CA1178664A - Method of welding of connection wires to microcircuit contacts - Google Patents

Method of welding of connection wires to microcircuit contacts

Info

Publication number
CA1178664A
CA1178664A CA000388476A CA388476A CA1178664A CA 1178664 A CA1178664 A CA 1178664A CA 000388476 A CA000388476 A CA 000388476A CA 388476 A CA388476 A CA 388476A CA 1178664 A CA1178664 A CA 1178664A
Authority
CA
Canada
Prior art keywords
wire
spark discharge
ball
electrode
plasma
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA000388476A
Other languages
English (en)
French (fr)
Inventor
Hermanus A. Van De Pas
Johannes B.P. Janssen
Wilhelmus J.J. Lorenz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Application granted granted Critical
Publication of CA1178664A publication Critical patent/CA1178664A/en
Expired legal-status Critical Current

Links

Classifications

    • H10W72/075—
    • H10P95/00—
    • H10W72/015—
    • H10W72/01551—
    • H10W72/07141—
    • H10W72/07511—
    • H10W72/07521—
    • H10W72/07532—
    • H10W72/07533—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/5522—
    • H10W72/5524—
    • H10W90/754—

Landscapes

  • Wire Bonding (AREA)
CA000388476A 1980-10-29 1981-10-22 Method of welding of connection wires to microcircuit contacts Expired CA1178664A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL8005922A NL8005922A (nl) 1980-10-29 1980-10-29 Werkwijze voor het vormen van een draadverbinding.
NL8005922 1980-10-29

Publications (1)

Publication Number Publication Date
CA1178664A true CA1178664A (en) 1984-11-27

Family

ID=19836074

Family Applications (1)

Application Number Title Priority Date Filing Date
CA000388476A Expired CA1178664A (en) 1980-10-29 1981-10-22 Method of welding of connection wires to microcircuit contacts

Country Status (18)

Country Link
JP (1) JPS5916409B2 (enExample)
KR (1) KR890000585B1 (enExample)
AU (1) AU546818B2 (enExample)
BE (1) BE890887A (enExample)
BR (1) BR8106902A (enExample)
CA (1) CA1178664A (enExample)
CH (1) CH654142A5 (enExample)
DD (1) DD205294A5 (enExample)
DE (1) DE3141842A1 (enExample)
ES (1) ES506580A0 (enExample)
FR (1) FR2493044B1 (enExample)
GB (1) GB2086297B (enExample)
HK (1) HK40885A (enExample)
IT (1) IT1139570B (enExample)
MY (1) MY8500623A (enExample)
NL (1) NL8005922A (enExample)
PL (1) PL133893B1 (enExample)
SG (1) SG21984G (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4476365A (en) * 1982-10-08 1984-10-09 Fairchild Camera & Instrument Corp. Cover gas control of bonding ball formation
US4549059A (en) * 1982-11-24 1985-10-22 Nec Corporation Wire bonder with controlled atmosphere
US4476366A (en) * 1983-02-01 1984-10-09 Fairchild Camera & Instrument Corp. Controlled bonding wire ball formation
US4594493A (en) * 1983-07-25 1986-06-10 Fairchild Camera & Instrument Corp. Method and apparatus for forming ball bonds
FR2555813B1 (fr) * 1983-09-28 1986-06-20 Hitachi Ltd Dispositif a semi-conducteurs et procede de fabrication d'un tel dispositif
US4705204A (en) * 1985-03-01 1987-11-10 Mitsubishi Denki Kabushiki Kaisha Method of ball forming for wire bonding
US5031821A (en) * 1988-08-19 1991-07-16 Hitachi, Ltd. Semiconductor integrated circuit device, method for producing or assembling same, and producing or assembling apparatus for use in the method
US5628922A (en) * 1995-07-14 1997-05-13 Motorola, Inc. Electrical flame-off wand
DE29608277U1 (de) * 1996-04-30 1996-09-19 F&K Delvotec Bondtechnik GmbH, 85521 Ottobrunn Vorrichtung zum Ball-Bonden
JP2003163235A (ja) * 2001-11-29 2003-06-06 Shinkawa Ltd ワイヤボンディング装置
TWI229022B (en) * 2002-06-20 2005-03-11 Esec Trading Sa Device with electrodes for the formation of a ball at the end of a wire
KR101771142B1 (ko) * 2012-10-05 2017-08-24 가부시키가이샤 신가와 산화 방지 가스 취출 유닛

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH568656A5 (en) * 1974-03-20 1975-10-31 Transistor Ag Welding of contact blobs to semiconductor lead wires - uses electric DC light arc of preset current strength for melting lead wire end
NL7406783A (nl) * 1974-05-21 1975-11-25 Philips Nv Werkwijze voor het aanbrengen van een draad- verbinding aan een halfgeleiderinrichting.
GB1536872A (en) * 1975-05-15 1978-12-20 Welding Inst Electrical inter-connection method and apparatus
GB1468974A (en) * 1975-05-23 1977-03-30 Ferranti Ltd Manufacture of semiconductor devices
GB1600021A (en) * 1977-07-26 1981-10-14 Welding Inst Electrical inter-connection method and apparatus

Also Published As

Publication number Publication date
DD205294A5 (de) 1983-12-21
CH654142A5 (de) 1986-01-31
FR2493044A1 (fr) 1982-04-30
FR2493044B1 (fr) 1986-03-28
HK40885A (en) 1985-05-31
NL8005922A (nl) 1982-05-17
PL133893B1 (en) 1985-07-31
ES8301390A1 (es) 1982-11-16
KR830008394A (ko) 1983-11-18
GB2086297B (en) 1983-12-21
ES506580A0 (es) 1982-11-16
AU546818B2 (en) 1985-09-19
DE3141842A1 (de) 1982-10-21
JPS57102036A (en) 1982-06-24
BE890887A (fr) 1982-04-27
SG21984G (en) 1985-01-04
PL233586A1 (enExample) 1982-05-10
AU7689381A (en) 1982-05-06
MY8500623A (en) 1985-12-31
DE3141842C2 (enExample) 1990-09-20
GB2086297A (en) 1982-05-12
IT1139570B (it) 1986-09-24
KR890000585B1 (ko) 1989-03-21
JPS5916409B2 (ja) 1984-04-16
IT8124731A0 (it) 1981-10-27
BR8106902A (pt) 1982-07-13

Similar Documents

Publication Publication Date Title
CA1178664A (en) Method of welding of connection wires to microcircuit contacts
US5095187A (en) Weakening wire supplied through a wire bonder
JPS51147174A (en) Method and apparatus for connecting wires
GB8602740D0 (en) Bonding wires
DE3470290D1 (en) Arrangement for protecting a capillar part serving to weld wires in a semiconductor element against sparking
JPS5440570A (en) Method of bonding high voltage aluminum ball
EP0133118A3 (en) Method and apparatus for forming ball bonds
US4459452A (en) Ball bonding of wire
US3826000A (en) Terminating of electrical conductors
US3934108A (en) Lead bonding method and apparatus
US3950631A (en) Device for welding a wire by means of thermo-compression bonding
DE2965205D1 (en) Method of bonding metallic wires to microcircuit conductors
US4489231A (en) Method for preparing electrical conductor
US3500013A (en) Method of making connections to a microcircuit
US4040714A (en) C-clamp ground adapters
HK1079A (en) Provision of wire connections for semiconductor devices
JP2904618B2 (ja) ワイヤボンダー用ボール形成装置
JPS58137523A (ja) 放電加工装置における給電ケ−ブルの接続構造
US6739494B2 (en) Device with electrodes for the formation of a ball at the end of a wire
SU1532248A1 (ru) Способ автоматической приварки проволочных выводов и устройство дл его осуществлени
JP2000294595A (ja) ワイヤボンディング方法
JP2002172466A (ja) コンデンサ放電型のスタッド溶接方法
DD145147A1 (de) Verfahren und anordnung zum anschmelzen von kugelfoermigen kontakten an anschlussdraehte
JPH02135746A (ja) ボール形成装置及びそのワイヤ切れ検知方法
JPS56157040A (en) Semiconductor assembling device

Legal Events

Date Code Title Description
MKEX Expiry