CA2007469A1 - Puce de stockage de donnees protegees a blindage conducteur - Google Patents

Puce de stockage de donnees protegees a blindage conducteur

Info

Publication number
CA2007469A1
CA2007469A1 CA2007469A CA2007469A CA2007469A1 CA 2007469 A1 CA2007469 A1 CA 2007469A1 CA 2007469 A CA2007469 A CA 2007469A CA 2007469 A CA2007469 A CA 2007469A CA 2007469 A1 CA2007469 A1 CA 2007469A1
Authority
CA
Canada
Prior art keywords
circuit elements
conductive layer
integrated circuit
circuit chip
conductive shield
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA2007469A
Other languages
English (en)
Other versions
CA2007469C (fr
Inventor
Robert C. Gilberg
Richard M. Knowles
Paul Moroney
William Allen Shumate
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Arris Technology Inc
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of CA2007469A1 publication Critical patent/CA2007469A1/fr
Application granted granted Critical
Publication of CA2007469C publication Critical patent/CA2007469C/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/57—Protection from inspection, reverse engineering or tampering
    • H01L23/576—Protection from inspection, reverse engineering or tampering using active circuits
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F21/00—Security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
    • G06F21/70—Protecting specific internal or peripheral components, in which the protection of a component leads to protection of the entire computer
    • G06F21/86—Secure or tamper-resistant housings
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
    • G11C7/24—Memory cell safety or protection circuits, e.g. arrangements for preventing inadvertent reading or writing; Status cells; Test cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y04—INFORMATION OR COMMUNICATION TECHNOLOGIES HAVING AN IMPACT ON OTHER TECHNOLOGY AREAS
    • Y04S—SYSTEMS INTEGRATING TECHNOLOGIES RELATED TO POWER NETWORK OPERATION, COMMUNICATION OR INFORMATION TECHNOLOGIES FOR IMPROVING THE ELECTRICAL POWER GENERATION, TRANSMISSION, DISTRIBUTION, MANAGEMENT OR USAGE, i.e. SMART GRIDS
    • Y04S40/00—Systems for electrical power generation, transmission, distribution or end-user application management characterised by the use of communication or information technologies, or communication or information technology specific aspects supporting them
    • Y04S40/20—Information technology specific aspects, e.g. CAD, simulation, modelling, system security
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S257/00—Active solid-state devices, e.g. transistors, solid-state diodes
    • Y10S257/922—Active solid-state devices, e.g. transistors, solid-state diodes with means to prevent inspection of or tampering with an integrated circuit, e.g. "smart card", anti-tamper

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Theoretical Computer Science (AREA)
  • Software Systems (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Security & Cryptography (AREA)
  • Manufacturing & Machinery (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Storage Device Security (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Semiconductor Memories (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Non-Volatile Memory (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Credit Cards Or The Like (AREA)
CA002007469A 1989-01-12 1990-01-10 Puce de stockage de donnees protegees a blindage conducteur Expired - Fee Related CA2007469C (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/297,472 1989-01-12
US07/297,472 US4933898A (en) 1989-01-12 1989-01-12 Secure integrated circuit chip with conductive shield

Publications (2)

Publication Number Publication Date
CA2007469A1 true CA2007469A1 (fr) 1990-07-12
CA2007469C CA2007469C (fr) 1994-08-16

Family

ID=23146461

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002007469A Expired - Fee Related CA2007469C (fr) 1989-01-12 1990-01-10 Puce de stockage de donnees protegees a blindage conducteur

Country Status (11)

Country Link
US (1) US4933898A (fr)
EP (2) EP0378306B1 (fr)
JP (1) JPH0787237B2 (fr)
KR (1) KR0180521B1 (fr)
AU (1) AU617026B2 (fr)
CA (1) CA2007469C (fr)
DE (2) DE69033241T2 (fr)
DK (2) DK0920057T3 (fr)
ES (2) ES2214760T3 (fr)
IE (1) IE62793B1 (fr)
NO (2) NO303808B1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8110894B2 (en) 2003-12-29 2012-02-07 Commissariat A L'energie Atomique Protection for an integrated circuit chip containing confidential data

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8110894B2 (en) 2003-12-29 2012-02-07 Commissariat A L'energie Atomique Protection for an integrated circuit chip containing confidential data

Also Published As

Publication number Publication date
NO900114D0 (no) 1990-01-10
NO975981L (no) 1997-12-19
IE62793B1 (en) 1995-03-08
EP0920057A3 (fr) 2000-01-12
ES2134188T3 (es) 1999-10-01
DE69033241D1 (de) 1999-09-16
IE900003L (en) 1990-07-12
JPH02232960A (ja) 1990-09-14
NO900114L (no) 1990-07-13
EP0920057A2 (fr) 1999-06-02
AU4766990A (en) 1990-07-19
US4933898A (en) 1990-06-12
NO975981D0 (no) 1997-12-19
DK0920057T3 (da) 2004-05-10
NO303808B1 (no) 1998-08-31
EP0378306B1 (fr) 1999-08-11
EP0378306A3 (fr) 1991-12-04
EP0920057B1 (fr) 2004-01-02
DK0378306T3 (da) 2000-03-13
KR0180521B1 (ko) 1999-04-15
JPH0787237B2 (ja) 1995-09-20
AU617026B2 (en) 1991-11-14
ES2214760T3 (es) 2004-09-16
DE69034125D1 (de) 2004-02-05
DE69034125T2 (de) 2004-11-18
CA2007469C (fr) 1994-08-16
EP0378306A2 (fr) 1990-07-18
DE69033241T2 (de) 2000-02-03
KR900012345A (ko) 1990-08-03

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