JP2008510309A5 - - Google Patents

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Publication number
JP2008510309A5
JP2008510309A5 JP2007526192A JP2007526192A JP2008510309A5 JP 2008510309 A5 JP2008510309 A5 JP 2008510309A5 JP 2007526192 A JP2007526192 A JP 2007526192A JP 2007526192 A JP2007526192 A JP 2007526192A JP 2008510309 A5 JP2008510309 A5 JP 2008510309A5
Authority
JP
Japan
Prior art keywords
wiring board
external contact
wiring
rubber elastic
pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007526192A
Other languages
English (en)
Japanese (ja)
Other versions
JP5059607B2 (ja
JP2008510309A (ja
Filing date
Publication date
Priority claimed from DE102004040414A external-priority patent/DE102004040414B4/de
Application filed filed Critical
Publication of JP2008510309A publication Critical patent/JP2008510309A/ja
Publication of JP2008510309A5 publication Critical patent/JP2008510309A5/ja
Application granted granted Critical
Publication of JP5059607B2 publication Critical patent/JP5059607B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2007526192A 2004-08-19 2005-07-20 外部接触部の外部接触パッドを含んだ半導体部品の配線基板、および、その製造方法 Expired - Fee Related JP5059607B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102004040414.3 2004-08-19
DE102004040414A DE102004040414B4 (de) 2004-08-19 2004-08-19 Verfahren zur Herstellung eines Verdrahtungssubstrats eines Halbleiterbauteils mit Außenkontaktanschlussflecken für Außenkontakte
PCT/DE2005/001278 WO2006017998A2 (de) 2004-08-19 2005-07-20 Verdrahtungssubstrat eines halbleiterbauteils mit aussenkontaktanschlussflecken für aussenkontakte und verfahren zur herstellung desselben

Publications (3)

Publication Number Publication Date
JP2008510309A JP2008510309A (ja) 2008-04-03
JP2008510309A5 true JP2008510309A5 (https=) 2011-08-25
JP5059607B2 JP5059607B2 (ja) 2012-10-24

Family

ID=35745461

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007526192A Expired - Fee Related JP5059607B2 (ja) 2004-08-19 2005-07-20 外部接触部の外部接触パッドを含んだ半導体部品の配線基板、および、その製造方法

Country Status (7)

Country Link
US (1) US7638418B2 (https=)
EP (1) EP1779428B1 (https=)
JP (1) JP5059607B2 (https=)
KR (1) KR100889840B1 (https=)
CN (1) CN100530625C (https=)
DE (1) DE102004040414B4 (https=)
WO (1) WO2006017998A2 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8895358B2 (en) * 2009-09-11 2014-11-25 Stats Chippac, Ltd. Semiconductor device and method of forming cavity in PCB containing encapsulant or dummy die having CTE similar to CTE of large array WLCSP
US9960130B2 (en) 2015-02-06 2018-05-01 UTAC Headquarters Pte. Ltd. Reliable interconnect
KR102902631B1 (ko) 2021-01-29 2025-12-22 삼성전자주식회사 포스트를 포함하는 반도체 패키지
EP4334974A1 (en) * 2021-05-06 2024-03-13 Qualcomm Technologies, Inc. High-power die heat sink with vertical heat path
US11929299B2 (en) 2021-05-06 2024-03-12 Qualcomm Incorporated High-power die heat sink with vertical heat path
US11948853B2 (en) 2021-05-06 2024-04-02 QUALCOMM Technologies Incorporated High-power die heat sink
CN114980492A (zh) * 2022-06-28 2022-08-30 昆山国显光电有限公司 线路板组件、显示屏及电子设备

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6433948A (en) * 1987-07-29 1989-02-03 Hitachi Chemical Co Ltd Wiring board for mounting semiconductor element
US5716218A (en) * 1991-06-04 1998-02-10 Micron Technology, Inc. Process for manufacturing an interconnect for testing a semiconductor die
JPH0846084A (ja) * 1994-08-02 1996-02-16 Shinko Electric Ind Co Ltd 表面実装型半導体パッケージ及びその製造方法並びに半導体装置
US5759047A (en) * 1996-05-24 1998-06-02 International Business Machines Corporation Flexible circuitized interposer with apertured member and method for making same
US6020220A (en) 1996-07-09 2000-02-01 Tessera, Inc. Compliant semiconductor chip assemblies and methods of making same
US6417029B1 (en) 1996-12-12 2002-07-09 Tessera, Inc. Compliant package with conductive elastomeric posts
US5900674A (en) * 1996-12-23 1999-05-04 General Electric Company Interface structures for electronic devices
JPH10270496A (ja) * 1997-03-27 1998-10-09 Hitachi Ltd 電子装置、情報処理装置、半導体装置並びに半導体チップの実装方法
US6333565B1 (en) * 1998-03-23 2001-12-25 Seiko Epson Corporation Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
JP2001094227A (ja) * 1999-09-20 2001-04-06 Shinko Electric Ind Co Ltd 半導体チップ実装用の配線基板と該基板を用いた半導体チップの実装方法
JP2001217514A (ja) * 2000-02-03 2001-08-10 Denso Corp 多層配線基板
US6555908B1 (en) * 2000-02-10 2003-04-29 Epic Technologies, Inc. Compliant, solderable input/output bump structures
US6399896B1 (en) * 2000-03-15 2002-06-04 International Business Machines Corporation Circuit package having low modulus, conformal mounting pads
US6358836B1 (en) * 2000-06-16 2002-03-19 Industrial Technology Research Institute Wafer level package incorporating elastomeric pads in dummy plugs
JP4329235B2 (ja) * 2000-06-27 2009-09-09 セイコーエプソン株式会社 半導体装置及びその製造方法
US6417019B1 (en) * 2001-04-04 2002-07-09 Lumileds Lighting, U.S., Llc Phosphor converted light emitting diode
JP4105409B2 (ja) * 2001-06-22 2008-06-25 株式会社ルネサステクノロジ マルチチップモジュールの製造方法
DE10134011B4 (de) * 2001-07-12 2007-08-16 Infineon Technologies Ag Trägersubstrat, das zur Kontaktierung mit einer integrierten Schaltung vorgesehen ist
JP3891838B2 (ja) * 2001-12-26 2007-03-14 株式会社ルネサステクノロジ 半導体装置およびその製造方法
JP2003198068A (ja) * 2001-12-27 2003-07-11 Nec Corp プリント基板、半導体装置、およびプリント基板と部品との電気的接続構造
JP2003264256A (ja) * 2002-03-08 2003-09-19 Hitachi Ltd 半導体装置
JP3952375B2 (ja) * 2002-03-25 2007-08-01 富士通株式会社 チップ実装体、チップ実装体の製造方法、及び、電子機器
JP2003318322A (ja) * 2002-04-25 2003-11-07 Matsushita Electric Ind Co Ltd インターポーザ基板およびその製造方法、ならびに半導体装置およびその製造方法
JP2004128364A (ja) * 2002-10-07 2004-04-22 Renesas Technology Corp 半導体パッケージおよび半導体パッケージの実装構造体
JP3905032B2 (ja) * 2002-12-20 2007-04-18 シャープ株式会社 半導体装置、および、その製造方法
KR20040069513A (ko) * 2003-01-29 2004-08-06 삼성전자주식회사 신뢰성 높은 볼 그리드 어레이 패키지와 그 제조 방법

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