TW202202297A - Removal mechanism, resin molding apparatus, and manufacturing method - Google Patents

Removal mechanism, resin molding apparatus, and manufacturing method Download PDF

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TW202202297A
TW202202297A TW110102955A TW110102955A TW202202297A TW 202202297 A TW202202297 A TW 202202297A TW 110102955 A TW110102955 A TW 110102955A TW 110102955 A TW110102955 A TW 110102955A TW 202202297 A TW202202297 A TW 202202297A
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resin
resin molded
molded product
region
pressing
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TW110102955A
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Chinese (zh)
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TWI798628B (en
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吉田周平
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日商Ｔｏｗａ股份有限公司
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F3/00—Severing by means other than cutting; Apparatus therefor
    • B26F3/04—Severing by squeezing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/01—Means for holding or positioning work
    • B26D7/02—Means for holding or positioning work with clamping means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/16—Cooling
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/38—Cutting-off equipment for sprues or ingates
    • B29C45/382—Cutting-off equipment for sprues or ingates disposed outside the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/72—Heating or cooling
    • B29C45/7207—Heating or cooling of the moulded articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/16—Cooling
    • B29C2035/1658—Cooling using gas
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
    • Y02W30/00—Technologies for solid waste management
    • Y02W30/50—Reuse, recycling or recovery technologies
    • Y02W30/62—Plastics recycling; Rubber recycling

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Thermal Sciences (AREA)
  • Oral & Maxillofacial Surgery (AREA)
  • Health & Medical Sciences (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

The present invention relates to a removal mechanism, a resin molding apparatus, and a manufacturing method for more appropriately removing useless resin portions from a resin molded article. The removal mechanism removes the useless resin portion from the resin molded article. In the resin molded article, an electronic component mounted on a substrate is sealed with a resin. In a plan view of the resin molded article, the region of the resin includes a first region overlapping the region of the substrate and a second region extending outward from the region of the substrate. The removal mechanism includes a bearing portion, a pressing portion, and a fixing portion. The resin molded article is disposed on the bearing portion. The pressing portion presses the resin molded article disposed on the bearing portion. The fixing part fixes the second region. The bearing part and the pressing part rotate in a state in which the second region is fixed by the fixing part. The pressing portion includes a plurality of protruding members that press the resin molded article. The plurality of protruding members move up and down independently of each other.

Description

去除機構、樹脂成形裝置及製造方法Removal mechanism, resin molding device, and manufacturing method

本發明關於一種去除機構、樹脂成形裝置及製造方法。The present invention relates to a removal mechanism, a resin molding apparatus, and a manufacturing method.

日本特開平10-223663號公報(專利文獻1)，揭露一種不必要的樹脂的分離裝置。此不必要的樹脂的分離裝置，構成為可自被樹脂密封的半導體導線框架切離不必要的樹脂。在此不必要的樹脂的分離裝置中，在藉由承受台與導線框架推壓板來夾持(clamp)導線框架，且中央殘料部被推壓的狀態下，使導線框架轉動。藉此，自被樹脂密封的半導體導線框架切離不必要的樹脂(參照專利文獻1)。Japanese Patent Laid-Open No. 10-223663 (Patent Document 1) discloses an unnecessary resin separation device. This unnecessary resin separation device is configured to be capable of cutting out unnecessary resin from the resin-sealed semiconductor lead frame. In this unnecessary resin separation device, the lead frame is rotated in a state where the lead frame is clamped by the receiving table and the lead frame pressing plate, and the center residual portion is pressed. Thereby, unnecessary resin is cut|disconnected from the resin-sealed semiconductor lead frame (refer patent document 1).

[先前技術文獻] (專利文獻) 專利文獻1：日本特開平10-223663號公報[Prior Art Literature] (patent literature) Patent Document 1: Japanese Patent Application Laid-Open No. 10-223663

[發明所欲解決的問題] 在上述專利文獻1所揭露的分離裝置中，例如當分離裝置沒有保持平行時，藉由導線框架推壓板而施加到導線框架上的壓力，在每個區域中的偏差變大。又，例如當承受台與導線框架推壓板夾持到在導線框架上的毛邊時，也會發生同樣的事情。[Problems to be Solved by Invention] In the separation device disclosed in the above-mentioned Patent Document 1, for example, when the separation device is not kept parallel, the pressure applied to the lead frame by the lead frame pressing plate has a large deviation in each region. Also, the same thing occurs when, for example, the receiving base and the lead frame pressing plate are clamped to the burrs on the lead frame.

在藉由導線框架推壓板而施加到導線框架上的壓力，在每個區域中的偏差變大的情況，當導線框架轉動時，在導線框架上產生的壓力，在一部分的區域中發生偏差。其結果，在導線框架中，例如會產生不必要的樹脂的殘留、或封裝部的破損。When the pressure applied to the lead frame by the lead frame pressing plate has a large deviation in each area, when the lead frame is rotated, the pressure generated on the lead frame is deviated in a part of the area. As a result, in the lead frame, for example, unnecessary resin residues or damage to the package may occur.

本發明是為了解決這種問題而完成，其目的在於可更適當地實行自樹脂成形品除去不必要的樹脂部。The present invention has been made to solve such a problem, and an object thereof is to more appropriately remove unnecessary resin portions from a resin molded product.

[解決問題的技術手段] 依據本發明的一形態的去除機構，構成為可自樹脂成形品除去不必要的樹脂部。在樹脂成形品中，藉由樹脂來密封被構裝在基板上的電子零件。當俯視樹脂成形品時，樹脂的區域，包含與基板的區域重疊的第一區域、及自基板的區域往外延伸的第二區域。去除機構，具備承受部、推壓部及固定部。承受部，構成為其上可配置樹脂成形品。推壓部，構成為可推壓被配置於承受部上之樹脂成形品。固定部，構成為可固定上述第二區域。承受部和推壓部，在藉由固定部來固定上述第二區域的狀態下轉動。推壓部，具備複數個突起構件，以推壓樹脂成形品。複數個突起構件，各自可互相獨立地上下移動。[Technical means to solve the problem] According to the removal mechanism of one aspect of this invention, it is comprised so that an unnecessary resin part can be removed from a resin molded product. In the resin molded product, the electronic components mounted on the substrate are sealed with resin. The resin region includes a first region overlapping with the substrate region and a second region extending outward from the substrate region in a plan view of the resin molded product. The removal mechanism includes a receiving portion, a pressing portion, and a fixing portion. The receiving portion is configured so that a resin molded product can be placed thereon. The pressing portion is configured to be capable of pressing the resin molded product placed on the receiving portion. The fixing portion is configured to be capable of fixing the second region. The receiving portion and the pressing portion rotate in a state where the second region is fixed by the fixing portion. The pressing portion includes a plurality of protruding members for pressing the resin molded product. Each of the plurality of protruding members can move up and down independently of each other.

依據本發明的其他形態的樹脂成形裝置，具備：樹脂成形機構，其構成為可製造樹脂成形品；及，上述去除機構。A resin molding apparatus according to another aspect of the present invention includes: a resin molding mechanism configured to be capable of producing a resin molded product; and the above-described removal mechanism.

依據本發明的其他形態的樹脂成形品的製造方法，是使用上述去除機構來將不必要的樹脂部除去之樹脂成形品的製造方法。此製造方法，包含下述步驟：將第一樹脂成形品配置在承受部上、藉由推壓部來推壓已配置於承受部上之第一樹脂成形品、藉由固定部來固定上述第二區域、及在已固定上述第二區域的狀態下使承受部和推壓部雙方轉動。According to another aspect of the present invention, a method for producing a resin molded article is a method for producing a resin molded article in which unnecessary resin portions are removed using the above-mentioned removing mechanism. This manufacturing method includes the steps of: arranging a first resin molded product on a receiving portion, pressing the first resin molded product placed on the receiving portion by a pressing portion, and fixing the first resin molded product by a fixing portion. Two regions, and both the receiving portion and the pressing portion are rotated in a state in which the second region is fixed.

[發明的效果] 依據本發明，能夠更適當地實行自樹脂成形品除去不必要的樹脂部。[Effect of invention] According to the present invention, it is possible to more appropriately remove the unnecessary resin portion from the resin molded product.

以下，參照圖式並詳細地說明本發明的實施形態。另外，對於圖中的相同或相當部分賦予相同符號且不重複其說明。Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In addition, the same code|symbol is attached|subjected to the same or corresponding part in a figure, and the description is not repeated.

[1.樹脂成形裝置的構成] 第1圖是概略地表示依據本實施形態的樹脂成形裝置10的構成的圖。如第1圖所示，樹脂成形裝置10，包含樹脂成形機構20、去除機構100、及控制部500。[1. Configuration of resin molding apparatus] FIG. 1 is a diagram schematically showing the configuration of a resin molding apparatus 10 according to the present embodiment. As shown in FIG. 1 , the resin molding apparatus 10 includes a resin molding mechanism 20 , a removing mechanism 100 , and a control unit 500 .

在樹脂成形機構20中，使用轉移模製法來實行樹脂成形品的製造。樹脂成形機構20，具備成形模具(未圖示)、及將該成形模具加以閉模之閉模機構(未圖示)。在樹脂成形機構20中，例如對於已構裝有半導體晶片等電子零件之基板進行樹脂成形。作為基板的一例，舉例為印刷電路基板及導線框架。In the resin molding mechanism 20, a transfer molding method is used to manufacture a resin molding. The resin molding mechanism 20 includes a molding die (not shown) and a mold closing mechanism (not shown) that closes the molding die. In the resin molding mechanism 20, for example, resin molding is performed on a substrate on which electronic components such as a semiconductor wafer are mounted. As an example of a board|substrate, a printed circuit board and a lead frame are mentioned.

第2圖是概略地表示在樹脂成形機構20中製造的樹脂成形品200的一例的平面圖。第3圖是概略地表示樹脂成形品200的一例的正面圖。各圖式中的箭頭符號UDLRFB的各自指示的方向，在其他圖式中也是共通的。FIG. 2 is a plan view schematically showing an example of a resin molded product 200 produced by the resin molding mechanism 20 . FIG. 3 is a front view schematically showing an example of the resin molded product 200 . The directions indicated by the arrow symbols UDLRFB in each drawing are also common to other drawings.

如第2圖和第3圖所示，樹脂成形品200，包含複數個(2個)基板210。各基板210的形狀，當俯視時呈矩形狀。電子零件(未圖示)，被構裝在各基板210上，並藉由密封樹脂部220來密封電子零件。2個密封樹脂部220，隔著不必要的樹脂部230而被連續地形成。As shown in FIGS. 2 and 3 , the resin molded product 200 includes a plurality of (two) substrates 210 . The shape of each substrate 210 is rectangular in plan view. Electronic components (not shown) are mounted on the respective substrates 210 , and the electronic components are sealed by the sealing resin portion 220 . The two sealing resin portions 220 are formed continuously with the unnecessary resin portions 230 interposed therebetween.

不必要的樹脂部230，包含複數個(4個)殘料部232。自各殘料部232，朝向箭頭符號L方向延伸出2條澆道部234，且朝向箭頭符號R方向延伸出2條澆道部234。在樹脂成形品200中，不必要的樹脂部230包含4個殘料部232，所以在各箭頭符號LR方向上延伸有8條澆道部234。當俯視時，密封樹脂部220與基板210重疊，不必要的樹脂部230之中的至少殘料部232自基板210的區域延伸出去。The unnecessary resin part 230 includes a plurality of (four) residual parts 232 . From each residual material portion 232, two runner portions 234 extend in the direction of arrow L, and two runner portions 234 extend in the direction of arrow R. In the resin molded product 200, since the unnecessary resin part 230 includes four residual parts 232, eight runner parts 234 extend in the directions of the respective arrows LR. The sealing resin portion 220 overlaps with the substrate 210 in a plan view, and at least the residual material portion 232 of the unnecessary resin portions 230 extends from the region of the substrate 210 .

再次參照第1圖，去除機構100，構成為可自樹脂成形品200切離不必要的樹脂部230。在去除機構100中，基板210相對於不必要的樹脂部230彎折，使各密封樹脂部220與不必要的樹脂部230的根部(連結部)裂開，藉此分離各密封樹脂部220與不必要的樹脂部230(所謂的蝶形式澆口斷開(gate break))。藉此，自樹脂成形品200除去不必要的樹脂部230。Referring again to FIG. 1 , the removal mechanism 100 is configured to be capable of cutting off the unnecessary resin portion 230 from the resin molded product 200 . In the removal mechanism 100 , the substrate 210 is bent relative to the unnecessary resin portion 230 to split the root portion (connection portion) of each sealing resin portion 220 and the unnecessary resin portion 230 , thereby separating each sealing resin portion 220 and Unnecessary resin portion 230 (so-called butterfly gate break). Thereby, the unnecessary resin portion 230 is removed from the resin molded product 200 .

控制部500，包含CPU(中央處理單元，Central Processing Unit)、RAM(隨機存取記憶體，Random Access Memory)及ROM(唯讀記憶體，Read Only Memory)，並構成為可對應於資訊處理來實行各構成元件的控制。控制部500，構成為可控制樹脂成形機構20和去除機構100。以下，詳細地說明去除機構100。The control unit 500 includes a CPU (Central Processing Unit, Central Processing Unit), a RAM (Random Access Memory, Random Access Memory), and a ROM (Read Only Memory, Read Only Memory), and is configured to correspond to information processing. Control of each constituent element is carried out. The control unit 500 is configured to control the resin molding mechanism 20 and the removing mechanism 100 . Hereinafter, the removal mechanism 100 will be described in detail.

[2.不必要的樹脂的去除機構的構成] 第4圖是概略地表示去除機構100的正面圖。如第4圖所示，去除機構100，包含一對的承受部130、一對的推壓部140、一對的冷卻部170、承受構件120、殘料推壓構件150、及推壓部推壓構件160。[2. Configuration of unnecessary resin removal mechanism] FIG. 4 is a front view schematically showing the removal mechanism 100 . As shown in FIG. 4, the removal mechanism 100 includes a pair of receiving parts 130, a pair of pressing parts 140, a pair of cooling parts 170, a receiving member 120, a residual material pressing member 150, and a pressing part pressing pressing member 160 .

承受部130，是當俯視時呈矩形狀的台座，在上部配置有基板210。承受部130，構成為以承受部旋轉軸P1為中心而轉動。承受部130，藉由拉伸線圈彈簧(未圖示)而被保持成有彈性。承受構件120，是當俯視時呈矩形狀的台座，在上部配置有殘料部232。The receiving portion 130 is a pedestal having a rectangular shape in plan view, and the substrate 210 is arranged on the upper portion. The receiving portion 130 is configured to rotate about the receiving portion rotation axis P1. The receiving portion 130 is held elastically by a tension coil spring (not shown). The receiving member 120 is a pedestal having a rectangular shape in plan view, and a residual material portion 232 is arranged on the upper portion.

在一對的承受部130的上方(箭頭符號U方向)，設置有一對的推壓部140。藉由承受部130與推壓部140來夾住基板210，該推壓部140對向於該承受部130。推壓部140，在構成為與承受部130之間夾住基板210的狀態下，以推壓部旋轉軸(未圖示)為中心而轉動。對於推壓部140，詳細說明於後。A pair of pressing portions 140 are provided above the pair of receiving portions 130 (in the direction of arrow U). The substrate 210 is clamped by the receiving portion 130 and the pressing portion 140 , and the pressing portion 140 faces the receiving portion 130 . The pressing portion 140 is configured to rotate around a pressing portion rotating shaft (not shown) in a state where the substrate 210 is sandwiched between the receiving portion 130 and the receiving portion 130 . The pressing portion 140 will be described in detail later.

在承受構件120的上方，設置有殘料推壓構件150。藉由承受構件120與殘料推壓構件150來夾住殘料部232。藉此，固定殘料部232。Above the receiving member 120, a residual material pressing member 150 is provided. The residual material portion 232 is sandwiched by the receiving member 120 and the residual material pressing member 150 . Thereby, the residual material part 232 is fixed.

在藉由承受部130與推壓部140來夾住基板210的狀態下，藉由冷卻部170來將冷風吹到密封樹脂部220和澆道部234(第2圖)上。密封樹脂部220和澆道部234被冷卻，藉此使密封樹脂部220和澆道部234硬化，使密封樹脂部220和不必要的樹脂部230的根部容易裂開，所以不必要的樹脂部230的除去成為容易。In a state where the substrate 210 is sandwiched by the receiving portion 130 and the pressing portion 140 , the cooling portion 170 blows cold air onto the sealing resin portion 220 and the runner portion 234 ( FIG. 2 ). The sealing resin portion 220 and the runner portion 234 are cooled, whereby the sealing resin portion 220 and the runner portion 234 are hardened, and the roots of the sealing resin portion 220 and the unnecessary resin portion 230 are easily split, so the unnecessary resin portion Removal of 230 becomes easy.

推壓部推壓構件160，構成為在上下方向(箭頭符號UD)上移動。若在藉由承受部130與推壓部140來夾住基板210的狀態下使推壓部推壓構件160往下方移動，且將推壓部推壓構件160推壓到推壓部140的頂面，則使推壓部140和承受部130轉動。The pressing portion pressing member 160 is configured to move in the up-down direction (arrow symbol UD). When the substrate 210 is sandwiched between the receiving portion 130 and the pressing portion 140 , the pressing portion pressing member 160 is moved downward, and the pressing portion pressing member 160 is pressed to the top of the pressing portion 140 . the surface, the pressing part 140 and the receiving part 130 are rotated.

[3.推壓部的構成] 第5圖是概略地表示推壓部140之中的第4圖的區域A1周圍的構成的圖。如第5圖所示，推壓部140，包含基部141和複數個(3個)突起構件144。[3. Configuration of the pressing part] FIG. 5 is a diagram schematically showing a configuration around the area A1 of FIG. 4 in the pressing portion 140 . As shown in FIG. 5 , the pressing portion 140 includes a base portion 141 and a plurality of (three) protruding members 144 .

第6圖是概略地表示突起構件144的正面圖。如第6圖所示，在突起構件144中，複數個(3個)突起部302自基部301往下方延伸。在相鄰的兩個突起部302之間形成有空間S1。在基部301的頂面，形成有複數個(2個)孔H1、孔H2。在各孔H1中安裝有圓筒狀的襯套146。在孔H1和襯套146內，貫穿有圓筒狀的導件148(第5圖)。在孔H2中安裝有彈性構件142。導件148的外徑，比孔H1和襯套146的內徑小，所以突起構件144可相對於基部141在上下方向移動。FIG. 6 is a front view schematically showing the protruding member 144 . As shown in FIG. 6 , in the protruding member 144 , a plurality of (three) protruding portions 302 extend downward from the base portion 301 . A space S1 is formed between two adjacent protrusions 302 . A plurality of (two) holes H1 and H2 are formed on the top surface of the base portion 301 . A cylindrical bush 146 is attached to each hole H1. A cylindrical guide 148 ( FIG. 5 ) is inserted through the hole H1 and the bush 146 . An elastic member 142 is installed in the hole H2. Since the outer diameter of the guide 148 is smaller than the inner diameter of the hole H1 and the bush 146 , the protruding member 144 can move up and down with respect to the base 141 .

再次參照第5圖，複數個突起構件144，各自藉由個別的彈性構件142而被固定於基部141。因此，複數個突起構件144，各自構成為可互相獨立地上下移動。彈性構件142，例如以彈簧來構成。如上述，導件148位於各孔H1和各襯套146的內側。Referring to FIG. 5 again, the plurality of protruding members 144 are each fixed to the base portion 141 by the respective elastic members 142 . Therefore, each of the plurality of protruding members 144 is configured to be movable up and down independently of each other. The elastic member 142 is constituted by, for example, a spring. As described above, the guides 148 are located inside each of the holes H1 and each of the bushes 146 .

在藉由推壓部140與承受部130來夾住基板210的狀態下，各澆道部234位於個別的空間S1、或相鄰的突起構件144之間的空間。亦即，推壓部140，構成為避開澆道部234(不必要的樹脂部230)並推壓樹脂成形品200。In a state in which the substrate 210 is sandwiched by the pressing portion 140 and the receiving portion 130 , each runner portion 234 is located in an individual space S1 or a space between adjacent protruding members 144 . That is, the pressing portion 140 is configured to press the resin molded product 200 while avoiding the runner portion 234 (unnecessary resin portion 230 ).

這樣一來，在推壓部140中，複數個突起構件144，各自構成為可互相獨立地上下移動。接著說明，使推壓部140具有這種構成的理由。In this way, in the pressing portion 140, the plurality of protruding members 144 are each configured to be movable up and down independently of each other. Next, the reason why the pressing portion 140 has such a configuration will be described.

[4.推壓部具有特徵的構成的理由] 首先，對於假如推壓部140不具有上述特徵的構成的情況會產生的何種問題進行說明。[4. Reasons for the characteristic configuration of the pressing portion] First, what kind of problems will occur if the pressing portion 140 does not have the above-described configuration will be described.

第7圖是用以說明當推壓部140不具有上述特徵的構成時可能產生的第一問題的圖。參照第7圖，在此例中，推壓部140X是一體成形。亦即，推壓部140X成一體地在上下方向移動。FIG. 7 is a diagram for explaining a first problem that may occur when the pressing portion 140 does not have the above-described configuration. Referring to FIG. 7, in this example, the pressing portion 140X is integrally formed. That is, the pressing portion 140X integrally moves in the vertical direction.

此時，例如，若推壓部140X相對於承受部130傾斜，則藉由推壓部140X施加到基板210上的壓力在每個區域中的偏差變大。在此例中，相較於靠近箭頭符號B方向的區域，藉由推壓部140X施加到靠近箭頭符號F方向的區域中的壓力較大。對應於壓力的偏差變大，當承受部130和推壓部140X轉動時，在樹脂成形品200上產生的應力會偏向一部分的區域中。其結果，在樹脂成形品200中，例如會產生不必要的樹脂的殘留、或封裝部的破損。At this time, for example, if the pressing portion 140X is inclined with respect to the receiving portion 130 , the variation of the pressure applied to the substrate 210 by the pressing portion 140X in each region becomes large. In this example, the pressure applied by the pressing portion 140X to the area near the direction of the arrow F is larger than that of the area near the direction of the arrow B. FIG. As the deviation of the pressure increases, when the receiving portion 130 and the pressing portion 140X are rotated, the stress generated in the resin molded product 200 is deviated to a part of the region. As a result, in the resin molded product 200 , for example, unnecessary resin residues or damage to the sealing portion may occur.

第8圖是用以說明當推壓部140不具有上述特徵的構成時可能產生的第二問題的圖。參照第8圖，在此例中，樹脂毛邊部235自一部分的澆道部234延伸。此時，推壓部140X會卡到樹脂毛邊部235。FIG. 8 is a diagram for explaining a second problem that may occur when the pressing portion 140 does not have the above-described configuration. Referring to FIG. 8 , in this example, the resin flash portion 235 extends from a part of the runner portion 234 . At this time, the pressing portion 140X is caught in the resin burr portion 235 .

若產生這種事態，則藉由推壓部140X在樹脂毛邊部235附近的施加到基板210上的壓力，比藉由推壓部140X在自樹脂毛邊部235較為離開的區域中施加到基板210上的壓力更大。亦即，藉由推壓部140X施加到基板210上的壓力在每個區域中的偏差變大。其結果，在樹脂成形品200中，例如會產生不必要的樹脂的殘留、或封裝部的破損。If such a situation occurs, the pressure applied to the substrate 210 by the pressing portion 140X in the vicinity of the resin burr portion 235 is applied to the substrate 210 in a region farther away from the resin burr portion 235 by the pressing portion 140X than by the pressing portion 140X. more pressure on. That is, the variation in the pressure applied to the substrate 210 by the pressing portion 140X in each region becomes larger. As a result, in the resin molded product 200 , for example, unnecessary resin residues or damage to the sealing portion may occur.

在依據本實施形態的去除機構100中，推壓部140具有上述特徵的構成，所以可減少第一問題和第二問題所造成的影響。以下，進行詳細的說明。In the removing mechanism 100 according to the present embodiment, since the pressing portion 140 has the above-described characteristic configuration, the influence of the first problem and the second problem can be reduced. Hereinafter, a detailed description will be given.

第9圖是用以說明在依據本實施形態的去除機構100中可減少上述第一問題所造成的影響的理由的圖。參照第9圖，在此例中，推壓部140相對於承受部130傾斜。在推壓部140中，各突起構件144可互相獨立地上下移動，所以即便推壓部140有稍微的傾斜，各突起構件144也可接觸至基板210。其結果，可抑制藉由推壓部140施加到基板210上的壓力在每個區域中的偏差。亦即，依據本實施形態的去除機構100，當藉由推壓部140與承受部130來夾住樹脂成形品200時，能夠抑制藉由推壓部140施加到基板210上的壓力在每個區域中的偏差。FIG. 9 is a diagram for explaining the reason why the influence of the above-mentioned first problem can be reduced in the removal mechanism 100 according to the present embodiment. Referring to FIG. 9 , in this example, the pressing portion 140 is inclined relative to the receiving portion 130 . In the pressing portion 140 , each of the protruding members 144 can move up and down independently of each other, so even if the pressing portion 140 is slightly inclined, each of the protruding members 144 can come into contact with the substrate 210 . As a result, the variation of the pressure applied to the substrate 210 by the pressing portion 140 in each region can be suppressed. That is, according to the removing mechanism 100 of the present embodiment, when the resin molded product 200 is sandwiched by the pressing portion 140 and the receiving portion 130, it is possible to suppress the pressure applied to the substrate 210 by the pressing portion 140 from appearing in each case. deviations in the region.

第10圖是用以說明在依據本實施形態的去除機構100中可減少上述第二問題所造成的影響的理由的圖。參照第10圖，在此例中，樹脂毛邊部235自一部分的澆道部234延伸。在推壓部140中，各突起構件144可互相獨立地上下移動，所以即便一部分的突起構件144會卡到樹脂毛邊部235，其他部分的突起構件144也不會卡到樹脂毛邊部235而可接觸至基板210。其結果，可抑制藉由推壓部140施加到基板210上的壓力在每個區域中的偏差。亦即，依據本實施形態的去除機構100，當藉由推壓部140與承受部130來夾住樹脂成形品200時，能夠抑制藉由推壓部140施加到基板210上的壓力在每個區域中的偏差。FIG. 10 is a diagram for explaining the reason why the influence of the above-mentioned second problem can be reduced in the removal mechanism 100 according to the present embodiment. Referring to FIG. 10 , in this example, the resin flash portion 235 extends from a part of the runner portion 234 . In the pressing portion 140, each protruding member 144 can move up and down independently of each other, so even if a part of the protruding members 144 is caught in the resin burr portion 235, the other part of the protruding member 144 will not be caught in the resin burr portion 235 and can be contacted to the substrate 210 . As a result, the variation of the pressure applied to the substrate 210 by the pressing portion 140 in each region can be suppressed. That is, according to the removing mechanism 100 of the present embodiment, when the resin molded product 200 is sandwiched by the pressing portion 140 and the receiving portion 130, it is possible to suppress the pressure applied to the substrate 210 by the pressing portion 140 from appearing in each case. deviations in the region.

[5.不必要的樹脂的去除機構的動作] 第11圖是表示去除機構100所進行的不必要的樹脂部230的除去動作的流程圖。此流程圖所示的處理，例如藉由在樹脂成形裝置10中包含的控制部500來實行。[5. Operation of unnecessary resin removal mechanism] FIG. 11 is a flowchart showing the operation of removing the unnecessary resin portion 230 by the removing mechanism 100 . The processing shown in this flowchart is executed, for example, by the control unit 500 included in the resin molding apparatus 10 .

參照第11圖，控制部500，控制搬送機構(未圖示)，以將樹脂成形品200配置在承受部130和承受構件120上(步驟S100)。控制部500，控制一對的推壓部140，以推壓基板210(第2圖)(步驟S110)。控制部500，控制殘料推壓構件150，以推壓殘料部232(第2圖)(步驟S120)。另外步驟S110、S120，也可以同時地實行，也可以相反順序地實行。11, the control part 500 controls a conveyance mechanism (not shown) so that the resin molded product 200 is arrange|positioned on the receiving part 130 and the receiving member 120 (step S100). The control unit 500 controls the pair of pressing units 140 to press the substrate 210 (FIG. 2) (step S110). The control part 500 controls the residual material pressing member 150 to press the residual material part 232 (FIG. 2) (step S120). In addition, steps S110 and S120 may be performed simultaneously, or may be performed in reverse order.

第12圖是概略地表示在實行第11圖中的步驟S120之後的狀態的去除機構100的正面圖。如第12圖所示，藉由推壓部140與承受部130來夾住各基板210，藉由殘料推壓構件150與承受構件120來夾住殘料部232。另外，在此狀態下，藉由自冷卻部170噴吹的冷風來冷卻樹脂成形品200。FIG. 12 is a front view schematically showing the removal mechanism 100 in a state after step S120 in FIG. 11 is executed. As shown in FIG. 12 , each substrate 210 is sandwiched by the pressing portion 140 and the receiving portion 130 , and the residual portion 232 is sandwiched by the residual pressing member 150 and the receiving member 120 . In addition, in this state, the resin molded product 200 is cooled by the cold air blown from the cooling unit 170 .

再度參照第11圖，在藉由殘料推壓構件150和承受構件120來固定殘料部232的狀態下，控制部500，控制推壓部推壓構件160，以使各承受部130和各推壓部140各自轉動(步驟S130)。使推壓部推壓構件160下降，並使推壓部推壓構件160對推壓部140的頂面進行推壓，藉此使承受部130和推壓部140各自轉動。Referring to FIG. 11 again, in a state where the residual material portion 232 is fixed by the residual material pressing member 150 and the receiving member 120, the control portion 500 controls the pressing portion pressing member 160 so that each receiving portion 130 and each The pressing parts 140 are each rotated (step S130). The receiving portion 130 and the pressing portion 140 are each rotated by lowering the pressing portion pressing member 160 and pressing the pressing portion pressing member 160 against the top surface of the pressing portion 140 .

第13圖是概略地表示在承受部130和推壓部140已轉動的狀態下的去除機構100的正面圖。如第13圖所示，使承受部130和推壓部140轉動，藉此使各密封樹脂部220與不必要的樹脂部230的根部裂開。藉此，自樹脂成形品200適當地除去不必要的樹脂部230。FIG. 13 is a front view schematically showing the removal mechanism 100 in a state in which the receiving portion 130 and the pressing portion 140 are rotated. As shown in FIG. 13 , each of the sealing resin portions 220 and the roots of the unnecessary resin portions 230 are split by rotating the receiving portion 130 and the pressing portion 140 . Thereby, the unnecessary resin portion 230 is appropriately removed from the resin molded product 200 .

[6.特徵] 如以上所述，在依據本實施形態的去除機構100中，推壓部140，各自具備複數個突起構件144，以推壓樹脂成形品200。複數個突起構件144，各自構成為可互相獨立地上下移動。[6. Features] As described above, in the removing mechanism 100 according to the present embodiment, the pressing portions 140 each include a plurality of protruding members 144 for pressing the resin molded product 200 . The plurality of protruding members 144 are each configured to be movable up and down independently of each other.

藉此，可抑制藉由推壓部140施加到基板210上的壓力在每個區域中的偏差。亦即，依據本實施形態的去除機構100，當藉由推壓部140與承受部130來夾住樹脂成形品200時，能夠抑制藉由推壓部140施加到基板210上的壓力在每個區域中的偏差。其結果，在樹脂成形品200中，例如能夠減少產生不必要的樹脂的殘留、或封裝部的破損的可能性。亦即，依據本實施形態的去除機構100，能夠自樹脂成形品200適當地除去不必要的樹脂部230。Thereby, the variation of the pressure applied to the substrate 210 by the pressing portion 140 in each region can be suppressed. That is, according to the removing mechanism 100 of the present embodiment, when the resin molded product 200 is sandwiched by the pressing portion 140 and the receiving portion 130, it is possible to suppress the pressure applied to the substrate 210 by the pressing portion 140 from appearing in each case. deviations in the region. As a result, in the resin molded product 200 , for example, it is possible to reduce the possibility of unnecessary resin residue or damage to the sealing portion. That is, according to the removing mechanism 100 of the present embodiment, the unnecessary resin portion 230 can be appropriately removed from the resin molded product 200 .

又，在依據本實施形態的去除機構100中，藉由冷卻部170來冷卻樹脂成形品200。若沒有藉由推壓部140來充分地推壓基板210，則在基板210與密封樹脂部220中的線膨脹係數不同，所以當樹脂成形品200冷卻時會產生基板210的翹曲。依據本實施形態的去除機構100，可抑制藉由推壓部140施加到基板210上的壓力在每個區域中的偏差，並充分地推壓基板210，所以能夠抑制伴隨樹脂成形品200的冷卻而發生的基板210的翹曲。In addition, in the removing mechanism 100 according to the present embodiment, the resin molded product 200 is cooled by the cooling unit 170 . If the substrate 210 is not sufficiently pressed by the pressing portion 140 , the substrate 210 and the sealing resin portion 220 have different linear expansion coefficients, so that the substrate 210 may warp when the resin molded product 200 is cooled. According to the removing mechanism 100 of the present embodiment, the variation of the pressure applied to the substrate 210 by the pressing portion 140 in each region can be suppressed, and the substrate 210 can be pressed sufficiently, so that cooling accompanying the resin molded product 200 can be suppressed. Warpage of the substrate 210 occurs.

[7.其他實施形態] 上述實施形態的技術思想，不限定於以上說明的實施形態。以下，對於能夠適用上述實施形態的技術思想之其他實施形態的一例進行說明。[7. Other Embodiments] The technical idea of the above-described embodiment is not limited to the above-described embodiment. Hereinafter, an example of another embodiment to which the technical idea of the above-described embodiment can be applied will be described.

在依據上述實施形態的去除機構100中，承受部130被設置於下方，推壓部140被設置於上方。然而，也不一定要是此位置關係。例如，也可以是推壓部140被設置於下方，承受部130被設置於上方。In the removal mechanism 100 according to the above-described embodiment, the receiving portion 130 is provided below, and the pressing portion 140 is provided above. However, this positional relationship is not necessarily required. For example, the pressing portion 140 may be provided below, and the receiving portion 130 may be provided above.

又，在依據上述實施形態的去除機構100中，突起構件144具有複數個突起部302。然而，突起構件144也不一定要具有複數個突起部302。例如，取代突起構件144，也可以使用僅具有一個突起部之突起構件，該突起部具有與突起部302同等的寬度。此時，取代1個突起構件144，成為使用3個突起構件。在3個突起構件各自的上方安裝有不同的彈性構件142。此時，各突起部可互相獨立地上下移動。Furthermore, in the removal mechanism 100 according to the above-described embodiment, the protruding member 144 has the plurality of protruding portions 302 . However, the protruding member 144 does not necessarily have to have a plurality of protruding portions 302 . For example, instead of the protruding member 144, a protruding member having only one protruding portion having the same width as the protruding portion 302 may be used. In this case, instead of one protruding member 144, three protruding members are used. A different elastic member 142 is attached above each of the three protruding members. At this time, the respective protrusions can move up and down independently of each other.

又，在依據上述實施形態的去除裝置10中，藉由控制部500來實行樹脂成形機構20和去除機構100的控制。然而，樹脂成形機構20和去除機構100的控制，也不一定要藉由共通的控制部500來實行。例如，樹脂成形機構20和去除機構100也可以各自具有專用的控制部。In addition, in the removing apparatus 10 according to the above-described embodiment, the control unit 500 executes the control of the resin molding mechanism 20 and the removing mechanism 100 . However, the control of the resin molding mechanism 20 and the removal mechanism 100 is not necessarily performed by the common control unit 500 . For example, the resin molding mechanism 20 and the removing mechanism 100 may each have a dedicated control unit.

又，在依據上述實施形態的去除機構100中，樹脂成形品200包含複數個(2個)基板210。然而，樹脂成形品200也不一定要包含複數個基板210。例如，樹脂成形品200也可以包含單數個基板210，也就是所謂的一次一張的構成。此時，推壓部140和承受部130，也可以不設為一對，而是設為單數個。Furthermore, in the removal mechanism 100 according to the above-described embodiment, the resin molded product 200 includes a plurality of (two) substrates 210 . However, the resin molded product 200 does not necessarily need to include a plurality of substrates 210 . For example, the resin molded product 200 may include a single number of substrates 210 , that is, a so-called one-at-a-time configuration. At this time, the pressing part 140 and the receiving part 130 may not be a pair, but a singular number.

又，在依據上述實施形態的去除機構100中，冷卻部170，被設置為獨立於其他部分。然而，冷卻部170，也不一定要被設置為獨立於其他部分。例如，冷卻部170，也可以被內建於推壓部140和殘料推壓構件150的至少一方中。In addition, in the removing mechanism 100 according to the above-described embodiment, the cooling part 170 is provided independently of other parts. However, the cooling part 170 does not necessarily have to be provided independently of other parts. For example, the cooling part 170 may be built in at least one of the pressing part 140 and the residual material pressing member 150 .

以上，對於本發明的實施形態例示地進行說明。亦即，為了對於例示進行說明，揭露了詳細說明和附圖。因此，在詳細說明和附圖記載的構成構件中，有時會包含用以解決問題時不必要的構成構件。因此，雖然這些不必要的構成構件被記載在詳細說明和附圖中，但是這些不必要的構成構件不應被直接地認定為必要。The embodiments of the present invention have been described above by way of example. That is, the detailed description and the drawings are disclosed for the purpose of illustrating the illustration. Therefore, the constituent members described in the detailed description and the drawings may include constituent members that are unnecessary to solve the problem. Therefore, although these unnecessary constituent elements are described in the detailed description and the drawings, these unnecessary constituent elements should not be directly identified as essential.

又，上述實施形態，整體而言，僅是本發明的例示。上述實施形態，在本發明的範圍內可進行各種改良和變化。亦即，當實施本發明時，能夠對應於實施形態而適當地採用具體的構成。In addition, the above-described embodiment is merely an illustration of the present invention as a whole. Various modifications and changes can be made to the above-described embodiments within the scope of the present invention. That is, when implementing the present invention, a specific configuration can be appropriately adopted according to the embodiment.

10:樹脂成形裝置 20:樹脂成形機構 100:去除機構 120:承受構件 130:承受部 140,140X:推壓部 141,301:基部 142:彈性構件 144:突起構件 146:襯套 148:導件 150:殘料推壓構件 160:推壓部推壓構件 170:冷卻部 200:樹脂成形品 210:基板 220:密封樹脂部 230:不必要的樹脂部 232:殘料部 234:澆道部 235:樹脂毛邊部 302:突起部 500:控制部 A1:區域 H1,H2:孔 P1:承受部旋轉軸 S1:空間10: Resin molding device 20: Resin molding mechanism 100: Removal of Mechanisms 120: Bearing member 130: Receiving Department 140, 140X: push part 141,301: Base 142: elastic member 144: Protruding member 146: Bushing 148: Guide 150: Residual material push member 160: Pressing part pressing member 170: Cooling Department 200: Resin molded product 210: Substrate 220: Sealing Resin Department 230: Unnecessary resin part 232: Remnants Department 234: Sprue Department 235: Resin burrs 302: Protrusions 500: Control Department A1: Area H1,H2: Holes P1: Rotary axis of the receiving part S1: Space

第1圖是概略地表示樹脂成形裝置的構成的圖。 第2圖是概略地表示在樹脂成形機構中製造的樹脂成形品的一例的平面圖。 第3圖是概略地表示樹脂成形品的一例的正面圖。 第4圖是概略地表示去除機構的正面圖。 第5圖是概略地表示推壓部之中的一部分的構成的圖。 第6圖是概略地表示突起構件的正面圖。 第7圖是用以說明當推壓部不具有特徵的構成時可能產生的第一問題的圖。 第8圖是用以說明當推壓部不具有特徵的構成時可能產生的第二問題的圖。 第9圖是用以說明可減少第一問題所造成的影響的理由的圖。 第10圖是用以說明可減少第二問題所造成的影響的理由的圖。 第11圖是表示去除機構所進行的不必要的樹脂部的除去動作的流程圖。 第12圖是概略地表示在實行第11圖中的步驟S120之後的狀態的去除機構的正面圖。 第13圖是概略地表示在承受部和推壓部已轉動的狀態下的去除機構的正面圖。FIG. 1 is a diagram schematically showing the configuration of a resin molding apparatus. FIG. 2 is a plan view schematically showing an example of a resin molded product produced by the resin molding mechanism. Fig. 3 is a front view schematically showing an example of a resin molded product. Fig. 4 is a front view schematically showing the removal mechanism. FIG. 5 is a diagram schematically showing the configuration of a part of the pressing portion. Fig. 6 is a front view schematically showing the projection member. FIG. 7 is a diagram for explaining a first problem that may occur when the pressing portion does not have a characteristic structure. FIG. 8 is a diagram for explaining a second problem that may occur when the pressing portion does not have a characteristic structure. FIG. 9 is a diagram for explaining the reason why the influence of the first problem can be reduced. FIG. 10 is a diagram for explaining the reason why the influence of the second problem can be reduced. FIG. 11 is a flowchart showing the operation of removing the unnecessary resin portion by the removing mechanism. Fig. 12 is a front view schematically showing the removal mechanism in a state after step S120 in Fig. 11 is executed. Fig. 13 is a front view schematically showing the removal mechanism in a state in which the receiving portion and the pressing portion are rotated.

國內寄存資訊 (請依寄存機構、日期、號碼順序註記) 無Domestic storage information (please note in the order of storage institution, date and number) without

國外寄存資訊 (請依寄存國家、機構、日期、號碼順序註記) 無Foreign deposit information (please mark in the order of deposit country, institution, date and number) without

130:承受部130: Receiving Department

140:推壓部140: Pushing part

141:基部141: Base

142:彈性構件142: elastic member

144:突起構件144: Protruding member

146:襯套146: Bushing

148:導件148: Guide

200:樹脂成形品200: Resin molded product

210:基板210: Substrate

234:澆道部234: Sprue Department

H1:孔H1: hole

S1:空間S1: Space

Claims (6)

一種去除機構，構成為可自樹脂成形品除去不必要的樹脂部； 在前述樹脂成形品中，藉由樹脂來密封被構裝在基板上的電子零件； 當俯視前述樹脂成形品時，前述樹脂的區域，包含與前述基板的區域重疊的第一區域、及自前述基板的區域往外延伸的第二區域； 前述去除機構，具備： 承受部，其構成為其上可配置前述樹脂成形品； 推壓部，其構成為可推壓被配置於前述承受部上之前述樹脂成形品；及， 固定部，其構成為可固定前述第二區域； 其中，前述承受部和前述推壓部，構成為可在藉由前述固定部來固定前述第二區域的狀態下轉動； 並且，前述推壓部具備複數個突起構件，以推壓前述樹脂成形品； 前述複數個突起構件，各自可互相獨立地上下移動。A removal mechanism configured to remove an unnecessary resin portion from a resin molded product; In the aforementioned resin-molded product, the electronic components mounted on the substrate are sealed with resin; When the resin molded product is viewed from above, the resin region includes a first region overlapping with the substrate region and a second region extending outward from the substrate region; The aforementioned removal mechanism includes: a receiving portion configured so that the aforementioned resin-molded article can be arranged thereon; a pressing portion configured to press the resin molded product disposed on the receiving portion; and, a fixing portion configured to fix the second region; wherein, the receiving portion and the pressing portion are configured to be rotatable in a state where the second region is fixed by the fixing portion; In addition, the pressing portion includes a plurality of protruding members for pressing the resin molded product; Each of the plurality of protruding members can move up and down independently of each other. 如請求項1所述之去除機構，其中，前述推壓部，構成為可避開前述不必要的樹脂部並推壓前述樹脂成形品。The removing mechanism according to claim 1, wherein the pressing portion is configured to avoid the unnecessary resin portion and press the resin molded product. 如請求項1或2所述之去除機構，其中，前述推壓部進一步具備基部、第一彈性構件及第二彈性構件； 並且，前述複數個突起構件，包含第一突起構件和第二突起構件； 前述第一突起構件，藉由前述第一彈性構件而被固定於前述基部； 前述第二突起構件，藉由前述第二彈性構件而被固定於前述基部。The removing mechanism according to claim 1 or 2, wherein the pressing portion further includes a base, a first elastic member, and a second elastic member; And, the aforesaid plural protruding members include a first protruding member and a second protruding member; the first protruding member is fixed to the base by the first elastic member; The second protruding member is fixed to the base by the second elastic member. 如請求項1或2所述之去除機構，其中，進一步具備冷卻部，構成為可冷卻前述樹脂成形品。The removal mechanism according to claim 1 or 2, further comprising a cooling unit configured to cool the resin molded product. 一種樹脂成形裝置，具備： 樹脂成形機構，其構成為可製造樹脂成形品；及， 請求項1至4中任一項所述之去除機構。A resin molding device, comprising: A resin molding mechanism configured to produce resin molded articles; and, The removal mechanism of any one of claims 1 to 4. 一種樹脂成形品的製造方法，是使用請求項1至4中任一項所述之去除機構來將不必要的樹脂部除去之樹脂成形品的製造方法，包含下述步驟： 將前述樹脂成形品配置在前述承受部上、 藉由前述推壓部來推壓已配置於前述承受部上之前述樹脂成形品、 藉由前述固定部來固定前述第二區域、及 在已固定前述第二區域的狀態下使前述承受部和前述推壓部雙方轉動。A manufacturing method of a resin molded product, which is a manufacturing method of a resin molded product using the removing mechanism described in any one of claims 1 to 4 to remove an unnecessary resin portion, comprising the following steps: Arranging the resin molded product on the receiving portion, The resin molded product placed on the receiving portion is pressed by the pressing portion, fixing the second region by the fixing portion, and Both the receiving portion and the pressing portion are rotated in a state in which the second region is fixed.
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