CN100334746C - 荧光材料混合物、波长转换的浇注料和光源装置 - Google Patents
荧光材料混合物、波长转换的浇注料和光源装置 Download PDFInfo
- Publication number
- CN100334746C CN100334746C CNB008014957A CN00801495A CN100334746C CN 100334746 C CN100334746 C CN 100334746C CN B008014957 A CNB008014957 A CN B008014957A CN 00801495 A CN00801495 A CN 00801495A CN 100334746 C CN100334746 C CN 100334746C
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- fluorescent material
- ray
- material mixture
- garnet
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- 239000003566 sealing material Substances 0.000 title abstract 2
- 239000000463 material Substances 0.000 claims abstract description 84
- 239000002223 garnet Substances 0.000 claims abstract description 33
- 229910052746 lanthanum Inorganic materials 0.000 claims abstract description 16
- 229910052765 Lutetium Inorganic materials 0.000 claims abstract description 14
- 229910052688 Gadolinium Inorganic materials 0.000 claims abstract description 13
- 229910052771 Terbium Inorganic materials 0.000 claims abstract description 13
- 229910052706 scandium Inorganic materials 0.000 claims abstract description 12
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 10
- 229910052727 yttrium Inorganic materials 0.000 claims abstract description 10
- 229910052772 Samarium Inorganic materials 0.000 claims abstract description 9
- 229910052733 gallium Inorganic materials 0.000 claims abstract description 9
- 239000000203 mixture Substances 0.000 claims description 59
- 238000006243 chemical reaction Methods 0.000 claims description 15
- 239000000049 pigment Substances 0.000 claims description 7
- 229920002994 synthetic fiber Polymers 0.000 claims description 7
- 239000003795 chemical substances by application Substances 0.000 claims description 2
- 229910052500 inorganic mineral Inorganic materials 0.000 claims description 2
- 239000011707 mineral Substances 0.000 claims description 2
- 239000013008 thixotropic agent Substances 0.000 claims description 2
- 229910052738 indium Inorganic materials 0.000 abstract description 2
- 230000005855 radiation Effects 0.000 abstract 1
- 239000011347 resin Substances 0.000 description 11
- 229920005989 resin Polymers 0.000 description 11
- 229910052684 Cerium Inorganic materials 0.000 description 8
- 239000000843 powder Substances 0.000 description 8
- 230000003595 spectral effect Effects 0.000 description 8
- GZCRRIHWUXGPOV-UHFFFAOYSA-N terbium atom Chemical compound [Tb] GZCRRIHWUXGPOV-UHFFFAOYSA-N 0.000 description 8
- 238000005266 casting Methods 0.000 description 7
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 description 7
- 229910019990 cerium-doped yttrium aluminum garnet Inorganic materials 0.000 description 7
- 229910002601 GaN Inorganic materials 0.000 description 5
- 229910052761 rare earth metal Inorganic materials 0.000 description 4
- 150000002910 rare earth metals Chemical class 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 238000001228 spectrum Methods 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 2
- 230000004913 activation Effects 0.000 description 2
- 239000012190 activator Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 230000005284 excitation Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000005457 optimization Methods 0.000 description 2
- 238000009877 rendering Methods 0.000 description 2
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical group [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 2
- 229910000967 As alloy Inorganic materials 0.000 description 1
- 150000000703 Cerium Chemical class 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 238000000295 emission spectrum Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7766—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals
- C09K11/7767—Chalcogenides
- C09K11/7769—Oxides
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7766—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals
- C09K11/7774—Aluminates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
- H05B33/14—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of the electroluminescent material, or by the simultaneous addition of the electroluminescent material in or onto the light source
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
- H01L33/504—Elements with two or more wavelength conversion materials
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Inorganic Chemistry (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Luminescent Compositions (AREA)
- Led Device Packages (AREA)
- Optical Filters (AREA)
Abstract
Description
Claims (21)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19934126A DE19934126A1 (de) | 1999-07-23 | 1999-07-23 | Leuchtstoff für Lichtquellen und zugehörige Lichtquelle |
DE19934126.5 | 1999-07-23 | ||
DE19963791A DE19963791A1 (de) | 1999-12-30 | 1999-12-30 | Leuchtstoffanordnung, wellenlängenkonvertierende Vergussmasse und Lichtquelle |
DE19963791.1 | 1999-12-30 | ||
PCT/DE2000/002495 WO2001009370A2 (de) | 1999-07-30 | 2000-07-28 | Nachweis und identifikation von bakterienstämmen |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1327706A CN1327706A (zh) | 2001-12-19 |
CN100334746C true CN100334746C (zh) | 2007-08-29 |
Family
ID=26054272
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB008014957A Expired - Lifetime CN100334746C (zh) | 1999-07-23 | 2000-07-24 | 荧光材料混合物、波长转换的浇注料和光源装置 |
Country Status (10)
Country | Link |
---|---|
US (3) | US7132786B1 (zh) |
EP (2) | EP1471775B9 (zh) |
JP (2) | JP3825318B2 (zh) |
KR (1) | KR100450647B1 (zh) |
CN (1) | CN100334746C (zh) |
AT (1) | ATE279089T1 (zh) |
AU (1) | AU7267500A (zh) |
CA (1) | CA2343909C (zh) |
DE (2) | DE50016032D1 (zh) |
WO (1) | WO2001008453A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104342156A (zh) * | 2013-07-30 | 2015-02-11 | 宁波升谱光电半导体有限公司 | 一种荧光粉及其制备方法和含该荧光粉的发光器件 |
Families Citing this family (62)
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CA2343909C (en) * | 1999-07-23 | 2013-04-02 | Osram Opto Semiconductors Gmbh & Co. Ohg | Arrangement of luminescent materials, wavelength-converting casting compound and light source |
JP4817534B2 (ja) * | 2000-06-09 | 2011-11-16 | 星和電機株式会社 | 発光ダイオードランプ |
US6616862B2 (en) | 2001-05-21 | 2003-09-09 | General Electric Company | Yellow light-emitting halophosphate phosphors and light sources incorporating the same |
US6596195B2 (en) * | 2001-06-01 | 2003-07-22 | General Electric Company | Broad-spectrum terbium-containing garnet phosphors and white-light sources incorporating the same |
DE10133352A1 (de) | 2001-07-16 | 2003-02-06 | Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh | Beleuchtungseinheit mit mindestens einer LED als Lichtquelle |
CN1311054C (zh) * | 2001-07-19 | 2007-04-18 | 南帝化学工业股份有限公司 | 钇铝石榴石型荧光粉及其制法与应用 |
JP4032682B2 (ja) * | 2001-08-28 | 2008-01-16 | 三菱化学株式会社 | 蛍光体 |
CN100423296C (zh) * | 2001-09-03 | 2008-10-01 | 松下电器产业株式会社 | 半导体发光元件、发光装置及半导体发光元件的制造方法 |
DE10146719A1 (de) * | 2001-09-20 | 2003-04-17 | Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh | Beleuchtungseinheit mit mindestens einer LED als Lichtquelle |
DE10147040A1 (de) | 2001-09-25 | 2003-04-24 | Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh | Beleuchtungseinheit mit mindestens einer LED als Lichtquelle |
US6630077B2 (en) * | 2001-10-11 | 2003-10-07 | General Electric Company | Terbium- or lutetium - containing garnet phosphors and scintillators for detection of high-energy radiation |
US7008558B2 (en) * | 2001-10-11 | 2006-03-07 | General Electric Company | Terbium or lutetium containing scintillator compositions having increased resistance to radiation damage |
AU2003221442A1 (en) * | 2002-03-22 | 2003-10-08 | Nichia Corporation | Nitride phosphor and method for preparation thereof, and light emitting device |
TWI226357B (en) | 2002-05-06 | 2005-01-11 | Osram Opto Semiconductors Gmbh | Wavelength-converting reaction-resin, its production method, light-radiating optical component and light-radiating semiconductor-body |
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DE10316769A1 (de) * | 2003-04-10 | 2004-10-28 | Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH | Leuchtstoffbassierte LED und zugehöriger Leuchtstoff |
EP1659335A4 (en) | 2003-08-28 | 2010-05-05 | Mitsubishi Chem Corp | LIGHT DISPENSER AND PHOSPHORUS |
CN100354389C (zh) * | 2003-10-09 | 2007-12-12 | 中国科学院上海硅酸盐研究所 | 铝酸钆基发光薄膜材料芯片及其制备方法 |
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Also Published As
Publication number | Publication date |
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CA2343909A1 (en) | 2001-02-01 |
JP2003505583A (ja) | 2003-02-12 |
US6998771B2 (en) | 2006-02-14 |
DE50016032D1 (de) | 2010-12-30 |
KR100450647B1 (ko) | 2004-10-01 |
US20050029929A1 (en) | 2005-02-10 |
EP1471775A3 (de) | 2008-05-14 |
WO2001008453A1 (de) | 2001-02-01 |
JP2005101651A (ja) | 2005-04-14 |
EP1471775B9 (de) | 2011-04-13 |
EP1116419B1 (de) | 2004-10-06 |
ATE279089T1 (de) | 2004-10-15 |
US20060133063A1 (en) | 2006-06-22 |
US7261837B2 (en) | 2007-08-28 |
US7132786B1 (en) | 2006-11-07 |
EP1471775A2 (de) | 2004-10-27 |
JP4639351B2 (ja) | 2011-02-23 |
EP1471775B1 (de) | 2010-11-17 |
AU7267500A (en) | 2001-02-13 |
EP1116419A1 (de) | 2001-07-18 |
JP3825318B2 (ja) | 2006-09-27 |
CN1327706A (zh) | 2001-12-19 |
CA2343909C (en) | 2013-04-02 |
DE50008093D1 (de) | 2004-11-11 |
KR20010079911A (ko) | 2001-08-22 |
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