CN100530625C - 包含外部接触垫片的半导体部件的布线衬底及其制造方法 - Google Patents

包含外部接触垫片的半导体部件的布线衬底及其制造方法 Download PDF

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Publication number
CN100530625C
CN100530625C CNB2005800351647A CN200580035164A CN100530625C CN 100530625 C CN100530625 C CN 100530625C CN B2005800351647 A CNB2005800351647 A CN B2005800351647A CN 200580035164 A CN200580035164 A CN 200580035164A CN 100530625 C CN100530625 C CN 100530625C
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CN
China
Prior art keywords
substrate
contact pads
external contact
wiring substrate
contacts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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CNB2005800351647A
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English (en)
Chinese (zh)
Other versions
CN101048866A (zh
Inventor
M·鲍尔
R·斯泰纳
H·沃纳
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Infineon Technologies AG
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Infineon Technologies AG
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Publication of CN101048866A publication Critical patent/CN101048866A/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/121—Arrangements for protection of devices protecting against mechanical damage
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H05K1/114—Pad being close to via, but not surrounding the via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0187—Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/091—Locally and permanently deformed areas including dielectric material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/654—Top-view layouts
    • H10W70/655—Fan-out layouts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/923—Bond pads having multiple stacked layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/9415—Dispositions of bond pads relative to the surface, e.g. recessed, protruding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/942—Dispositions of bond pads relative to underlying supporting features, e.g. bond pads, RDLs or vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
CNB2005800351647A 2004-08-19 2005-07-20 包含外部接触垫片的半导体部件的布线衬底及其制造方法 Expired - Fee Related CN100530625C (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102004040414.3 2004-08-19
DE102004040414A DE102004040414B4 (de) 2004-08-19 2004-08-19 Verfahren zur Herstellung eines Verdrahtungssubstrats eines Halbleiterbauteils mit Außenkontaktanschlussflecken für Außenkontakte
PCT/DE2005/001278 WO2006017998A2 (de) 2004-08-19 2005-07-20 Verdrahtungssubstrat eines halbleiterbauteils mit aussenkontaktanschlussflecken für aussenkontakte und verfahren zur herstellung desselben

Publications (2)

Publication Number Publication Date
CN101048866A CN101048866A (zh) 2007-10-03
CN100530625C true CN100530625C (zh) 2009-08-19

Family

ID=35745461

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2005800351647A Expired - Fee Related CN100530625C (zh) 2004-08-19 2005-07-20 包含外部接触垫片的半导体部件的布线衬底及其制造方法

Country Status (7)

Country Link
US (1) US7638418B2 (https=)
EP (1) EP1779428B1 (https=)
JP (1) JP5059607B2 (https=)
KR (1) KR100889840B1 (https=)
CN (1) CN100530625C (https=)
DE (1) DE102004040414B4 (https=)
WO (1) WO2006017998A2 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8895358B2 (en) * 2009-09-11 2014-11-25 Stats Chippac, Ltd. Semiconductor device and method of forming cavity in PCB containing encapsulant or dummy die having CTE similar to CTE of large array WLCSP
US9960130B2 (en) 2015-02-06 2018-05-01 UTAC Headquarters Pte. Ltd. Reliable interconnect
KR102902631B1 (ko) 2021-01-29 2025-12-22 삼성전자주식회사 포스트를 포함하는 반도체 패키지
EP4334974A1 (en) * 2021-05-06 2024-03-13 Qualcomm Technologies, Inc. High-power die heat sink with vertical heat path
US11929299B2 (en) 2021-05-06 2024-03-12 Qualcomm Incorporated High-power die heat sink with vertical heat path
US11948853B2 (en) 2021-05-06 2024-04-02 QUALCOMM Technologies Incorporated High-power die heat sink
CN114980492A (zh) * 2022-06-28 2022-08-30 昆山国显光电有限公司 线路板组件、显示屏及电子设备

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5900674A (en) * 1996-12-23 1999-05-04 General Electric Company Interface structures for electronic devices
US6265245B1 (en) * 1991-06-04 2001-07-24 Micron Technology, Inc. Compliant interconnect for testing a semiconductor die
US6399896B1 (en) * 2000-03-15 2002-06-04 International Business Machines Corporation Circuit package having low modulus, conformal mounting pads
US20020192865A1 (en) * 1997-03-27 2002-12-19 Hitachi, Ltd. And Hitachi Hokkai Semiconductor, Ltd. Process for mounting electronic device and semiconductor device
DE10134011A1 (de) * 2001-07-12 2003-01-30 Infineon Technologies Ag Trägersubstrat, das zur Kontaktierung mit einer integrierten Schaltung vorgesehen ist
US20030121698A1 (en) * 2001-12-27 2003-07-03 Nec Corporation Semiconductor device and printed wiring board having electrode pads
US20030201534A1 (en) * 2000-02-10 2003-10-30 Epic Technologies, Inc. Compliant, solderable input/output bump structures
US20040147060A1 (en) * 2003-01-29 2004-07-29 Jeong-Woo Seo Ball grid array package having improved reliability and method of manufacturing the same

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6433948A (en) * 1987-07-29 1989-02-03 Hitachi Chemical Co Ltd Wiring board for mounting semiconductor element
JPH0846084A (ja) * 1994-08-02 1996-02-16 Shinko Electric Ind Co Ltd 表面実装型半導体パッケージ及びその製造方法並びに半導体装置
US5759047A (en) * 1996-05-24 1998-06-02 International Business Machines Corporation Flexible circuitized interposer with apertured member and method for making same
US6020220A (en) 1996-07-09 2000-02-01 Tessera, Inc. Compliant semiconductor chip assemblies and methods of making same
US6417029B1 (en) 1996-12-12 2002-07-09 Tessera, Inc. Compliant package with conductive elastomeric posts
US6333565B1 (en) * 1998-03-23 2001-12-25 Seiko Epson Corporation Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
JP2001094227A (ja) * 1999-09-20 2001-04-06 Shinko Electric Ind Co Ltd 半導体チップ実装用の配線基板と該基板を用いた半導体チップの実装方法
JP2001217514A (ja) * 2000-02-03 2001-08-10 Denso Corp 多層配線基板
US6358836B1 (en) * 2000-06-16 2002-03-19 Industrial Technology Research Institute Wafer level package incorporating elastomeric pads in dummy plugs
JP4329235B2 (ja) * 2000-06-27 2009-09-09 セイコーエプソン株式会社 半導体装置及びその製造方法
US6417019B1 (en) * 2001-04-04 2002-07-09 Lumileds Lighting, U.S., Llc Phosphor converted light emitting diode
JP4105409B2 (ja) * 2001-06-22 2008-06-25 株式会社ルネサステクノロジ マルチチップモジュールの製造方法
JP3891838B2 (ja) * 2001-12-26 2007-03-14 株式会社ルネサステクノロジ 半導体装置およびその製造方法
JP2003264256A (ja) * 2002-03-08 2003-09-19 Hitachi Ltd 半導体装置
JP3952375B2 (ja) * 2002-03-25 2007-08-01 富士通株式会社 チップ実装体、チップ実装体の製造方法、及び、電子機器
JP2003318322A (ja) * 2002-04-25 2003-11-07 Matsushita Electric Ind Co Ltd インターポーザ基板およびその製造方法、ならびに半導体装置およびその製造方法
JP2004128364A (ja) * 2002-10-07 2004-04-22 Renesas Technology Corp 半導体パッケージおよび半導体パッケージの実装構造体
JP3905032B2 (ja) * 2002-12-20 2007-04-18 シャープ株式会社 半導体装置、および、その製造方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6265245B1 (en) * 1991-06-04 2001-07-24 Micron Technology, Inc. Compliant interconnect for testing a semiconductor die
US5900674A (en) * 1996-12-23 1999-05-04 General Electric Company Interface structures for electronic devices
US20020192865A1 (en) * 1997-03-27 2002-12-19 Hitachi, Ltd. And Hitachi Hokkai Semiconductor, Ltd. Process for mounting electronic device and semiconductor device
US20030201534A1 (en) * 2000-02-10 2003-10-30 Epic Technologies, Inc. Compliant, solderable input/output bump structures
US6399896B1 (en) * 2000-03-15 2002-06-04 International Business Machines Corporation Circuit package having low modulus, conformal mounting pads
DE10134011A1 (de) * 2001-07-12 2003-01-30 Infineon Technologies Ag Trägersubstrat, das zur Kontaktierung mit einer integrierten Schaltung vorgesehen ist
US20030121698A1 (en) * 2001-12-27 2003-07-03 Nec Corporation Semiconductor device and printed wiring board having electrode pads
US20040147060A1 (en) * 2003-01-29 2004-07-29 Jeong-Woo Seo Ball grid array package having improved reliability and method of manufacturing the same

Also Published As

Publication number Publication date
JP5059607B2 (ja) 2012-10-24
US7638418B2 (en) 2009-12-29
CN101048866A (zh) 2007-10-03
US20070194459A1 (en) 2007-08-23
DE102004040414A1 (de) 2006-03-02
DE102004040414B4 (de) 2006-08-31
EP1779428B1 (de) 2015-05-27
KR20070042580A (ko) 2007-04-23
JP2008510309A (ja) 2008-04-03
KR100889840B1 (ko) 2009-03-20
WO2006017998A2 (de) 2006-02-23
EP1779428A2 (de) 2007-05-02
WO2006017998A3 (de) 2006-08-03

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