CN100419501C - 基板的处理装置和处理方法 - Google Patents

基板的处理装置和处理方法 Download PDF

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Publication number
CN100419501C
CN100419501C CNB2004100640625A CN200410064062A CN100419501C CN 100419501 C CN100419501 C CN 100419501C CN B2004100640625 A CNB2004100640625 A CN B2004100640625A CN 200410064062 A CN200410064062 A CN 200410064062A CN 100419501 C CN100419501 C CN 100419501C
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CN
China
Prior art keywords
substrate
nozzle
treating fluid
short transverse
upright state
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB2004100640625A
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English (en)
Chinese (zh)
Other versions
CN1576961A (zh
Inventor
矶明典
西部幸伸
和歌月尊彦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Mechatronics Corp
Original Assignee
Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Publication of CN1576961A publication Critical patent/CN1576961A/zh
Application granted granted Critical
Publication of CN100419501C publication Critical patent/CN100419501C/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67028Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/6715Apparatus for applying a liquid, a resin, an ink or the like
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2201/00Constructional arrangements not provided for in groups G02F1/00 - G02F7/00
    • G02F2201/54Arrangements for reducing warping-twist
CNB2004100640625A 2003-07-18 2004-07-16 基板的处理装置和处理方法 Expired - Fee Related CN100419501C (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2003199087 2003-07-18
JP199087/2003 2003-07-18
JP2004191134A JP4421956B2 (ja) 2003-07-18 2004-06-29 基板の処理装置及び処理方法
JP191134/2004 2004-06-29

Publications (2)

Publication Number Publication Date
CN1576961A CN1576961A (zh) 2005-02-09
CN100419501C true CN100419501C (zh) 2008-09-17

Family

ID=34379735

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2004100640625A Expired - Fee Related CN100419501C (zh) 2003-07-18 2004-07-16 基板的处理装置和处理方法

Country Status (4)

Country Link
JP (1) JP4421956B2 (ja)
KR (1) KR101055247B1 (ja)
CN (1) CN100419501C (ja)
TW (1) TWI347629B (ja)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4627681B2 (ja) * 2005-04-20 2011-02-09 芝浦メカトロニクス株式会社 基板の処理装置及び処理方法
JP4557872B2 (ja) * 2005-11-28 2010-10-06 株式会社日立ハイテクノロジーズ 基板処理装置、基板処理方法、及び基板の製造方法
TWI319213B (en) * 2005-11-28 2010-01-01 Hitachi High Tech Corp A substrate processing device, a substrate processing method and a production method for a substrate
JP4685618B2 (ja) * 2005-12-13 2011-05-18 芝浦メカトロニクス株式会社 基板の処理装置
KR100835745B1 (ko) * 2006-12-29 2008-06-09 최찬규 하향식 유리 박형화 방법
JP2008277556A (ja) * 2007-04-27 2008-11-13 Shibaura Mechatronics Corp 基板の処理装置
JP4575932B2 (ja) * 2007-05-29 2010-11-04 化研テック株式会社 パレット洗浄装置およびパレット洗浄方法
KR100865475B1 (ko) * 2007-08-30 2008-10-27 세메스 주식회사 노즐 어셈블리, 이를 갖는 처리액 공급 장치 및 이를이용하는 처리액 공급 방법
JP5362623B2 (ja) * 2010-03-03 2013-12-11 大日本スクリーン製造株式会社 基板処理装置
DE102010013909A1 (de) * 2010-04-01 2011-10-06 Lp Vermarktungs Gmbh & Co. Kg Vorrichtung und Verfahren zum Besprühen einer Oberfläche eines Substrates
CN102094199A (zh) * 2010-11-23 2011-06-15 黄佳佳 一种电子软标签的蚀刻设备
US8458842B2 (en) * 2011-05-10 2013-06-11 Nanya Technology Corp. Post-CMP wafer cleaning apparatus
KR101342616B1 (ko) * 2013-04-26 2013-12-20 창성 주식회사 수직형 기판 박리 시스템
KR102223764B1 (ko) * 2013-12-27 2021-03-05 세메스 주식회사 기판처리장치 및 방법
CN105158829B (zh) * 2015-07-30 2019-06-04 京东方科技集团股份有限公司 基板、彩色滤光片模组、形成基板模组的方法和显示装置
JP6667241B2 (ja) * 2015-09-28 2020-03-18 株式会社Screenホールディングス 処理液供給装置、基板処理システムおよび処理液供給方法
CN106992136B (zh) * 2017-04-20 2020-04-07 武汉华星光电技术有限公司 湿法蚀刻设备及湿法蚀刻方法
KR102433317B1 (ko) * 2017-10-11 2022-08-17 삼성디스플레이 주식회사 습식 식각 장치
CN111006262A (zh) * 2019-12-31 2020-04-14 美埃(中国)环境净化有限公司 一种水洗型除油烟净化装置及其水洗控制方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001343632A (ja) * 2000-06-02 2001-12-14 Sharp Corp 液晶表示素子の製造方法
JP2002350054A (ja) * 2001-05-30 2002-12-04 Tokyo Electron Ltd 基板処理装置及び基板処理方法
CN1398425A (zh) * 2000-12-11 2003-02-19 住友精密工业株式会社 传送式基板处理装置
CN1398424A (zh) * 2000-12-12 2003-02-19 住友精密工业株式会社 摇动喷淋型传送式基板处理装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10118583A (ja) 1996-10-24 1998-05-12 Nippon Electric Glass Co Ltd 板状物の洗浄装置
JP3550277B2 (ja) * 1997-07-24 2004-08-04 大日本スクリーン製造株式会社 基板処理装置
KR100343044B1 (ko) * 1997-08-28 2002-10-25 다이닛뽕스크린 세이조오 가부시키가이샤 기판처리장치및처리방법
JP3556110B2 (ja) * 1998-12-22 2004-08-18 大日本スクリーン製造株式会社 基板処理装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001343632A (ja) * 2000-06-02 2001-12-14 Sharp Corp 液晶表示素子の製造方法
CN1398425A (zh) * 2000-12-11 2003-02-19 住友精密工业株式会社 传送式基板处理装置
CN1398424A (zh) * 2000-12-12 2003-02-19 住友精密工业株式会社 摇动喷淋型传送式基板处理装置
JP2002350054A (ja) * 2001-05-30 2002-12-04 Tokyo Electron Ltd 基板処理装置及び基板処理方法

Also Published As

Publication number Publication date
JP2005052825A (ja) 2005-03-03
KR101055247B1 (ko) 2011-08-08
TWI347629B (en) 2011-08-21
JP4421956B2 (ja) 2010-02-24
TW200507038A (en) 2005-02-16
KR20050009695A (ko) 2005-01-25
CN1576961A (zh) 2005-02-09

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