TW200733261A - Fixture and method for removing mold runner - Google Patents

Fixture and method for removing mold runner

Info

Publication number
TW200733261A
TW200733261A TW095105885A TW95105885A TW200733261A TW 200733261 A TW200733261 A TW 200733261A TW 095105885 A TW095105885 A TW 095105885A TW 95105885 A TW95105885 A TW 95105885A TW 200733261 A TW200733261 A TW 200733261A
Authority
TW
Taiwan
Prior art keywords
mold runner
molding
fixture
molding compound
gate
Prior art date
Application number
TW095105885A
Other languages
Chinese (zh)
Other versions
TWI294653B (en
Inventor
Yun-Lung Chang
Yu-Chang Tsai
Chia-Ming Chang
Original Assignee
Advanced Semiconductor Eng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Semiconductor Eng filed Critical Advanced Semiconductor Eng
Priority to TW095105885A priority Critical patent/TWI294653B/en
Publication of TW200733261A publication Critical patent/TW200733261A/en
Application granted granted Critical
Publication of TWI294653B publication Critical patent/TWI294653B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Abstract

A fixture and a method suitable for removing a mold runner from a package matrix after molding are provided. First, the package matrix including multiple packages is clipped by the fixture, wherein each package has a molding compound and a molding gate. The mold runner is disposed on the molding gate and is connected to the molding compound. Next, the mold runner and the packages are cool down by air blowing at the same time. Thereafter, the connecting portion between the mold runner and the molding compound is snapped, and the molding compound is removed from the molding gate.
TW095105885A 2006-02-22 2006-02-22 Fixture and method for removing mold runner TWI294653B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW095105885A TWI294653B (en) 2006-02-22 2006-02-22 Fixture and method for removing mold runner

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW095105885A TWI294653B (en) 2006-02-22 2006-02-22 Fixture and method for removing mold runner

Publications (2)

Publication Number Publication Date
TW200733261A true TW200733261A (en) 2007-09-01
TWI294653B TWI294653B (en) 2008-03-11

Family

ID=45068213

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095105885A TWI294653B (en) 2006-02-22 2006-02-22 Fixture and method for removing mold runner

Country Status (1)

Country Link
TW (1) TWI294653B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7275060B2 (en) * 2020-02-05 2023-05-17 Ｔｏｗａ株式会社 REMOVAL MECHANISM, RESIN MOLDING APPARATUS AND MANUFACTURING METHOD

Also Published As

Publication number Publication date
TWI294653B (en) 2008-03-11

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