SG11202108831UA - Abrasive elements with precisely shaped features, abrasive articles fabricated therefrom and methods of making thereof - Google Patents
Abrasive elements with precisely shaped features, abrasive articles fabricated therefrom and methods of making thereofInfo
- Publication number
- SG11202108831UA SG11202108831UA SG11202108831UA SG11202108831UA SG11202108831UA SG 11202108831U A SG11202108831U A SG 11202108831UA SG 11202108831U A SG11202108831U A SG 11202108831UA SG 11202108831U A SG11202108831U A SG 11202108831UA SG 11202108831U A SG11202108831U A SG 11202108831UA
- Authority
- SG
- Singapore
- Prior art keywords
- abrasive
- making
- methods
- precisely shaped
- shaped features
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/12—Lapping plates for working plane surfaces
- B24B37/14—Lapping plates for working plane surfaces characterised by the composition or properties of the plate materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201962805003P | 2019-02-13 | 2019-02-13 | |
PCT/IB2020/051078 WO2020165759A1 (en) | 2019-02-13 | 2020-02-11 | Abrasive elements with precisely shaped features, abrasive articles fabricated therefrom and methods of making thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11202108831UA true SG11202108831UA (en) | 2021-09-29 |
Family
ID=72045268
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11202108831UA SG11202108831UA (en) | 2019-02-13 | 2020-02-11 | Abrasive elements with precisely shaped features, abrasive articles fabricated therefrom and methods of making thereof |
Country Status (7)
Country | Link |
---|---|
US (1) | US20220134512A1 (en) |
EP (1) | EP3924146A4 (en) |
JP (1) | JP2022519889A (en) |
CN (1) | CN113439010A (en) |
SG (1) | SG11202108831UA (en) |
TW (1) | TW202104520A (en) |
WO (1) | WO2020165759A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115106871A (en) * | 2022-08-29 | 2022-09-27 | 成都中科卓尔智能科技集团有限公司 | Flexible high-precision repairing device and process for surface defects of semiconductor material |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5692950A (en) * | 1996-08-08 | 1997-12-02 | Minnesota Mining And Manufacturing Company | Abrasive construction for semiconductor wafer modification |
US8062098B2 (en) * | 2000-11-17 | 2011-11-22 | Duescher Wayne O | High speed flat lapping platen |
JP2003188125A (en) * | 2001-12-18 | 2003-07-04 | Ebara Corp | Polishing apparatus |
US7160178B2 (en) * | 2003-08-07 | 2007-01-09 | 3M Innovative Properties Company | In situ activation of a three-dimensional fixed abrasive article |
JP5597140B2 (en) * | 2007-12-31 | 2014-10-01 | スリーエム イノベイティブ プロパティズ カンパニー | Plasma-treated abrasive article and method for producing the article |
US9132526B2 (en) * | 2011-03-07 | 2015-09-15 | Entegris, Inc. | Chemical mechanical planarization conditioner |
KR20150039795A (en) * | 2012-08-02 | 2015-04-13 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | Abrasive elements with precisely shaped features, abrasive articles fabricated therefrom and methods of making thereof |
KR102304574B1 (en) * | 2014-03-21 | 2021-09-27 | 엔테그리스, 아이엔씨. | Chemical mechanical planarization pad conditioner with elongated cutting edges |
TW201538276A (en) * | 2014-04-08 | 2015-10-16 | Kinik Co | Chemical mechanical polishing conditioner having different heights |
BR112017007263A2 (en) * | 2014-10-07 | 2017-12-19 | 3M Innovative Properties Co | ? textured abrasive article and related methods? |
-
2020
- 2020-02-11 WO PCT/IB2020/051078 patent/WO2020165759A1/en unknown
- 2020-02-11 US US17/430,774 patent/US20220134512A1/en active Pending
- 2020-02-11 JP JP2021547156A patent/JP2022519889A/en active Pending
- 2020-02-11 SG SG11202108831UA patent/SG11202108831UA/en unknown
- 2020-02-11 CN CN202080014226.0A patent/CN113439010A/en active Pending
- 2020-02-11 EP EP20755385.0A patent/EP3924146A4/en active Pending
- 2020-02-12 TW TW109104363A patent/TW202104520A/en unknown
Also Published As
Publication number | Publication date |
---|---|
CN113439010A (en) | 2021-09-24 |
EP3924146A4 (en) | 2022-11-09 |
EP3924146A1 (en) | 2021-12-22 |
US20220134512A1 (en) | 2022-05-05 |
WO2020165759A1 (en) | 2020-08-20 |
TW202104520A (en) | 2021-02-01 |
JP2022519889A (en) | 2022-03-25 |
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