CN100447951C - 氮化物半导体自支撑衬底和氮化物半导体发光元件 - Google Patents
氮化物半导体自支撑衬底和氮化物半导体发光元件 Download PDFInfo
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- CN100447951C CN100447951C CNB2007100963199A CN200710096319A CN100447951C CN 100447951 C CN100447951 C CN 100447951C CN B2007100963199 A CNB2007100963199 A CN B2007100963199A CN 200710096319 A CN200710096319 A CN 200710096319A CN 100447951 C CN100447951 C CN 100447951C
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/18—Epitaxial-layer growth characterised by the substrate
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/40—AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
- C30B29/403—AIII-nitrides
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/0242—Crystalline insulating materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02439—Materials
- H01L21/02491—Conductive materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02538—Group 13/15 materials
- H01L21/0254—Nitrides
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0062—Processes for devices with an active region comprising only III-V compounds
- H01L33/0075—Processes for devices with an active region comprising only III-V compounds comprising nitride compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02636—Selective deposition, e.g. simultaneous growth of mono- and non-monocrystalline semiconductor materials
- H01L21/02639—Preparation of substrate for selective deposition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02636—Selective deposition, e.g. simultaneous growth of mono- and non-monocrystalline semiconductor materials
- H01L21/02647—Lateral overgrowth
Abstract
Description
实施例1 | 实施例2 | 实施例3 | 比较例 | |
衬底的晶格常数的偏差(ppm) | ±7.39 | ±8.92 | ±11.94 | ±17.1 |
LED的发光波长的偏差范围(nm) | 4 | 4 | 6 | 15 |
得到6mW输出的芯片比例(%) | 81 | 80 | 78 | 50 |
寿命在5000小时以上的芯片比例(%) | 81 | 80 | 78 | 50 |
Claims (5)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006164573A JP4816277B2 (ja) | 2006-06-14 | 2006-06-14 | 窒化物半導体自立基板及び窒化物半導体発光素子 |
JP2006164573 | 2006-06-14 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101090096A CN101090096A (zh) | 2007-12-19 |
CN100447951C true CN100447951C (zh) | 2008-12-31 |
Family
ID=38690410
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2007100963199A Active CN100447951C (zh) | 2006-06-14 | 2007-04-10 | 氮化物半导体自支撑衬底和氮化物半导体发光元件 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7649194B2 (zh) |
JP (1) | JP4816277B2 (zh) |
CN (1) | CN100447951C (zh) |
DE (1) | DE102007021944B4 (zh) |
TW (1) | TWI358468B (zh) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100714629B1 (ko) * | 2006-03-17 | 2007-05-07 | 삼성전기주식회사 | 질화물 반도체 단결정 기판, 그 제조방법 및 이를 이용한수직구조 질화물 발광소자 제조방법 |
JP5262545B2 (ja) * | 2007-10-29 | 2013-08-14 | 日立電線株式会社 | 窒化物半導体自立基板及びそれを用いたデバイス |
JP2009231595A (ja) * | 2008-03-24 | 2009-10-08 | Oki Data Corp | 半導体素子製造方法 |
US8154038B2 (en) * | 2008-07-01 | 2012-04-10 | Taiwan Semiconductor Manufacturing Co., Ltd | Group-III nitride for reducing stress caused by metal nitride reflector |
US10036099B2 (en) | 2008-08-07 | 2018-07-31 | Slt Technologies, Inc. | Process for large-scale ammonothermal manufacturing of gallium nitride boules |
TWI389347B (zh) * | 2008-11-13 | 2013-03-11 | Epistar Corp | 光電元件及其製作方法 |
JP5170030B2 (ja) * | 2009-08-11 | 2013-03-27 | 日立電線株式会社 | 窒化物半導体自立基板、窒化物半導体自立基板の製造方法、及び窒化物半導体デバイス |
JP2011077386A (ja) * | 2009-09-30 | 2011-04-14 | Sumitomo Electric Ind Ltd | 高電子移動度トランジスタ、エピタキシャル基板、及び高電子移動度トランジスタを作製する方法 |
CN102299226B (zh) * | 2010-06-24 | 2014-04-30 | 上海蓝光科技有限公司 | 一种垂直结构发光二极管及其制造方法 |
JP2012033708A (ja) * | 2010-07-30 | 2012-02-16 | Sumitomo Electric Ind Ltd | 半導体装置の製造方法 |
KR101148694B1 (ko) * | 2010-12-09 | 2012-05-25 | 삼성전기주식회사 | 질화물계 반도체 소자 및 그 제조 방법 |
KR20120079392A (ko) * | 2011-01-04 | 2012-07-12 | (주)세미머티리얼즈 | 반도체 발광소자의 제조방법 |
JP6103089B2 (ja) * | 2011-04-15 | 2017-03-29 | 三菱化学株式会社 | Iii族窒化物結晶の製造方法およびiii族窒化物結晶 |
JP2012231103A (ja) | 2011-04-15 | 2012-11-22 | Mitsubishi Chemicals Corp | Iii族窒化物結晶の製造方法およびiii族窒化物結晶 |
WO2013134432A1 (en) | 2012-03-06 | 2013-09-12 | Soraa, Inc. | Light emitting diodes with low refractive index material layers to reduce light guiding effects |
US10145026B2 (en) * | 2012-06-04 | 2018-12-04 | Slt Technologies, Inc. | Process for large-scale ammonothermal manufacturing of semipolar gallium nitride boules |
US9840790B2 (en) * | 2012-08-23 | 2017-12-12 | Hexatech, Inc. | Highly transparent aluminum nitride single crystalline layers and devices made therefrom |
US9761763B2 (en) | 2012-12-21 | 2017-09-12 | Soraa, Inc. | Dense-luminescent-materials-coated violet LEDs |
EP3315639B1 (en) * | 2013-08-08 | 2024-05-01 | Mitsubishi Chemical Corporation | Self-standing gan substrate, gan crystal, method for producing gan single crystal, and method for producing semiconductor device |
WO2015107813A1 (ja) | 2014-01-17 | 2015-07-23 | 三菱化学株式会社 | GaN基板、GaN基板の製造方法、GaN結晶の製造方法および半導体デバイスの製造方法 |
JP6714431B2 (ja) | 2016-05-27 | 2020-06-24 | 株式会社サイオクス | 結晶基板の製造方法 |
CN110164959A (zh) * | 2019-05-15 | 2019-08-23 | 中国电子科技集团公司第十三研究所 | 一种衬底及外延片 |
JP7339096B2 (ja) | 2019-09-25 | 2023-09-05 | 住友化学株式会社 | 窒化物半導体基板の製造方法および窒化物半導体基板 |
CN113140447A (zh) * | 2021-04-21 | 2021-07-20 | 西安电子科技大学 | 基于TiN掩膜的GaN材料及其制备方法 |
CN115036402B (zh) * | 2022-08-12 | 2022-10-25 | 江苏第三代半导体研究院有限公司 | 诱导增强型Micro-LED同质外延结构及其制备方法 |
Citations (4)
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JPH11251253A (ja) * | 1998-03-05 | 1999-09-17 | Nichia Chem Ind Ltd | 窒化物半導体基板の製造方法および窒化物半導体基板 |
CN1260485A (zh) * | 1999-01-08 | 2000-07-19 | 中国科学院半导体研究所 | 非破坏性定量检测砷化镓单晶化学配比的方法 |
CN1387231A (zh) * | 2001-05-21 | 2002-12-25 | 日本电气株式会社 | 基于氮化物的化合物半导体晶体衬底结构及其制造方法 |
JP2003178984A (ja) * | 2001-03-27 | 2003-06-27 | Nec Corp | Iii族窒化物半導体基板およびその製造方法 |
Family Cites Families (9)
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JPH0628234B2 (ja) * | 1984-10-05 | 1994-04-13 | 株式会社日立製作所 | GaAs単結晶および半導体装置 |
US6086673A (en) * | 1998-04-02 | 2000-07-11 | Massachusetts Institute Of Technology | Process for producing high-quality III-V nitride substrates |
JP3788041B2 (ja) * | 1998-06-30 | 2006-06-21 | 住友電気工業株式会社 | GaN単結晶基板の製造方法 |
JP3788037B2 (ja) * | 1998-06-18 | 2006-06-21 | 住友電気工業株式会社 | GaN単結晶基板 |
US6596079B1 (en) * | 2000-03-13 | 2003-07-22 | Advanced Technology Materials, Inc. | III-V nitride substrate boule and method of making and using the same |
US6673149B1 (en) * | 2000-09-06 | 2004-01-06 | Matsushita Electric Industrial Co., Ltd | Production of low defect, crack-free epitaxial films on a thermally and/or lattice mismatched substrate |
US7105865B2 (en) * | 2001-09-19 | 2006-09-12 | Sumitomo Electric Industries, Ltd. | AlxInyGa1−x−yN mixture crystal substrate |
JP4416648B2 (ja) * | 2002-05-17 | 2010-02-17 | アンモノ・スプウカ・ジ・オグラニチョノン・オドポヴィエドニアウノシツィオン | 発光素子の製造方法 |
JP2005101475A (ja) * | 2003-08-28 | 2005-04-14 | Hitachi Cable Ltd | Iii−v族窒化物系半導体基板及びその製造方法 |
-
2006
- 2006-06-14 JP JP2006164573A patent/JP4816277B2/ja active Active
- 2006-10-03 US US11/541,790 patent/US7649194B2/en active Active
-
2007
- 2007-04-10 CN CNB2007100963199A patent/CN100447951C/zh active Active
- 2007-05-10 DE DE102007021944A patent/DE102007021944B4/de not_active Expired - Fee Related
- 2007-05-16 TW TW096117321A patent/TWI358468B/zh not_active IP Right Cessation
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH11251253A (ja) * | 1998-03-05 | 1999-09-17 | Nichia Chem Ind Ltd | 窒化物半導体基板の製造方法および窒化物半導体基板 |
CN1260485A (zh) * | 1999-01-08 | 2000-07-19 | 中国科学院半导体研究所 | 非破坏性定量检测砷化镓单晶化学配比的方法 |
JP2003178984A (ja) * | 2001-03-27 | 2003-06-27 | Nec Corp | Iii族窒化物半導体基板およびその製造方法 |
CN1387231A (zh) * | 2001-05-21 | 2002-12-25 | 日本电气株式会社 | 基于氮化物的化合物半导体晶体衬底结构及其制造方法 |
Also Published As
Publication number | Publication date |
---|---|
JP4816277B2 (ja) | 2011-11-16 |
DE102007021944A1 (de) | 2007-12-20 |
JP2007331973A (ja) | 2007-12-27 |
US20070290228A1 (en) | 2007-12-20 |
US7649194B2 (en) | 2010-01-19 |
DE102007021944B4 (de) | 2012-04-12 |
CN101090096A (zh) | 2007-12-19 |
TW200815630A (en) | 2008-04-01 |
TWI358468B (en) | 2012-02-21 |
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