CN100454532C - 装置组件 - Google Patents

装置组件 Download PDF

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Publication number
CN100454532C
CN100454532C CNB2004100282983A CN200410028298A CN100454532C CN 100454532 C CN100454532 C CN 100454532C CN B2004100282983 A CNB2004100282983 A CN B2004100282983A CN 200410028298 A CN200410028298 A CN 200410028298A CN 100454532 C CN100454532 C CN 100454532C
Authority
CN
China
Prior art keywords
interposer
input
substrate
output
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CNB2004100282983A
Other languages
English (en)
Chinese (zh)
Other versions
CN1531081A (zh
Inventor
小威廉·E·伯迪克
詹姆斯·W·罗斯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of CN1531081A publication Critical patent/CN1531081A/zh
Application granted granted Critical
Publication of CN100454532C publication Critical patent/CN100454532C/zh
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H10W70/635—Through-vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/654—Top-view layouts
    • H10W70/655—Fan-out layouts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/654—Top-view layouts
    • H10W70/656—Fan-in layouts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
CNB2004100282983A 2003-03-14 2004-03-09 装置组件 Expired - Lifetime CN100454532C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/388,997 2003-03-14
US10/388,997 US6819001B2 (en) 2003-03-14 2003-03-14 Interposer, interposer package and device assembly employing the same

Publications (2)

Publication Number Publication Date
CN1531081A CN1531081A (zh) 2004-09-22
CN100454532C true CN100454532C (zh) 2009-01-21

Family

ID=32962177

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2004100282983A Expired - Lifetime CN100454532C (zh) 2003-03-14 2004-03-09 装置组件

Country Status (6)

Country Link
US (1) US6819001B2 (https=)
JP (1) JP5568205B2 (https=)
CN (1) CN100454532C (https=)
DE (1) DE102004012595A1 (https=)
IL (1) IL160581A0 (https=)
NL (1) NL1025639C2 (https=)

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US6990176B2 (en) 2003-10-30 2006-01-24 General Electric Company Methods and apparatus for tileable sensor array
US7019346B2 (en) * 2003-12-23 2006-03-28 Intel Corporation Capacitor having an anodic metal oxide substrate
US7242073B2 (en) * 2003-12-23 2007-07-10 Intel Corporation Capacitor having an anodic metal oxide substrate
US20060091538A1 (en) * 2004-11-04 2006-05-04 Kabadi Ashok N Low profile and tight pad-pitch land-grid-array (LGA) socket
US7230334B2 (en) * 2004-11-12 2007-06-12 International Business Machines Corporation Semiconductor integrated circuit chip packages having integrated microchannel cooling modules
WO2006075283A2 (en) * 2005-01-11 2006-07-20 Koninklijke Philips Electronics, N.V. Redistribution interconnect for microbeamformer(s) and a medical ultrasound system
KR100652397B1 (ko) * 2005-01-17 2006-12-01 삼성전자주식회사 매개 인쇄회로기판을 사용하는 적층형 반도체 패키지
EP1890825A2 (en) * 2005-06-07 2008-02-27 Koninklijke Philips Electronics N.V. Multicomponent backing block for ultrasound sensor assemblies
JP4507101B2 (ja) 2005-06-30 2010-07-21 エルピーダメモリ株式会社 半導体記憶装置及びその製造方法
JP2007139912A (ja) * 2005-11-15 2007-06-07 Sharp Corp 駆動素子実装表示装置
JP4744360B2 (ja) * 2006-05-22 2011-08-10 富士通株式会社 半導体装置
TWI326908B (en) * 2006-09-11 2010-07-01 Ind Tech Res Inst Packaging structure and fabricating method thereof
US20080068815A1 (en) * 2006-09-18 2008-03-20 Oliver Richard Astley Interface Assembly And Method for Integrating A Data Acquisition System on a Sensor Array
US7518226B2 (en) * 2007-02-06 2009-04-14 Stats Chippac Ltd. Integrated circuit packaging system with interposer
KR101387701B1 (ko) * 2007-08-01 2014-04-23 삼성전자주식회사 반도체 패키지 및 이의 제조방법
KR101623880B1 (ko) * 2008-09-24 2016-05-25 삼성전자주식회사 반도체 패키지
US7973272B2 (en) * 2009-03-09 2011-07-05 Bae Systems Information And Electronic Systems Integration, Inc. Interface techniques for coupling a microchannel plate to a readout circuit
US7923290B2 (en) * 2009-03-27 2011-04-12 Stats Chippac Ltd. Integrated circuit packaging system having dual sided connection and method of manufacture thereof
US7936060B2 (en) * 2009-04-29 2011-05-03 International Business Machines Corporation Reworkable electronic device assembly and method
JPWO2011030504A1 (ja) * 2009-09-11 2013-02-04 パナソニック株式会社 電子部品実装体及びその製造方法並びにインタポーザ
US8008121B2 (en) * 2009-11-04 2011-08-30 Stats Chippac, Ltd. Semiconductor package and method of mounting semiconductor die to opposite sides of TSV substrate
US8405229B2 (en) * 2009-11-30 2013-03-26 Endicott Interconnect Technologies, Inc. Electronic package including high density interposer and circuitized substrate assembly utilizing same
US8363418B2 (en) * 2011-04-18 2013-01-29 Morgan/Weiss Technologies Inc. Above motherboard interposer with peripheral circuits
US9013041B2 (en) * 2011-12-28 2015-04-21 Broadcom Corporation Semiconductor package with ultra-thin interposer without through-semiconductor vias
US9006908B2 (en) * 2012-08-01 2015-04-14 Marvell Israel (M.I.S.L) Ltd. Integrated circuit interposer and method of manufacturing the same
WO2014121300A2 (en) * 2013-02-04 2014-08-07 American Semiconductor, Inc. Photonic data transfer assembly
US20140264938A1 (en) * 2013-03-14 2014-09-18 Douglas R. Hackler, Sr. Flexible Interconnect
WO2015047350A1 (en) * 2013-09-27 2015-04-02 Intel Corporation Dual-sided die packages
JP2015082524A (ja) * 2013-10-21 2015-04-27 ソニー株式会社 配線基板、半導体装置
US9613857B2 (en) * 2014-10-30 2017-04-04 Taiwan Semiconductor Manufacturing Company, Ltd. Electrostatic discharge protection structure and method
US11309192B2 (en) * 2018-06-05 2022-04-19 Intel Corporation Integrated circuit package supports
DE102020206769B3 (de) * 2020-05-29 2021-06-10 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein Mikroelektronische anordnung und verfahren zur herstellung derselben
US11804428B2 (en) * 2020-11-13 2023-10-31 Qualcomm Incorporated Mixed pad size and pad design
CN114698242A (zh) * 2022-03-29 2022-07-01 维沃移动通信有限公司 Fpc和电子设备

Citations (5)

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Publication number Priority date Publication date Assignee Title
US3982268A (en) * 1973-10-30 1976-09-21 General Electric Company Deep diode lead throughs
US5258648A (en) * 1991-06-27 1993-11-02 Motorola, Inc. Composite flip chip semiconductor device with an interposer having test contacts formed along its periphery
CN1160932A (zh) * 1996-03-27 1997-10-01 三菱电机株式会社 半导体器件
US6459582B1 (en) * 2000-07-19 2002-10-01 Fujitsu Limited Heatsink apparatus for de-coupling clamping forces on an integrated circuit package
CN2534677Y (zh) * 2002-01-21 2003-02-05 威盛电子股份有限公司 可插拔集成电路装置

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JPH0233960A (ja) * 1988-07-23 1990-02-05 Nec Corp 半導体装置
US5366380A (en) * 1989-06-13 1994-11-22 General Datacomm, Inc. Spring biased tapered contact elements for electrical connectors and integrated circuit packages
JPH04159740A (ja) 1990-10-23 1992-06-02 Matsushita Electric Ind Co Ltd チップのボンディング方法
JPH05198697A (ja) * 1992-01-20 1993-08-06 Fujitsu Ltd シリコン基板金属ビア形成方法およびマルチチップモジュール製造方法
JPH0810738B2 (ja) * 1993-08-30 1996-01-31 株式会社日立製作所 半導体装置及びその製造方法
JPH08236658A (ja) * 1995-02-27 1996-09-13 Nec Eng Ltd 集積回路パッケージ
US6219237B1 (en) * 1998-08-31 2001-04-17 Micron Technology, Inc. Structure and method for an electronic assembly
JP2000138313A (ja) * 1998-10-30 2000-05-16 Shinko Electric Ind Co Ltd 半導体装置及びその製造方法
CA2266158C (en) * 1999-03-18 2003-05-20 Ibm Canada Limited-Ibm Canada Limitee Connecting devices and method for interconnecting circuit components
JP2000307025A (ja) 1999-04-23 2000-11-02 Matsushita Electric Ind Co Ltd 電子部品とその製造方法および電子部品実装体
JP2001217388A (ja) * 2000-02-01 2001-08-10 Sony Corp 電子装置およびその製造方法
US7271491B1 (en) * 2000-08-31 2007-09-18 Micron Technology, Inc. Carrier for wafer-scale package and wafer-scale package including the carrier
JP2002083846A (ja) 2000-09-07 2002-03-22 Nec Corp 実装用ピン及び実装装置
JP2002110865A (ja) * 2000-09-27 2002-04-12 Toshiba Corp 回路装置
DE10142116A1 (de) * 2001-08-30 2002-11-14 Infineon Technologies Ag Elektronisches Bauteil und Verfahren zu seiner Herstellung

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3982268A (en) * 1973-10-30 1976-09-21 General Electric Company Deep diode lead throughs
US5258648A (en) * 1991-06-27 1993-11-02 Motorola, Inc. Composite flip chip semiconductor device with an interposer having test contacts formed along its periphery
CN1160932A (zh) * 1996-03-27 1997-10-01 三菱电机株式会社 半导体器件
US6459582B1 (en) * 2000-07-19 2002-10-01 Fujitsu Limited Heatsink apparatus for de-coupling clamping forces on an integrated circuit package
CN2534677Y (zh) * 2002-01-21 2003-02-05 威盛电子股份有限公司 可插拔集成电路装置

Also Published As

Publication number Publication date
JP2004282072A (ja) 2004-10-07
US6819001B2 (en) 2004-11-16
JP5568205B2 (ja) 2014-08-06
CN1531081A (zh) 2004-09-22
NL1025639C2 (nl) 2005-05-26
IL160581A0 (en) 2004-07-25
DE102004012595A1 (de) 2004-10-28
US20040178484A1 (en) 2004-09-16
NL1025639A1 (nl) 2004-09-16

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Granted publication date: 20090121