CN100377303C - 反射镜设备、曝光设备以及器件制造方法 - Google Patents

反射镜设备、曝光设备以及器件制造方法 Download PDF

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Publication number
CN100377303C
CN100377303C CNB038023571A CN03802357A CN100377303C CN 100377303 C CN100377303 C CN 100377303C CN B038023571 A CNB038023571 A CN B038023571A CN 03802357 A CN03802357 A CN 03802357A CN 100377303 C CN100377303 C CN 100377303C
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CN
China
Prior art keywords
mirror
speculum
temperature
exposure
equipment
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Expired - Fee Related
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CNB038023571A
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English (en)
Chinese (zh)
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CN1618114A (zh
Inventor
宫岛义一
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Canon Inc
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Canon Inc
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Publication of CN1618114A publication Critical patent/CN1618114A/zh
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70233—Optical aspects of catoptric systems, i.e. comprising only reflective elements, e.g. extreme ultraviolet [EUV] projection systems
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/18—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors
    • G02B7/181—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors with means for compensating for changes in temperature or for controlling the temperature; thermal stabilisation
    • G02B7/1815—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors with means for compensating for changes in temperature or for controlling the temperature; thermal stabilisation with cooling or heating systems
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G03F7/7015—Details of optical elements
    • G03F7/70175—Lamphouse reflector arrangements or collector mirrors, i.e. collecting light from solid angle upstream of the light source
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G03F7/702—Reflective illumination, i.e. reflective optical elements other than folding mirrors, e.g. extreme ultraviolet [EUV] illumination systems
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70883—Environment aspects, e.g. pressure of beam-path gas, temperature of optical system
    • G03F7/70891—Temperature
    • G—PHYSICS
    • G21—NUCLEAR PHYSICS; NUCLEAR ENGINEERING
    • G21K—HANDLING OF PARTICLES OR IONISING RADIATION NOT OTHERWISE PROVIDED FOR; IRRADIATION DEVICES; GAMMA RAY OR X-RAY MICROSCOPES
    • G21K1/00—Arrangements for handling particles or ionising radiation, e.g. focusing or moderating
    • G21K1/06—Arrangements for handling particles or ionising radiation, e.g. focusing or moderating using diffraction, refraction or reflection, e.g. monochromators
    • G—PHYSICS
    • G21—NUCLEAR PHYSICS; NUCLEAR ENGINEERING
    • G21K—HANDLING OF PARTICLES OR IONISING RADIATION NOT OTHERWISE PROVIDED FOR; IRRADIATION DEVICES; GAMMA RAY OR X-RAY MICROSCOPES
    • G21K2201/00—Arrangements for handling radiation or particles
    • G21K2201/06—Arrangements for handling radiation or particles using diffractive, refractive or reflecting elements
    • G21K2201/065—Arrangements for handling radiation or particles using diffractive, refractive or reflecting elements provided with cooling means
    • G—PHYSICS
    • G21—NUCLEAR PHYSICS; NUCLEAR ENGINEERING
    • G21K—HANDLING OF PARTICLES OR IONISING RADIATION NOT OTHERWISE PROVIDED FOR; IRRADIATION DEVICES; GAMMA RAY OR X-RAY MICROSCOPES
    • G21K2201/00—Arrangements for handling radiation or particles
    • G21K2201/06—Arrangements for handling radiation or particles using diffractive, refractive or reflecting elements
    • G21K2201/067—Construction details

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Atmospheric Sciences (AREA)
  • Toxicology (AREA)
  • Optics & Photonics (AREA)
  • Environmental & Geological Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Optical Elements Other Than Lenses (AREA)
  • Lenses (AREA)
CNB038023571A 2002-06-28 2003-06-19 反射镜设备、曝光设备以及器件制造方法 Expired - Fee Related CN100377303C (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2002191282A JP3944008B2 (ja) 2002-06-28 2002-06-28 反射ミラー装置及び露光装置及びデバイス製造方法
JP191282/2002 2002-06-28
PCT/JP2003/007796 WO2004003982A1 (en) 2002-06-28 2003-06-19 Reflection mirror apparatus, exposure apparatus and device manufacturing method

Publications (2)

Publication Number Publication Date
CN1618114A CN1618114A (zh) 2005-05-18
CN100377303C true CN100377303C (zh) 2008-03-26

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CNB038023571A Expired - Fee Related CN100377303C (zh) 2002-06-28 2003-06-19 反射镜设备、曝光设备以及器件制造方法

Country Status (7)

Country Link
US (1) US7349063B2 (enExample)
EP (1) EP1518262A4 (enExample)
JP (1) JP3944008B2 (enExample)
KR (1) KR100572098B1 (enExample)
CN (1) CN100377303C (enExample)
TW (1) TW594436B (enExample)
WO (1) WO2004003982A1 (enExample)

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1387054B1 (en) * 2002-07-31 2012-07-25 Canon Kabushiki Kaisha Cooling apparatus for an optical element, exposure apparatus comprising said cooling apparatus, and device fabrication method
JP2004247438A (ja) * 2003-02-13 2004-09-02 Canon Inc 冷却装置
JP4532835B2 (ja) * 2003-02-13 2010-08-25 キヤノン株式会社 冷却装置、それを有する光学部材並びに露光装置
JP2005101537A (ja) * 2003-08-29 2005-04-14 Canon Inc 露光装置及びそれを用いたデバイスの製造方法
JP2005109158A (ja) * 2003-09-30 2005-04-21 Canon Inc 冷却装置及び方法、それを有する露光装置、デバイスの製造方法
US6977713B2 (en) * 2003-12-08 2005-12-20 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP4666908B2 (ja) 2003-12-12 2011-04-06 キヤノン株式会社 露光装置、計測方法及びデバイス製造方法
FR2871622B1 (fr) * 2004-06-14 2008-09-12 Commissariat Energie Atomique Dispositif de generation de lumiere dans l'extreme ultraviolet et application a une source de lithographie par rayonnement dans l'extreme ultraviolet
US7355672B2 (en) * 2004-10-04 2008-04-08 Asml Netherlands B.V. Method for the removal of deposition on an optical element, method for the protection of an optical element, device manufacturing method, apparatus including an optical element, and lithographic apparatus
CN101006554A (zh) * 2004-10-29 2007-07-25 株式会社尼康 标线保护构件、标线运送装置、曝光装置及标线运送方法
JP2008523451A (ja) * 2004-12-14 2008-07-03 ラドーフ ゲーエムベーハー フォトリソグラフィ転写用のコリメートされたuv光線を生成するプロセスおよび装置
TWI409313B (zh) * 2005-01-26 2013-09-21 Nitto Denko Corp 黏著劑組成物、黏著型光學薄膜及影像顯示裝置
JP2006261273A (ja) * 2005-03-16 2006-09-28 Canon Inc チャンバおよびこれを用いた露光装置
JP2006269941A (ja) * 2005-03-25 2006-10-05 Canon Inc 導光装置、露光装置、並びにデバイス製造方法
DE102005017262B3 (de) 2005-04-12 2006-10-12 Xtreme Technologies Gmbh Kollektorspiegel für plasmabasierte kurzwellige Strahlungsquellen
JP2008124079A (ja) * 2006-11-08 2008-05-29 Nikon Corp 露光装置とそれを用いた半導体装置または液晶装置の製造方法
JP4893249B2 (ja) * 2006-11-10 2012-03-07 株式会社ニコン 露光装置とそれを用いた半導体素子または液晶素子の製造方法
US20090017298A1 (en) * 2007-07-11 2009-01-15 Nitto Denko Corporation Adhesive composition, adhesive optical film and image display device
WO2009039883A1 (en) * 2007-09-26 2009-04-02 Carl Zeiss Smt Ag Optical imaging device with thermal stabilization
US7740362B1 (en) * 2008-02-19 2010-06-22 Jefferson Science Associates Mirror with thermally controlled radius of curvature
US9176398B2 (en) 2008-06-10 2015-11-03 Asml Netherlands B.V. Method and system for thermally conditioning an optical element
US7641349B1 (en) * 2008-09-22 2010-01-05 Cymer, Inc. Systems and methods for collector mirror temperature control using direct contact heat transfer
JP5732257B2 (ja) * 2010-01-15 2015-06-10 エーエスエムエル ネザーランズ ビー.ブイ. リソグラフィ装置、デバイス製造方法およびコンピュータ読取可能媒体
JP5478773B2 (ja) * 2010-03-26 2014-04-23 カール・ツァイス・エスエムティー・ゲーエムベーハー 光学系、露光装置、及び波面補正方法
JP5478553B2 (ja) 2010-09-03 2014-04-23 日東電工株式会社 連続ウェブ状光学フィルム積層体ロール及びその製造方法
DE102011005778A1 (de) * 2011-03-18 2012-09-20 Carl Zeiss Smt Gmbh Optisches Element
JP6209518B2 (ja) * 2011-09-21 2017-10-04 カール・ツァイス・エスエムティー・ゲーエムベーハー マイクロリソグラフィ投影露光装置のミラーの熱作動用の構成体
JP6041541B2 (ja) * 2012-06-04 2016-12-07 キヤノン株式会社 露光装置及びデバイス製造方法
JP2013179330A (ja) * 2013-04-25 2013-09-09 Gigaphoton Inc 極端紫外光源装置
US9544984B2 (en) 2013-07-22 2017-01-10 Kla-Tencor Corporation System and method for generation of extreme ultraviolet light
DE102014219770A1 (de) 2014-09-30 2016-03-31 Carl Zeiss Smt Gmbh Spiegelanordnung, insbesondere für eine mikrolithographische Projektionsbelichtungsanlage, sowie Verfahren zur Ableitung eines Wärmestromes aus dem Bereich einer Spiegelanordnung
NL2015718A (en) * 2014-12-12 2016-09-20 Asml Netherlands Bv Reflector.
JP6742717B2 (ja) * 2015-12-10 2020-08-19 キヤノン株式会社 光学装置、それを備えた露光装置、および物品の製造方法
CN114690367A (zh) * 2020-12-30 2022-07-01 中国科学院长春光学精密机械与物理研究所 一种用于地面光学设施反射镜的热控装置
JP7550102B2 (ja) * 2021-04-16 2024-09-12 株式会社アマダ レーザ加工ヘッド及びレーザ加工装置
DE102022202241A1 (de) 2022-03-04 2023-03-02 Carl Zeiss Smt Gmbh Optisches system und projektionsbelichtungsanlage
CN114967036B (zh) * 2022-05-30 2024-02-02 深圳综合粒子设施研究院 一种反射镜面形控制结构及光束线装置

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05291117A (ja) * 1992-04-14 1993-11-05 Hitachi Ltd 投影露光方法およびその装置
JP2000100697A (ja) * 1998-09-22 2000-04-07 Nikon Corp 露光装置の調整方法及び露光装置
US6118527A (en) * 1998-02-09 2000-09-12 Jurca Optoelektronik Gmbh Method for monitoring the functionality of the transparent protective element of a transparent laser optical system, and a device for carrying out this method
WO2001042855A2 (fr) * 1999-12-08 2001-06-14 Commissariat A L'energie Atomique Dispositif de lithographie utilisant une source de rayonnement dans le domaine extreme ultraviolet et des miroirs multicouches a large bande spectrale dans ce domaine
JP2001215105A (ja) * 2000-02-02 2001-08-10 Nikon Corp 干渉計、形状測定装置及び露光装置、並びに形状測定方法及び露光方法
US6359678B1 (en) * 1997-11-14 2002-03-19 Nikon Corporation Exposure apparatus, method for producing the same, and exposure method
US6406820B1 (en) * 1998-03-02 2002-06-18 Nikon Corporation Exposure method for a projection optical system

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4253739A (en) * 1979-06-25 1981-03-03 United Technologies Corporation Thermally compensated mirror
US4674848A (en) * 1986-03-17 1987-06-23 Itek Corporation Laser mirror having a cooled, deformable surface
US4743104A (en) * 1986-10-14 1988-05-10 The United States Of America As Represented By The Secretary Of The Air Force Variable area manifolds for ring mirror heat exchangers
US4844603A (en) * 1987-12-24 1989-07-04 United Technologies Corporation Cooled flexible mirror arrangement
CA2077572C (en) * 1991-09-07 1998-08-18 Masahito Niibe Method of and apparatus for stabilizing shapes of objects, such as optical elements, as well as exposure apparatus using same and method of manufacturing semiconductr devices
JP3301153B2 (ja) * 1993-04-06 2002-07-15 株式会社ニコン 投影露光装置、露光方法、及び素子製造方法
JPH0992613A (ja) * 1995-09-21 1997-04-04 Nikon Corp 温調装置及び走査型露光装置
US6727980B2 (en) * 1998-09-17 2004-04-27 Nikon Corporation Apparatus and method for pattern exposure and method for adjusting the apparatus
US6091494A (en) * 1999-05-25 2000-07-18 Venturedyne, Ltd. Particle sensor with cooled light trap and related method
DE10000191B8 (de) * 2000-01-05 2005-10-06 Carl Zeiss Smt Ag Projektbelichtungsanlage der Mikrolithographie
US6621557B2 (en) * 2000-01-13 2003-09-16 Nikon Corporation Projection exposure apparatus and exposure methods
US6630984B2 (en) * 2000-08-03 2003-10-07 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method, and device manufactured thereby
EP1178357A1 (en) * 2000-08-03 2002-02-06 Asm Lithography B.V. Lithographic apparatus
KR20020060282A (ko) * 2001-01-10 2002-07-18 윤종용 리소그래피 시스템에서 노광 제어방법 및 노광 제어장치
TWI263120B (en) * 2001-05-08 2006-10-01 Asml Netherlands Bv Optical exposure method, device manufacturing method and lithographic projection apparatus
US6846086B2 (en) * 2002-03-11 2005-01-25 Intel Corporation Mirror assembly with thermal contour control
US20050099611A1 (en) * 2002-06-20 2005-05-12 Nikon Corporation Minimizing thermal distortion effects on EUV mirror
US20030235682A1 (en) * 2002-06-21 2003-12-25 Sogard Michael R. Method and device for controlling thermal distortion in elements of a lithography system
EP1387054B1 (en) * 2002-07-31 2012-07-25 Canon Kabushiki Kaisha Cooling apparatus for an optical element, exposure apparatus comprising said cooling apparatus, and device fabrication method
JP4458333B2 (ja) * 2003-02-13 2010-04-28 キヤノン株式会社 露光装置、およびデバイスの製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05291117A (ja) * 1992-04-14 1993-11-05 Hitachi Ltd 投影露光方法およびその装置
US6359678B1 (en) * 1997-11-14 2002-03-19 Nikon Corporation Exposure apparatus, method for producing the same, and exposure method
US6118527A (en) * 1998-02-09 2000-09-12 Jurca Optoelektronik Gmbh Method for monitoring the functionality of the transparent protective element of a transparent laser optical system, and a device for carrying out this method
US6406820B1 (en) * 1998-03-02 2002-06-18 Nikon Corporation Exposure method for a projection optical system
JP2000100697A (ja) * 1998-09-22 2000-04-07 Nikon Corp 露光装置の調整方法及び露光装置
WO2001042855A2 (fr) * 1999-12-08 2001-06-14 Commissariat A L'energie Atomique Dispositif de lithographie utilisant une source de rayonnement dans le domaine extreme ultraviolet et des miroirs multicouches a large bande spectrale dans ce domaine
JP2001215105A (ja) * 2000-02-02 2001-08-10 Nikon Corp 干渉計、形状測定装置及び露光装置、並びに形状測定方法及び露光方法

Also Published As

Publication number Publication date
WO2004003982A1 (en) 2004-01-08
CN1618114A (zh) 2005-05-18
TW594436B (en) 2004-06-21
EP1518262A4 (en) 2007-03-14
KR100572098B1 (ko) 2006-04-17
JP2004039696A (ja) 2004-02-05
US7349063B2 (en) 2008-03-25
JP3944008B2 (ja) 2007-07-11
EP1518262A1 (en) 2005-03-30
US20050073663A1 (en) 2005-04-07
TW200403543A (en) 2004-03-01
KR20050022016A (ko) 2005-03-07

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