TWI798628B - Removing mechanism, resin molding device and manufacturing method - Google Patents

Abstract

The problem to be solved by the present invention is to provide a removal mechanism capable of performing removal of an unnecessary resin portion from a resin molded product more appropriately. In order to solve this problem, the removal mechanism of this invention removes unnecessary resin part from a resin molded article. In the resin molded product, the electronic components mounted on the substrate are sealed with resin. When the resin molded product is viewed from above, the resin region includes a first region overlapping with the substrate region and a second region extending outward from the substrate region. The removal mechanism includes a receiving part, a pressing part and a fixing part. Receptacle on which a resin molded product can be placed. The pressing part pushes the resin molded product placed on the receiving part. A fixing part, which fixes the above-mentioned second area. The receiving part and the pressing part rotate while the second region is fixed by the fixing part. The pressing part includes a plurality of protruding members for pressing the resin molded product. Each of the plurality of protruding members can move up and down independently of each other.

Description

Removing mechanism, resin molding device and manufacturing method

The present invention relates to a removal mechanism, a resin molding device and a manufacturing method.

Japanese Patent Application Laid-Open No. 10-223663 (Patent Document 1) discloses an unnecessary resin separation device. The unnecessary resin separating device is configured to cut off unnecessary resin from the resin-sealed semiconductor lead frame. In this unnecessary resin separation device, the lead frame is rotated while the lead frame is clamped by the receiving table and the lead frame pressing plate, and the central residual part is pressed. Thereby, unnecessary resin is cut|disconnected from the resin-sealed semiconductor lead frame (refer patent document 1).

[Prior Art Literature] (patent documents) Patent Document 1: Japanese Patent Application Laid-Open No. 10-223663

[Problem to be solved by the invention] In the separation device disclosed in the above Patent Document 1, for example, when the separation device is not kept parallel, the deviation becomes large in each area by the pressure applied to the lead frame by the lead frame pressing plate. Also, the same thing happens, for example, when the stand and the lead frame push plate are clamped to the burr on the lead frame.

When the pressure applied to the lead frame by pressing the plate by the lead frame varies widely in each region, when the lead frame rotates, the pressure applied to the lead frame varies in some regions. As a result, in the lead frame, for example, unnecessary resin remains or the package part is damaged.

This invention was made|formed in order to solve such a problem, and it aims at performing removal of unnecessary resin part from a resin molded article more suitably.

[Technical means to solve the problem] The removing mechanism according to one aspect of the present invention is configured to be able to remove unnecessary resin portions from a resin molded product. In the resin molded product, the electronic components mounted on the substrate are sealed with resin. When the resin molded product is viewed from above, the resin region includes a first region overlapping with the substrate region and a second region extending outward from the substrate region. The removal mechanism includes a receiving part, a pressing part and a fixing part. The receiving portion is configured such that a resin molded product can be disposed thereon. The pressing part is configured to be able to press the resin molded product placed on the receiving part. The fixing part is configured to be able to fix the above-mentioned second region. The receiving part and the pressing part rotate while the second region is fixed by the fixing part. The pressing part includes a plurality of protruding members for pressing the resin molded product. Each of the plurality of protruding members can move up and down independently of each other.

A resin molding device according to another aspect of the present invention includes: a resin molding mechanism configured to manufacture a resin molded product; and the removal mechanism described above.

A method of manufacturing a resin molded article according to another aspect of the present invention is a method of manufacturing a resin molded article in which unnecessary resin portions are removed using the above-mentioned removal mechanism. This manufacturing method includes the following steps: arranging the first resin molded product on the receiving part, pressing the first resin molded product arranged on the receiving part by the pressing part, and fixing the above-mentioned first resin molded product by the fixing part. The second area, and both the receiving portion and the pressing portion are rotated in a state where the second area is fixed.

[Effect of the invention] According to the present invention, it is possible to more appropriately remove unnecessary resin portions from a resin molded product.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In addition, the same code|symbol is attached|subjected to the same or corresponding part in a figure, and the description is not repeated.

[1. Configuration of resin molding device] Fig. 1 is a diagram schematically showing the configuration of a resin molding apparatus 10 according to the present embodiment. As shown in FIG. 1 , the resin molding apparatus 10 includes a resin molding mechanism 20 , a removal mechanism 100 , and a control unit 500 .

In the resin molding mechanism 20, the manufacture of a resin molded product is performed using a transfer molding method. The resin molding mechanism 20 includes a molding die (not shown) and a mold closing mechanism (not shown) for closing the molding die. In the resin molding mechanism 20, resin molding is performed on, for example, a substrate on which electronic components such as semiconductor chips are mounted. As an example of a board|substrate, a printed circuit board and a lead frame are mentioned.

FIG. 2 is a plan view schematically showing an example of a resin molded product 200 manufactured in the resin molding mechanism 20 . FIG. 3 is a front view schematically showing an example of a resin molded product 200 . The directions indicated by the arrow symbol UDLRFB in each figure are common to other figures.

As shown in FIGS. 2 and 3 , the resin molded product 200 includes a plurality (two) of substrates 210 . The shape of each substrate 210 is rectangular in plan view. Electronic components (not shown) are mounted on each substrate 210 , and the electronic components are sealed by the sealing resin portion 220 . The two sealing resin portions 220 are continuously formed with the unnecessary resin portion 230 interposed therebetween.

The unnecessary resin portion 230 includes a plurality (four) of residue portions 232 . From each scrap part 232, two runner parts 234 extend toward the direction of the arrow symbol L, and two runner parts 234 extend toward the direction of the arrow symbol R. In the resin molded product 200 , since the unnecessary resin portion 230 includes four residue portions 232 , eight runner portions 234 extend in the direction of each arrow LR. The sealing resin part 220 overlaps with the substrate 210 in a plan view, and at least the remaining part 232 of the unnecessary resin part 230 extends from the region of the substrate 210 .

Referring again to FIG. 1 , the removing mechanism 100 is configured to cut off unnecessary resin portions 230 from the resin molded product 200 . In the removal mechanism 100, the base plate 210 is bent relative to the unnecessary resin portion 230, and the roots (joint portions) of the respective sealing resin portions 220 and the unnecessary resin portion 230 are split, thereby separating each sealing resin portion 220 from the unnecessary resin portion 230. Unnecessary resin portion 230 (so-called butterfly gate break). Thereby, unnecessary resin part 230 is removed from resin molded product 200 .

The control unit 500 includes a CPU (Central Processing Unit, Central Processing Unit), a RAM (Random Access Memory, Random Access Memory) and a ROM (Read Only Memory, Read Only Memory), and is configured to correspond to information processing Execute the control of each component. The control unit 500 is configured to control the resin molding mechanism 20 and the removing mechanism 100 . Hereinafter, the removing mechanism 100 will be described in detail.

[2. Configuration of unnecessary resin removal mechanism] FIG. 4 is a front view schematically showing the removal mechanism 100 . As shown in Figure 4, the removal mechanism 100 includes a pair of receiving parts 130, a pair of pressing parts 140, a pair of cooling parts 170, a receiving member 120, a residual material pressing member 150, and a pair of pressing part pushing parts. Compression member 160 .

The receiving portion 130 is a rectangular pedestal in plan view, and the substrate 210 is disposed on the upper portion. The receiving part 130 is configured to rotate around the receiving part rotation axis P1. The receiving portion 130 is held elastically by a tension coil spring (not shown). The receiving member 120 is a rectangular pedestal when viewed from above, and a residual part 232 is arranged on the upper part.

A pair of pressing parts 140 are provided above the pair of receiving parts 130 (direction of arrow symbol U). The substrate 210 is clamped by the receiving part 130 and the pressing part 140 , and the pressing part 140 is opposite to the receiving part 130 . The pressing part 140 rotates around a pressing part rotating shaft (not shown) in a state in which the substrate 210 is sandwiched between the receiving part 130 and the receiving part 130 . The pressing part 140 will be described in detail later.

Above the receiving member 120, a scrap pressing member 150 is provided. The residue portion 232 is clamped by the receiving member 120 and the residue pressing member 150 . Thereby, the residue part 232 is fixed.

In a state where the substrate 210 is clamped by the receiving part 130 and the pressing part 140 , cold air is blown onto the sealing resin part 220 and the runner part 234 ( FIG. 2 ) by the cooling part 170 . The sealing resin part 220 and the runner part 234 are cooled, whereby the sealing resin part 220 and the runner part 234 are hardened, and the roots of the sealing resin part 220 and the unnecessary resin part 230 are easily cracked, so the unnecessary resin part The removal of 230 is made easy.

Pressing Portion The pressing member 160 is configured to move in the vertical direction (arrow UD). If the pressing part pressing member 160 is moved downward in the state where the substrate 210 is clamped by the receiving part 130 and the pressing part 140 , and the pressing part pressing member 160 is pushed to the top of the pressing part 140 face, the pressing part 140 and the receiving part 130 are rotated.

[3. Configuration of the pressing part] FIG. 5 is a diagram schematically showing the configuration around the region A1 in FIG. 4 in the pressing portion 140 . As shown in FIG. 5 , the pressing portion 140 includes a base portion 141 and a plurality (three) of protrusion members 144 .

FIG. 6 is a front view schematically showing the protruding member 144 . As shown in FIG. 6 , in the protrusion member 144 , a plurality (three) of protrusions 302 extend downward from the base 301 . A space S1 is formed between two adjacent protrusions 302 . A plurality of (two) holes H1 and H2 are formed on the top surface of the base 301 . A cylindrical bush 146 is attached to each hole H1. A cylindrical guide 148 (FIG. 5 ) penetrates through the hole H1 and the bush 146 . An elastic member 142 is installed in the hole H2. Since the outer diameter of the guide 148 is smaller than the inner diameters of the hole H1 and the bush 146 , the protruding member 144 can move vertically relative to the base 141 .

Referring to FIG. 5 again, a plurality of protruding members 144 are each fixed to the base 141 by an individual elastic member 142 . Therefore, each of the plurality of protruding members 144 is configured to be movable up and down independently of each other. The elastic member 142 is constituted by, for example, a spring. As mentioned above, the guides 148 are located inside each hole H1 and each bushing 146 .

In the state where the substrate 210 is clamped by the pressing part 140 and the receiving part 130 , each runner part 234 is located in an individual space S1 or a space between adjacent protruding members 144 . That is, the pressing part 140 is configured to press the resin molded product 200 while avoiding the runner part 234 (unnecessary resin part 230 ).

In this way, in the pressing part 140, each of the plurality of protrusion members 144 is configured to be movable up and down independently of each other. Next, the reason why the pressing portion 140 has such a configuration will be described.

[4. The reason why the pressing part has a characteristic configuration] First, what kind of problems will arise if the pressing part 140 does not have the above-mentioned characteristic configuration will be described.

FIG. 7 is a diagram for explaining the first problem that may occur when the pressing portion 140 does not have the above-mentioned characteristic configuration. Referring to FIG. 7, in this example, the pressing portion 140X is integrally formed. That is, the pressing part 140X moves in the vertical direction integrally.

At this time, for example, if the pressing portion 140X is inclined with respect to the receiving portion 130 , the pressure applied to the substrate 210 by the pressing portion 140X varies greatly in each area. In this example, compared with the area near the arrow B direction, the pressure applied by the pressing part 140X is greater in the area close to the arrow F direction. When the receiving part 130 and the pressing part 140X rotate according to the variation in pressure, the stress generated on the resin molded product 200 is biased to a part of the region. As a result, in the resin molded product 200 , for example, unnecessary resin residues or damage to the sealing portion may occur.

FIG. 8 is a diagram for explaining the second problem that may occur when the pressing portion 140 does not have the above-mentioned characteristic configuration. Referring to FIG. 8 , in this example, the resin burr portion 235 extends from a part of the runner portion 234 . At this time, the pressing portion 140X is caught on the resin burr portion 235 .

If such a situation occurs, the pressure applied to the substrate 210 in the vicinity of the resin burr portion 235 by the pressing portion 140X is applied to the substrate 210 in a region separated from the resin burr portion 235 by the pressing portion 140X. The pressure is even greater. That is, the deviation of the pressure applied to the substrate 210 by the pressing portion 140X becomes large in each area. As a result, in the resin molded product 200 , for example, unnecessary resin residues or damage to the sealing portion may occur.

In the removing mechanism 100 according to this embodiment, since the pressing part 140 has the above-mentioned characteristic configuration, the influence of the first problem and the second problem can be reduced. Hereinafter, a detailed description will be given.

FIG. 9 is a diagram for explaining the reason why the influence of the above-mentioned first problem can be reduced in the removing mechanism 100 according to the present embodiment. Referring to FIG. 9 , in this example, the pressing portion 140 is inclined relative to the receiving portion 130 . In the pressing part 140 , each protruding member 144 can move up and down independently of each other, so even if the pressing part 140 is slightly inclined, each protruding member 144 can contact the substrate 210 . As a result, variations in the pressure applied to the substrate 210 by the pressing portion 140 in each area can be suppressed. That is, according to the removing mechanism 100 of this embodiment, when the resin molded product 200 is clamped by the pressing part 140 and the receiving part 130, it is possible to suppress the pressure applied to the substrate 210 by the pressing part 140 from being applied to each other. Deviation in the area.

FIG. 10 is a diagram for explaining the reason why the influence of the above-mentioned second problem can be reduced in the removal mechanism 100 according to the present embodiment. Referring to FIG. 10 , in this example, the resin burr portion 235 extends from a part of the runner portion 234 . In the pressing part 140, each protruding member 144 can move up and down independently of each other, so even if a part of the protruding members 144 gets stuck on the resin burr 235, the other part of the protruding members 144 will not get caught on the resin burr 235 and can contacts to the substrate 210 . As a result, variations in the pressure applied to the substrate 210 by the pressing portion 140 in each area can be suppressed. That is, according to the removing mechanism 100 of this embodiment, when the resin molded product 200 is clamped by the pressing part 140 and the receiving part 130, it is possible to suppress the pressure applied to the substrate 210 by the pressing part 140 from being applied to each other. Deviation in the area.

[5. Operation of unnecessary resin removal mechanism] FIG. 11 is a flowchart showing the removal operation of the unnecessary resin portion 230 by the removal mechanism 100 . The processing shown in this flowchart is executed, for example, by the control unit 500 included in the resin molding apparatus 10 .

Referring to FIG. 11 , the control unit 500 controls the transport mechanism (not shown) so that the resin molded product 200 is placed on the receiving unit 130 and the receiving member 120 (step S100 ). The control unit 500 controls the pair of pressing units 140 to press the substrate 210 ( FIG. 2 ) (step S110 ). The control unit 500 controls the residual material pressing member 150 so as to press the residual material part 232 (FIG. 2) (step S120). In addition, steps S110 and S120 may also be performed simultaneously, or may be performed in reverse order.

FIG. 12 is a front view schematically showing the removal mechanism 100 in a state after step S120 in FIG. 11 is executed. As shown in FIG. 12 , each substrate 210 is clamped by the pressing part 140 and the receiving part 130 , and the remaining material part 232 is clamped by the residual material pressing member 150 and the receiving member 120 . In addition, in this state, the resin molded product 200 is cooled by the cold air blown from the cooling unit 170 .

Referring to Fig. 11 again, in the state where the residue portion 232 is fixed by the residue pressing member 150 and the receiving member 120, the control unit 500 controls the pushing member 160 so that each receiving portion 130 and each The pressing parts 140 rotate individually (step S130). The pressing part pressing member 160 is lowered, and the pressing part pressing member 160 is pressed against the top surface of the pressing part 140 , whereby the receiving part 130 and the pressing part 140 are rotated respectively.

FIG. 13 is a front view schematically showing the removing mechanism 100 in a state where the receiving part 130 and the pressing part 140 are rotated. As shown in FIG. 13 , by rotating the receiving portion 130 and the pressing portion 140 , the roots of the respective sealing resin portions 220 and unnecessary resin portions 230 are split. Thereby, unnecessary resin part 230 is appropriately removed from resin molded product 200 .

[6. Features] As described above, in the removing mechanism 100 according to this embodiment, the pressing parts 140 each include a plurality of protrusion members 144 to press the resin molded product 200 . The plurality of protruding members 144 are configured to be movable up and down independently of each other.

Thereby, the deviation of the pressure applied to the substrate 210 by the pressing part 140 in each area can be suppressed. That is, according to the removing mechanism 100 of this embodiment, when the resin molded product 200 is clamped by the pressing part 140 and the receiving part 130, it is possible to suppress the pressure applied to the substrate 210 by the pressing part 140 from being applied to each other. Deviation in the area. As a result, in the resin molded product 200 , for example, it is possible to reduce the possibility of occurrence of unnecessary resin residue or damage of the sealing portion. That is, according to the removing mechanism 100 of this embodiment, the unnecessary resin part 230 can be removed appropriately from the resin molded product 200 .

Moreover, in the removing mechanism 100 according to this embodiment, the resin molded product 200 is cooled by the cooling unit 170 . If the substrate 210 is not sufficiently pressed by the pressing part 140, the linear expansion coefficients of the substrate 210 and the sealing resin part 220 are different, so that the substrate 210 warps when the resin molded product 200 is cooled. According to the removing mechanism 100 of this embodiment, the variation in the pressure applied to the substrate 210 by the pressing part 140 can be suppressed in each area, and the substrate 210 can be sufficiently pressed, so that the accompanying cooling of the resin molded product 200 can be suppressed. The warping of the substrate 210 occurs.

[7. Other embodiments] The technical idea of the above embodiment is not limited to the embodiment described above. Hereinafter, an example of other embodiments to which the technical idea of the above-mentioned embodiments can be applied will be described.

In the removing mechanism 100 according to the above embodiment, the receiving part 130 is provided below, and the pressing part 140 is provided above. However, this positional relationship is not necessarily required. For example, the pressing part 140 may be provided below and the receiving part 130 may be provided above.

In addition, in the removing mechanism 100 according to the above-mentioned embodiment, the protrusion member 144 has a plurality of protrusions 302 . However, the protrusion member 144 does not necessarily have to have a plurality of protrusions 302 . For example, instead of the protruding member 144, a protruding member having only one protruding portion having the same width as the protruding portion 302 may be used. In this case, instead of one protrusion member 144, three protrusion members are used. Different elastic members 142 are attached above the three protruding members. At this time, each protrusion can move up and down independently of each other.

In addition, in the removal device 10 according to the above-mentioned embodiment, the control of the resin molding mechanism 20 and the removal mechanism 100 is performed by the control unit 500 . However, the control of the resin molding mechanism 20 and the removal mechanism 100 does not necessarily have to be performed by the common control unit 500 . For example, the resin molding mechanism 20 and the removal mechanism 100 may each have a dedicated control unit.

Moreover, in the removal mechanism 100 according to the above-mentioned embodiment, the resin molded product 200 includes a plurality of (two) substrates 210 . However, the resin molded product 200 does not necessarily have to include a plurality of substrates 210 . For example, the resin molded product 200 may include an odd number of substrates 210 , that is, a so-called configuration one at a time. In this case, the pressing part 140 and the receiving part 130 may not be provided as a pair, but may be provided as an odd number.

In addition, in the removal mechanism 100 according to the above-mentioned embodiment, the cooling unit 170 is provided independently of other parts. However, the cooling unit 170 does not necessarily have to be provided independently of other parts. For example, the cooling unit 170 may be built in at least one of the pressing unit 140 and the residue pressing member 150 .

As mentioned above, the embodiment of this invention was demonstrated exemplarily. That is, the detailed description and the drawings are disclosed for the purpose of explaining an example. Therefore, in the detailed description and the constituent members described in the drawings, constituent members that are unnecessary for solving the problem may be included. Therefore, although these unnecessary constituent members are described in the detailed description and the drawings, these unnecessary constituent members should not be directly regarded as essential.

In addition, the above-mentioned embodiments are merely illustrations of the present invention as a whole. Various modifications and changes can be made to the above-described embodiments within the scope of the present invention. That is, when implementing the present invention, specific configurations can be appropriately adopted according to the embodiment.

10: Resin molding device 20: Resin forming mechanism 100:Remove mechanism 120: bearing member 130: receiving part 140,140X: Pushing part 141,301: base 142: Elastic member 144: protruding member 146: Bushing 148: guide 150: residual material pushing member 160: pushing part pushing member 170: cooling department 200: Resin molded product 210: Substrate 220:Sealing resin department 230: Unnecessary resin part 232: Residue department 234: sprue department 235: resin burrs 302: protrusion 500: control department A1: area H1, H2: hole P1: Receiving part rotation axis S1: space

Fig. 1 is a diagram schematically showing the configuration of a resin molding device. Fig. 2 is a plan view schematically showing an example of a resin molded product manufactured in a resin molding mechanism. Fig. 3 is a front view schematically showing an example of a resin molded product. Fig. 4 is a front view schematically showing the removal mechanism. Fig. 5 is a diagram schematically showing the configuration of a part of the pressing portion. Fig. 6 is a front view schematically showing a protrusion member. FIG. 7 is a diagram for explaining a first problem that may occur when the pressing portion does not have a characteristic configuration. FIG. 8 is a diagram for explaining a second problem that may occur when the pressing portion does not have a characteristic configuration. FIG. 9 is a diagram for explaining the reason why the influence of the first problem can be reduced. FIG. 10 is a diagram for explaining the reason why the influence of the second problem can be reduced. Fig. 11 is a flowchart showing the operation of removing unnecessary resin portions by the removing mechanism. Fig. 12 is a front view schematically showing the removal mechanism in a state after step S120 in Fig. 11 is executed. Fig. 13 is a front view schematically showing the removing mechanism in a state where the receiving part and the pressing part are rotated.

Domestic deposit information (please note in order of depositor, date, and number) none

Overseas storage information (please note in order of storage country, organization, date, and number) none

130: receiving part

140: Pushing part

141: base

142: Elastic member

144: protruding member

146: Bushing

148: guide

200: Resin molded products

210: Substrate

234: sprue department

H1: hole

S1: space

Claims (6)

A removal mechanism configured to remove unnecessary resin portions from a resin molded product; in the resin molded product, an electronic component mounted on a substrate is sealed by resin; when the resin molded product is viewed from above, the resin The region includes a first region overlapping with the region of the substrate and a second region extending outward from the region of the substrate; the removal mechanism includes: a receiving portion configured to place the resin molded product on it; The pressing part is configured to push the aforementioned resin molded product disposed on the aforementioned receiving part; and the fixing part is configured to fix the aforementioned second region; wherein the aforementioned receiving part and the aforementioned pressing part are configured as The second region can be rotated while being fixed by the fixing part; and the pressing part has a base; and, a plurality of protruding members are provided on the base to push the resin molded product; The plurality of protruding members are arranged along one side of the unnecessary resin portion of the substrate in plan view, and each of the plurality of protruding members can move up and down independently of each other relative to the base. The removing mechanism according to claim 1, wherein the pressing portion is configured to push the resin molded product while avoiding the unnecessary resin portion. The removing mechanism according to claim 1 or 2, wherein the pressing part further includes a first elastic member and a second elastic member; and, the plurality of protruding members include a first protruding member and a second protruding member; The first protruding member is fixed to the base by the first elastic member; the second protruding member is fixed to the base by the second elastic member. The removing mechanism according to claim 1 or 2, further comprising a cooling unit configured to cool the resin molded product. A resin molding device comprising: a resin molding mechanism configured to manufacture a resin molded product; and the removing mechanism according to any one of claims 1 to 4. A method of manufacturing a resin molded product, which is a method of manufacturing a resin molded product in which unnecessary resin portions are removed using the removing mechanism described in any one of claims 1 to 4, comprising the steps of: removing the aforementioned resin molded product Arranged on the receiving portion, push the resin molded product disposed on the receiving portion by the pressing portion, fix the second region by the fixing portion, and fix the second region In this state, both the receiving portion and the pressing portion are rotated.

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