CN100407412C - 用于包覆塑封的热沉或标记部分的微型模锁定结构 - Google Patents

用于包覆塑封的热沉或标记部分的微型模锁定结构 Download PDF

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Publication number
CN100407412C
CN100407412C CN038256118A CN03825611A CN100407412C CN 100407412 C CN100407412 C CN 100407412C CN 038256118 A CN038256118 A CN 038256118A CN 03825611 A CN03825611 A CN 03825611A CN 100407412 C CN100407412 C CN 100407412C
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CN
China
Prior art keywords
heat sink
groove
mold
die
compound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN038256118A
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English (en)
Chinese (zh)
Other versions
CN1714445A (zh
Inventor
亚历山大·J·埃利奥特
L·M·马哈林格姆
威廉姆·M·斯特罗姆
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NXP USA Inc
Original Assignee
Freescale Semiconductor Inc
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Filing date
Publication date
Application filed by Freescale Semiconductor Inc filed Critical Freescale Semiconductor Inc
Publication of CN1714445A publication Critical patent/CN1714445A/zh
Application granted granted Critical
Publication of CN100407412C publication Critical patent/CN100407412C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/04—Manufacture or treatment of leadframes
    • H10W70/048—Mechanical treatments, e.g. punching, cutting, deforming or cold welding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H10W40/778—Auxiliary members characterised by their shape in encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/02—Manufacture or treatment of conductive package substrates serving as an interconnection, e.g. of metal plates
    • H10W70/027—Mechanical treatments, e.g. deforming, punching or cutting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device

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  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Die Bonding (AREA)
CN038256118A 2002-12-13 2003-09-30 用于包覆塑封的热沉或标记部分的微型模锁定结构 Expired - Fee Related CN100407412C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/318,699 US7091602B2 (en) 2002-12-13 2002-12-13 Miniature moldlocks for heatsink or flag for an overmolded plastic package
US10/318,699 2002-12-13

Publications (2)

Publication Number Publication Date
CN1714445A CN1714445A (zh) 2005-12-28
CN100407412C true CN100407412C (zh) 2008-07-30

Family

ID=32506436

Family Applications (1)

Application Number Title Priority Date Filing Date
CN038256118A Expired - Fee Related CN100407412C (zh) 2002-12-13 2003-09-30 用于包覆塑封的热沉或标记部分的微型模锁定结构

Country Status (7)

Country Link
US (2) US7091602B2 (https=)
JP (1) JP2006510221A (https=)
KR (1) KR101017533B1 (https=)
CN (1) CN100407412C (https=)
AU (1) AU2003277127A1 (https=)
TW (1) TWI321834B (https=)
WO (1) WO2004055889A1 (https=)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7091602B2 (en) * 2002-12-13 2006-08-15 Freescale Semiconductor, Inc. Miniature moldlocks for heatsink or flag for an overmolded plastic package
SG157957A1 (en) * 2003-01-29 2010-01-29 Interplex Qlp Inc Package for integrated circuit die
US7061025B2 (en) * 2003-03-10 2006-06-13 Mccolloch Lawrence R Optoelectronic device packaging assemblies and methods of making the same
JP4565174B2 (ja) * 2004-05-12 2010-10-20 Ｄｏｗａメタルテック株式会社 窪み加工銅板もしくは銅合金板、その製造方法、および順送金型
US7446411B2 (en) * 2005-10-24 2008-11-04 Freescale Semiconductor, Inc. Semiconductor structure and method of assembly
US8030742B2 (en) * 2007-11-30 2011-10-04 Infineon Technologies Electronic device having profiled elements extending from planar surfaces
US7834431B2 (en) * 2008-04-08 2010-11-16 Freescale Semiconductor, Inc. Leadframe for packaged electronic device with enhanced mold locking capability
US8124447B2 (en) * 2009-04-10 2012-02-28 Advanced Semiconductor Engineering, Inc. Manufacturing method of advanced quad flat non-leaded package
CN101882609A (zh) * 2009-05-08 2010-11-10 飞思卡尔半导体公司 用于半导体封装体的引线框
JP5833459B2 (ja) 2012-01-31 2015-12-16 新光電気工業株式会社 リードフレーム及びその製造方法と半導体装置及びその製造方法
CN102969297A (zh) * 2012-11-20 2013-03-13 无锡市威海达机械制造有限公司 一种浇铸槽型引线框架结构
JP6195771B2 (ja) * 2013-10-02 2017-09-13 株式会社三井ハイテック リードフレーム及びその製造方法並びにそれを用いた半導体装置
US9685351B2 (en) 2014-07-18 2017-06-20 Nxp Usa, Inc. Wire bond mold lock method and structure
US9659843B2 (en) * 2014-11-05 2017-05-23 Infineon Technologies Ag Lead frame strip with molding compound channels
JP6408431B2 (ja) * 2015-06-11 2018-10-17 Ｓｈプレシジョン株式会社 リードフレーム、リードフレームの製造方法、および半導体装置
KR102427092B1 (ko) * 2015-10-16 2022-08-01 삼성전자주식회사 열 정보 표지를 갖는 반도체 장치
CN105575822B (zh) * 2015-12-28 2018-01-30 四川金湾电子有限责任公司 一种半导体引线框架正面燕尾槽冲压方法
US10998255B2 (en) * 2018-07-12 2021-05-04 Nxp Usa, Inc. Overmolded microelectronic packages containing knurled flanges and methods for the production thereof
WO2020053728A2 (en) * 2018-09-11 2020-03-19 Rjr Technologies, Inc. Air cavity package with improved connections between components
US11837532B2 (en) * 2020-01-15 2023-12-05 Texas Instruments Incorporated Leadframe with delamination resistant feature
DE112023002893T5 (de) * 2022-10-06 2025-04-17 Fuji Electric Co., Ltd. Halbleitermodul, halbleitervorrichtung und fahrzeug
WO2024090029A1 (ja) * 2022-10-25 2024-05-02 富士電機株式会社 半導体モジュール、半導体装置、及び車両
CN117444534A (zh) * 2023-10-26 2024-01-26 广东华智芯电子科技有限公司 纯铜热沉块体及其制备方法、电子封装材料

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5278446A (en) * 1992-07-06 1994-01-11 Motorola, Inc. Reduced stress plastic package
US5722161A (en) * 1994-05-03 1998-03-03 Amkor Electronics, Inc. Method of making a packaged semiconductor die including heat sink with locking feature
CN1355668A (zh) * 2000-10-31 2002-06-26 W.C.贺利氏股份有限两合公司 制造金属支承框架的方法,金属支承框架及其应用

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5315763A (en) 1976-07-28 1978-02-14 Hitachi Ltd Resin sealed type semiconductor device
JP2570037B2 (ja) * 1990-12-03 1997-01-08 モトローラ・インコーポレイテッド 分離型ヒートシンク・ボンディングパッドを有する半導体パッケージ
JP2698259B2 (ja) * 1991-11-27 1998-01-19 三洋電機株式会社 ヒートシンクの製造方法
JPH07161896A (ja) 1993-12-02 1995-06-23 Hitachi Cable Ltd リードフレームとその製造方法
JPH08148629A (ja) * 1994-09-20 1996-06-07 Fujitsu Ltd 半導体装置及びその製造方法及び半導体装置用基板
US5535515A (en) * 1995-03-13 1996-07-16 Jacoby; John Method of manufacturing a stress-free heatsink assembly
KR100230515B1 (ko) * 1997-04-04 1999-11-15 윤종용 요철이 형성된 리드 프레임의 제조방법
US6376914B2 (en) * 1999-12-09 2002-04-23 Atmel Corporation Dual-die integrated circuit package
US6294409B1 (en) 2000-01-27 2001-09-25 Siliconware Precisionware Industries Co., Ltd. Method of forming a constricted-mouth dimple structure on a leadframe die pad
US7091602B2 (en) * 2002-12-13 2006-08-15 Freescale Semiconductor, Inc. Miniature moldlocks for heatsink or flag for an overmolded plastic package

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5278446A (en) * 1992-07-06 1994-01-11 Motorola, Inc. Reduced stress plastic package
US5722161A (en) * 1994-05-03 1998-03-03 Amkor Electronics, Inc. Method of making a packaged semiconductor die including heat sink with locking feature
CN1355668A (zh) * 2000-10-31 2002-06-26 W.C.贺利氏股份有限两合公司 制造金属支承框架的方法,金属支承框架及其应用

Also Published As

Publication number Publication date
KR101017533B1 (ko) 2011-02-28
US8310042B2 (en) 2012-11-13
US7091602B2 (en) 2006-08-15
JP2006510221A (ja) 2006-03-23
US20060220187A1 (en) 2006-10-05
KR20050089825A (ko) 2005-09-08
TWI321834B (en) 2010-03-11
AU2003277127A1 (en) 2004-07-09
CN1714445A (zh) 2005-12-28
WO2004055889A1 (en) 2004-07-01
US20040113262A1 (en) 2004-06-17
TW200419739A (en) 2004-10-01

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Address after: Texas in the United States

Patentee after: NXP USA, Inc.

Address before: Texas in the United States

Patentee before: FREESCALE SEMICONDUCTOR, Inc.

CF01 Termination of patent right due to non-payment of annual fee
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Granted publication date: 20080730

Termination date: 20210930