10W74/15—
    • H10W90/724—
    • H10W90/734—
    • H10W90/754—

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
CNB200580008837XA 2004-03-19 2005-03-08 半导体器件及其制造方法 Expired - Lifetime CN100539092C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP079597/2004 2004-03-19
JP2004079597A JP4903987B2 (ja) 2004-03-19 2004-03-19 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
CN1934699A CN1934699A (zh) 2007-03-21
CN100539092C true CN100539092C (zh) 2009-09-09

Family

ID=34961509

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB200580008837XA Expired - Lifetime CN100539092C (zh) 2004-03-19 2005-03-08 半导体器件及其制造方法

Country Status (8)

Country Link
US (1) US8262970B2 (enExample)
EP (1) EP1730775B1 (enExample)
JP (1) JP4903987B2 (enExample)
KR (1) KR101168861B1 (enExample)
CN (1) CN100539092C (enExample)
MY (1) MY146873A (enExample)
TW (1) TWI383429B (enExample)
WO (1) WO2005091361A1 (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4931366B2 (ja) 2005-04-27 2012-05-16 東レ・ダウコーニング株式会社 硬化性シリコーン組成物および電子部品
JP5207591B2 (ja) 2006-02-23 2013-06-12 東レ・ダウコーニング株式会社 半導体装置の製造方法および半導体装置
JP5285846B2 (ja) 2006-09-11 2013-09-11 東レ・ダウコーニング株式会社 硬化性シリコーン組成物および電子部品
CN102290170A (zh) * 2010-06-17 2011-12-21 台湾双羽电机股份有限公司 薄型电阻及其制造方法
US10629457B2 (en) * 2012-06-08 2020-04-21 Hitachi Chemical Company, Ltd. Method for manufacturing semiconductor device
US8997342B2 (en) * 2012-10-15 2015-04-07 Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd. Method of fabrication, a multilayer electronic structure and structures in accordance with the method
JP2014082284A (ja) * 2012-10-15 2014-05-08 Dow Corning Toray Co Ltd 凸状硬化物及び基材を備える一体化物の製造方法
US9470395B2 (en) 2013-03-15 2016-10-18 Abl Ip Holding Llc Optic for a light source
US10807329B2 (en) 2013-05-10 2020-10-20 Abl Ip Holding Llc Silicone optics
WO2016036072A1 (ko) 2014-09-01 2016-03-10 한국생산기술연구원 레독스 플로우 전지용 바이폴라 플레이트 제조 방법
JP5994961B1 (ja) * 2015-03-05 2016-09-21 住友ベークライト株式会社 封止用樹脂組成物、車載用電子制御ユニットの製造方法、および車載用電子制御ユニット
KR102695706B1 (ko) * 2022-05-24 2024-08-16 레이저쎌 주식회사 진공챔버를 구비한 가압 방식의 레이저 리플로우 장치

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0997498A1 (en) * 1998-10-28 2000-05-03 Dow Corning Corporation Silicone composition, method for the preparation thereof and silicone elastomer

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0214244A (ja) * 1988-06-30 1990-01-18 Toray Dow Corning Silicone Co Ltd 加熱硬化性オルガノポリシロキサン組成物
JP3516764B2 (ja) 1995-03-08 2004-04-05 アピックヤマダ株式会社 リリースフィルムを用いる樹脂モールド装置及び樹脂モールド方法
JPH1177733A (ja) 1997-09-01 1999-03-23 Apic Yamada Kk 樹脂モールド方法及び樹脂モールド装置
US6080605A (en) * 1998-10-06 2000-06-27 Tessera, Inc. Methods of encapsulating a semiconductor chip using a settable encapsulant
US6040366A (en) * 1998-02-27 2000-03-21 General Electric Company Liquid injection molding silicone elastomers having primerless adhesion
JP3494586B2 (ja) * 1999-03-26 2004-02-09 アピックヤマダ株式会社 樹脂封止装置及び樹脂封止方法
JP4646363B2 (ja) * 2000-06-29 2011-03-09 東レ・ダウコーニング株式会社 シリコーンゴム組成物
JP4947858B2 (ja) * 2001-08-21 2012-06-06 東レ・ダウコーニング株式会社 導電性液状シリコーンゴム組成物、導電性シリコーンゴム成形物およびその製造方法
JP4061361B2 (ja) * 2001-12-28 2008-03-19 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 付加反応型ポリオルガノシロキサン組成物
AU2003240017A1 (en) * 2002-05-31 2003-12-19 Dow Corning Toray Silicone Co., Ltd. Thermoconductive curable liquid polymer composition and semiconductor device produced with the use of this composition

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0997498A1 (en) * 1998-10-28 2000-05-03 Dow Corning Corporation Silicone composition, method for the preparation thereof and silicone elastomer

Also Published As

Publication number Publication date
JP4903987B2 (ja) 2012-03-28
US20070273050A1 (en) 2007-11-29
JP2005268565A (ja) 2005-09-29
EP1730775A1 (en) 2006-12-13
CN1934699A (zh) 2007-03-21
MY146873A (en) 2012-10-15
US8262970B2 (en) 2012-09-11
TW200535957A (en) 2005-11-01
WO2005091361A1 (en) 2005-09-29
KR101168861B1 (ko) 2012-07-30
KR20060123643A (ko) 2006-12-01
EP1730775B1 (en) 2013-02-13
TWI383429B (zh) 2013-01-21

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Granted publication date: 20090909