ATE390988T1 - In-situ-aktivierung eines dreidimensionalen festgelegten schleifkörpers - Google Patents
In-situ-aktivierung eines dreidimensionalen festgelegten schleifkörpersInfo
- Publication number
- ATE390988T1 ATE390988T1 AT04777083T AT04777083T ATE390988T1 AT E390988 T1 ATE390988 T1 AT E390988T1 AT 04777083 T AT04777083 T AT 04777083T AT 04777083 T AT04777083 T AT 04777083T AT E390988 T1 ATE390988 T1 AT E390988T1
- Authority
- AT
- Austria
- Prior art keywords
- grinding body
- fixed grinding
- situ activation
- dimensional fixed
- abrasive article
- Prior art date
Links
- 230000004913 activation Effects 0.000 title 1
- 238000011065 in-situ storage Methods 0.000 title 1
- 230000003628 erosive effect Effects 0.000 abstract 2
- 239000000758 substrate Substances 0.000 abstract 2
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/02—Devices or means for dressing or conditioning abrasive surfaces of plane surfaces on abrasive tools
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Other Investigation Or Analysis Of Materials By Electrical Means (AREA)
- Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/636,792 US7160178B2 (en) | 2003-08-07 | 2003-08-07 | In situ activation of a three-dimensional fixed abrasive article |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE390988T1 true ATE390988T1 (de) | 2008-04-15 |
Family
ID=34116473
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT04777083T ATE390988T1 (de) | 2003-08-07 | 2004-06-24 | In-situ-aktivierung eines dreidimensionalen festgelegten schleifkörpers |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US7160178B2 (enExample) |
| EP (1) | EP1651386B1 (enExample) |
| JP (1) | JP4634381B2 (enExample) |
| KR (1) | KR101161883B1 (enExample) |
| CN (1) | CN100519079C (enExample) |
| AT (1) | ATE390988T1 (enExample) |
| DE (1) | DE602004012864T2 (enExample) |
| MY (1) | MY137233A (enExample) |
| TW (1) | TWI327504B (enExample) |
| WO (1) | WO2005016596A1 (enExample) |
Families Citing this family (51)
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|---|---|---|---|---|
| US9238207B2 (en) | 1997-04-04 | 2016-01-19 | Chien-Min Sung | Brazed diamond tools and methods for making the same |
| US9221154B2 (en) | 1997-04-04 | 2015-12-29 | Chien-Min Sung | Diamond tools and methods for making the same |
| US9868100B2 (en) | 1997-04-04 | 2018-01-16 | Chien-Min Sung | Brazed diamond tools and methods for making the same |
| US9463552B2 (en) | 1997-04-04 | 2016-10-11 | Chien-Min Sung | Superbrasvie tools containing uniformly leveled superabrasive particles and associated methods |
| US9409280B2 (en) | 1997-04-04 | 2016-08-09 | Chien-Min Sung | Brazed diamond tools and methods for making the same |
| US9199357B2 (en) | 1997-04-04 | 2015-12-01 | Chien-Min Sung | Brazed diamond tools and methods for making the same |
| US6951509B1 (en) * | 2004-03-09 | 2005-10-04 | 3M Innovative Properties Company | Undulated pad conditioner and method of using same |
| US20060019417A1 (en) * | 2004-07-26 | 2006-01-26 | Atsushi Shigeta | Substrate processing method and substrate processing apparatus |
| US7384436B2 (en) * | 2004-08-24 | 2008-06-10 | Chien-Min Sung | Polycrystalline grits and associated methods |
| US20070060026A1 (en) * | 2005-09-09 | 2007-03-15 | Chien-Min Sung | Methods of bonding superabrasive particles in an organic matrix |
| US7449124B2 (en) * | 2005-02-25 | 2008-11-11 | 3M Innovative Properties Company | Method of polishing a wafer |
| US7179159B2 (en) * | 2005-05-02 | 2007-02-20 | Applied Materials, Inc. | Materials for chemical mechanical polishing |
| US8398466B2 (en) * | 2006-11-16 | 2013-03-19 | Chien-Min Sung | CMP pad conditioners with mosaic abrasive segments and associated methods |
| US8678878B2 (en) | 2009-09-29 | 2014-03-25 | Chien-Min Sung | System for evaluating and/or improving performance of a CMP pad dresser |
| US8622787B2 (en) * | 2006-11-16 | 2014-01-07 | Chien-Min Sung | CMP pad dressers with hybridized abrasive surface and related methods |
| US8393934B2 (en) * | 2006-11-16 | 2013-03-12 | Chien-Min Sung | CMP pad dressers with hybridized abrasive surface and related methods |
| US9138862B2 (en) | 2011-05-23 | 2015-09-22 | Chien-Min Sung | CMP pad dresser having leveled tips and associated methods |
| US9724802B2 (en) | 2005-05-16 | 2017-08-08 | Chien-Min Sung | CMP pad dressers having leveled tips and associated methods |
| US7169031B1 (en) * | 2005-07-28 | 2007-01-30 | 3M Innovative Properties Company | Self-contained conditioning abrasive article |
| US20070049184A1 (en) * | 2005-08-24 | 2007-03-01 | International Business Machines Corporation | Retaining ring structure for enhanced removal rate during fixed abrasive chemical mechanical polishing |
| US20070128991A1 (en) * | 2005-12-07 | 2007-06-07 | Yoon Il-Young | Fixed abrasive polishing pad, method of preparing the same, and chemical mechanical polishing apparatus including the same |
| JP4858966B2 (ja) * | 2006-11-02 | 2012-01-18 | Towa株式会社 | 電子部品の圧縮成形方法及び成形装置 |
| US20150017884A1 (en) * | 2006-11-16 | 2015-01-15 | Chien-Min Sung | CMP Pad Dressers with Hybridized Abrasive Surface and Related Methods |
| JP5143019B2 (ja) * | 2006-12-04 | 2013-02-13 | パナソニック株式会社 | 封止材料、実装方法、リペア方法および実装構造体 |
| US8591764B2 (en) * | 2006-12-20 | 2013-11-26 | 3M Innovative Properties Company | Chemical mechanical planarization composition, system, and method of use |
| US7635290B2 (en) * | 2007-08-15 | 2009-12-22 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Interpenetrating network for chemical mechanical polishing |
| US7530887B2 (en) * | 2007-08-16 | 2009-05-12 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad with controlled wetting |
| US20100243471A1 (en) * | 2007-10-31 | 2010-09-30 | 3M Innovative Properties Company | Composition, method and process for polishing a wafer |
| CN101903131B (zh) * | 2007-11-13 | 2013-01-02 | 宋健民 | Cmp垫修整器 |
| TWI388402B (en) | 2007-12-06 | 2013-03-11 | Methods for orienting superabrasive particles on a surface and associated tools | |
| JP5597140B2 (ja) * | 2007-12-31 | 2014-10-01 | スリーエム イノベイティブ プロパティズ カンパニー | プラズマ処理された研磨物品及び同物品の作製方法 |
| DE102008021636B3 (de) * | 2008-04-30 | 2009-11-19 | Esk Ceramics Gmbh & Co. Kg | Verfahren zum Fixieren eines Verbindungselements auf einem Werkstück und Bauteil aus einem Werkstück mit einem darauf fixierten Verbindungselement |
| JP2009302136A (ja) * | 2008-06-10 | 2009-12-24 | Panasonic Corp | 半導体集積回路 |
| US20110104989A1 (en) * | 2009-04-30 | 2011-05-05 | First Principles LLC | Dressing bar for embedding abrasive particles into substrates |
| US8801497B2 (en) | 2009-04-30 | 2014-08-12 | Rdc Holdings, Llc | Array of abrasive members with resilient support |
| US9221148B2 (en) | 2009-04-30 | 2015-12-29 | Rdc Holdings, Llc | Method and apparatus for processing sliders for disk drives, and to various processing media for the same |
| DE102009030297B3 (de) * | 2009-06-24 | 2011-01-20 | Siltronic Ag | Verfahren zum Polieren einer Halbleiterscheibe |
| DE102009030294B4 (de) * | 2009-06-24 | 2013-04-25 | Siltronic Ag | Verfahren zur Politur der Kante einer Halbleiterscheibe |
| US20100330890A1 (en) | 2009-06-30 | 2010-12-30 | Zine-Eddine Boutaghou | Polishing pad with array of fluidized gimballed abrasive members |
| CN103299418A (zh) | 2010-09-21 | 2013-09-11 | 铼钻科技股份有限公司 | 单层金刚石颗粒散热器及其相关方法 |
| CN103329253B (zh) | 2011-05-23 | 2016-03-30 | 宋健民 | 具有平坦化尖端的化学机械研磨垫修整器 |
| KR101819539B1 (ko) * | 2011-11-29 | 2018-01-17 | 캐보트 마이크로일렉트로닉스 코포레이션 | 기초 레이어 및 연마면 레이어를 가진 연마 패드 |
| US9067298B2 (en) * | 2011-11-29 | 2015-06-30 | Nexplanar Corporation | Polishing pad with grooved foundation layer and polishing surface layer |
| US9067297B2 (en) | 2011-11-29 | 2015-06-30 | Nexplanar Corporation | Polishing pad with foundation layer and polishing surface layer |
| US9597769B2 (en) | 2012-06-04 | 2017-03-21 | Nexplanar Corporation | Polishing pad with polishing surface layer having an aperture or opening above a transparent foundation layer |
| US20190337119A1 (en) * | 2016-12-21 | 2019-11-07 | 3M Innovative Properties Company | Pad conditioner with spacer and wafer planarization system |
| JP7198801B2 (ja) | 2017-07-11 | 2023-01-04 | スリーエム イノベイティブ プロパティズ カンパニー | 適合性コーティングを含む研磨物品及びそれによる研磨システム |
| CN111032284B (zh) | 2017-08-04 | 2022-11-04 | 3M创新有限公司 | 具有增强的共平面性的微复制型抛光表面 |
| US12048980B2 (en) | 2017-08-25 | 2024-07-30 | 3M Innovative Properties Company | Surface projection polishing pad |
| CN113439010B (zh) | 2019-02-13 | 2024-08-27 | 3M创新有限公司 | 具有精确成形特征部的磨料元件、用其制成的磨料制品及其制造方法 |
| KR102747336B1 (ko) * | 2021-03-03 | 2024-12-31 | 어플라이드 머티어리얼스, 인코포레이티드 | 공간 분해능을 제공하기 위한 모터 토크 모니터링 동안의 압력 신호들 |
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|---|---|---|---|---|
| US907862A (en) * | 1905-02-18 | 1908-12-29 | Henry D Nicholls | Grinding and sharpening machine. |
| US2990661A (en) * | 1958-07-10 | 1961-07-04 | Donald P Hackett | Backing disk for abrasive sheet |
| US3110140A (en) * | 1961-01-03 | 1963-11-12 | Helen M Jacox | Backing plate for abrasive disks |
| FR1596322A (enExample) | 1968-01-05 | 1970-06-15 | ||
| JPS5474396U (enExample) * | 1977-11-05 | 1979-05-26 | ||
| US4652275A (en) * | 1985-08-07 | 1987-03-24 | Minnesota Mining And Manufacturing Company | Erodable agglomerates and abrasive products containing the same |
| US4799939A (en) * | 1987-02-26 | 1989-01-24 | Minnesota Mining And Manufacturing Company | Erodable agglomerates and abrasive products containing the same |
| US5014468A (en) * | 1989-05-05 | 1991-05-14 | Norton Company | Patterned coated abrasive for fine surface finishing |
| JPH0432850U (enExample) * | 1990-07-15 | 1992-03-17 | ||
| US5152917B1 (en) * | 1991-02-06 | 1998-01-13 | Minnesota Mining & Mfg | Structured abrasive article |
| US5437754A (en) * | 1992-01-13 | 1995-08-01 | Minnesota Mining And Manufacturing Company | Abrasive article having precise lateral spacing between abrasive composite members |
| MY114512A (en) * | 1992-08-19 | 2002-11-30 | Rodel Inc | Polymeric substrate with polymeric microelements |
| BR9406687A (pt) * | 1993-05-26 | 1996-02-06 | Minnesota Mining & Mfg | Processo para polimento de uma peça de trabalho |
| US5549962A (en) * | 1993-06-30 | 1996-08-27 | Minnesota Mining And Manufacturing Company | Precisely shaped particles and method of making the same |
| US5453312A (en) * | 1993-10-29 | 1995-09-26 | Minnesota Mining And Manufacturing Company | Abrasive article, a process for its manufacture, and a method of using it to reduce a workpiece surface |
| US5454844A (en) * | 1993-10-29 | 1995-10-03 | Minnesota Mining And Manufacturing Company | Abrasive article, a process of making same, and a method of using same to finish a workpiece surface |
| JP3036348B2 (ja) * | 1994-03-23 | 2000-04-24 | 三菱マテリアル株式会社 | ウェーハ研磨パッドのツルーイング装置 |
| US5458532A (en) * | 1994-01-12 | 1995-10-17 | Cannone; Salvatore L. | Undulating edged pad holder for rotary floor polishers |
| US5897424A (en) * | 1995-07-10 | 1999-04-27 | The United States Of America As Represented By The Secretary Of Commerce | Renewable polishing lap |
| US5958794A (en) * | 1995-09-22 | 1999-09-28 | Minnesota Mining And Manufacturing Company | Method of modifying an exposed surface of a semiconductor wafer |
| US5692950A (en) * | 1996-08-08 | 1997-12-02 | Minnesota Mining And Manufacturing Company | Abrasive construction for semiconductor wafer modification |
| AU6887898A (en) * | 1997-04-04 | 1998-10-30 | Obsidian, Inc. | Polishing media magazine for improved polishing |
| DE69841220D1 (de) * | 1997-04-30 | 2009-11-19 | Minnesota Mining & Mfg | Verfahren zum planarisieren der oberfläche eines halbleiterwafers |
| US6194317B1 (en) * | 1998-04-30 | 2001-02-27 | 3M Innovative Properties Company | Method of planarizing the upper surface of a semiconductor wafer |
| US6093280A (en) * | 1997-08-18 | 2000-07-25 | Lsi Logic Corporation | Chemical-mechanical polishing pad conditioning systems |
| US6200199B1 (en) * | 1998-03-31 | 2001-03-13 | Applied Materials, Inc. | Chemical mechanical polishing conditioner |
| US6123612A (en) * | 1998-04-15 | 2000-09-26 | 3M Innovative Properties Company | Corrosion resistant abrasive article and method of making |
| US6190243B1 (en) * | 1998-05-07 | 2001-02-20 | Ebara Corporation | Polishing apparatus |
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| US20040053566A1 (en) * | 2001-01-12 | 2004-03-18 | Applied Materials, Inc. | CMP platen with patterned surface |
| US6217426B1 (en) * | 1999-04-06 | 2001-04-17 | Applied Materials, Inc. | CMP polishing pad |
| US6220942B1 (en) * | 1999-04-02 | 2001-04-24 | Applied Materials, Inc. | CMP platen with patterned surface |
| US20040072518A1 (en) * | 1999-04-02 | 2004-04-15 | Applied Materials, Inc. | Platen with patterned surface for chemical mechanical polishing |
| US6413873B1 (en) * | 1999-05-03 | 2002-07-02 | Applied Materials, Inc. | System for chemical mechanical planarization |
| US20020077037A1 (en) * | 1999-05-03 | 2002-06-20 | Tietz James V. | Fixed abrasive articles |
| US6491843B1 (en) * | 1999-12-08 | 2002-12-10 | Eastman Kodak Company | Slurry for chemical mechanical polishing silicon dioxide |
| US6498101B1 (en) * | 2000-02-28 | 2002-12-24 | Micron Technology, Inc. | Planarizing pads, planarizing machines and methods for making and using planarizing pads in mechanical and chemical-mechanical planarization of microelectronic device substrate assemblies |
| US6451697B1 (en) * | 2000-04-06 | 2002-09-17 | Applied Materials, Inc. | Method for abrasive-free metal CMP in passivation domain |
| KR100360469B1 (ko) * | 2000-05-09 | 2002-11-08 | 삼성전자 주식회사 | 화학기계적 연마장치의 연마패드 컨디셔닝 장치 |
| US6361414B1 (en) * | 2000-06-30 | 2002-03-26 | Lam Research Corporation | Apparatus and method for conditioning a fixed abrasive polishing pad in a chemical mechanical planarization process |
| US6520834B1 (en) * | 2000-08-09 | 2003-02-18 | Micron Technology, Inc. | Methods and apparatuses for analyzing and controlling performance parameters in mechanical and chemical-mechanical planarization of microelectronic substrates |
| US6800020B1 (en) | 2000-10-02 | 2004-10-05 | Lam Research Corporation | Web-style pad conditioning system and methods for implementing the same |
| US6569349B1 (en) * | 2000-10-23 | 2003-05-27 | Applied Materials Inc. | Additives to CMP slurry to polish dielectric films |
| US6524167B1 (en) * | 2000-10-27 | 2003-02-25 | Applied Materials, Inc. | Method and composition for the selective removal of residual materials and barrier materials during substrate planarization |
| US20020072296A1 (en) * | 2000-11-29 | 2002-06-13 | Muilenburg Michael J. | Abrasive article having a window system for polishing wafers, and methods |
| US20020127957A1 (en) * | 2000-12-20 | 2002-09-12 | Shipley Kevin D. | Chemical mechanical polish pad conditioning device |
| US6612917B2 (en) * | 2001-02-07 | 2003-09-02 | 3M Innovative Properties Company | Abrasive article suitable for modifying a semiconductor wafer |
| US6632129B2 (en) * | 2001-02-15 | 2003-10-14 | 3M Innovative Properties Company | Fixed abrasive article for use in modifying a semiconductor wafer |
| US6530824B2 (en) * | 2001-03-09 | 2003-03-11 | Rodel Holdings, Inc. | Method and composition for polishing by CMP |
| US20020142601A1 (en) * | 2001-03-30 | 2002-10-03 | Boyd John M. | Method for planarizing a surface of a semiconductor wafer with a fixed abrasive material |
| US6508697B1 (en) * | 2001-07-16 | 2003-01-21 | Robert Lyle Benner | Polishing pad conditioning system |
| US6712679B2 (en) * | 2001-08-08 | 2004-03-30 | Lam Research Corporation | Platen assembly having a topographically altered platen surface |
| US6652708B2 (en) | 2001-12-28 | 2003-11-25 | Lam Research Corporation | Methods and apparatus for conditioning and temperature control of a processing surface |
-
2003
- 2003-08-07 US US10/636,792 patent/US7160178B2/en not_active Expired - Lifetime
-
2004
- 2004-06-24 EP EP04777083A patent/EP1651386B1/en not_active Expired - Lifetime
- 2004-06-24 JP JP2006522555A patent/JP4634381B2/ja not_active Expired - Fee Related
- 2004-06-24 KR KR1020067002553A patent/KR101161883B1/ko not_active Expired - Fee Related
- 2004-06-24 CN CNB2004800226356A patent/CN100519079C/zh not_active Expired - Fee Related
- 2004-06-24 DE DE602004012864T patent/DE602004012864T2/de not_active Expired - Lifetime
- 2004-06-24 AT AT04777083T patent/ATE390988T1/de not_active IP Right Cessation
- 2004-06-24 WO PCT/US2004/020415 patent/WO2005016596A1/en not_active Ceased
- 2004-07-12 TW TW093120786A patent/TWI327504B/zh not_active IP Right Cessation
- 2004-07-22 MY MYPI20042943A patent/MY137233A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TW200524709A (en) | 2005-08-01 |
| EP1651386A1 (en) | 2006-05-03 |
| JP2007501716A (ja) | 2007-02-01 |
| WO2005016596A1 (en) | 2005-02-24 |
| JP4634381B2 (ja) | 2011-02-16 |
| US20050032462A1 (en) | 2005-02-10 |
| TWI327504B (en) | 2010-07-21 |
| KR101161883B1 (ko) | 2012-07-03 |
| KR20060118402A (ko) | 2006-11-23 |
| DE602004012864T2 (de) | 2009-04-02 |
| CN100519079C (zh) | 2009-07-29 |
| MY137233A (en) | 2009-01-30 |
| EP1651386B1 (en) | 2008-04-02 |
| DE602004012864D1 (de) | 2008-05-15 |
| CN1832829A (zh) | 2006-09-13 |
| US7160178B2 (en) | 2007-01-09 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |