JP2006510221A - オーバーモールド・プラスチック・パッケージ用ヒートシンクまたはフラグ用の微小モールドロック - Google Patents

オーバーモールド・プラスチック・パッケージ用ヒートシンクまたはフラグ用の微小モールドロック Download PDF

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Publication number
JP2006510221A
JP2006510221A JP2004560294A JP2004560294A JP2006510221A JP 2006510221 A JP2006510221 A JP 2006510221A JP 2004560294 A JP2004560294 A JP 2004560294A JP 2004560294 A JP2004560294 A JP 2004560294A JP 2006510221 A JP2006510221 A JP 2006510221A
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JP
Japan
Prior art keywords
heat sink
main channel
mold
plastic molding
mold lock
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004560294A
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English (en)
Japanese (ja)
Other versions
JP2006510221A5 (https=
Inventor
ジェイ． エリオット、アレクサンダー
マーリンガム、エル．エム．
エム． ストローム、ウィリアム
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NXP USA Inc
Original Assignee
NXP USA Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NXP USA Inc filed Critical NXP USA Inc
Publication of JP2006510221A publication Critical patent/JP2006510221A/ja
Publication of JP2006510221A5 publication Critical patent/JP2006510221A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/04—Manufacture or treatment of leadframes
    • H10W70/048—Mechanical treatments, e.g. punching, cutting, deforming or cold welding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H10W40/778—Auxiliary members characterised by their shape in encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/02—Manufacture or treatment of conductive package substrates serving as an interconnection, e.g. of metal plates
    • H10W70/027—Mechanical treatments, e.g. deforming, punching or cutting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Die Bonding (AREA)
JP2004560294A 2002-12-13 2003-09-30 オーバーモールド・プラスチック・パッケージ用ヒートシンクまたはフラグ用の微小モールドロック Pending JP2006510221A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/318,699 US7091602B2 (en) 2002-12-13 2002-12-13 Miniature moldlocks for heatsink or flag for an overmolded plastic package
PCT/US2003/030859 WO2004055889A1 (en) 2002-12-13 2003-09-30 Miniature moldlocks for heatsink or flag for an overmolded plastic package

Publications (2)

Publication Number Publication Date
JP2006510221A true JP2006510221A (ja) 2006-03-23
JP2006510221A5 JP2006510221A5 (https=) 2006-11-24

Family

ID=32506436

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004560294A Pending JP2006510221A (ja) 2002-12-13 2003-09-30 オーバーモールド・プラスチック・パッケージ用ヒートシンクまたはフラグ用の微小モールドロック

Country Status (7)

Country Link
US (2) US7091602B2 (https=)
JP (1) JP2006510221A (https=)
KR (1) KR101017533B1 (https=)
CN (1) CN100407412C (https=)
AU (1) AU2003277127A1 (https=)
TW (1) TWI321834B (https=)
WO (1) WO2004055889A1 (https=)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005327767A (ja) * 2004-05-12 2005-11-24 Dowa Mining Co Ltd 窪み加工銅板もしくは銅合金板、その製造方法、および順送金型
JP2013157536A (ja) * 2012-01-31 2013-08-15 Shinko Electric Ind Co Ltd リードフレーム及びその製造方法と半導体装置及びその製造方法
JP2017005124A (ja) * 2015-06-11 2017-01-05 Ｓｈマテリアル株式会社 リードフレーム、リードフレームの製造方法、および半導体装置
WO2024075445A1 (ja) * 2022-10-06 2024-04-11 富士電機株式会社 半導体モジュール、半導体装置、及び車両
WO2024090029A1 (ja) * 2022-10-25 2024-05-02 富士電機株式会社 半導体モジュール、半導体装置、及び車両

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7091602B2 (en) * 2002-12-13 2006-08-15 Freescale Semiconductor, Inc. Miniature moldlocks for heatsink or flag for an overmolded plastic package
SG157957A1 (en) * 2003-01-29 2010-01-29 Interplex Qlp Inc Package for integrated circuit die
US7061025B2 (en) * 2003-03-10 2006-06-13 Mccolloch Lawrence R Optoelectronic device packaging assemblies and methods of making the same
US7446411B2 (en) * 2005-10-24 2008-11-04 Freescale Semiconductor, Inc. Semiconductor structure and method of assembly
US8030742B2 (en) * 2007-11-30 2011-10-04 Infineon Technologies Electronic device having profiled elements extending from planar surfaces
US7834431B2 (en) * 2008-04-08 2010-11-16 Freescale Semiconductor, Inc. Leadframe for packaged electronic device with enhanced mold locking capability
US8124447B2 (en) * 2009-04-10 2012-02-28 Advanced Semiconductor Engineering, Inc. Manufacturing method of advanced quad flat non-leaded package
CN101882609A (zh) * 2009-05-08 2010-11-10 飞思卡尔半导体公司 用于半导体封装体的引线框
CN102969297A (zh) * 2012-11-20 2013-03-13 无锡市威海达机械制造有限公司 一种浇铸槽型引线框架结构
JP6195771B2 (ja) * 2013-10-02 2017-09-13 株式会社三井ハイテック リードフレーム及びその製造方法並びにそれを用いた半導体装置
US9685351B2 (en) 2014-07-18 2017-06-20 Nxp Usa, Inc. Wire bond mold lock method and structure
US9659843B2 (en) * 2014-11-05 2017-05-23 Infineon Technologies Ag Lead frame strip with molding compound channels
KR102427092B1 (ko) * 2015-10-16 2022-08-01 삼성전자주식회사 열 정보 표지를 갖는 반도체 장치
CN105575822B (zh) * 2015-12-28 2018-01-30 四川金湾电子有限责任公司 一种半导体引线框架正面燕尾槽冲压方法
US10998255B2 (en) * 2018-07-12 2021-05-04 Nxp Usa, Inc. Overmolded microelectronic packages containing knurled flanges and methods for the production thereof
WO2020053728A2 (en) * 2018-09-11 2020-03-19 Rjr Technologies, Inc. Air cavity package with improved connections between components
US11837532B2 (en) * 2020-01-15 2023-12-05 Texas Instruments Incorporated Leadframe with delamination resistant feature
CN117444534A (zh) * 2023-10-26 2024-01-26 广东华智芯电子科技有限公司 纯铜热沉块体及其制备方法、电子封装材料

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5315763A (en) 1976-07-28 1978-02-14 Hitachi Ltd Resin sealed type semiconductor device
JP2570037B2 (ja) * 1990-12-03 1997-01-08 モトローラ・インコーポレイテッド 分離型ヒートシンク・ボンディングパッドを有する半導体パッケージ
JP2698259B2 (ja) * 1991-11-27 1998-01-19 三洋電機株式会社 ヒートシンクの製造方法
US5278446A (en) 1992-07-06 1994-01-11 Motorola, Inc. Reduced stress plastic package
JPH07161896A (ja) 1993-12-02 1995-06-23 Hitachi Cable Ltd リードフレームとその製造方法
US5701034A (en) 1994-05-03 1997-12-23 Amkor Electronics, Inc. Packaged semiconductor die including heat sink with locking feature
JPH08148629A (ja) * 1994-09-20 1996-06-07 Fujitsu Ltd 半導体装置及びその製造方法及び半導体装置用基板
US5535515A (en) * 1995-03-13 1996-07-16 Jacoby; John Method of manufacturing a stress-free heatsink assembly
KR100230515B1 (ko) * 1997-04-04 1999-11-15 윤종용 요철이 형성된 리드 프레임의 제조방법
US6376914B2 (en) * 1999-12-09 2002-04-23 Atmel Corporation Dual-die integrated circuit package
US6294409B1 (en) 2000-01-27 2001-09-25 Siliconware Precisionware Industries Co., Ltd. Method of forming a constricted-mouth dimple structure on a leadframe die pad
DE10054081A1 (de) 2000-10-31 2002-05-08 Heraeus Gmbh W C Verfahren zur Herstellung eines Metallträgerrahmens, Metallrägerrahmen und seine Verwendung
US7091602B2 (en) * 2002-12-13 2006-08-15 Freescale Semiconductor, Inc. Miniature moldlocks for heatsink or flag for an overmolded plastic package

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005327767A (ja) * 2004-05-12 2005-11-24 Dowa Mining Co Ltd 窪み加工銅板もしくは銅合金板、その製造方法、および順送金型
JP2013157536A (ja) * 2012-01-31 2013-08-15 Shinko Electric Ind Co Ltd リードフレーム及びその製造方法と半導体装置及びその製造方法
JP2017005124A (ja) * 2015-06-11 2017-01-05 Ｓｈマテリアル株式会社 リードフレーム、リードフレームの製造方法、および半導体装置
WO2024075445A1 (ja) * 2022-10-06 2024-04-11 富士電機株式会社 半導体モジュール、半導体装置、及び車両
WO2024090029A1 (ja) * 2022-10-25 2024-05-02 富士電機株式会社 半導体モジュール、半導体装置、及び車両
JPWO2024090029A1 (https=) * 2022-10-25 2024-05-02
JP7827161B2 (ja) 2022-10-25 2026-03-10 富士電機株式会社 半導体モジュール、半導体装置、及び車両

Also Published As

Publication number Publication date
CN100407412C (zh) 2008-07-30
KR101017533B1 (ko) 2011-02-28
US8310042B2 (en) 2012-11-13
US7091602B2 (en) 2006-08-15
US20060220187A1 (en) 2006-10-05
KR20050089825A (ko) 2005-09-08
TWI321834B (en) 2010-03-11
AU2003277127A1 (en) 2004-07-09
CN1714445A (zh) 2005-12-28
WO2004055889A1 (en) 2004-07-01
US20040113262A1 (en) 2004-06-17
TW200419739A (en) 2004-10-01

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