JPH0837266A - Semiconductor device manufacturing equipment and method - Google Patents

Abstract

PURPOSE:To provide a method of removing the tie bars and burrs of a resin- sealed semiconductor device without producing lead plating burrs. CONSTITUTION:A lead frame is sealed up with resin into a certain shape as required, provided with leads 10 located on one side of a sealed part, and equipped with a tie bar 8 which links the leads 10 together and serves to dam up resin when a resin sealing operation is carried out, wherein blades 1 determined in thickness corresponding to the space between the leads 10 are prepared and inserted between the leads 10 to remove the tie bar 8 and resin burrs 9 by cutting. By this setup, burrs can be removed without producing lead plating burrs, and an device of this constitution used for removing a tie bar and burrs is capable of dealing with various kinds of semiconductor devices by replacing blades and spacers.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a semiconductor device and an apparatus used therefor, and more particularly to a technique effective when applied to the manufacture of a resin-sealed semiconductor device using a lead frame.

[0002]

2. Description of the Related Art Generally, in the manufacture of semiconductor devices,
It is necessary to seal the semiconductor element with resin or ceramic.

Among these processes, the one in which a semiconductor element is sealed with a resin is suitable for mass production because a multiple lead frame can be used and the cost can be reduced. The resin encapsulation type is manufactured by inserting the lead frame between the upper and lower molds and injecting the resin, so in order to prevent the encapsulation resin from flowing out, what is called a tie bar is a sealing body. It is usually formed by connecting the leads at a fixed distance outside the.

Therefore, the resin flows between the tie bar and the sealing body, and unnecessary resin (hereinafter referred to as burr) is formed. The burr is unnecessary and should be removed, and the tie bar also connects each lead and must be removed. For this reason, each burr and tie bar may be cut and removed by a punch or the like.

As an example of a technique using a punch, "Surface mount type LSI package and improvement of its reliability", page 211, Moto Murakami, published by Applied Technology Publishing, 1988.
It is published on November 16, 2014, or in JP-A-49-14086.

[0006]

Generally, when the resin and the tie bar are removed by punching or the like, the plating is performed after the lead frame is plated, so that the plating layer is slightly formed on the burr in contact with the lead frame. However, there is a problem that the plating layer on the burr is peeled off when it is cut and removed by a punch or the like, and the plating part on the lead is also peeled off to form a plating burr. Not shown until.

Further, since these punch dies for removing burrs and tie bars are manufactured according to the outer shape of each semiconductor device, there is a problem that equipment investment and manufacturing days are required when adapting. .

The present invention solves the above problems,
An object of the present invention is to provide a method for manufacturing a semiconductor device which is excellent in removing resin burrs and tie bars, does not cause plating burrs, is inexpensive, and can be applied to manufacturing various semiconductor devices, and an apparatus used therefor.

[0009]

The typical means of the invention disclosed in the present application will be described below.

That is, after the semiconductor element is placed in the semiconductor element placement portion of the lead frame, it is sealed in a desired shape with resin, and there are a plurality of external leads in at least one direction of the sealing portion, and the leads are placed between them. In a semiconductor manufacturing apparatus for connecting, cutting the tie bar and a burr of a lead frame having a tie bar that is a resin flow stop at the time of sealing with the resin, and forming at least a portion where the tie bar and the burr are not present between the leads, A blade having a thickness to be inserted between the leads, a means for bringing the blade into contact with a tie bar and a burr between the leads, and a means for rotating the blade, the blade and the burr being cut.

[0011]

According to the above-mentioned means, since the resin burr and the tie bar are cut by using the blade, the burr and the tie bar which are not affected by the plating layer formed on the burr by adjusting the blade interval can be obtained. It can be removed. Further, it becomes possible to deal with various semiconductor devices by replacing the blade.

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is an exploded view of an essential part for explaining the configuration of a blade used in a semiconductor device manufacturing apparatus according to an embodiment of the present invention, and FIGS. 2 and 3 show a manufacturing apparatus used in the present invention. It is a schematic top view which showed the state which is using and the cutting process is performed.

The object of the present embodiment is to manufacture a semiconductor device using a lead frame, in which a semiconductor element is arranged in a semiconductor element arranging portion such as a tab of the lead frame and is sealed in a desired shape with resin. And a plurality of external leads exist in at least one direction of the sealing portion, connect the leads, and have a tie bar that serves as a sealing resin stopper when the resin is sealed. .

First, FIG. 1 shows a blade peripheral portion which is a main part of this embodiment. The blade 1 has a rectangular hole 1a in the center thereof, and a spacer 2 corresponding to the width of the lead is arranged between the blades 1. This spacer 2 also has a rectangular hole 2a at the center. The rotary shaft 3 is inserted into the rectangular hole 2a.

As shown in FIG. 2, a motor 4 is connected to the end of the rotary shaft 3 to rotate the blade 1. A bearing 6 for supporting the blade 1 is attached to the opposite end of the motor 4. These are mounted and mounted on the support base 5. Further, two rails 7 are arranged below the support base 5 on the left and right sides, and the support base 5 can be moved in parallel by a driving means (not shown).

The target semiconductor device is arranged between the leads 10 so as to correspond to the blade 1, and is fixed by a fixing means (not shown). A portion of the semiconductor device surrounded by the resin-sealed body surface 11, each lead 10 and the tie bar 8 is formed with a burr 9 by a sealing resin.
Are formed. The tie bar 8 is used as a flow stop so that the sealing resin does not flow out when the resin is sealed to form the sealing body 11.

Next, the manufacturing process will be described. First, the semiconductor device is fixed by fixing means (not shown). Tie bar 8 formed between each lead 10 of the fixed semiconductor device
Corresponding to the burr 9 and each blade 1, each blade 1 is mounted and arranged on the support shaft 3. At this time, each blade 1 by the spacer 2
Adjust the spacing between. In this state, the support base 5 moves in parallel on the rail 7 by the driving means (not shown) and comes into contact with the tie bar 8 and the burr 9, and as shown in FIG.
And the burr 9 is removed by cutting to form a tie bar and a burr-free portion between the leads 8. This electrically separates the leads. The cutting removal by each blade 2 is performed until the vicinity of the resin sealing body 11 is cut and removed. Since there is some margin between the leads 8, the leads 8 are cut without affecting the plating layer on the burr.

Although the present invention has been described above with respect to the technology that is the background of the present application, the present application is not limited to the above-described embodiments, and it goes without saying that various modifications can be made without departing from the technology. .

That is, any number of blades may be used. For example, as long as it has external leads in at least one direction, it can be applied to blades in one direction, and external leads in two and four directions. As long as they are provided, the blades may be arranged at various places, or the target semiconductor device may be movable and the leads may be oriented in the blade direction.

[0020]

The effects of the typical inventions among the inventions disclosed in this application will be described below.

That is, by using a blade having a margin between the leads, it is possible to remove the tie bar and the burr which are free from plating burr. Further, by preparing a plurality of spacers and blades having different thicknesses, rapid application to various semiconductor devices becomes possible. Further, since equipment such as a mold is unnecessary, the production equipment can be manufactured at low cost.

[Brief description of drawings]

FIG. 1 is a perspective view showing a main part of a blade used in the present invention.

FIG. 2 is a schematic top view showing the outline of an apparatus used in the present invention.

FIG. 3 is a schematic top view showing an outline of an apparatus used in the present invention.

[Explanation of symbols]

1. ． Blade, 2. ． Spacer, 3. ． Axis of rotation,
4. ． Motor, 5. ． Support base, 6. ． Bearing, 7. ． Rail, 8. ． Tie bar, 9. ． Bali, 10. ． Reed, 1
1. ． Sealed body

Claims (2)

[Claims] 1. A semiconductor device manufacturing method for manufacturing a semiconductor device using a lead frame, wherein a semiconductor element is arranged in a semiconductor element arrangement portion of a lead frame, and is sealed in a desired shape with a resin, and at least a sealing portion. There are multiple external leads in one direction, and connect between the leads,
A step of preparing a lead frame having a tie bar for blocking the flow of the sealing resin at the time of sealing the resin, a step of preparing a blade having a thickness that fits between the plurality of leads, and inserting the blade between the leads A method of manufacturing a semiconductor device, comprising cutting the tie bar and a resin burr to form at least a portion where the tie bar and the burr do not exist between the leads. 2. A semiconductor element is placed in a semiconductor element placement portion of a lead frame, and then sealed in a desired shape with a resin, and there are a plurality of external leads in at least one direction of the sealing portion, and there is a space between the leads. And a burr of a lead frame having a tie bar that prevents the sealing resin from flowing when the resin is sealed, and at least a portion where the tie bar and the burr are not present is formed between the leads. A semiconductor manufacturing apparatus, comprising: a blade having a thickness to be inserted between external leads; a means for bringing the blade into contact with a tie bar and a burr between the leads; and a means for rotating the blade.