PL133893B1 - Method of connecting with wire an electronic microcircuit to its connection conductor - Google Patents

Method of connecting with wire an electronic microcircuit to its connection conductor Download PDF

Info

Publication number
PL133893B1
PL133893B1 PL1981233586A PL23358681A PL133893B1 PL 133893 B1 PL133893 B1 PL 133893B1 PL 1981233586 A PL1981233586 A PL 1981233586A PL 23358681 A PL23358681 A PL 23358681A PL 133893 B1 PL133893 B1 PL 133893B1
Authority
PL
Poland
Prior art keywords
wire
ball
electrode
spark discharge
plasma
Prior art date
Application number
PL1981233586A
Other languages
English (en)
Polish (pl)
Other versions
PL233586A1 (enExample
Original Assignee
Nv Philips' Gloeilampenfabrieken Te Eindhoven
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nv Philips' Gloeilampenfabrieken Te Eindhoven, Philips Nv filed Critical Nv Philips' Gloeilampenfabrieken Te Eindhoven
Publication of PL233586A1 publication Critical patent/PL233586A1/xx
Publication of PL133893B1 publication Critical patent/PL133893B1/pl

Links

Classifications

    • H10W72/075—
    • H10P95/00—
    • H10W72/015—
    • H10W72/01551—
    • H10W72/07141—
    • H10W72/07511—
    • H10W72/07521—
    • H10W72/07532—
    • H10W72/07533—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/5522—
    • H10W72/5524—
    • H10W90/754—

Landscapes

  • Wire Bonding (AREA)
PL1981233586A 1980-10-29 1981-10-26 Method of connecting with wire an electronic microcircuit to its connection conductor PL133893B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL8005922A NL8005922A (nl) 1980-10-29 1980-10-29 Werkwijze voor het vormen van een draadverbinding.

Publications (2)

Publication Number Publication Date
PL233586A1 PL233586A1 (enExample) 1982-05-10
PL133893B1 true PL133893B1 (en) 1985-07-31

Family

ID=19836074

Family Applications (1)

Application Number Title Priority Date Filing Date
PL1981233586A PL133893B1 (en) 1980-10-29 1981-10-26 Method of connecting with wire an electronic microcircuit to its connection conductor

Country Status (18)

Country Link
JP (1) JPS5916409B2 (enExample)
KR (1) KR890000585B1 (enExample)
AU (1) AU546818B2 (enExample)
BE (1) BE890887A (enExample)
BR (1) BR8106902A (enExample)
CA (1) CA1178664A (enExample)
CH (1) CH654142A5 (enExample)
DD (1) DD205294A5 (enExample)
DE (1) DE3141842A1 (enExample)
ES (1) ES506580A0 (enExample)
FR (1) FR2493044B1 (enExample)
GB (1) GB2086297B (enExample)
HK (1) HK40885A (enExample)
IT (1) IT1139570B (enExample)
MY (1) MY8500623A (enExample)
NL (1) NL8005922A (enExample)
PL (1) PL133893B1 (enExample)
SG (1) SG21984G (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4476365A (en) * 1982-10-08 1984-10-09 Fairchild Camera & Instrument Corp. Cover gas control of bonding ball formation
US4549059A (en) * 1982-11-24 1985-10-22 Nec Corporation Wire bonder with controlled atmosphere
US4476366A (en) * 1983-02-01 1984-10-09 Fairchild Camera & Instrument Corp. Controlled bonding wire ball formation
US4594493A (en) * 1983-07-25 1986-06-10 Fairchild Camera & Instrument Corp. Method and apparatus for forming ball bonds
FR2555813B1 (fr) * 1983-09-28 1986-06-20 Hitachi Ltd Dispositif a semi-conducteurs et procede de fabrication d'un tel dispositif
US4705204A (en) * 1985-03-01 1987-11-10 Mitsubishi Denki Kabushiki Kaisha Method of ball forming for wire bonding
US5031821A (en) * 1988-08-19 1991-07-16 Hitachi, Ltd. Semiconductor integrated circuit device, method for producing or assembling same, and producing or assembling apparatus for use in the method
US5628922A (en) * 1995-07-14 1997-05-13 Motorola, Inc. Electrical flame-off wand
DE29608277U1 (de) * 1996-04-30 1996-09-19 F&K Delvotec Bondtechnik GmbH, 85521 Ottobrunn Vorrichtung zum Ball-Bonden
JP2003163235A (ja) * 2001-11-29 2003-06-06 Shinkawa Ltd ワイヤボンディング装置
TWI229022B (en) * 2002-06-20 2005-03-11 Esec Trading Sa Device with electrodes for the formation of a ball at the end of a wire
KR101771142B1 (ko) * 2012-10-05 2017-08-24 가부시키가이샤 신가와 산화 방지 가스 취출 유닛

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH568656A5 (en) * 1974-03-20 1975-10-31 Transistor Ag Welding of contact blobs to semiconductor lead wires - uses electric DC light arc of preset current strength for melting lead wire end
NL7406783A (nl) * 1974-05-21 1975-11-25 Philips Nv Werkwijze voor het aanbrengen van een draad- verbinding aan een halfgeleiderinrichting.
GB1536872A (en) * 1975-05-15 1978-12-20 Welding Inst Electrical inter-connection method and apparatus
GB1468974A (en) * 1975-05-23 1977-03-30 Ferranti Ltd Manufacture of semiconductor devices
GB1600021A (en) * 1977-07-26 1981-10-14 Welding Inst Electrical inter-connection method and apparatus

Also Published As

Publication number Publication date
DD205294A5 (de) 1983-12-21
CH654142A5 (de) 1986-01-31
FR2493044A1 (fr) 1982-04-30
CA1178664A (en) 1984-11-27
FR2493044B1 (fr) 1986-03-28
HK40885A (en) 1985-05-31
NL8005922A (nl) 1982-05-17
ES8301390A1 (es) 1982-11-16
KR830008394A (ko) 1983-11-18
GB2086297B (en) 1983-12-21
ES506580A0 (es) 1982-11-16
AU546818B2 (en) 1985-09-19
DE3141842A1 (de) 1982-10-21
JPS57102036A (en) 1982-06-24
BE890887A (fr) 1982-04-27
SG21984G (en) 1985-01-04
PL233586A1 (enExample) 1982-05-10
AU7689381A (en) 1982-05-06
MY8500623A (en) 1985-12-31
DE3141842C2 (enExample) 1990-09-20
GB2086297A (en) 1982-05-12
IT1139570B (it) 1986-09-24
KR890000585B1 (ko) 1989-03-21
JPS5916409B2 (ja) 1984-04-16
IT8124731A0 (it) 1981-10-27
BR8106902A (pt) 1982-07-13

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