CN100477517C - 表面安装型saw元件 - Google Patents
表面安装型saw元件 Download PDFInfo
- Publication number
- CN100477517C CN100477517C CNB2004800413598A CN200480041359A CN100477517C CN 100477517 C CN100477517 C CN 100477517C CN B2004800413598 A CNB2004800413598 A CN B2004800413598A CN 200480041359 A CN200480041359 A CN 200480041359A CN 100477517 C CN100477517 C CN 100477517C
- Authority
- CN
- China
- Prior art keywords
- piezoelectric substrate
- sealing resin
- acoustic wave
- saw
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
- H03H9/1085—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a non-uniform sealing mass covering the non-active sides of the BAW device
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Abstract
Description
Claims (4)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004029848A JP2005223641A (ja) | 2004-02-05 | 2004-02-05 | 表面実装型sawデバイス |
JP029848/2004 | 2004-02-05 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1914800A CN1914800A (zh) | 2007-02-14 |
CN100477517C true CN100477517C (zh) | 2009-04-08 |
Family
ID=34835966
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2004800413598A Expired - Fee Related CN100477517C (zh) | 2004-02-05 | 2004-11-12 | 表面安装型saw元件 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7608977B2 (zh) |
EP (1) | EP1715581A4 (zh) |
JP (1) | JP2005223641A (zh) |
CN (1) | CN100477517C (zh) |
WO (1) | WO2005076472A1 (zh) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4856014B2 (ja) * | 2007-06-28 | 2012-01-18 | 三菱電機株式会社 | 回路モジュールとその製造方法 |
JP5195903B2 (ja) * | 2008-03-31 | 2013-05-15 | 株式会社村田製作所 | 電子部品モジュール及び該電子部品モジュールの製造方法 |
JP5686943B2 (ja) * | 2008-09-17 | 2015-03-18 | 太陽誘電株式会社 | 弾性波デバイス及びその製造方法 |
US7791255B2 (en) * | 2008-11-13 | 2010-09-07 | Eta Sa Manufacture Horlogère Suisse | Packaging for piezoelectric resonator |
EP2187520B1 (en) * | 2008-11-13 | 2011-04-06 | Micro Crystal AG | Packaging for piezoelectric resonator |
US8922100B2 (en) * | 2009-03-04 | 2014-12-30 | Honda Motor Co., Ltd. | Woven active fiber composite |
JP5029704B2 (ja) * | 2010-01-20 | 2012-09-19 | 株式会社村田製作所 | 弾性波デュプレクサ |
JP2013145932A (ja) * | 2010-05-07 | 2013-07-25 | Murata Mfg Co Ltd | 弾性表面波装置及びその製造方法 |
US9530906B2 (en) * | 2013-10-18 | 2016-12-27 | Stc.Unm | Methods to introduce sub-micrometer, symmetry-breaking surface corrugation to silicon substrates to increase light trapping |
US9680445B2 (en) * | 2014-10-31 | 2017-06-13 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Packaged device including cavity package with elastic layer within molding compound |
JP6853834B2 (ja) * | 2017-06-29 | 2021-03-31 | 京セラ株式会社 | 圧電基板および弾性表面波デバイス |
WO2019044309A1 (ja) * | 2017-08-31 | 2019-03-07 | 株式会社村田製作所 | 弾性波装置およびそれを搭載した弾性波モジュール |
CN111130489A (zh) * | 2019-12-04 | 2020-05-08 | 天津大学 | 芯片封装模块及封装方法及具有该模块的电子装置 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0314375A (ja) | 1989-06-13 | 1991-01-23 | Mitsubishi Electric Corp | テレビジヨン受信機の電源回路 |
JPH0242809A (ja) * | 1989-06-26 | 1990-02-13 | Murata Mfg Co Ltd | 弾性表面波装置 |
JPH066175A (ja) * | 1992-06-19 | 1994-01-14 | Murata Mfg Co Ltd | 圧電部品 |
JP3395796B2 (ja) * | 1992-08-18 | 2003-04-14 | ティーディーケイ株式会社 | 焦電基板の加熱方法及び加熱装置 |
JPH06305895A (ja) * | 1993-04-26 | 1994-11-01 | Hitachi Metals Ltd | タンタル酸リチウム単結晶および弾性表面波素子および移動通信用電話 |
JPH085758B2 (ja) | 1993-04-27 | 1996-01-24 | 日本電気株式会社 | 結晶加工方法 |
DE69819971T2 (de) * | 1997-07-25 | 2004-09-02 | Crystal Technology, Inc., Palo Alto | Vorbehandelte Kristalle aus Lithiumniobat und Lithiumtantalat und das Verfahren zu ihrer Herstellung |
US6319430B1 (en) * | 1997-07-25 | 2001-11-20 | Crystal Technology, Inc. | Preconditioned crystals of lithium niobate and lithium tantalate and method of preparing the same |
JP2001230095A (ja) | 2000-02-14 | 2001-08-24 | Denki Kagaku Kogyo Kk | 電子部品容器 |
JP3829644B2 (ja) | 2000-05-01 | 2006-10-04 | 株式会社村田製作所 | 表面波装置、横波トランスデューサー及び縦波トランスデューサーの製造方法 |
CN1254914C (zh) * | 2000-07-06 | 2006-05-03 | 株式会社东芝 | 声表面波器件及其生产方法 |
JP4145476B2 (ja) * | 2000-09-25 | 2008-09-03 | Tdk株式会社 | 弾性表面波装置の製造方法 |
US6969945B2 (en) * | 2001-02-06 | 2005-11-29 | Matsushita Electric Industrial Co., Ltd. | Surface acoustic wave device, method for manufacturing, and electronic circuit device |
JP2003031711A (ja) | 2001-07-18 | 2003-01-31 | Denki Kagaku Kogyo Kk | 帯電量の少ない電子部品 |
EP1475890A1 (en) | 2002-02-12 | 2004-11-10 | Matsushita Electric Industrial Co., Ltd. | Elastic surface wave apparatus |
US6932957B2 (en) * | 2002-06-28 | 2005-08-23 | Silicon Light Machines Corporation | Method and apparatus for increasing bulk conductivity of a ferroelectric material |
JP2004129224A (ja) * | 2002-07-31 | 2004-04-22 | Murata Mfg Co Ltd | 圧電部品およびその製造方法 |
JP2005020423A (ja) | 2003-06-26 | 2005-01-20 | Murata Mfg Co Ltd | 弾性表面波装置 |
US7153487B2 (en) * | 2004-05-25 | 2006-12-26 | Crystal Technology, Inc. | Using condensed chemicals to precondition lithium niobate and lithium tantalate crystals |
US7439648B2 (en) * | 2004-08-27 | 2008-10-21 | Kyocera Corporation | Surface acoustic wave device and manufacturing method therefor, and communications equipment |
-
2004
- 2004-02-05 JP JP2004029848A patent/JP2005223641A/ja active Pending
- 2004-11-12 WO PCT/JP2004/016857 patent/WO2005076472A1/ja not_active Application Discontinuation
- 2004-11-12 EP EP04821283A patent/EP1715581A4/en not_active Withdrawn
- 2004-11-12 US US10/586,224 patent/US7608977B2/en not_active Expired - Fee Related
- 2004-11-12 CN CNB2004800413598A patent/CN100477517C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US20070164637A1 (en) | 2007-07-19 |
EP1715581A1 (en) | 2006-10-25 |
CN1914800A (zh) | 2007-02-14 |
WO2005076472A1 (ja) | 2005-08-18 |
EP1715581A4 (en) | 2007-09-12 |
US7608977B2 (en) | 2009-10-27 |
JP2005223641A (ja) | 2005-08-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: SEIKO EPSON CORP. Free format text: FORMER OWNER: EPSON TOYOCOM CORP. Effective date: 20111017 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20111017 Address after: Tokyo, Japan, Japan Patentee after: Seiko Epson Corp. Address before: Tokyo, Japan, Japan Patentee before: Epson Toyocom Corp. |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090408 Termination date: 20191112 |