ATE390988T1 - In-situ-aktivierung eines dreidimensionalen festgelegten schleifkörpers - Google Patents
In-situ-aktivierung eines dreidimensionalen festgelegten schleifkörpersInfo
- Publication number
- ATE390988T1 ATE390988T1 AT04777083T AT04777083T ATE390988T1 AT E390988 T1 ATE390988 T1 AT E390988T1 AT 04777083 T AT04777083 T AT 04777083T AT 04777083 T AT04777083 T AT 04777083T AT E390988 T1 ATE390988 T1 AT E390988T1
- Authority
- AT
- Austria
- Prior art keywords
- grinding body
- fixed grinding
- situ activation
- dimensional fixed
- abrasive article
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/02—Devices or means for dressing or conditioning abrasive surfaces of plane surfaces on abrasive tools
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Other Investigation Or Analysis Of Materials By Electrical Means (AREA)
- Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/636,792 US7160178B2 (en) | 2003-08-07 | 2003-08-07 | In situ activation of a three-dimensional fixed abrasive article |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE390988T1 true ATE390988T1 (de) | 2008-04-15 |
Family
ID=34116473
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT04777083T ATE390988T1 (de) | 2003-08-07 | 2004-06-24 | In-situ-aktivierung eines dreidimensionalen festgelegten schleifkörpers |
Country Status (10)
Country | Link |
---|---|
US (1) | US7160178B2 (de) |
EP (1) | EP1651386B1 (de) |
JP (1) | JP4634381B2 (de) |
KR (1) | KR101161883B1 (de) |
CN (1) | CN100519079C (de) |
AT (1) | ATE390988T1 (de) |
DE (1) | DE602004012864T2 (de) |
MY (1) | MY137233A (de) |
TW (1) | TWI327504B (de) |
WO (1) | WO2005016596A1 (de) |
Families Citing this family (50)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9238207B2 (en) | 1997-04-04 | 2016-01-19 | Chien-Min Sung | Brazed diamond tools and methods for making the same |
US9463552B2 (en) | 1997-04-04 | 2016-10-11 | Chien-Min Sung | Superbrasvie tools containing uniformly leveled superabrasive particles and associated methods |
US9868100B2 (en) | 1997-04-04 | 2018-01-16 | Chien-Min Sung | Brazed diamond tools and methods for making the same |
US9199357B2 (en) | 1997-04-04 | 2015-12-01 | Chien-Min Sung | Brazed diamond tools and methods for making the same |
US9221154B2 (en) | 1997-04-04 | 2015-12-29 | Chien-Min Sung | Diamond tools and methods for making the same |
US9409280B2 (en) | 1997-04-04 | 2016-08-09 | Chien-Min Sung | Brazed diamond tools and methods for making the same |
US6951509B1 (en) * | 2004-03-09 | 2005-10-04 | 3M Innovative Properties Company | Undulated pad conditioner and method of using same |
US20060019417A1 (en) * | 2004-07-26 | 2006-01-26 | Atsushi Shigeta | Substrate processing method and substrate processing apparatus |
US20070060026A1 (en) * | 2005-09-09 | 2007-03-15 | Chien-Min Sung | Methods of bonding superabrasive particles in an organic matrix |
US7384436B2 (en) * | 2004-08-24 | 2008-06-10 | Chien-Min Sung | Polycrystalline grits and associated methods |
US7449124B2 (en) * | 2005-02-25 | 2008-11-11 | 3M Innovative Properties Company | Method of polishing a wafer |
US7179159B2 (en) * | 2005-05-02 | 2007-02-20 | Applied Materials, Inc. | Materials for chemical mechanical polishing |
US8398466B2 (en) * | 2006-11-16 | 2013-03-19 | Chien-Min Sung | CMP pad conditioners with mosaic abrasive segments and associated methods |
US9724802B2 (en) | 2005-05-16 | 2017-08-08 | Chien-Min Sung | CMP pad dressers having leveled tips and associated methods |
US9138862B2 (en) | 2011-05-23 | 2015-09-22 | Chien-Min Sung | CMP pad dresser having leveled tips and associated methods |
US8678878B2 (en) | 2009-09-29 | 2014-03-25 | Chien-Min Sung | System for evaluating and/or improving performance of a CMP pad dresser |
US8622787B2 (en) * | 2006-11-16 | 2014-01-07 | Chien-Min Sung | CMP pad dressers with hybridized abrasive surface and related methods |
US8393934B2 (en) | 2006-11-16 | 2013-03-12 | Chien-Min Sung | CMP pad dressers with hybridized abrasive surface and related methods |
US7169031B1 (en) * | 2005-07-28 | 2007-01-30 | 3M Innovative Properties Company | Self-contained conditioning abrasive article |
US20070049184A1 (en) * | 2005-08-24 | 2007-03-01 | International Business Machines Corporation | Retaining ring structure for enhanced removal rate during fixed abrasive chemical mechanical polishing |
US20070128991A1 (en) * | 2005-12-07 | 2007-06-07 | Yoon Il-Young | Fixed abrasive polishing pad, method of preparing the same, and chemical mechanical polishing apparatus including the same |
JP4858966B2 (ja) * | 2006-11-02 | 2012-01-18 | Towa株式会社 | 電子部品の圧縮成形方法及び成形装置 |
US20150017884A1 (en) * | 2006-11-16 | 2015-01-15 | Chien-Min Sung | CMP Pad Dressers with Hybridized Abrasive Surface and Related Methods |
JP5143020B2 (ja) * | 2006-12-04 | 2013-02-13 | パナソニック株式会社 | 封止材料及び実装構造体 |
US8591764B2 (en) * | 2006-12-20 | 2013-11-26 | 3M Innovative Properties Company | Chemical mechanical planarization composition, system, and method of use |
US7635290B2 (en) | 2007-08-15 | 2009-12-22 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Interpenetrating network for chemical mechanical polishing |
US7530887B2 (en) * | 2007-08-16 | 2009-05-12 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad with controlled wetting |
JP2011502362A (ja) * | 2007-10-31 | 2011-01-20 | スリーエム イノベイティブ プロパティズ カンパニー | ウエハを研磨するための組成物、方法及びプロセス |
CN101903131B (zh) * | 2007-11-13 | 2013-01-02 | 宋健民 | Cmp垫修整器 |
US9011563B2 (en) | 2007-12-06 | 2015-04-21 | Chien-Min Sung | Methods for orienting superabrasive particles on a surface and associated tools |
CN101925441B (zh) * | 2007-12-31 | 2013-08-14 | 3M创新有限公司 | 经等离子处理的磨料制品及其制造方法 |
DE102008021636B3 (de) * | 2008-04-30 | 2009-11-19 | Esk Ceramics Gmbh & Co. Kg | Verfahren zum Fixieren eines Verbindungselements auf einem Werkstück und Bauteil aus einem Werkstück mit einem darauf fixierten Verbindungselement |
JP2009302136A (ja) * | 2008-06-10 | 2009-12-24 | Panasonic Corp | 半導体集積回路 |
US20110159784A1 (en) * | 2009-04-30 | 2011-06-30 | First Principles LLC | Abrasive article with array of gimballed abrasive members and method of use |
US9221148B2 (en) | 2009-04-30 | 2015-12-29 | Rdc Holdings, Llc | Method and apparatus for processing sliders for disk drives, and to various processing media for the same |
US8801497B2 (en) * | 2009-04-30 | 2014-08-12 | Rdc Holdings, Llc | Array of abrasive members with resilient support |
DE102009030294B4 (de) * | 2009-06-24 | 2013-04-25 | Siltronic Ag | Verfahren zur Politur der Kante einer Halbleiterscheibe |
DE102009030297B3 (de) * | 2009-06-24 | 2011-01-20 | Siltronic Ag | Verfahren zum Polieren einer Halbleiterscheibe |
US20100330890A1 (en) * | 2009-06-30 | 2010-12-30 | Zine-Eddine Boutaghou | Polishing pad with array of fluidized gimballed abrasive members |
CN103221180A (zh) | 2010-09-21 | 2013-07-24 | 铼钻科技股份有限公司 | 具有基本平坦颗粒尖端的超研磨工具及其相关方法 |
CN103329253B (zh) | 2011-05-23 | 2016-03-30 | 宋健民 | 具有平坦化尖端的化学机械研磨垫修整器 |
US9067297B2 (en) * | 2011-11-29 | 2015-06-30 | Nexplanar Corporation | Polishing pad with foundation layer and polishing surface layer |
US9067298B2 (en) * | 2011-11-29 | 2015-06-30 | Nexplanar Corporation | Polishing pad with grooved foundation layer and polishing surface layer |
SG11201402224WA (en) * | 2011-11-29 | 2014-09-26 | Nexplanar Corp | Polishing pad with foundation layer and polishing surface layer |
US9597769B2 (en) | 2012-06-04 | 2017-03-21 | Nexplanar Corporation | Polishing pad with polishing surface layer having an aperture or opening above a transparent foundation layer |
US20190337119A1 (en) * | 2016-12-21 | 2019-11-07 | 3M Innovative Properties Company | Pad conditioner with spacer and wafer planarization system |
US12043785B2 (en) | 2017-07-11 | 2024-07-23 | 3M Innovative Properties Company | Abrasive articles including conformable coatings and polishing system therefrom |
CN111032285B (zh) | 2017-08-25 | 2022-07-19 | 3M创新有限公司 | 表面突起抛光垫 |
SG11202108831UA (en) * | 2019-02-13 | 2021-09-29 | 3M Innovative Properties Co | Abrasive elements with precisely shaped features, abrasive articles fabricated therefrom and methods of making thereof |
US20220281060A1 (en) * | 2021-03-03 | 2022-09-08 | Applied Materials, Inc. | Pressure signals with different frequencies during friction monitoring to provide spatial resolution |
Family Cites Families (54)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US907862A (en) | 1905-02-18 | 1908-12-29 | Henry D Nicholls | Grinding and sharpening machine. |
US2990661A (en) | 1958-07-10 | 1961-07-04 | Donald P Hackett | Backing disk for abrasive sheet |
US3110140A (en) | 1961-01-03 | 1963-11-12 | Helen M Jacox | Backing plate for abrasive disks |
FR1596322A (de) | 1968-01-05 | 1970-06-15 | ||
JPS5474396U (de) * | 1977-11-05 | 1979-05-26 | ||
US4652275A (en) | 1985-08-07 | 1987-03-24 | Minnesota Mining And Manufacturing Company | Erodable agglomerates and abrasive products containing the same |
US4799939A (en) | 1987-02-26 | 1989-01-24 | Minnesota Mining And Manufacturing Company | Erodable agglomerates and abrasive products containing the same |
US5014468A (en) | 1989-05-05 | 1991-05-14 | Norton Company | Patterned coated abrasive for fine surface finishing |
JPH0432850U (de) * | 1990-07-15 | 1992-03-17 | ||
US5152917B1 (en) | 1991-02-06 | 1998-01-13 | Minnesota Mining & Mfg | Structured abrasive article |
US5437754A (en) | 1992-01-13 | 1995-08-01 | Minnesota Mining And Manufacturing Company | Abrasive article having precise lateral spacing between abrasive composite members |
MY114512A (en) | 1992-08-19 | 2002-11-30 | Rodel Inc | Polymeric substrate with polymeric microelements |
CA2163761A1 (en) * | 1993-05-26 | 1994-12-08 | Michael V. Mucci | Method of providing a smooth surface on a substrate |
US5549962A (en) | 1993-06-30 | 1996-08-27 | Minnesota Mining And Manufacturing Company | Precisely shaped particles and method of making the same |
US5453312A (en) | 1993-10-29 | 1995-09-26 | Minnesota Mining And Manufacturing Company | Abrasive article, a process for its manufacture, and a method of using it to reduce a workpiece surface |
US5454844A (en) | 1993-10-29 | 1995-10-03 | Minnesota Mining And Manufacturing Company | Abrasive article, a process of making same, and a method of using same to finish a workpiece surface |
JP3036348B2 (ja) | 1994-03-23 | 2000-04-24 | 三菱マテリアル株式会社 | ウェーハ研磨パッドのツルーイング装置 |
US5458532A (en) | 1994-01-12 | 1995-10-17 | Cannone; Salvatore L. | Undulating edged pad holder for rotary floor polishers |
US5897424A (en) | 1995-07-10 | 1999-04-27 | The United States Of America As Represented By The Secretary Of Commerce | Renewable polishing lap |
US5958794A (en) | 1995-09-22 | 1999-09-28 | Minnesota Mining And Manufacturing Company | Method of modifying an exposed surface of a semiconductor wafer |
US5692950A (en) | 1996-08-08 | 1997-12-02 | Minnesota Mining And Manufacturing Company | Abrasive construction for semiconductor wafer modification |
KR20010005993A (ko) | 1997-04-04 | 2001-01-15 | 오브시디안 인코포레이티드 | 향상된 폴리싱을 위한 폴리싱 미디어 매거진 |
US6194317B1 (en) * | 1998-04-30 | 2001-02-27 | 3M Innovative Properties Company | Method of planarizing the upper surface of a semiconductor wafer |
US6093280A (en) | 1997-08-18 | 2000-07-25 | Lsi Logic Corporation | Chemical-mechanical polishing pad conditioning systems |
US6200199B1 (en) | 1998-03-31 | 2001-03-13 | Applied Materials, Inc. | Chemical mechanical polishing conditioner |
US6123612A (en) | 1998-04-15 | 2000-09-26 | 3M Innovative Properties Company | Corrosion resistant abrasive article and method of making |
US6190243B1 (en) | 1998-05-07 | 2001-02-20 | Ebara Corporation | Polishing apparatus |
US6203407B1 (en) | 1998-09-03 | 2001-03-20 | Micron Technology, Inc. | Method and apparatus for increasing-chemical-polishing selectivity |
US6093085A (en) | 1998-09-08 | 2000-07-25 | Advanced Micro Devices, Inc. | Apparatuses and methods for polishing semiconductor wafers |
US6263605B1 (en) | 1998-12-21 | 2001-07-24 | Motorola, Inc. | Pad conditioner coupling and end effector for a chemical mechanical planarization system and method therefor |
US6217426B1 (en) | 1999-04-06 | 2001-04-17 | Applied Materials, Inc. | CMP polishing pad |
US20040053566A1 (en) | 2001-01-12 | 2004-03-18 | Applied Materials, Inc. | CMP platen with patterned surface |
US6220942B1 (en) | 1999-04-02 | 2001-04-24 | Applied Materials, Inc. | CMP platen with patterned surface |
US20040072518A1 (en) | 1999-04-02 | 2004-04-15 | Applied Materials, Inc. | Platen with patterned surface for chemical mechanical polishing |
US20020077037A1 (en) | 1999-05-03 | 2002-06-20 | Tietz James V. | Fixed abrasive articles |
KR20000077144A (ko) | 1999-05-03 | 2000-12-26 | 조셉 제이. 스위니 | 화학 기계적 평탄화 시스템 |
US6491843B1 (en) | 1999-12-08 | 2002-12-10 | Eastman Kodak Company | Slurry for chemical mechanical polishing silicon dioxide |
US6498101B1 (en) | 2000-02-28 | 2002-12-24 | Micron Technology, Inc. | Planarizing pads, planarizing machines and methods for making and using planarizing pads in mechanical and chemical-mechanical planarization of microelectronic device substrate assemblies |
US6451697B1 (en) * | 2000-04-06 | 2002-09-17 | Applied Materials, Inc. | Method for abrasive-free metal CMP in passivation domain |
KR100360469B1 (ko) | 2000-05-09 | 2002-11-08 | 삼성전자 주식회사 | 화학기계적 연마장치의 연마패드 컨디셔닝 장치 |
US6361414B1 (en) * | 2000-06-30 | 2002-03-26 | Lam Research Corporation | Apparatus and method for conditioning a fixed abrasive polishing pad in a chemical mechanical planarization process |
US6520834B1 (en) | 2000-08-09 | 2003-02-18 | Micron Technology, Inc. | Methods and apparatuses for analyzing and controlling performance parameters in mechanical and chemical-mechanical planarization of microelectronic substrates |
US6800020B1 (en) | 2000-10-02 | 2004-10-05 | Lam Research Corporation | Web-style pad conditioning system and methods for implementing the same |
US6569349B1 (en) * | 2000-10-23 | 2003-05-27 | Applied Materials Inc. | Additives to CMP slurry to polish dielectric films |
US6524167B1 (en) * | 2000-10-27 | 2003-02-25 | Applied Materials, Inc. | Method and composition for the selective removal of residual materials and barrier materials during substrate planarization |
US20020072296A1 (en) | 2000-11-29 | 2002-06-13 | Muilenburg Michael J. | Abrasive article having a window system for polishing wafers, and methods |
US20020127957A1 (en) | 2000-12-20 | 2002-09-12 | Shipley Kevin D. | Chemical mechanical polish pad conditioning device |
US6612917B2 (en) | 2001-02-07 | 2003-09-02 | 3M Innovative Properties Company | Abrasive article suitable for modifying a semiconductor wafer |
US6632129B2 (en) | 2001-02-15 | 2003-10-14 | 3M Innovative Properties Company | Fixed abrasive article for use in modifying a semiconductor wafer |
US6530824B2 (en) * | 2001-03-09 | 2003-03-11 | Rodel Holdings, Inc. | Method and composition for polishing by CMP |
US20020142601A1 (en) | 2001-03-30 | 2002-10-03 | Boyd John M. | Method for planarizing a surface of a semiconductor wafer with a fixed abrasive material |
US6508697B1 (en) | 2001-07-16 | 2003-01-21 | Robert Lyle Benner | Polishing pad conditioning system |
US6712679B2 (en) | 2001-08-08 | 2004-03-30 | Lam Research Corporation | Platen assembly having a topographically altered platen surface |
US6652708B2 (en) | 2001-12-28 | 2003-11-25 | Lam Research Corporation | Methods and apparatus for conditioning and temperature control of a processing surface |
-
2003
- 2003-08-07 US US10/636,792 patent/US7160178B2/en not_active Expired - Lifetime
-
2004
- 2004-06-24 EP EP04777083A patent/EP1651386B1/de not_active Expired - Lifetime
- 2004-06-24 AT AT04777083T patent/ATE390988T1/de not_active IP Right Cessation
- 2004-06-24 KR KR1020067002553A patent/KR101161883B1/ko not_active IP Right Cessation
- 2004-06-24 DE DE602004012864T patent/DE602004012864T2/de not_active Expired - Lifetime
- 2004-06-24 CN CNB2004800226356A patent/CN100519079C/zh not_active Expired - Fee Related
- 2004-06-24 WO PCT/US2004/020415 patent/WO2005016596A1/en active Application Filing
- 2004-06-24 JP JP2006522555A patent/JP4634381B2/ja not_active Expired - Fee Related
- 2004-07-12 TW TW093120786A patent/TWI327504B/zh not_active IP Right Cessation
- 2004-07-22 MY MYPI20042943A patent/MY137233A/en unknown
Also Published As
Publication number | Publication date |
---|---|
WO2005016596A1 (en) | 2005-02-24 |
CN1832829A (zh) | 2006-09-13 |
KR20060118402A (ko) | 2006-11-23 |
KR101161883B1 (ko) | 2012-07-03 |
TW200524709A (en) | 2005-08-01 |
CN100519079C (zh) | 2009-07-29 |
JP4634381B2 (ja) | 2011-02-16 |
DE602004012864D1 (de) | 2008-05-15 |
TWI327504B (en) | 2010-07-21 |
MY137233A (en) | 2009-01-30 |
EP1651386B1 (de) | 2008-04-02 |
EP1651386A1 (de) | 2006-05-03 |
DE602004012864T2 (de) | 2009-04-02 |
US20050032462A1 (en) | 2005-02-10 |
US7160178B2 (en) | 2007-01-09 |
JP2007501716A (ja) | 2007-02-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |