KR101161883B1 - 고정화된 3차원 연삭 용품의 제자리 활성화 - Google Patents

고정화된 3차원 연삭 용품의 제자리 활성화 Download PDF

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Publication number
KR101161883B1
KR101161883B1 KR1020067002553A KR20067002553A KR101161883B1 KR 101161883 B1 KR101161883 B1 KR 101161883B1 KR 1020067002553 A KR1020067002553 A KR 1020067002553A KR 20067002553 A KR20067002553 A KR 20067002553A KR 101161883 B1 KR101161883 B1 KR 101161883B1
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South Korea
Prior art keywords
delete delete
immobilized
grinding
article
substrate
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Expired - Fee Related
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Korean (ko)
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KR20060118402A (ko
Inventor
존 제이. 가글리어르디
크리스토퍼 제이. 루에브
Original Assignee
쓰리엠 이노베이티브 프로퍼티즈 컴파니
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Publication of KR20060118402A publication Critical patent/KR20060118402A/ko
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/02—Devices or means for dressing or conditioning abrasive surfaces of plane surfaces on abrasive tools

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)
  • Other Investigation Or Analysis Of Materials By Electrical Means (AREA)
KR1020067002553A 2003-08-07 2004-06-24 고정화된 3차원 연삭 용품의 제자리 활성화 Expired - Fee Related KR101161883B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/636,792 US7160178B2 (en) 2003-08-07 2003-08-07 In situ activation of a three-dimensional fixed abrasive article
US10/636,792 2003-08-07
PCT/US2004/020415 WO2005016596A1 (en) 2003-08-07 2004-06-24 In situ activation of a three-dimensional fixed abrasive article

Publications (2)

Publication Number Publication Date
KR20060118402A KR20060118402A (ko) 2006-11-23
KR101161883B1 true KR101161883B1 (ko) 2012-07-03

Family

ID=34116473

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020067002553A Expired - Fee Related KR101161883B1 (ko) 2003-08-07 2004-06-24 고정화된 3차원 연삭 용품의 제자리 활성화

Country Status (10)

Country Link
US (1) US7160178B2 (enExample)
EP (1) EP1651386B1 (enExample)
JP (1) JP4634381B2 (enExample)
KR (1) KR101161883B1 (enExample)
CN (1) CN100519079C (enExample)
AT (1) ATE390988T1 (enExample)
DE (1) DE602004012864T2 (enExample)
MY (1) MY137233A (enExample)
TW (1) TWI327504B (enExample)
WO (1) WO2005016596A1 (enExample)

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US9409280B2 (en) 1997-04-04 2016-08-09 Chien-Min Sung Brazed diamond tools and methods for making the same
US9238207B2 (en) 1997-04-04 2016-01-19 Chien-Min Sung Brazed diamond tools and methods for making the same
US9868100B2 (en) 1997-04-04 2018-01-16 Chien-Min Sung Brazed diamond tools and methods for making the same
US9221154B2 (en) 1997-04-04 2015-12-29 Chien-Min Sung Diamond tools and methods for making the same
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US7384436B2 (en) * 2004-08-24 2008-06-10 Chien-Min Sung Polycrystalline grits and associated methods
US20070060026A1 (en) * 2005-09-09 2007-03-15 Chien-Min Sung Methods of bonding superabrasive particles in an organic matrix
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US8398466B2 (en) * 2006-11-16 2013-03-19 Chien-Min Sung CMP pad conditioners with mosaic abrasive segments and associated methods
US9724802B2 (en) 2005-05-16 2017-08-08 Chien-Min Sung CMP pad dressers having leveled tips and associated methods
US9138862B2 (en) 2011-05-23 2015-09-22 Chien-Min Sung CMP pad dresser having leveled tips and associated methods
US8622787B2 (en) * 2006-11-16 2014-01-07 Chien-Min Sung CMP pad dressers with hybridized abrasive surface and related methods
US8393934B2 (en) * 2006-11-16 2013-03-12 Chien-Min Sung CMP pad dressers with hybridized abrasive surface and related methods
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JP4858966B2 (ja) * 2006-11-02 2012-01-18 Ｔｏｗａ株式会社 電子部品の圧縮成形方法及び成形装置
US20150017884A1 (en) * 2006-11-16 2015-01-15 Chien-Min Sung CMP Pad Dressers with Hybridized Abrasive Surface and Related Methods
WO2008069179A1 (ja) * 2006-12-04 2008-06-12 Panasonic Corporation 封止材料及びその封止材料を用いる実装方法
US8591764B2 (en) * 2006-12-20 2013-11-26 3M Innovative Properties Company Chemical mechanical planarization composition, system, and method of use
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CN101925441B (zh) * 2007-12-31 2013-08-14 3M创新有限公司 经等离子处理的磨料制品及其制造方法
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US9221148B2 (en) 2009-04-30 2015-12-29 Rdc Holdings, Llc Method and apparatus for processing sliders for disk drives, and to various processing media for the same
US20110104989A1 (en) * 2009-04-30 2011-05-05 First Principles LLC Dressing bar for embedding abrasive particles into substrates
DE102009030294B4 (de) * 2009-06-24 2013-04-25 Siltronic Ag Verfahren zur Politur der Kante einer Halbleiterscheibe
DE102009030297B3 (de) * 2009-06-24 2011-01-20 Siltronic Ag Verfahren zum Polieren einer Halbleiterscheibe
US20100330890A1 (en) * 2009-06-30 2010-12-30 Zine-Eddine Boutaghou Polishing pad with array of fluidized gimballed abrasive members
CN103221180A (zh) 2010-09-21 2013-07-24 铼钻科技股份有限公司 具有基本平坦颗粒尖端的超研磨工具及其相关方法
WO2012162430A2 (en) 2011-05-23 2012-11-29 Chien-Min Sung Cmp pad dresser having leveled tips and associated methods
US9067298B2 (en) * 2011-11-29 2015-06-30 Nexplanar Corporation Polishing pad with grooved foundation layer and polishing surface layer
KR101819539B1 (ko) * 2011-11-29 2018-01-17 캐보트 마이크로일렉트로닉스 코포레이션 기초 레이어 및 연마면 레이어를 가진 연마 패드
US9067297B2 (en) * 2011-11-29 2015-06-30 Nexplanar Corporation Polishing pad with foundation layer and polishing surface layer
US9597769B2 (en) 2012-06-04 2017-03-21 Nexplanar Corporation Polishing pad with polishing surface layer having an aperture or opening above a transparent foundation layer
JP7232763B2 (ja) * 2016-12-21 2023-03-03 スリーエム イノベイティブ プロパティズ カンパニー スペーサ及びウェハ平坦化システムを有するパッドコンディショナ
JP7198801B2 (ja) 2017-07-11 2023-01-04 スリーエム イノベイティブ プロパティズ カンパニー 適合性コーティングを含む研磨物品及びそれによる研磨システム
US12208483B2 (en) 2017-08-04 2025-01-28 3M Innovative Properties Company Microreplicated polishing surface with enhanced co-planarity
WO2019038675A1 (en) 2017-08-25 2019-02-28 3M Innovative Properties Company SURFACE SURFACE SURFACE POLISHING PAD
SG11202108831UA (en) 2019-02-13 2021-09-29 3M Innovative Properties Co Abrasive elements with precisely shaped features, abrasive articles fabricated therefrom and methods of making thereof
US12440942B2 (en) 2021-03-03 2025-10-14 Applied Materials, Inc. Pressure signals with different frequencies during friction monitoring to provide spatial resolution

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Also Published As

Publication number Publication date
EP1651386B1 (en) 2008-04-02
CN1832829A (zh) 2006-09-13
EP1651386A1 (en) 2006-05-03
KR20060118402A (ko) 2006-11-23
DE602004012864D1 (de) 2008-05-15
JP2007501716A (ja) 2007-02-01
US20050032462A1 (en) 2005-02-10
TWI327504B (en) 2010-07-21
TW200524709A (en) 2005-08-01
ATE390988T1 (de) 2008-04-15
DE602004012864T2 (de) 2009-04-02
MY137233A (en) 2009-01-30
WO2005016596A1 (en) 2005-02-24
US7160178B2 (en) 2007-01-09
JP4634381B2 (ja) 2011-02-16
CN100519079C (zh) 2009-07-29

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