JP2018129368A - Method for manufacturing light-emitting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing a light-emitting device, which is arranged so that even if a metal burr is produced, the burr cannot cause a trouble.SOLUTION: A method for manufacturing a light-emitting device comprises the steps of: an end portion-forming step S11 of cutting, from a metal frame plate MB, outer leads 41, 42 protruding from outer wall surfaces 24, 25 of a package 2 in which a light-emitting element 30 is sealed by a resin to form an end portion of each outer lead; a bending step S12 of bending each outer lead so that the end portion of the outer lead is located on a lower face side of the package; and a die-contact step S13 of putting a die in contact with each outer lead located on the lower face side of the package. The die used in the die-contact step has a groove portion 52b, and the end portion of each outer lead is disposed at the groove.SELECTED DRAWING: Figure 3

Description

  The present disclosure relates to a method for manufacturing a light emitting device.

  Conventionally, in a manufacturing method of a light emitting device including a light emitting element, a portion to be a lead terminal is formed by cutting a single metal frame plate, and a resin package is provided in each of the formed lead terminal portions, and a plurality of light emitting devices are provided. The device is formed from a single metal frame plate. In such a method for manufacturing a light-emitting device, in order to use a part of the metal frame plate as a lead terminal for electrical connection with the outside of the light-emitting device, the portion to be the lead terminal is cut and bent with a mold or the like Things have been done.

  For example, in the technique described in Patent Document 1, a part of the cut metal frame plate is pressed and bent by a mold to form a light emitting device. Moreover, in the technique described in Patent Document 2, a liquid lubricant is supplied to the lead molding surface of the lead molding die for each one or a plurality of lead molding operations, thereby forming a lead terminal. This prevents the generation of lead plating scraps due to friction. Furthermore, in the technique described in Patent Document 3, a part of the lead terminal moves in contact with the region on the molding table so that a part of the solder is peeled off. The solder thus peeled off is placed in a groove provided on the molding table.

JP 2001-118868 A Japanese Patent Laid-Open No. 06-349995 Japanese Patent Laid-Open No. 10-163394

  However, all of the manufacturing methods proposed in Patent Documents 1 to 3 generate metal burrs after cutting the end portions of the leads from the metal frame plate, and contact the mold when the metal burrs are bent. May come off and cause problems.

  An object of the embodiment according to the present disclosure is to provide a method for manufacturing a light-emitting device that does not cause a problem even if a metal burr occurs.

  In order to solve the above-described problem, a method of manufacturing a light emitting device according to an embodiment of the present disclosure includes: cutting an outer lead protruding from an outer wall surface of a package in which a light emitting element is sealed with resin; An end forming step for forming a portion, a bending step for bending the outer lead such that an end portion of the outer lead is positioned on the lower surface side of the package, and a gold on the outer lead positioned on the lower surface side of the package An abutting step for abutting the die, and a mold used in the abutting step has a groove portion, and an end portion of the outer lead is disposed so as to be positioned in the groove portion.

  According to the method of manufacturing a light emitting device according to the embodiment of the present disclosure, the groove is formed so that the mold does not contact the metal burr generated when the lead portion is cut, and thus the metal burr is dropped during the manufacturing process. The cause of the problem is eliminated.

It is a perspective view which shows typically the light-emitting device which concerns on embodiment. It is sectional drawing in the II-II line of the light-emitting device of FIG. It is a flowchart which shows the procedure of the manufacturing method of the light-emitting device which concerns on embodiment. It is a top view which shows typically the part of the metal frame board which abbreviate | omitted one part in the manufacturing method of the light-emitting device which concerns on embodiment. In the manufacturing method of the light-emitting device concerning an embodiment, it omits others and is a sectional view showing typically one package formed in a metal frame board. In the manufacturing method of the light-emitting device concerning an embodiment, it is a sectional view showing typically an end part formation process which separates an end part of an outer lead in one package formed in a metal frame board, omitting others. In the manufacturing method of the light-emitting device concerning an embodiment, it is a sectional view expanding and showing typically the state of the outer lead separated in Drawing 5B. In the manufacturing method of the light-emitting device concerning an embodiment, it is a sectional view showing typically the 1st bending process which bends an outer lead in one package formed in a metal frame board, omitting others. In the manufacturing method of the light-emitting device concerning an embodiment, it is a sectional view showing typically a preparatory bending process about the 2nd position of an outer lead in one package which omitted others and was formed in a metal frame board. In the manufacturing method of the light-emitting device concerning an embodiment, it is a sectional view showing typically this bending process about the 2nd position of the outer lead in one package which omitted others and was formed in the metal frame board. In the manufacturing method of the light emitting device according to the embodiment, a contact process in which a mold is brought into contact with an outer lead in a single package formed on a metal frame plate by omitting others and a final state in which the outer lead is bent is schematically illustrated. FIG. In the contact process of the manufacturing method of the light-emitting device concerning an embodiment, it is a top view showing typically a lower metallic mold corresponding to one package part formed in a metal frame board, omitting others. It is sectional drawing which shows typically the metal mold | die equivalent to one package part which abbreviate | omitted others and formed in the metal frame board in the contact process of the manufacturing method of the light-emitting device which concerns on embodiment. In the manufacturing method of the light-emitting device concerning an embodiment, it is a perspective view showing a state of a portion corresponding to one package of a lower metallic mold used at a contact process, omitting others.

  Hereinafter, embodiments according to the present invention will be described with reference to the drawings. The embodiment described below exemplifies a method for manufacturing a light emitting device for embodying the technical idea of the present invention. Therefore, the present invention does not specify a method for manufacturing a light-emitting device in the following embodiments. In particular, the dimensions, materials, shapes, relative arrangements, and the like of the members described in the embodiments are not intended to limit the scope of the present invention only to those unless otherwise specified. It is just an example. In addition, the drawings referred to in the following description schematically show the present invention, and therefore the scale, spacing, positional relationship, etc. of each member are exaggerated, or some of the members are not shown. There is a case. Moreover, in the following description, the same name and code | symbol indicate the same or the same member in principle, and detailed description is abbreviate | omitted suitably.

In the embodiment according to the present invention, the configuration of the light emitting device will be described first, and then the method for manufacturing the light emitting device will be described.
As shown in FIGS. 1 and 2, the light emitting device 1 includes a package 2 having a support member 20 and an electrode 40, and a light emitting element 30 provided on the electrode 40 in a recess 21 formed in the support member 20 of the package 2. And the sealing member 10 that covers the light emitting element 30 and is filled in the recess 21.
The light emitting device 1 emits light emitted from the light emitting element 30 directly to the outside through the sealing member 10 or by reflecting the light on the inner wall surface of the recess 21. Each configuration will be described below.

  Here, the package 2 includes an electrode 40 on which the light emitting element 30 is mounted, and a support member 20 that supports the electrode 40. The package 2 is a molded product in which the light emitting element 30 is mounted and protected in the recess 21 and the electrode 40 and the support member 20 are integrally molded. In the package 2, the inner leads 41 a and 42 a of the electrode 40 on which the light emitting element 30 is mounted are exposed on the bottom surface of the recess 21. The package 2 supports the outer leads 41 and 42 that are continuous with the inner leads 41a and 42a of the electrode 40 in a state where the outer leads 41 and 42 are bent so as to protrude from the opposing outer wall surfaces 24 and 25 into a predetermined shape. .

(Support member)
The support member 20 is formed in such a manner that it opens to the upper surface of a substantially rectangular parallelepiped to form a recess 21, and the bottom surface of the recess 21 is positioned at the approximate center in the thickness direction. The support member 20 is formed with the recess 21 so that the inner leads 41 a and 42 b serving as the mounting region of the light emitting element 30 are exposed on the bottom surface of the recess 21. In this embodiment, the concave portion 21 formed in the support member 20 has a circular shape in a plan view, but an oval shape, a track shape (a shape in which a semicircle is attached to both sides of the rectangle), a square shape, It can be a polygon such as a triangle or a shape close to these. In addition, the recess 21 is formed such that the bottom surface is smaller than the top surface opening, so that the inner wall surface is an upward inclined surface. By having this inclined surface, the light from the light emitting element 30 is reflected and the light extraction efficiency is improved.

  Further, a step 22 is formed at one of the corners on the upper surface of the support member 20. The step portion 22 is used as, for example, a cathode mark indicating the polarity of the pair of electrodes 40. The inner leads 41a and 42a are installed so as to be separated from each other and a part of the support member 20 is interposed therebetween. Furthermore, the outer leads 41 and 42 that are continuous from the inner leads 41 a and 42 a and are exposed on the outer wall surface of the support member 20 are bent along the outer wall surfaces 24 and 25 and the lower surface 23. Further, the support member 20 is formed as a lower surface central portion 23a in which the center of the lower surface 23 facing the upper surface is convex downward when the surface on which the concave portion 21 is formed is the upper surface. And the lower surface side part 23b, 23c of the state whose thickness is smaller (or dented) than the lower surface center part 23a is formed in the both sides of the lower surface center part 23a. The lower surface central portion 23a is formed continuously from one edge of the lower surface 23 to the other edge with a predetermined width at a position between the outer leads 41, 42 disposed on the lower surface side. The lower surface central portion 23a is formed in a convex shape having a thickness smaller than that of the lead end portions 41f and 42f when the lead end portions 41f and 42f, which are the end portions of the outer leads 41 and 42, face each other.

  The material constituting the support member 20 is an insulating member, and a member that is difficult to transmit light from the light emitting element 30 or external light is preferable. Moreover, what has a certain intensity | strength is preferable and a thermosetting resin, a thermoplastic resin, etc. can be used.

(electrode)
The electrode 40 is for supplying a current from the outside to the electronic components such as the light emitting element 30 and the protection element. The electrode 40 is supported by the support member 20 and continuously bent from the inside of the recess 21 through the outer wall surfaces 24 and 25 to the lower surface 23 side. The electrode 40 is provided as a pair of inner leads 41 a and 42 b in the recess 21 so as to be electrically connected to the light emitting element 30, exposed from the outer walls 24 and 25, and along the lower surface 23 from the outer wall surfaces 24 and 25. The pair of outer leads 41 and 42 are bent. That is, the electrode 40 includes one outer lead 41 that is continuous with one inner lead 41a and the other outer lead 42 that is continuous with the other inner lead 42a.
The outer leads 41 and 42 are formed symmetrically, and rectangular through holes 41g and 42g are formed at positions facing the outer wall surfaces 24 and 25, respectively. By forming the through holes 41g and 42g, the outer leads 41 and 42 are easily bent when bent from the second positions 41b and 42b along the outer wall surfaces 24 and 25. The outer leads 41 and 42 are formed on the lower surface 23 of the support member 20 so that the lead end portions 41f and 42f are opposed to each other with a substantially constant interval.

  The outer leads 41 and 42 are divided into two portions at the portions protruding from the outer wall surfaces 24 and 25 by the through holes 41g and 42g, respectively, and are formed with a predetermined plate width at the tip. The positions where the outer leads 41 and 42 are bent along the corners where the outer wall surfaces 24 and 25 and the lower surface 23 of the support member 20 are connected are defined as first positions 41d and 42d, respectively. The positions of the outer leads 41 and 42 that protrude from the outer wall surfaces 24 and 25 of the support member 20 and are bent downward are defined as second positions 41b and 42b, respectively. The outer leads 41 and 42 have positions between the second positions 41b and 42b and the first positions 41d and 42d as third positions 41c and 42c, respectively. In addition, the outer leads 41 and 42 have positions between the first positions 41d and 42d and the lead end portions 41f and 42f (positions facing the lower surface of the support member 20) as fourth positions 41e and 42e, respectively. The first positions 41d and 42d are positions from the second positions 41b and 42b, which are positions protruding from the outer wall surfaces 24 and 25 of the support member 20, to the lead end portions 41f and 42f. This is a position bent along the corners of the wall surfaces 24, 25 and the lower surface 23. The second positions 41b and 42b are positions between the outer wall surfaces 24 and 25 of the support member 20 and the first positions 41d and 42d. Here, the second positions 41b and 42b are 90 degrees immediately after protruding from the outer wall surfaces 24 and 25. It is a position that can be bent.

  The material constituting the electrode 40 is preferably a material having a relatively large thermal conductivity, whereby heat generated in the light emitting element 30 can be efficiently released to the outside. For example, those having a thermal conductivity of about 200 W / (m · K) or more are preferable. The electrode 40 is preferably made of a material having a relatively large mechanical strength, and a material that can be easily punched or etched. Specifically, metals or alloys, such as copper, aluminum, gold, silver, tungsten, iron, nickel, cobalt, molybdenum, are mentioned. Further, a light reflecting film such as silver, aluminum, alley presence or an alloy thereof may be provided on the surface.

  Further, the thickness, shape, etc. of the electrode 40 can be appropriately adjusted in consideration of the size, shape, etc. of the light emitting device 1 to be obtained. When the electrode 40 is made of a material that easily absorbs light, it is preferable that the electrode 40 has a laminated structure, such as providing a member that easily reflects light on the surface. For example, the electrode 40 preferably has a laminated structure in which silver is plated on a conductive member made of tungsten or copper.

(Light emitting element)
As shown in FIG.1 and FIG.2, in this embodiment, the light emitting element 30 is mounted in the inner lead 42a via the joining member. The light emitting element 30 may include, for example, a pair of electrodes on the same surface side, or may be provided on the opposite surface side. In the present embodiment, the light emitting element 30 has a pair of electrodes on the same surface side, and has a surface on which the pair of electrodes are formed as an upper surface as a main light extraction surface. As the light emitting element 30, a publicly known one can be used. For example, it is preferable to use a light emitting diode or a laser diode. Moreover, the light emitting element 30 can select the thing of arbitrary wavelengths. For example, as a blue and green light emitting element, a nitride semiconductor (In _X Al _Y Ga _1- XYN, 0 ≦ X, 0 ≦ Y, X + Y ≦ 1), a device using GaP is used. Can be used. Furthermore, as a red light emitting element, GaAlAs, AlInGaP, or the like can be used in addition to the nitride semiconductor element. Note that the composition, emission color, size, number, and the like of the light emitting element 30 to be used can be appropriately selected according to the purpose.

(Conductive wire)
The conductive wire 31 preferably has good ohmic properties with the electrode 40, mechanical connectivity, electrical conductivity, and thermal conductivity. Examples of the conductive wire 31 include those using metals such as gold, copper, platinum, and aluminum, and alloys thereof. A wire bonding apparatus is used for connection of the conductive wire 31.

(Sealing member)
Here, resin is used as an example for the sealing member 10, and the recess 21 formed in the package 2 is filled. The sealing member 10 protects the light emitting element 30, the conductive wire 31, the inner leads 41 a and 42 a and the like housed in the recess 21 from dust, moisture, external force, and the like. The sealing member 10 preferably has translucency. Specific examples of the material include silicone resin, epoxy resin, and urea resin. In addition to such materials, a coloring agent, a light diffusing agent, a filler, a fluorescent substance (phosphor), and the like can be contained depending on the purpose. In addition, although it is preferable to provide the sealing member 10 so that the whole inside the recessed part 21 may be filled, it can also be filled up to the middle of the recessed part 21 according to the objective.

The phosphor contained in the sealing member 10 is a material that absorbs light from the light emitting element 30 and converts it into light of a different wavelength. For example, a rare earth aluminate mainly activated by a lanthanoid element such as Ce Examples thereof include phosphors, nitride phosphors and oxynitride phosphors mainly activated by lanthanoid elements such as Eu and Ce. Further, as the phosphor, a YAG phosphor (yellow phosphor) which is a garnet crystal composed of a complex oxide of yttrium and aluminum (Y ₃ Al ₅ O ₁₂ ) can also be used. Two or more kinds of phosphors (fluorescent substances) may be used as the phosphor.

  In the light emitting device 1 having the above configuration, burrs Ba may occur at the lead end portions 41f and 42f that are the end portions of the outer leads 41 and 42 at the time of manufacture. And this burr | flash Ba may contact the metal mold | die 50 etc. in a manufacturing process, and may have a bad influence on the light-emitting device 1 by isolate | separating from lead end part 41f, 42f. Therefore, in the manufacturing method of the light emitting device 1, even if burrs Ba are generated at the lead end portions 41 f and 42 f of the outer leads 41 and 42, as shown below, in the manufacturing process and the like of this embodiment, the burrs Ba Is not separated from the lead end portions 41f and 42f.

Next, a method for manufacturing the light emitting device will be described.
As shown in FIG. 3, the manufacturing method of the light emitting device is performed in a procedure including an end portion forming step S11, a bending step S12, and a contact step S13.
In the present embodiment, before performing the end portion forming step S11, as shown in FIGS. 3 and 4, the processing step S01 for processing the metal frame plate MB to form the punched hole Ha, and the processed metal frame A support member forming step S02 in which the support member 20 is provided at a predetermined position of the plate MB, a mounting step S03 in which the light emitting element 30 is mounted in the recess 21 of the support member 20 provided in the metal frame plate MB, and FIGS. As described above, the sealing member forming step S04 in which the sealing member 10 is formed in the recess 21 in which the light emitting element 30 is mounted is performed in advance. Note that the manufacturing method of the present embodiment does not necessarily include the processing step S01 and the support member forming step S02. For example, the processing step S01 and the support member forming step S02 include the metal frame plate MB in which the punched holes Ha are formed. It may be a preparation step S10 for preparing the package 2 on which the support member 20 is formed.

  The metal frame plate MB is a material of the electrode 40. For example, a metal such as copper, aluminum, gold, silver, tungsten, iron, nickel, or an alloy such as nickel alloy or phosphor bronze is used. Further, when the metal frame plate MB is processed to form the punched holes Ha and the through holes 41g and 42g, a general press device is used. Further, in the support member forming step S02, for example, a resin frame is injected and filled into a space surrounded by a mold, so that the metal frame plate MB serving as the electrode 40 is set at the approximate center in the thickness direction, and the concave portion 21 and the stepped portion 22 are formed. The support member 20 is formed in a predetermined shape including the lower surface central portion 23a and the like. In the mounting step S03, after the support member 20 is formed, the light emitting element 30 is bonded to the upper surface of the inner lead 42a via the bonding member, and is electrically connected to the electrode 40 using the conductive wire 31. . Moreover, when providing protective elements, such as a Zener diode, it can carry out with mounting of the light emitting element 30 by mounting process S03. Thereafter, as shown in FIG. 5A, in the sealing member forming step S <b> 04, the sealing member 10 containing phosphor is placed inside the recess 21 such as the top of the light emitting element 30 placed on the electrode 40 inside the recess 21. It is dropped and filled with a potting device or the like, and then cured by heating and sealed. In addition, the fluorescent substance contained in the sealing member is contained substantially evenly in the sealing resin, and is naturally allowed to settle with its own weight over time.

When the sealing member forming step S04 is finished, an end portion forming step S11 is then performed. In the present embodiment, as shown in FIG. 4, a plurality of light emitting devices 1 are manufactured simultaneously on one metal frame plate MB, but in FIGS. 5A to 5G and FIGS. 6A to 6C, The part which manufactures the one light-emitting device 1 is shown typically and demonstrated. In FIGS. 5A to 5G and FIGS. 6A to 6C, hatching lines indicating the cross sections of the outer leads 41 and 42 are omitted as much as possible. Further, in FIGS. 5A, 5B, and 5D to 5G, the support member 20 is shown without being sectioned. 5A to 5G and FIGS. 6A to 6C show only a portion of the metal frame plate MB where one of the packages 2 is processed.
The end portion forming step S11 is a step of forming the lead end portions 41f, 42f of the outer leads 41, 42 by separating the outer leads 41, 42 protruding from the outer wall surfaces 24, 25 of the support member 20 from the metal frame plate MB. .

  As shown in FIGS. 5A and 5B, the edge forming step S11 is processed by, for example, the upper and lower pressers P1a and P1b and the forming blade BR1 of the cut forming apparatus CF. The cut forming device CF is formed by holding the positions of the metal frame other than the portion to be processed of the metal frame plate MB with the pressers P1a and P1b from above and below, and forming blades BR1 disposed at the positions where the outer leads 41 and 42 are separated from each other. Is operated from the upper side to the lower side of the support member 20. In this end forming step S11, a cutting step S11a for separating the outer leads 41, 42 from the metal frame plate MB by the forming blade BR1 is performed, and at the same time, the first positions 41d, 42d of the outer leads 41, 42 are placed on the package 2. A pre-bending step S11b for bending at a predetermined angle from the upper side to the lower side is performed.

  That is, in the separation step S11a, the outer leads 41, 42 are separated from the metal frame plate MB by the blade portion at the tip of the forming blade BR1. Then, the outer leads 41 and 42 are pressed by the inclined surface portion of the lower surface of the forming blade BR1 continuously to the separation step S11a so that the first positions 41d and 42d are within a predetermined angle, for example, 20 to 50 degrees. A pre-bending step S11b for bending is performed. In the metal frame plate MB, the package 2 is connected to the frame portion by the hanger leads even if the end portions of the outer leads 41 and 42 are cut. The hanger lead is in a state in which a part of the frame is engaged with the side surface of the package 2, and the package 2 is supported.

  In the end portion forming step S11, in the separating step S11a, as shown in FIG. 5C, burrs Ba may occur on the upper surface side of the lead end portions 41f and 42f of the outer leads 41 and 42. The burr Ba is maintained in a state of being connected to the outer leads 41 and 42 as they are when the tools such as the mold 50 do not come into contact with each other until the outer leads 41 and 42 are bent to the final shape. It should be noted that the outer leads 41 and 42 in which the burrs Ba are generated are buried in the bonding member at the mounting position when the light emitting device 1 is formed, and the light emitting device 1 is directly mounted at the mounting position. There is no fear.

  In the method for manufacturing the light emitting device, the bending step S12 is performed following the end portion forming step S11. The bending step S12 is a step of bending the outer leads 41, 42 along the outer wall surfaces 24, 25 and the lower surface of the support member 20. The bending step S12 includes a first bending step S12a and a second bending step S12b. Further, the second bending step S12b may include two steps, a preparatory bending step S120a and a main bending step S120b. As the bending step S12, the outer leads 41 and 42 are processed by the mold 50 used in the subsequent abutting step S13 by performing two or three steps. It should be noted that each work is performed on the metal frame plate MB by changing the work place with a handler or a feed roller. Therefore, each processing operation is also performed by changing the processing place in each process such as the preliminary bending process S11b, the first bending process S12b, the second bending process S12, and the contact process S13.

  In the bending step S12, the first bending step S12a is a step of bending the first positions 41d and 42d of the outer leads 41 and 42. In the first bending step S12a, as shown in FIG. 5D, first, the third positions 41c, between the outer wall surfaces of the outer leads 41, 42 and the first positions 41d, 42d by the pressers P2a, P2b of the cut forming device CF. 42c is fixed. And 1st bending process S12a operates the forming press BR2 toward the lower surface side from the upper surface side of the supporting member 20. FIG. In the first bending step S12a, an operation of bending the first bent positions 41d and 42d of the outer leads 41 and 42 to 90 degrees from the upper surface side to the lower surface side of the package 2 is performed by the operation of the forming press BR2. . The metal frame plate MB bent at 90 degrees in the first position 41d, 42d in the lower surface direction is moved to a place where the second bending step S12b is performed. In the first bending step S12a, the first positions 41d and 42d of the outer leads 41 and 42 may be bent at 90 degrees or more. The angle of 90 degrees or more here is an angle when the first positions 41d and 42d of the outer leads 41 and 42 are finally bent (see FIG. 2), for example, 90 degrees. Over 95 degrees. The lengths of the third positions 41c and 42c fixed by the pressers P2a and P2b of the cut forming device CF are from the lower surface of the support member to the position where the outer leads of the outer wall surfaces 24 and 25 of the support member 20 protrude. It is almost the same as the height. Thereby, an outer lead can be processed so that the outer wall surfaces 24 and 25 and the lower surface 23 of the supporting member 20 may be followed by 2nd bending process S12b after that.

  The second bending step S12b is a step of bending the second positions 41b and 42b of the outer leads 41 and 42. As shown in FIGS. 5E and 5F, the second bending step S12 includes a preparatory bending step S120a and a main bending step S120b. In the second bending step S12b, the outer leads 41 and 42 are bent along the outer wall surface so as to be easily processed in the abutting step S13 which is the next step. In the preparatory bending step S120a, first, the upper surface side and the lower surface side of the support member 20 are fixed by the pressers P3a and P3b of the cut forming device CF. In the second bending step S12b, the forming press BR3 is operated from the upper surface side to the lower surface side of the support member 20. In the second bending step S12b, the second positions 41b and 42b of the outer leads 41 and 42 are bent at a predetermined angle, for example, 45 degrees, by the operation of the forming press BR3. In the preliminary bending step S120a, since the through holes 41g and 42g are formed at the third positions 41c and 42c of the outer leads 41 and 42, the bending work is facilitated. When the preparatory bending step S120a is completed, the metal frame plate MB is moved to a processing place where the next main bending step S120b is performed.

  As shown in FIG. 5F, the main bending step S120b is first fixed at the positions of the upper surface side of the support member 20 and the lower surface central portion 23a by the pressers P4a and P4b of the cut forming device CF. And this bending process S120b operates forming press BR4 toward the lower surface side from the upper surface side of the supporting member 20. FIG. In the main bending step S120b, the second positions 41b and 42b of the outer leads 41 and 42 are bent further deeply to approximately 90 degrees by the operation of the forming press BR4. Thus, the outer leads 41 and 42 are in a state along the outer wall surfaces 24 and 25 of the support member 20, and the fourth positions 41 e and 42 e of the outer leads 41 and 42 are the lower side portions 23 b on the lower surface of the support member 20. , 23c. In the main bending step S120b, the lead end portions 41f and 42f are in a state along the lower surface side portions 23b and 23c sandwiching the lower surface central portion 23a on the lower surface side of the support member 20. For this reason, the presser foot P4b has a shape having a space between the lower surface side portions 23b and 23c. When the main bending step S120b is completed, the metal frame plate MB is moved to a processing place where the next contact step S13 is performed. In the process before the contact process S13, a tool for bending each position (for example, a forming press) does not contact the burr Ba of the lead end portions 41f and 42f.

As shown in FIG. 5G and FIG. 6B, the contact step S13 is performed by contacting and pressing the support member 20 and the outer leads 41 and 42 by the mold 50 including the upper mold 51 and the lower mold 52. In this process, the outer leads 41 and 42 are bent so as to have a final shape.
6B and 6C, the lower mold 52 used here is in contact with a burr Ba that may be formed on the lead ends 41f and 42f of the outer leads 41 and 42 of the light emitting device 1. The groove part 52b is formed so as not to occur. The lower mold 52 has a central contact bottom surface portion 52a that contacts the lower surface central portion 23a of the package 2, a groove portion 52b formed in parallel to both sides of the central contact bottom surface portion 52a, and a curved surface in the groove portion 52b. A lead lower surface abutting portion 52c continuously formed via a curved surface, a lead side surface abutting portion 52d continuously formed via a curved surface on the lead lower surface abutting portion 52c, and a lead side surface abutting portion 52d. The upper surface part 52e formed continuously via a curved surface and the knockout pin 52f provided in the center of the center contact | abutting bottom face part 52a so that vertical movement was possible were provided. In the lower mold 52, a portion where the upper surface portion 52e and the lead side surface contact portion 52d are continuous is formed as a curved surface having a large curvature radius, and the lead side surface contact portion 52d and the lead lower surface contact portion 52c are continuous. The portion is formed as a curved surface having a smaller radius of curvature than the curved surface described above. Further, in the lower mold 52, a groove 52b is formed between the central contact bottom surface portion 52a and the lead lower surface contact portion 52c.

  The groove portions 52b are formed on both sides of the central contact bottom surface portion 52a so as to be elongated openings with a predetermined width so as to face along the lead end portions 41f and 42f of the outer leads 41 and 42. The groove 52b is formed in the lower mold 52 so that the lead end portions 41f and 42f are positioned at the groove center when the outer leads 41 and 42 are bent. The groove 52b is formed to have a rectangular shape in plan view within a range of a depth of 0.1 to 0.3 mm and a width of 0.1 to 0.3 mm, for example. The groove 52b is formed in a curved surface in which one opening edge portion 52b1 continuous to the lead lower surface contact portion 52c side becomes a curve in a sectional view, and the other opening edge continuous to the center contact bottom surface portion 52a. The part 52b2 is formed in an angular shape so as to be a right angle in a sectional view. Further, in the lower mold 52, the lead lower surface contact portion 52c continuous to the groove portion 52b is formed so as to be inclined so that the groove portion 52b side becomes higher and becomes lower as the distance from the groove portion 52b increases. In addition, the opening of the groove 52b is higher toward the package 2 than the other opening edge 52b1 that is farther from the center of the package 2 than the other opening edge 52b1 that is closer to the center of the package 2. Is formed.

  In the abutting step S13, the lower mold 52 abuts from below the first positions 41d, 42d of the outer leads 41, 42 and the fourth positions 41e, 42e of the outer leads 41, 42. At the same time, in the abutting step S <b> 13, the upper mold 51 abuts so as to press the upper surface side of the support member 20. In the contact step S13, as shown in FIGS. 5G and 6A to 6C, when the lower mold 52 contacts the outer leads 41, 42, the first positions 41d, 42d of the outer leads 41, 42 are changed. First, it abuts on the lead side abutting portion 52d of the lower mold 52 to correct its position. Then, the first positions 41d and 42d and the fourth positions 41e and 42e of the outer leads 41 and 42 abut on the lead lower surface abutting portion 52c of the lower mold 52, and the lead end portions 41f and 42f become grooves 52b and 52b. To position. Then, the lower mold 52 faces so that the lead end portions 41f and 42f are positioned in one of the formed groove portions 52b.

  Accordingly, in the abutting step S13, even if the burr Ba is formed on the lead end portions 41f and 42f, the burr Ba does not abut on the lower mold 52, so that the burr Ba is connected to the lead end portions 41f and 42f. It is possible to maintain the state connected to the lead end portions 41f and 42f without being separated. In the abutting step S13, the first positions 41d and 42d of the outer leads 41 and 42 are bent so that a part of the lead end portions 41f and 42f substantially abuts on the lower surface side portions 23b and 23c of the package 2. Specifically, the first positions 41d and 42d are preferably bent at an angle of 90 to 95 degrees. Thereby, the angle between the 3rd position 41c, 42c and the 4th position 41e, 42e in the outer lead after contact process S13 turns into an acute angle. By making the angle between the third positions 41c and 42c and the fourth positions 41e and 42e acute, the lead end portions 41f and 42f are arranged closer to the package 2 than the first positions 41d and 42d. For this reason, even if the burr Ba is formed, the burr Ba can be accommodated within the outer dimensions of the light emitting device 1.

When the contact step S13 is completed, the outer leads 41 and 42 are bent into the final shape in the package 2. When the abutting step S <b> 13 is completed, the metal frame plate MB can be easily detached from the lower mold 52 by pushing the lower surface central portion 23 a by the knockout pin 52 f of the lower mold 52. The metal frame plate MB for which the contact step S13 has been completed is sent to the next step by a handler or the like.
The metal frame plate MB is in a state in which a plurality of light emitting devices 1 are formed at the time when the abutting step S13 is completed, and is held on the metal frame plate MB by humber leads. By removing each light emitting device 1 from the hanger lead in a subsequent process, the light emitting device 1 is separated into pieces. In the light emitting device 1, even if the burrs Ba remain on the lead end portions 41 f and 42 f of the outer leads 41 and 42, the light emitting device 1 is buried in the bonding member provided on the substrate when the light emitting device 1 is mounted on the substrate. It can be in a state that does not affect others. Further, in the bending step S12, even if the burr Ba exists at the lead end portions 41f and 42f of the outer leads 41 and 42, each tool does not contact the burr Ba until the contact step S13. . Therefore, by forming the groove 52b so as not to contact the burr Ba in the abutting step S13, the burr Ba is not separated and a bad influence cannot be produced in the manufacturing process.

In the method for manufacturing the light emitting device described above, the number of the light emitting elements 30 mounted on the package 2 may be plural, or a Zener diode or the like may be mounted together with the light emitting elements. Furthermore, although the outer leads 41 and 42 have been described as having the through holes 41g and 42g, it is not always necessary to provide the through holes 41g and 42g.
In the end portion forming step S11, the separation step S11a for separating the outer leads 41, 42 from the metal frame plate MB and the preliminary bending step S11b for performing preliminary bending may be performed as the same step or as separate steps. . Further, in the bending step S12, the first bending step S12a and the second bending step S12b may be performed, or the second bending step S12b may be set as the preparatory bending step S120a and the main bending step S120b.
In the final bending step S120b, the second positions 41b and 42b of the outer leads 41 and 42 are bent at an angle smaller than a right angle so as to be nearly parallel to the outer wall surfaces 24 and 25 of the package 2, but are at right angles. It may be. Furthermore, in the first bending step S12a, the first positions 41d and 42d of the outer leads 41 and 42 have been described as being bent at 90 degrees. However, the angle of the final form (exceeding 90 degrees according to the shape of the bottom surface of the package) 90 degrees to 95 degrees).

DESCRIPTION OF SYMBOLS 1 Light-emitting device 2 Package 10 Sealing member 20 Support member 21 Recessed part 22 Step part 23 Lower surface 23a Lower surface center part 23b Lower surface side part 24 Outer wall surface 30 Light emitting element 31 Conductive wire 40 Electrode 41, 42 Outer lead 41a, 42a Inner lead 41b 42b 2nd position 41c, 42c 3rd position 41d, 42d 1st position 41e, 42e 4th position 41f, 42f Lead end 41g, 42g Through hole 50 Die 51 Upper mold 52 Lower mold 52 Lower center contact bottom Portion 52b groove portion 52c lead lower surface contact portion 52d lead side surface contact portion 52e upper surface portion 52f knockout pin 52b1 opening edge portion 52b2 opening edge portion BR1 forming blade BR2 forming press BR3 forming press BR4 forming press Ba Forming device Ha Hole hole MB Metal frame plate S01 Processing step S02 Supporting member forming step S03 Mounting step S04 Sealing member forming step S10 Manufacturing method S11 End forming step S11a Cutting step S11b Preliminary bending step S12 Bending step S12a First bending step S12b Second bending step S120a Preparatory bending step S120b Main bending step S13 Contacting step

Claims (8)

An end portion forming step of forming an end portion of the outer lead by separating the outer lead protruding from the outer wall surface of the package in which the light emitting element is sealed with resin from the metal frame plate;
A bending step of bending the outer lead such that an end portion of the outer lead is positioned on a lower surface side of the package;
A contact step of contacting a mold to the outer lead located on the lower surface side of the package,
The metal mold | die used at the said contact process has a groove part, The manufacturing method of the light-emitting device arrange | positioned so that the edge part of the said outer lead may be located in the said groove part. The bending step includes a first bending step of bending the first position of the outer lead between the outer wall surface of the package and the end portion of the outer lead from the upper surface side to the lower surface side of the package;
A second bending step of bending the second position of the outer lead between the outer wall surface of the package and the first position of the outer lead from the upper surface side to the lower surface side of the package after the first bending step; The manufacturing method of the light-emitting device of Claim 1 which performs.   3. The manufacturing of the light emitting device according to claim 2, wherein the end forming step includes a pre-bending step of pre-bending the first position together with a separating step of separating the end of the outer lead from the metal frame plate. Method.   The abutting step uses the mold in which the groove portion is provided at a position facing each end of the outer lead protruding from the outer wall surface on one side of the package and the outer wall surface on the other side. The manufacturing method of the light-emitting device as described in any one of Claims 1-3.   5. The mold used in the abutting step is formed such that the groove portion has an elongated opening in parallel along the outer wall surface of the package in a plan view. The manufacturing method of the light-emitting device as described in any one of.   The light emitting device manufacturing method according to claim 5, wherein the metal mold used in the abutting step has a curved opening edge at a side far from the center of the package in the opening.   The mold used in the abutting step is such that, in the opening, one opening edge that is closer to the center of the package is closer to the package than the other opening edge that is far from the center of the package. The manufacturing method of the light-emitting device according to claim 5, wherein the light-emitting device is formed so as to be higher.   3. The bending according to claim 2, wherein the first bending step is bent so that a bending angle of the first position is 90 degrees or more, and the bending step is bent so that the bending angle of the first position is an acute angle. The method for manufacturing a light emitting device according to any one of claims 3 to 7, which refers to claim 2.

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