f.doc/g 1294651, 九、發明說明： 【發明所屬之技術領域】 本發明是有關於—種剝料治具與剝料方法，且特 料模後之封裝元件陣列上之封膠餘料的剥 【先前技術】 在^導體的封裝製程中，±要分為晶圓切 二』Μ㈣主要目的是防止晶片受到外界之濕氣、執量 影響。封膠過程大致上是將一具有半導體晶片或 二Π封裝基板（SUbStrate)置於模具（mold吐㈣ _ : ϋ'%的封轉料加熱銳融狀態 :材料經由柱塞(•聯)施予壓力以進入模呈= ::，封轉料密封住基板上之晶片或電子元;牛以形成) Μ之封裝膠體。待封裝膠體固化（_」)之後， 二移除，再對封裝基板進行切割啊 圖1=圖…是習知之—種移除灌模後形成在封裝笑 之、w餘料的流程圖。首先，請參考圖ia 車列ϋ完成封膠製程之後會被移到剝料機台之心= (咖聰)21〇上置放，此時封裝基板u〇上已形 ^ 覆晶片120的封裝膠體112(圖1A·會示i個），以 上曰存在純後所W的封膠餘料114，此封膠餘料⑴ 129 偏 3r.doc/g 會與封裝職ι12連接。接著，如圖 件陣列U)上方進行吹氣的動作，以冷卻封^ ^封裝元 封勝餘料114以及封裝膠體112。並且，土 10上之 封穋餘料m以及封裝膠體112固化後圖示、’待 (未綠示）將封裝元件陣列1()壓著於承9上lj枓=具 膠餘料114自封裂基板110上移除。210上’亚將封 行二封裝元件陣列進 一個封^ 弗封膠餘料以及每 致，亦^ _置的縣膠體其冷卻速度不- 亦即母一個封裝膠體的固化程度不同。如此一 f除封膠餘料時’容易有部分尚未完全固化的導餘料户 裝基板上。此外，由於封裝雜與封裝基板之^ 在熱祕係數（Coefficient of The麵i Expansi〇n,响白: =’所以在冷卻封裝賴㈣程巾，會在封裝膠體邀封 衣，板間的接合面上產生熱應力（thermal stress)，而造成 ^襄7〇件_曲變形（warpage)的現象。更甚者，會造成 =體自封«板上娜或晶#受職力破壞而無法正常 作。 【發明内容】 有鑑於此，本發明之目的是提供一種剝料治具，以 效地移除封裝it件陣列灌模後所殘留之封膠餘料。 士本赉月之另目的疋提供一種剝料治具，以避免剝料 ¥封I膠體朗裝基板間的接觸面被減力破壞。 本發明之再一目的是提供一種剝料方法，其可應用上 1294銳 f.doc/g 述之ft治具而達到較佳的剝料效果。 本發賴出―_料治具，叫括 具。在本發财，剝料治具適靜 ^、f 一上模 則適於移除一封裝元杜陆 、/ 4祛口，剝料機台 其中封褒元件陣列包括多殘封膠餘料， —封裝膠體與一灌模膠、、主口 、 母—封裝元件具有 配置於灌模膠注口上謂餘料是 於承載封裝.元件，且具二Ϊ連= 、 下极具表面具有多個 、第 -出氣孔對應於每—個封裝元 ^孔’這些第 地，上模具具有多個相 二机逼連通。同樣 具有多個第二出氣孔。這此第一 ’且上模具表面 震元件並與第二流道連通出=亦對應於每-個封 模具與下模具夾持封裝元件陣列，^ :制科的同時，上 與這些第二出氣孔對每-個封裝元件二氣，些第—出氣孔 在本發明之一實施例中，上模呈女 模㈣以容納封裝膠體，而上述：多、：個模穴，這些 於這些模穴内。 乐一出氣孔則位 本發明再提出一種剝料方法，此 裝元件陣列灌模後所殘留的—封膠2適於移除上 去包括下列步驟。首先，藉由上 :餘科，此剝料方 。接著’對封膠餘料吹氣，並同時2失持封裝元 ，-個封裝元件吹氣，以冷卻封膠 二曰由劍料治具對 彎折封膠餘料與封裝膠體之連接處二=吻體。之後， 乂使封膠餘料自灌模 I294^3,doc/g 膠注口剝離。 在本發明之一實施例中，剝料治具 :下模具，其中上模具是壓著於下模具:括具 =車列。在本發财，對該些縣元件 = 個第-出氣孔與多個第二二 =發暇在_治糾設料贿道與錢孔，並在 # :人乳的同時’藉由剝料治具夹持封裝元件陣列。， ^壯剝料治具_流道與吹氣孔的設計可以㈣對每固 封吹氣，以達到均勻冷卻的效果，有效解決剝料時 •餘料的殘留問題。此外，藉由剝料治具的夾持可 的陣列因為熱應力的作用而變形，故可得到較: 為讓本發明之上述和其他目的、特徵和優點 下下文特舉較佳實施例，並配合所_式，作詳二ί 【實施方式】 圖2是一封裝元件陣列灌模後的示意圖。請參 本實施例中，-封裝元件陣列3⑻在完成封膠製^之 裝腺Ϊ裝基板搬上會形成有多個包覆晶片（未纷示）的封 、多體312 ’以構成多個封裝元件31〇。此外，每一士一 :後310還具有一灌模膠注口 314 ’而在進行上述之封ί; 王後，灌杈膠注口 314上會形成一與封裝膠體 χ 封膠餘料320。 d 12連接之 f-doc/gF.doc/g 1294651, IX. Description of the invention: [Technical field of the invention] The present invention relates to a stripping jig and a stripping method, and the sealing material on the array of packaged components after the special mold Stripping [Prior Art] In the packaging process of the ^ conductor, ± is divided into wafers. The main purpose is to prevent the wafer from being affected by the moisture and the amount of the outside. The encapsulation process is generally to place a semiconductor wafer or a two-ply package substrate (SUbStrate) in a mold (mold spit (4) _ : ϋ '% of the sealing material is heated and melted: the material is applied via a plunger (• joint) The pressure is applied to the mold to form =:, and the sealing material is sealed to the wafer or the electron element on the substrate; the cow is formed to form the encapsulating colloid of the crucible. After the encapsulated colloid is cured (_"), the second is removed, and then the package substrate is cut. Figure 1 = Fig.... is a conventional flow chart for forming a package of laughter after removing the mold. First of all, please refer to Figure ia. After completing the sealing process, it will be moved to the center of the stripping machine = (Cai Cong) 21〇, and then the package substrate u has been packaged on the wafer 120. The colloid 112 (Fig. 1A· shows i), the above crucible exists in the pure sealant W, and the sealant (1) 129 is 3r.doc/g will be connected with the package. Next, an air blowing operation is performed above the image array U) to cool the sealing material and the encapsulant 112. Moreover, after the sealing material m on the soil 10 and the encapsulant 112 are cured, the icon (the green element is shown) presses the package element array 1 () onto the carrier 9 and the self-sealing of the adhesive material 114 The substrate 110 is removed. 210 On the 'Asian will seal the array of two package components into a seal ^ Fu sealant residual material and each, also _ _ set of county gels, the cooling rate is not - that is, the degree of curing of a female encapsulant is different. Such a f is not easy to have a portion of the guide material on the substrate that has not yet fully cured. In addition, due to the heat dissipation coefficient of the package and the package substrate (Coefficient of The surface, the white: = ', so in the cooling package (4), the package will be sealed in the package, the bonding between the plates Thermal stress is generated on the surface, causing a phenomenon of warpage. Further, it will cause the body to be self-sealing. SUMMARY OF THE INVENTION In view of the above, an object of the present invention is to provide a stripping jig for effectively removing the remaining material of the sealant after filling the package of the package of the element. A stripping jig for avoiding damage of the contact surface between the stripping and sealing metal substrates. A further object of the present invention is to provide a stripping method which can be applied to 1294 sharp f.doc/g The ft fixture is described to achieve better stripping effect. The hair is based on the _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ a packaged element dulu, / 4 mouth, stripping machine, wherein the array of sealing elements comprises a plurality of residual rubber seals, The colloid and the mold-filling glue, the main port and the mother-package component are disposed on the filling glue injection port, and the remaining material is carried in the package. The component has two = = =, and the lower electrode has a plurality of surfaces, - the air outlet corresponds to each of the package elements, the upper mold has a plurality of phase two mechanically connected. Also has a plurality of second air outlets. This first 'and the upper mold surface vibration component and The second flow channel communicates out=also corresponds to each of the sealing die and the lower die clamping package component array, ^: at the same time, the second and the second air outlet are two gas-for each package component, some first- Venting hole In one embodiment of the invention, the upper mold is a female mold (four) to accommodate the encapsulating colloid, and the above: a plurality of: a mold cavity, these are in the cavities. The Le-venting hole is in the present invention. The material method, the sealant 2 remaining after the filling of the component array is suitable for removing the above steps. First, by the above: Yuke, the stripping side, then 'blowing the remaining material of the sealant, At the same time 2 lost the package element, a package component blowing, to cool the seal The second joint is made of the sword material and the joint between the bent sealant and the encapsulant is the second kiss body. After that, the sealant is peeled off from the filling mold I294^3, doc/g glue mouth. In one embodiment of the invention, the stripping jig: the lower mold, wherein the upper mold is pressed against the lower mold: the bracket = the train column. In the present wealth, the county components = the first-venting hole and the plurality of The second two = 暇 暇 暇 纠 纠 纠 纠 纠 纠 纠 _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The blow hole design can (4) blow air to each solid seal to achieve uniform cooling effect, effectively solve the residual problem of the residual material during stripping. In addition, the array of the gripping tool can be clamped by thermal stress. The above and other objects, features and advantages of the present invention will become apparent from the following detailed description. Schematic diagram of the component array after filling. In the present embodiment, the package element array 3 (8) is formed with a plurality of encapsulated wafers (not shown) and a plurality of bodies 312' to form a plurality of packages. Package component 31〇. In addition, each of the first: the rear 310 also has a molding glue nozzle 314' and after performing the above-mentioned sealing; the queen, the filling glue 314 is formed with an encapsulating gel χ sealing residue 320. d 12 connected f-doc/g
餘料]2G有本發彡成於封裝基板搬上之封膠 即是本發明較佳實扩 一種剝料方法。圖3A至圖3C 例之剝料方法適於移除封Γ重f料方法的流程圖。本實施 封膠餘料32G。此_錢^= 3,^驗所殘留的 將圖2所示之完成封膠製程的=述.^，如圖3A所示， 料機台之承載座(未緣示)==D。。移至-剝 ; = = =封裝‘== 刪包括—下=^及===述之剝料治具 適於承载封裝元件31G(請^其中下模具· 由剝===:夹_元件陣列_之後，藉 示），以冷卻封^封^體312吹氣（如圖3B所 詳細說明。圖4是圖Γ之對剝料治具4〇0做 犯之上模具的上_下^^^見^圖认是圖 内具有多二通:圖第 具有多個第一出氣孔414 _ ^ 且下杈具410表面 道仍連通，且第一出氣孔414與第一流 來配設。因此，由ΐ!Γτ個封裝元件310(請參考圖2) 氣孔414導屮、人 級逭412導入之冷空氣可從第一出 件310。 々卻封裝元件陣列綱巾的每-個封裝元 1294规 f.doc/g 有多圖5A與圖沾，上模具4離 ^,L 424 元件310Γ往失去—出乳孔424同樣對應於每一個封裝 中，上模具月二與第f流道422連通。在本實施例 忿==:久而·!個第二“孔 可從第二出氣孔424 二'=22導入之冷空氣 孔丄==二:在籍由剝料治具_之第-吹氣 氣時，亦有元件310吹 氣。因此，封膠餘料32t 料咖吹 =料320以及每_個封裳膠體3 一二’封膠 :膠餘料320可以順利地自封裝基板地（二 此外，在冷卻封裝元件31 〇 400之上模具420會將封裝基板302塵著於下/^料治具 因此’封裝膠體312鱼封壯其此、下枳具410上。 熱應力破壞，而造成封間之接合面即不易被 在經由上述步驟來固化=:=: 之後’刪膠餘料”。與封鱗體二及:處膠體：2 10 d〇c/g 12946級 :料的過程中’本發明念所殘留之封膠 之外，同時亦利用制料户且央:出風源來冷卻封膠餘料 衣元件吹氣，使得每—個封壯二、丛以同時對每一個封 卜效解決m時封膠餘二$二到均勻冷卻的效 '而:的夹持亦可㈣免封裝元件陣列因為=力 (―)由’本發明之㈣方法有下列優點： 裴膠體可以被入:二件陣列中的封膠餘料以及每-個封 料可在剝料過程中，封膠餘 列。==;=.:;，夾持封裝元件陣 ΪΤ合…受到二的 象’進而提升縣轉之製奸率。 ⑯4的現 限定Γΐΐ發ί實施例揭露如上，然其並非用以 ，圍當視後附之申；者：本發明之保護 【圖式簡單說明】 板上之一種移除灌模後形成在封裝基 12946^^^0^ • 圖2是一封裝元件陣列灌模後的示意圖。 圖3A至圖3C是本發明較佳實施例之一種剝料方法的 流程圖。 圖4是圖3B之下模具的上視圖。 圖5A是圖3B之上模具的上視圖。 圖5B是圖3B之上模具的剖視圖。 【主要元件符號說明】 10 :封裝元件陣列 • 2〇 :出風源 110 :封裝基板 112 :封裝膠體 114 :封膠餘料 120 :晶片 210 :承載座 300 :封裝元件陣列 302 :封裝基板 φ 310 :封裝元件 312 :封裝膠體 314 :灌模膠注口 320 :封膠餘料 400 :剝料治具 410 :下模具 - 412 :第一流道 < 414 :第一出氣孔 12 12946§^f.d〇c/g 420 :上模具 422 :第二流道 424 ··第二出氣孔 426 ·•模穴Remaining material] 2G has the present invention, and the sealing material which is placed on the package substrate is a preferred method for stripping. The stripping method of the example of Figures 3A to 3C is adapted to remove the flow chart of the method for sealing the material. This implementation seals the remaining material 32G. This _ money ^ = 3, ^ test the residue of the completion of the sealing process shown in Figure 2 = ^, as shown in Figure 3A, the carrier of the machine table (not shown) == D. . Move to - strip; = = = package '== delete include - lower = ^ and = = = the stripping fixture described is suitable for carrying the package component 31G (please ^ lower mold · stripped ===: clip_component After the array_, the borrowing), the air is blown by the cooling seal 312 (as shown in FIG. 3B. FIG. 4 is the upper and lower part of the mold on the stripping tool 4〇0. ^^见^图是图 has multiple two-pass: the figure has a plurality of first air outlets 414 _ ^ and the surface of the lower cooker 410 is still connected, and the first air outlet 414 is arranged with the first flow.冷 Γ 个 个 个 个 个 个 个 个 个 个 个 个 个 个 个 个 个 个 个 个 个 个 个 个 个 个 个 个 个 个 个 逭 逭 逭 逭 412 412 412 412 412 412 412 412 412 412 412 412 412 412 412 412 The specification f.doc/g has more FIG. 5A and the image, the upper mold 4 is away from the ^, the L 424 element 310 is lost, and the milk outlet 424 is also corresponding to each package. The upper mold is connected to the f-flow channel 422 on the second month. In the present embodiment, 忿==: long time! The second "hole can be introduced from the second air outlet 424 two '=22 cold air hole 丄 == two: in the first stripping of the stripping fixture _ In the case of gas, there is also component 310 blowing. Therefore, Glue left material 32t, raw material blowing, material 320, and each _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The package substrate 302 will be dusted on the lower fixture, so that the encapsulant colloid 312 is sealed on the bottom and the lower cookware 410. The thermal stress is destroyed, and the joint surface of the seal is not easily obtained through the above steps. Curing =:=: After 'removing the residual material'. And sealing the scale body 2 and: colloid: 2 10 d〇c/g 12946 grade: in the process of the material, in addition to the sealant remaining in the invention, at the same time Also use the material households and the central: the wind source to cool the sealant residual material components to blow, so that each one seals the two, the bundles to solve the effect of each seal at the same time, the sealant is two or two to the uniform The cooling effect can be: (4) the package-free array can be used because the = force (-) by the method of (4) of the present invention has the following advantages: The ruthenium colloid can be incorporated into: the sealant in the two-piece array and each - A sealing material can be used in the stripping process, the remaining sealant. ==;=.:;, the clamping package components are combined... The rate of rape in the county. The current limit of 164 is disclosed in the above example, but it is not used, it is attached to the application; the protection of the invention [simplified description] a shift on the board Figure 2 is a schematic view of a stripping method of a preferred embodiment of the present invention. Figure 3A through Figure 3C are flow diagrams of a stripping method in accordance with a preferred embodiment of the present invention. 4 is a top view of the mold below Figure 3B. Figure 5A is a top view of the mold above Figure 3B. Figure 5B is a cross-sectional view of the mold of Figure 3B. [Main component symbol description] 10 : Package component array • 2〇: Outer source 110 : Package substrate 112 : Package colloid 114 : Sealing residue 120 : Wafer 210 : Carrier 300 : Package component array 302 : Package substrate φ 310 : package component 312 : encapsulant 314 : filling gel nozzle 320 : sealing residue 400 : stripping jig 410 : lower die - 412 : first flow path < 414 : first air outlet 12 12946§^fd〇 c/g 420: upper mold 422: second flow passage 424 · second air outlet 426 ·• mold cavity