FR2893436B1 - Securisation entre des composants electroniques d'une entite electronique securisee portable - Google Patents

Securisation entre des composants electroniques d'une entite electronique securisee portable

Info

Publication number
FR2893436B1
FR2893436B1 FR0511566A FR0511566A FR2893436B1 FR 2893436 B1 FR2893436 B1 FR 2893436B1 FR 0511566 A FR0511566 A FR 0511566A FR 0511566 A FR0511566 A FR 0511566A FR 2893436 B1 FR2893436 B1 FR 2893436B1
Authority
FR
France
Prior art keywords
securing
electronic
portable secure
entity
electronic components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0511566A
Other languages
English (en)
Other versions
FR2893436A1 (fr
Inventor
Marc Bertin
Joseph Hoppe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Idemia France SAS
Original Assignee
Oberthur Card Systems SA France
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oberthur Card Systems SA France filed Critical Oberthur Card Systems SA France
Priority to FR0511566A priority Critical patent/FR2893436B1/fr
Priority to US12/093,454 priority patent/US9262649B2/en
Priority to PCT/FR2006/002472 priority patent/WO2007057536A1/fr
Publication of FR2893436A1 publication Critical patent/FR2893436A1/fr
Application granted granted Critical
Publication of FR2893436B1 publication Critical patent/FR2893436B1/fr
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F21/00—Security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
    • G06F21/70—Protecting specific internal or peripheral components, in which the protection of a component leads to protection of the entire computer
    • G06F21/86—Secure or tamper-resistant housings
    • G06F21/87—Secure or tamper-resistant housings by means of encapsulation, e.g. for integrated circuits
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/0723—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/073—Special arrangements for circuits, e.g. for protecting identification code in memory
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01087—Francium [Fr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
FR0511566A 2005-11-15 2005-11-15 Securisation entre des composants electroniques d'une entite electronique securisee portable Expired - Fee Related FR2893436B1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
FR0511566A FR2893436B1 (fr) 2005-11-15 2005-11-15 Securisation entre des composants electroniques d'une entite electronique securisee portable
US12/093,454 US9262649B2 (en) 2005-11-15 2006-11-07 Security between electronic components of a portable secured electronic unit
PCT/FR2006/002472 WO2007057536A1 (fr) 2005-11-15 2006-11-07 Securisation entre des composants electroniques d'une entite electronique securisee portable

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0511566A FR2893436B1 (fr) 2005-11-15 2005-11-15 Securisation entre des composants electroniques d'une entite electronique securisee portable

Publications (2)

Publication Number Publication Date
FR2893436A1 FR2893436A1 (fr) 2007-05-18
FR2893436B1 true FR2893436B1 (fr) 2008-02-15

Family

ID=36607369

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0511566A Expired - Fee Related FR2893436B1 (fr) 2005-11-15 2005-11-15 Securisation entre des composants electroniques d'une entite electronique securisee portable

Country Status (3)

Country Link
US (1) US9262649B2 (fr)
FR (1) FR2893436B1 (fr)
WO (1) WO2007057536A1 (fr)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7779058B2 (en) * 2007-02-22 2010-08-17 Ronald Raymond Shea Method and apparatus for managing a digital inventory of multimedia files stored across a dynamic distributed network
FR2916593B1 (fr) * 2007-05-24 2009-10-02 Sagem Monetel Soc Par Actions Procede et dispositif de detection d'une tentative de substitution d'une piece d'origine d'un systeme electronique par une piece de remplacement
EP2405409A1 (fr) * 2010-07-06 2012-01-11 Gemalto SA Dispositif multiprocesseurs autonomes interconnectés, et procédé de personnalisation adapté
FR3026207B1 (fr) * 2014-09-22 2018-08-17 Prove & Run Terminal a affichage securise
CN105930747A (zh) * 2015-08-20 2016-09-07 天地融科技股份有限公司 一种电子设备及电子设备的保护方法
CN105989312A (zh) * 2015-08-20 2016-10-05 天地融科技股份有限公司 电子设备和电子设备的控制方法
US10984304B2 (en) 2017-02-02 2021-04-20 Jonny B. Vu Methods for placing an EMV chip onto a metal card
EP3438828B1 (fr) * 2017-08-03 2019-12-11 Hitachi Rail Sts S.P.A. Procédé et système pour commander à distance des interfaces homme-machine
USD956760S1 (en) * 2018-07-30 2022-07-05 Lion Credit Card Inc. Multi EMV chip card
US10931476B2 (en) * 2018-10-29 2021-02-23 Analog Devices Global Unlimited Company Content protection over synchronous data networks
US11010652B2 (en) 2019-05-09 2021-05-18 Capital One Services, Llc Orientationless chip layout for a transaction card

Family Cites Families (23)

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GB2205186B (en) * 1987-05-23 1991-02-13 Motorola Inc Memory cards
US4933898A (en) * 1989-01-12 1990-06-12 General Instrument Corporation Secure integrated circuit chip with conductive shield
US5787174A (en) * 1992-06-17 1998-07-28 Micron Technology, Inc. Remote identification of integrated circuit
FR2718311A1 (fr) * 1994-03-30 1995-10-06 Trt Telecom Radio Electr Dispositif de mise en Óoeuvre d'un système de signature de message et carte à puce comportant un tel dispositif.
US5835594A (en) * 1996-02-09 1998-11-10 Intel Corporation Methods and apparatus for preventing unauthorized write access to a protected non-volatile storage
US5861662A (en) * 1997-02-24 1999-01-19 General Instrument Corporation Anti-tamper bond wire shield for an integrated circuit
US6105136A (en) * 1998-02-13 2000-08-15 International Business Machines Corporation Computer system which is disabled when it is disconnected from a network
US6816968B1 (en) * 1998-07-10 2004-11-09 Silverbrook Research Pty Ltd Consumable authentication protocol and system
US6501390B1 (en) * 1999-01-11 2002-12-31 International Business Machines Corporation Method and apparatus for securely determining aspects of the history of a good
JP3389186B2 (ja) * 1999-04-27 2003-03-24 松下電器産業株式会社 半導体メモリカード及び読み出し装置
EP1076279A1 (fr) * 1999-08-13 2001-02-14 Hewlett-Packard Company Plate-formes d'ordinateurs et leurs procédés d'opération
US7005733B2 (en) * 1999-12-30 2006-02-28 Koemmerling Oliver Anti tamper encapsulation for an integrated circuit
US20020116626A1 (en) * 2001-02-13 2002-08-22 Wood Roger D. Authentication system, method and apparatus
US7065656B2 (en) * 2001-07-03 2006-06-20 Hewlett-Packard Development Company, L.P. Tamper-evident/tamper-resistant electronic components
US6758404B2 (en) * 2001-08-03 2004-07-06 General Instrument Corporation Media cipher smart card
EP1355268B1 (fr) * 2002-02-28 2006-04-05 Matsushita Electric Industrial Co., Ltd. Carte à memoire
CZ2005209A3 (cs) * 2002-09-10 2005-12-14 Ivi Smart Technologies, Inc. Bezpečné biometrické ověření identity
US7392404B2 (en) * 2002-12-20 2008-06-24 Gemalto, Inc. Enhancing data integrity and security in a processor-based system
US7644290B2 (en) * 2003-03-31 2010-01-05 Power Measurement Ltd. System and method for seal tamper detection for intelligent electronic devices
KR100528477B1 (ko) * 2003-07-22 2005-11-15 삼성전자주식회사 스마트카드의 해킹검지회로
DE102005008258A1 (de) * 2004-04-07 2005-10-27 Giesecke & Devrient Gmbh Datenträger mit TAN-Generator und Display
EP1612639A1 (fr) * 2004-06-30 2006-01-04 ST Incard S.r.l. Méthode de détection et de réaction contre une attaque potentielle d'une opération exécutée par un jeton ou une carte cryptographique et visant à faire respecter la sécurité.
US7535373B2 (en) * 2005-07-15 2009-05-19 Honeywell International, Inc. Security techniques for electronic devices

Also Published As

Publication number Publication date
FR2893436A1 (fr) 2007-05-18
US20080289003A1 (en) 2008-11-20
US9262649B2 (en) 2016-02-16
WO2007057536A1 (fr) 2007-05-24

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Legal Events

Date Code Title Description
PLFP Fee payment

Year of fee payment: 11

PLFP Fee payment

Year of fee payment: 12

PLFP Fee payment

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PLFP Fee payment

Year of fee payment: 14

PLFP Fee payment

Year of fee payment: 15

CA Change of address

Effective date: 20201228

CD Change of name or company name

Owner name: IDEMIA FRANCE, FR

Effective date: 20201228

ST Notification of lapse

Effective date: 20210705