ID22363A - Bubuk tembaga dengan area permukaan yang tinggi densitas yang rendah dan proses elektrodaposisi untuk pembuatannya - Google Patents

Bubuk tembaga dengan area permukaan yang tinggi densitas yang rendah dan proses elektrodaposisi untuk pembuatannya

Info

Publication number
ID22363A
ID22363A IDP990060D ID990060D ID22363A ID 22363 A ID22363 A ID 22363A ID P990060 D IDP990060 D ID P990060D ID 990060 D ID990060 D ID 990060D ID 22363 A ID22363 A ID 22363A
Authority
ID
Indonesia
Prior art keywords
electrodaposition
production
surface area
low density
high surface
Prior art date
Application number
IDP990060D
Other languages
English (en)
Indonesian (id)
Inventor
Stephen J Kohut
Ronald K Haines
Nicholas D Sophack
Wendy Gourt
Original Assignee
Electrocopper Products Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electrocopper Products Ltd filed Critical Electrocopper Products Ltd
Publication of ID22363A publication Critical patent/ID22363A/id

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25C—PROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY OR REFINING OF METALS; APPARATUS THEREFOR
    • C25C5/00—Electrolytic production, recovery or refining of metal powders or porous metal masses
    • C25C5/02—Electrolytic production, recovery or refining of metal powders or porous metal masses from solutions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/06—Metallic powder characterised by the shape of the particles
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/04—Making non-ferrous alloys by powder metallurgy
    • C22C1/0425—Copper-based alloys

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Electrochemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Nanotechnology (AREA)
  • Mechanical Engineering (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Non-Insulated Conductors (AREA)
  • Powder Metallurgy (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
IDP990060D 1998-02-04 1999-01-28 Bubuk tembaga dengan area permukaan yang tinggi densitas yang rendah dan proses elektrodaposisi untuk pembuatannya ID22363A (id)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/018,269 US6036839A (en) 1998-02-04 1998-02-04 Low density high surface area copper powder and electrodeposition process for making same

Publications (1)

Publication Number Publication Date
ID22363A true ID22363A (id) 1999-10-07

Family

ID=21787086

Family Applications (1)

Application Number Title Priority Date Filing Date
IDP990060D ID22363A (id) 1998-02-04 1999-01-28 Bubuk tembaga dengan area permukaan yang tinggi densitas yang rendah dan proses elektrodaposisi untuk pembuatannya

Country Status (13)

Country Link
US (2) US6036839A (pt)
EP (1) EP1051542A1 (pt)
JP (1) JP2002502915A (pt)
KR (1) KR20010040546A (pt)
CN (1) CN1284139A (pt)
AR (1) AR019521A1 (pt)
AU (1) AU745105B2 (pt)
BR (1) BR9815092A (pt)
CA (1) CA2317573A1 (pt)
ID (1) ID22363A (pt)
PE (1) PE20000168A1 (pt)
TW (1) TW473560B (pt)
WO (1) WO1999040240A1 (pt)

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WO2003060035A1 (en) * 2001-12-20 2003-07-24 Cognitek Management Systems, Inc. Composition for enhancing thermal conductivity of a heat transfer medium and method of use thereof
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DE102004063500A1 (de) * 2004-12-24 2006-07-06 Basf Ag Verwendung von Tensiden bei der Metallgewinnung
DE102005006982A1 (de) * 2005-02-15 2006-08-17 Basf Ag Verwendung nichtionischer Tenside bei der Metallgewinnung durch Elektrolyse
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US20070227390A1 (en) * 2006-03-31 2007-10-04 Richard Palmateer Shaped charges, lead-free liners, and methods for making lead-free liners
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KR20140068871A (ko) * 2011-07-08 2014-06-09 인스티튜트 오브 케미컬 테크놀로지 (딤드 유니버시티) 씨유 씨엘 열화학 사이클을 사용하는 수소의 생산에 사용되는 전기화학 전지
JP5631841B2 (ja) * 2011-10-21 2014-11-26 三井金属鉱業株式会社 銀被覆銅粉
JP5631910B2 (ja) * 2011-10-21 2014-11-26 三井金属鉱業株式会社 銀被覆銅粉
KR101138176B1 (ko) * 2011-10-24 2012-04-25 주광옥 전해동박 추출장치 및 추출방법
KR101308159B1 (ko) 2011-11-01 2013-10-15 성균관대학교산학협력단 고표면적 분말의 형성 방법
JP2013136818A (ja) * 2011-12-28 2013-07-11 Mitsui Mining & Smelting Co Ltd 銅粉
JP5942897B2 (ja) * 2012-03-22 2016-06-29 信越化学工業株式会社 酸化珪素析出体の連続製造方法及び製造装置
RU2533575C2 (ru) * 2012-11-28 2014-11-20 Игорь Станиславович Ясников Способ получения металлического порошка
WO2014115614A1 (ja) * 2013-01-24 2014-07-31 三井金属鉱業株式会社 銅粉
JP6001796B2 (ja) * 2014-06-16 2016-10-05 三井金属鉱業株式会社 銅粉、その製造方法、及びそれを含む導電性組成物
CN104131316A (zh) * 2014-07-04 2014-11-05 中南大学 在氯离子氨性体系中电解分离铜、钴镍的方法及其产品的应用
EP3167979A4 (en) * 2014-07-07 2018-03-14 Sumitomo Metal Mining Co., Ltd. Copper powder and electrically conductive paste, electrically conductive coating, electrically conductive sheet, and antistatic coating using same
US10810731B2 (en) 2014-11-07 2020-10-20 Arizona Board Of Regents On Behalf Of Arizona State University Information coding in dendritic structures and tags
JP2016138301A (ja) * 2015-01-26 2016-08-04 住友金属鉱山株式会社 樹枝状銅粉の製造方法、及びそれを用いた導電性銅ペースト、導電性塗料、導電性シート
WO2016151858A1 (ja) * 2015-03-26 2016-09-29 住友金属鉱山株式会社 銅粉及びそれを用いた銅ペースト、導電性塗料、導電性シート
JP5994897B1 (ja) * 2015-04-30 2016-09-21 住友金属鉱山株式会社 樹枝状銅粉の製造方法、及びその樹枝状銅粉を用いた銅ペースト、導電性塗料、導電性シート
JP6056901B2 (ja) * 2015-04-30 2017-01-11 住友金属鉱山株式会社 樹枝状銀コート銅粉の製造方法、及びその樹枝状銀コート銅粉を用いた銅ペースト、導電性塗料、導電性シート
JP5907302B1 (ja) * 2015-05-15 2016-04-26 住友金属鉱山株式会社 銅粉及びそれを用いた銅ペースト、導電性塗料、導電性シート、並びに銅粉の製造方法
JP5907301B1 (ja) 2015-05-15 2016-04-26 住友金属鉱山株式会社 銀コート銅粉及びそれを用いた銅ペースト、導電性塗料、導電性シート、並びに銀コート銅粉の製造方法
CN105441989A (zh) * 2015-11-26 2016-03-30 有研粉末新材料（北京）有限公司 一种电解铜粉易从阴极板脱落的方法
CN106757174B (zh) * 2017-02-23 2020-08-21 黄芃 一种电沉积制备金属粉末的方法
CN111372717B (zh) * 2017-12-07 2022-06-28 奥梅特电路股份有限公司 用于电子封装的组装的具有热稳定微结构的冶金组合物
WO2019210129A1 (en) 2018-04-26 2019-10-31 Kozicki Michael N Fabrication of dendritic structures and tags
US20220027620A1 (en) * 2018-12-04 2022-01-27 Arizona Board Of Regents On Behalf Of Arizona State University Dendritic tags
CN113677459A (zh) * 2019-04-05 2021-11-19 杰富意钢铁株式会社 粉末冶金用铁基混合粉末和铁基烧结体
CN112777782A (zh) * 2020-12-16 2021-05-11 天津华庆百胜能源有限公司 一种印制电路板厂含铜废液的回收处理方法
CN115449636B (zh) * 2022-09-05 2023-11-21 中南大学 一种锂离子电池正极材料的回收再生工艺

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Also Published As

Publication number Publication date
US6322609B1 (en) 2001-11-27
JP2002502915A (ja) 2002-01-29
PE20000168A1 (es) 2000-03-24
WO1999040240A1 (en) 1999-08-12
CA2317573A1 (en) 1999-08-12
AR019521A1 (es) 2002-02-27
AU1831799A (en) 1999-08-23
BR9815092A (pt) 2000-10-17
CN1284139A (zh) 2001-02-14
TW473560B (en) 2002-01-21
EP1051542A1 (en) 2000-11-15
US6036839A (en) 2000-03-14
AU745105B2 (en) 2002-03-14
KR20010040546A (ko) 2001-05-15

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