SG10201405421WA - Printing ink, metal nanoparticles used in the same, wiring, circuit board, and semiconductor package - Google Patents

Printing ink, metal nanoparticles used in the same, wiring, circuit board, and semiconductor package

Info

Publication number
SG10201405421WA
SG10201405421WA SG10201405421WA SG10201405421WA SG10201405421WA SG 10201405421W A SG10201405421W A SG 10201405421WA SG 10201405421W A SG10201405421W A SG 10201405421WA SG 10201405421W A SG10201405421W A SG 10201405421WA SG 10201405421W A SG10201405421W A SG 10201405421WA
Authority
SG
Singapore
Prior art keywords
wiring
circuit board
same
semiconductor package
printing ink
Prior art date
Application number
SG10201405421WA
Inventor
Hideo Nakako
Kazunori Yamamoto
Yasushi Kumashiro
Shunya Yokosawa
Yoshinori Ejiri
Katsuyuki Masuda
Kyoko Kuroda
Maki Inada
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of SG10201405421WA publication Critical patent/SG10201405421WA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • C09D11/32—Inkjet printing inks characterised by colouring agents
    • C09D11/322—Pigment inks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/52—Electrically conductive inks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/14—Conductive material dispersed in non-conductive inorganic material
    • H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Dispersion Chemistry (AREA)
  • Nanotechnology (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Ink Jet Recording Methods And Recording Media Thereof (AREA)
SG10201405421WA 2009-09-16 2010-09-13 Printing ink, metal nanoparticles used in the same, wiring, circuit board, and semiconductor package SG10201405421WA (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2009215001 2009-09-16
JP2010018417 2010-01-29
JP2010025318 2010-02-08

Publications (1)

Publication Number Publication Date
SG10201405421WA true SG10201405421WA (en) 2014-10-30

Family

ID=43758623

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201405421WA SG10201405421WA (en) 2009-09-16 2010-09-13 Printing ink, metal nanoparticles used in the same, wiring, circuit board, and semiconductor package

Country Status (9)

Country Link
US (1) US20120170241A1 (en)
EP (1) EP2479227B1 (en)
JP (1) JP5903887B2 (en)
KR (1) KR101633152B1 (en)
CN (1) CN102549086A (en)
MY (1) MY159795A (en)
SG (1) SG10201405421WA (en)
TW (1) TWI501259B (en)
WO (1) WO2011034019A1 (en)

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JP5795859B2 (en) 2010-10-27 2015-10-14 理想科学工業株式会社 Non-aqueous ink
JP5728659B2 (en) * 2011-07-29 2015-06-03 パナソニックＩｐマネジメント株式会社 Photosensitive electromagnetic wave shielding ink composition, electromagnetic wave shielding cured product, and method for producing electromagnetic wave shielding cured product
TWI476874B (en) * 2011-07-29 2015-03-11 Hon Hai Prec Ind Co Ltd Glass pad with circuit trace and method of making the same
KR101970373B1 (en) * 2011-08-03 2019-04-18 히타치가세이가부시끼가이샤 Composition set, electroconductive substrate and manufacturing method thereof, and electroconductive binding material composition
CN103187117B (en) * 2011-12-27 2016-04-27 比亚迪股份有限公司 Rubber of conductive rubber and application and surface selective metallization and preparation method thereof
JP5983096B2 (en) * 2012-06-28 2016-08-31 日立化成株式会社 Ink for printing method, printed wiring board, method for manufacturing printed wiring board, display device and solar cell module
KR102118308B1 (en) * 2012-11-26 2020-06-03 미쓰이금속광업주식회사 Copper powder and method for producing same
JP6171548B2 (en) * 2013-05-14 2017-08-02 セイコーエプソン株式会社 Ink jet recording apparatus and ink jet recording method
KR101466816B1 (en) * 2013-09-23 2014-12-10 국제엘렉트릭코리아 주식회사 Heater member and substrate processing apparatus using sysceptor
CZ307435B6 (en) * 2013-12-17 2018-08-22 Univerzita Tomáše Bati ve Zlíně Inorganic ink based on nanoparticles, especially for material printing
CN104194266A (en) * 2014-08-26 2014-12-10 太仓碧奇新材料研发有限公司 Nanometer cuprous-oxide-based semiconductor material for 3D printing and preparation method thereof
JP6554788B2 (en) * 2014-12-03 2019-08-07 富士電機株式会社 Manufacturing method of semiconductor device
CN104528801A (en) * 2014-12-18 2015-04-22 中国科学院深圳先进技术研究院 Preparation method of nano copper oxide and printing method of metal-matrix printing ink
EP3263248A4 (en) * 2015-02-27 2018-10-17 Hitachi Chemical Company, Ltd. Copper-containing particles, conductor-forming composition, method for manufacturing conductor, conductor and device
AR104005A1 (en) * 2015-02-27 2017-06-21 Dow Global Technologies Llc WATERPROOF DISPOSAL COMPOSITION OF THE FLUIDITY POINT IN STABLE HYDROCARBON SOLVENT
CN107530781B (en) * 2015-03-27 2020-09-08 松下电器产业株式会社 Metal nanoparticle dispersion liquid for solder paste, method for producing same, and solder paste and method for producing same
US10563079B2 (en) * 2016-03-04 2020-02-18 Xerox Corporation Silver nanoparticle ink
CN107493660A (en) * 2016-06-12 2017-12-19 品翔电通股份有限公司 The manufacture method of conductive wires
JP7003668B2 (en) * 2018-01-05 2022-02-04 住友電気工業株式会社 Manufacturing method of copper nano ink and copper nano ink
CN110294971A (en) * 2018-03-22 2019-10-01 深圳Tcl工业研究院有限公司 A kind of ink
JP6549298B1 (en) * 2018-09-21 2019-07-24 Ｊｘ金属株式会社 Pulverizable copper powder and method for producing the same
US11706874B2 (en) * 2019-08-06 2023-07-18 Microsoft Technology Licensing, Llc Electronic-circuit printing using low-cost ink
WO2023130044A1 (en) * 2021-12-30 2023-07-06 University Of Washington Ultrasensitive capacitive sensor composed of nanostructured electrodes

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US6638995B1 (en) * 1998-11-30 2003-10-28 Flint Ink Corporation Printing inks
JP3953237B2 (en) 1998-12-02 2007-08-08 株式会社アルバック Method for forming metal thin film and method for producing metal fine particle dispersion
JP3764349B2 (en) 2001-05-07 2006-04-05 ハリマ化成株式会社 Method of forming an alternative conductive metal film for plating using metal fine particle dispersion
JP4280025B2 (en) 2002-04-23 2009-06-17 大日本印刷株式会社 Method for forming fine pattern
JP2003334618A (en) 2002-05-17 2003-11-25 Kanto Auto Works Ltd Heming molding method and heming molding machine used therefor
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JP4728755B2 (en) 2005-09-22 2011-07-20 ハリマ化成株式会社 Method for forming conductive joint
CN101096479A (en) * 2006-01-18 2008-01-02 株式会社理光 Recording ink as well as ink media set, ink cartridge, ink recorded matter, inkjet recording apparatus and inkjet recording method
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US20100233011A1 (en) * 2007-10-22 2010-09-16 Hideo Nakako Method for forming a copper wiring pattern, and copper oxide particle dispersed slurry used therein
US8801971B2 (en) * 2007-12-18 2014-08-12 Hitachi Chemical Company, Ltd. Copper conductor film and manufacturing method thereof, conductive substrate and manufacturing method thereof, copper conductor wiring and manufacturing method thereof, and treatment solution
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JP4662382B2 (en) 2008-07-14 2011-03-30 東芝エレベータ株式会社 Abnormality diagnosis system for passenger conveyor
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KR100890928B1 (en) * 2008-09-19 2009-04-03 정승수 Copper nano ink and method for fabricating the same

Also Published As

Publication number Publication date
CN102549086A (en) 2012-07-04
TWI501259B (en) 2015-09-21
KR20120094157A (en) 2012-08-23
TW201117231A (en) 2011-05-16
MY159795A (en) 2017-01-31
JP5903887B2 (en) 2016-04-13
WO2011034019A1 (en) 2011-03-24
JPWO2011034019A1 (en) 2013-02-14
KR101633152B1 (en) 2016-06-23
EP2479227B1 (en) 2015-01-07
EP2479227A1 (en) 2012-07-25
US20120170241A1 (en) 2012-07-05
EP2479227A4 (en) 2013-02-20

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