CN100519012C - 能够以微细的液滴的形状喷射、层叠涂布的金属纳米粒子分散液 - Google Patents
能够以微细的液滴的形状喷射、层叠涂布的金属纳米粒子分散液 Download PDFInfo
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- CN100519012C CN100519012C CNB2004800314925A CN200480031492A CN100519012C CN 100519012 C CN100519012 C CN 100519012C CN B2004800314925 A CNB2004800314925 A CN B2004800314925A CN 200480031492 A CN200480031492 A CN 200480031492A CN 100519012 C CN100519012 C CN 100519012C
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- metal nanoparticle
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D17/00—Pigment pastes, e.g. for mixing in paints
- C09D17/004—Pigment pastes, e.g. for mixing in paints containing an inorganic pigment
- C09D17/006—Metal
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/24—Electrically-conducting paints
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0242—Shape of an individual particle
- H05K2201/0257—Nanoparticles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
Abstract
Description
实施例1 | 实施例2 | 实施例3 | 比较例1 | |
一液滴的点径(μm) | 0.6 | 0.7 | 0.9 | 1.5 |
描绘点间隙(μm) | 30 | 30 | 30 | 30 |
涂布层的圆形底面直径(μm) | 2.5 | 2.5 | 2.5 | >2.5 |
涂布层的平均高度(μm) | 20 | 20 | 20 | — |
烧结体层的底面直径(μm) | 2.5 | 2.5 | 2.5 | — |
烧结体层的平均高度(μm) | 15 | 13 | 12 | — |
体积固有电阻率(μΩ·cm) | 2.2 | 2.4 | 2.5 | — |
实施例4 | 实施例5 | 比较例2 | |
每一液滴的点径(μm) | 0.6 | 0.7 | 1.2 |
描绘点间隙(μm) | 30 | 30 | 30 |
涂布层的圆形底面直径(μm) | 2.5 | 2.5 | >2.5 |
涂布层的平均高度(μm) | 20 | 20 | - |
烧结体层的底面直径(μm) | 2.5 | 2.5 | - |
烧结体层的平均高度(μm) | 15 | 13 | - |
体积固有电阻率(μΩ·cm) | 2.6 | 2.7 | - |
实施例6 | 实施例7 | 比较例3 | |
每一液滴的点径(μm) | 0.7 | 0.8 | 1.9 |
描绘点间隙(μm) | 30 | 30 | 30 |
涂布层的圆形底面直径(μm) | 8.0 | 8.0 | >8.0 |
涂布层的平均高度(μm) | 10.0 | 10.0 | - |
烧结体层的底面直径(μm) | 8.0 | 8.0 | - |
烧结体层的平均高度(μm) | 7.0 | 6.7 | - |
体积固有电阻率(μΩ·cm) | 3.1 | 3.4 | - |
参考例1 | 参考例2 | 参考例.3 | |
对于除去分散溶媒的其他成分的配合量的基础 | 实施例3 | 实施例5 | 实施例7 |
分散溶媒的含有率(体积%) | 42 | 45 | 43 |
液粘度Pa·s(23℃) | 70 | 50 | 40 |
Claims (12)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003322043 | 2003-09-12 | ||
JP322043/2003 | 2003-09-12 | ||
PCT/JP2004/013229 WO2005025787A1 (ja) | 2003-09-12 | 2004-09-10 | 微細な液滴の形状で噴射し、積層塗布可能な金属ナノ粒子分散液 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1871085A CN1871085A (zh) | 2006-11-29 |
CN100519012C true CN100519012C (zh) | 2009-07-29 |
Family
ID=34308655
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2004800314925A Active CN100519012C (zh) | 2003-09-12 | 2004-09-10 | 能够以微细的液滴的形状喷射、层叠涂布的金属纳米粒子分散液 |
Country Status (7)
Country | Link |
---|---|
US (1) | US9006296B2 (zh) |
EP (1) | EP1666175B1 (zh) |
JP (1) | JP4284550B2 (zh) |
KR (1) | KR100740634B1 (zh) |
CN (1) | CN100519012C (zh) |
TW (1) | TWI331345B (zh) |
WO (1) | WO2005025787A1 (zh) |
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- 2004-09-10 US US10/571,507 patent/US9006296B2/en active Active
- 2004-09-10 TW TW93127675A patent/TWI331345B/zh active
- 2004-09-10 CN CNB2004800314925A patent/CN100519012C/zh active Active
- 2004-09-10 JP JP2005513914A patent/JP4284550B2/ja active Active
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EP1666175B1 (en) | 2019-05-15 |
JPWO2005025787A1 (ja) | 2007-11-08 |
TWI331345B (en) | 2010-10-01 |
EP1666175A1 (en) | 2006-06-07 |
EP1666175A4 (en) | 2010-10-27 |
WO2005025787A1 (ja) | 2005-03-24 |
KR100740634B1 (ko) | 2007-07-18 |
TW200519968A (en) | 2005-06-16 |
KR20060060725A (ko) | 2006-06-05 |
JP4284550B2 (ja) | 2009-06-24 |
CN1871085A (zh) | 2006-11-29 |
US20070098883A1 (en) | 2007-05-03 |
US9006296B2 (en) | 2015-04-14 |
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