BR9815092A - Pó de cobre de alta área superficial e baixa densidade, misturas com o mesmo e processo de eletrodeposição para fazê-lo - Google Patents

Pó de cobre de alta área superficial e baixa densidade, misturas com o mesmo e processo de eletrodeposição para fazê-lo

Info

Publication number
BR9815092A
BR9815092A BR9815092-8A BR9815092A BR9815092A BR 9815092 A BR9815092 A BR 9815092A BR 9815092 A BR9815092 A BR 9815092A BR 9815092 A BR9815092 A BR 9815092A
Authority
BR
Brazil
Prior art keywords
surface area
electrolyte solution
copper powder
low density
high surface
Prior art date
Application number
BR9815092-8A
Other languages
English (en)
Inventor
Stephen J Kohut
Ronald K Haines
Nicholas D Sopchak
Wendy Gort
Original Assignee
Electrocopper Prod Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electrocopper Prod Ltd filed Critical Electrocopper Prod Ltd
Publication of BR9815092A publication Critical patent/BR9815092A/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25C—PROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY OR REFINING OF METALS; APPARATUS THEREFOR
    • C25C5/00—Electrolytic production, recovery or refining of metal powders or porous metal masses
    • C25C5/02—Electrolytic production, recovery or refining of metal powders or porous metal masses from solutions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/06—Metallic powder characterised by the shape of the particles
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/04—Making non-ferrous alloys by powder metallurgy
    • C22C1/0425—Copper-based alloys

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Nanotechnology (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Mechanical Engineering (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Non-Insulated Conductors (AREA)
  • Powder Metallurgy (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

''Pó DE COBRE DE ALTA áREA SUPERFICIAL E BAIXA DENSIDADE, MISTURAS COM O MESMO E PROCESSO DE ELETRODEPOSIçãO PARA FAZê-LO''. Esta invenção refere-se a um pó de cobre de alta área superficial e baixa densidade tendo uma densidade aparente na faixa de cerca de 0,20 a cerca de 0,60 grama por centímetro cúbico, e uma área superficial de pelo menos 0,5 metro quadrado por grama. Esta invenção também se refere a um processo de eletrodeposição para fazer o pó de cobre acima eletrodepositando o pó de cobre de uma solução de eletrólito usando uma combinação de parâmetros de processo críticos. Estes parâmetros críticos incluem: uma concentração de íons cobre para a solução de eletrólito na faixa de cerca de 2 a cerca de 7 gramas por litro; uma concentração de íons cloro livres para a solução de eletrólito na faixa de cerca de 8 a cerca de 20 ppm; e um nível de impurezas para a solução de eletrólito não maior que cerca de 1,0 grama por litro; e uma solução de eletrólito que esteja livre de aditivos orgânicos.
BR9815092-8A 1998-02-04 1998-12-18 Pó de cobre de alta área superficial e baixa densidade, misturas com o mesmo e processo de eletrodeposição para fazê-lo BR9815092A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/018,269 US6036839A (en) 1998-02-04 1998-02-04 Low density high surface area copper powder and electrodeposition process for making same
PCT/US1998/026943 WO1999040240A1 (en) 1998-02-04 1998-12-18 Low density high surface area copper powder and electrodeposition process for making same

Publications (1)

Publication Number Publication Date
BR9815092A true BR9815092A (pt) 2000-10-17

Family

ID=21787086

Family Applications (1)

Application Number Title Priority Date Filing Date
BR9815092-8A BR9815092A (pt) 1998-02-04 1998-12-18 Pó de cobre de alta área superficial e baixa densidade, misturas com o mesmo e processo de eletrodeposição para fazê-lo

Country Status (13)

Country Link
US (2) US6036839A (pt)
EP (1) EP1051542A1 (pt)
JP (1) JP2002502915A (pt)
KR (1) KR20010040546A (pt)
CN (1) CN1284139A (pt)
AR (1) AR019521A1 (pt)
AU (1) AU745105B2 (pt)
BR (1) BR9815092A (pt)
CA (1) CA2317573A1 (pt)
ID (1) ID22363A (pt)
PE (1) PE20000168A1 (pt)
TW (1) TW473560B (pt)
WO (1) WO1999040240A1 (pt)

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CN104918732A (zh) * 2013-01-24 2015-09-16 三井金属矿业株式会社 铜粉
JP6001796B2 (ja) * 2014-06-16 2016-10-05 三井金属鉱業株式会社 銅粉、その製造方法、及びそれを含む導電性組成物
CN104131316A (zh) * 2014-07-04 2014-11-05 中南大学 在氯离子氨性体系中电解分离铜、钴镍的方法及其产品的应用
KR20170003639A (ko) * 2014-07-07 2017-01-09 스미토모 긴조쿠 고잔 가부시키가이샤 동분 및 그것을 이용한 도전성 페이스트, 도전성 도료, 도전성 시트, 대전 방지 도료
US10810731B2 (en) 2014-11-07 2020-10-20 Arizona Board Of Regents On Behalf Of Arizona State University Information coding in dendritic structures and tags
JP2016138301A (ja) * 2015-01-26 2016-08-04 住友金属鉱山株式会社 樹枝状銅粉の製造方法、及びそれを用いた導電性銅ペースト、導電性塗料、導電性シート
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JP5994897B1 (ja) * 2015-04-30 2016-09-21 住友金属鉱山株式会社 樹枝状銅粉の製造方法、及びその樹枝状銅粉を用いた銅ペースト、導電性塗料、導電性シート
JP5907301B1 (ja) 2015-05-15 2016-04-26 住友金属鉱山株式会社 銀コート銅粉及びそれを用いた銅ペースト、導電性塗料、導電性シート、並びに銀コート銅粉の製造方法
JP5907302B1 (ja) * 2015-05-15 2016-04-26 住友金属鉱山株式会社 銅粉及びそれを用いた銅ペースト、導電性塗料、導電性シート、並びに銅粉の製造方法
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Also Published As

Publication number Publication date
PE20000168A1 (es) 2000-03-24
EP1051542A1 (en) 2000-11-15
AU745105B2 (en) 2002-03-14
ID22363A (id) 1999-10-07
US6322609B1 (en) 2001-11-27
TW473560B (en) 2002-01-21
JP2002502915A (ja) 2002-01-29
WO1999040240A1 (en) 1999-08-12
AU1831799A (en) 1999-08-23
KR20010040546A (ko) 2001-05-15
CA2317573A1 (en) 1999-08-12
CN1284139A (zh) 2001-02-14
US6036839A (en) 2000-03-14
AR019521A1 (es) 2002-02-27

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Legal Events

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B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

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B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: REFERENTE AO DESPACHO 8.6 PUBLICADO NA RPI 1849 DE 13/06/2006.