CN100519079C - 用于三维固定的研磨件的原位激活的设备和方法 - Google Patents

用于三维固定的研磨件的原位激活的设备和方法 Download PDF

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Publication number
CN100519079C
CN100519079C CNB2004800226356A CN200480022635A CN100519079C CN 100519079 C CN100519079 C CN 100519079C CN B2004800226356 A CNB2004800226356 A CN B2004800226356A CN 200480022635 A CN200480022635 A CN 200480022635A CN 100519079 C CN100519079 C CN 100519079C
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China
Prior art keywords
abrasive
substrate
abrasive article
corrosion strength
supporting component
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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CNB2004800226356A
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English (en)
Chinese (zh)
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CN1832829A (zh
Inventor
约翰·J.·加格里亚蒂
克里斯多佛·J.·罗伯
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3M Innovative Properties Co
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3M Innovative Properties Co
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/02—Devices or means for dressing or conditioning abrasive surfaces of plane surfaces on abrasive tools

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)
  • Other Investigation Or Analysis Of Materials By Electrical Means (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
CNB2004800226356A 2003-08-07 2004-06-24 用于三维固定的研磨件的原位激活的设备和方法 Expired - Fee Related CN100519079C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/636,792 2003-08-07
US10/636,792 US7160178B2 (en) 2003-08-07 2003-08-07 In situ activation of a three-dimensional fixed abrasive article

Publications (2)

Publication Number Publication Date
CN1832829A CN1832829A (zh) 2006-09-13
CN100519079C true CN100519079C (zh) 2009-07-29

Family

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Family Applications (1)

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CNB2004800226356A Expired - Fee Related CN100519079C (zh) 2003-08-07 2004-06-24 用于三维固定的研磨件的原位激活的设备和方法

Country Status (10)

Country Link
US (1) US7160178B2 (enExample)
EP (1) EP1651386B1 (enExample)
JP (1) JP4634381B2 (enExample)
KR (1) KR101161883B1 (enExample)
CN (1) CN100519079C (enExample)
AT (1) ATE390988T1 (enExample)
DE (1) DE602004012864T2 (enExample)
MY (1) MY137233A (enExample)
TW (1) TWI327504B (enExample)
WO (1) WO2005016596A1 (enExample)

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US9199357B2 (en) 1997-04-04 2015-12-01 Chien-Min Sung Brazed diamond tools and methods for making the same
US9868100B2 (en) 1997-04-04 2018-01-16 Chien-Min Sung Brazed diamond tools and methods for making the same
US9238207B2 (en) 1997-04-04 2016-01-19 Chien-Min Sung Brazed diamond tools and methods for making the same
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US9138862B2 (en) 2011-05-23 2015-09-22 Chien-Min Sung CMP pad dresser having leveled tips and associated methods
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US8393934B2 (en) * 2006-11-16 2013-03-12 Chien-Min Sung CMP pad dressers with hybridized abrasive surface and related methods
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US20150017884A1 (en) * 2006-11-16 2015-01-15 Chien-Min Sung CMP Pad Dressers with Hybridized Abrasive Surface and Related Methods
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US8591764B2 (en) * 2006-12-20 2013-11-26 3M Innovative Properties Company Chemical mechanical planarization composition, system, and method of use
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US7530887B2 (en) * 2007-08-16 2009-05-12 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with controlled wetting
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US8393938B2 (en) * 2007-11-13 2013-03-12 Chien-Min Sung CMP pad dressers
TWI388402B (en) 2007-12-06 2013-03-11 Methods for orienting superabrasive particles on a surface and associated tools
JP5597140B2 (ja) * 2007-12-31 2014-10-01 スリーエム イノベイティブ プロパティズ カンパニー プラズマ処理された研磨物品及び同物品の作製方法
DE102008021636B3 (de) * 2008-04-30 2009-11-19 Esk Ceramics Gmbh & Co. Kg Verfahren zum Fixieren eines Verbindungselements auf einem Werkstück und Bauteil aus einem Werkstück mit einem darauf fixierten Verbindungselement
JP2009302136A (ja) * 2008-06-10 2009-12-24 Panasonic Corp 半導体集積回路
US9221148B2 (en) 2009-04-30 2015-12-29 Rdc Holdings, Llc Method and apparatus for processing sliders for disk drives, and to various processing media for the same
US8801497B2 (en) 2009-04-30 2014-08-12 Rdc Holdings, Llc Array of abrasive members with resilient support
US20110159784A1 (en) * 2009-04-30 2011-06-30 First Principles LLC Abrasive article with array of gimballed abrasive members and method of use
DE102009030297B3 (de) * 2009-06-24 2011-01-20 Siltronic Ag Verfahren zum Polieren einer Halbleiterscheibe
DE102009030294B4 (de) * 2009-06-24 2013-04-25 Siltronic Ag Verfahren zur Politur der Kante einer Halbleiterscheibe
US20100330890A1 (en) * 2009-06-30 2010-12-30 Zine-Eddine Boutaghou Polishing pad with array of fluidized gimballed abrasive members
CN103299418A (zh) 2010-09-21 2013-09-11 铼钻科技股份有限公司 单层金刚石颗粒散热器及其相关方法
WO2012162430A2 (en) 2011-05-23 2012-11-29 Chien-Min Sung Cmp pad dresser having leveled tips and associated methods
US9067297B2 (en) 2011-11-29 2015-06-30 Nexplanar Corporation Polishing pad with foundation layer and polishing surface layer
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US9067298B2 (en) 2011-11-29 2015-06-30 Nexplanar Corporation Polishing pad with grooved foundation layer and polishing surface layer
US9597769B2 (en) 2012-06-04 2017-03-21 Nexplanar Corporation Polishing pad with polishing surface layer having an aperture or opening above a transparent foundation layer
US20190337119A1 (en) * 2016-12-21 2019-11-07 3M Innovative Properties Company Pad conditioner with spacer and wafer planarization system
US12043785B2 (en) 2017-07-11 2024-07-23 3M Innovative Properties Company Abrasive articles including conformable coatings and polishing system therefrom
CN111032284B (zh) 2017-08-04 2022-11-04 3M创新有限公司 具有增强的共平面性的微复制型抛光表面
CN111032285B (zh) 2017-08-25 2022-07-19 3M创新有限公司 表面突起抛光垫
EP3924146A4 (en) * 2019-02-13 2022-11-09 3M Innovative Properties Company ABRASIVES WITH PRECISELY SHAPED FEATURES, ABRASIVES MADE THEREOF AND PROCESSES FOR THEIR MANUFACTURE
US12311494B2 (en) * 2021-03-03 2025-05-27 Applied Materials, Inc. Pressure signals during motor torque monitoring to provide spatial resolution

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Also Published As

Publication number Publication date
EP1651386B1 (en) 2008-04-02
DE602004012864D1 (de) 2008-05-15
US7160178B2 (en) 2007-01-09
CN1832829A (zh) 2006-09-13
JP2007501716A (ja) 2007-02-01
KR20060118402A (ko) 2006-11-23
KR101161883B1 (ko) 2012-07-03
TWI327504B (en) 2010-07-21
JP4634381B2 (ja) 2011-02-16
ATE390988T1 (de) 2008-04-15
MY137233A (en) 2009-01-30
EP1651386A1 (en) 2006-05-03
WO2005016596A1 (en) 2005-02-24
US20050032462A1 (en) 2005-02-10
TW200524709A (en) 2005-08-01
DE602004012864T2 (de) 2009-04-02

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