CH619739A5 - Process and appliance for making a non-conductive porous grinding body electroconductive - Google Patents

Process and appliance for making a non-conductive porous grinding body electroconductive Download PDF

Info

Publication number
CH619739A5
CH619739A5 CH1302175A CH1302175A CH619739A5 CH 619739 A5 CH619739 A5 CH 619739A5 CH 1302175 A CH1302175 A CH 1302175A CH 1302175 A CH1302175 A CH 1302175A CH 619739 A5 CH619739 A5 CH 619739A5
Authority
CH
Switzerland
Prior art keywords
solution
metal
grinding
grinding wheel
tool
Prior art date
Application number
CH1302175A
Other languages
German (de)
English (en)
Inventor
Kiyoshi Inoue
Original Assignee
Inoue Japax Res
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Inoue Japax Res filed Critical Inoue Japax Res
Publication of CH619739A5 publication Critical patent/CH619739A5/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1651—Two or more layers only obtained by electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1635—Composition of the substrate
    • C23C18/1644—Composition of the substrate porous substrates

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
CH1302175A 1974-10-25 1975-10-07 Process and appliance for making a non-conductive porous grinding body electroconductive CH619739A5 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP49122596A JPS5819745B2 (ja) 1974-10-25 1974-10-25 デンカイケンサクトイシノ ムデンカイメツキソウチ

Publications (1)

Publication Number Publication Date
CH619739A5 true CH619739A5 (en) 1980-10-15

Family

ID=14839833

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1302175A CH619739A5 (en) 1974-10-25 1975-10-07 Process and appliance for making a non-conductive porous grinding body electroconductive

Country Status (8)

Country Link
JP (1) JPS5819745B2 (ro)
CH (1) CH619739A5 (ro)
CS (1) CS189722B2 (ro)
DD (1) DD121609A5 (ro)
DK (1) DK443275A (ro)
NL (1) NL169092C (ro)
NO (1) NO145442C (ro)
RO (1) RO71718A (ro)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5837255A (ja) * 1981-08-26 1983-03-04 住金鋼材工業株式会社 合成床板
JPS6278335A (ja) * 1985-09-27 1987-04-10 バトラ−　マニユフアクチユアリング　コンパニ 壁パネル構造

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS542718B2 (ro) * 1971-08-27 1979-02-10
JPS59347B2 (ja) * 1974-09-04 1984-01-06 カブシキガイシヤ イノウエジヤパツクスケンキユウジヨ デンカイケンサクトイシノセイサクホウホウ オヨビ ソノソウチ

Also Published As

Publication number Publication date
RO71718A (ro) 1982-02-26
NO145442B (no) 1981-12-14
JPS5149129A (ro) 1976-04-28
NL169092C (nl) 1982-06-01
JPS5819745B2 (ja) 1983-04-19
NO753270L (ro) 1976-04-27
CS189722B2 (en) 1979-04-30
NL7512355A (nl) 1976-04-27
NO145442C (no) 1982-03-24
DD121609A5 (ro) 1976-08-12
NL169092B (nl) 1982-01-04
DK443275A (da) 1976-04-26

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PL Patent ceased