AU5410399A - Electronic component and method for the production thereof - Google Patents

Electronic component and method for the production thereof

Info

Publication number
AU5410399A
AU5410399A AU54103/99A AU5410399A AU5410399A AU 5410399 A AU5410399 A AU 5410399A AU 54103/99 A AU54103/99 A AU 54103/99A AU 5410399 A AU5410399 A AU 5410399A AU 5410399 A AU5410399 A AU 5410399A
Authority
AU
Australia
Prior art keywords
production
electronic component
electronic
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU54103/99A
Inventor
Joachim Sieg
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Elcos Electronic Components Support GmbH
Original Assignee
Elcos Electronic Componen GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Elcos Electronic Componen GmbH filed Critical Elcos Electronic Componen GmbH
Publication of AU5410399A publication Critical patent/AU5410399A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C2045/1486—Details, accessories and auxiliary operations
    • B29C2045/14967—Injecting through an opening of the insert
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
AU54103/99A 1998-07-22 1999-07-09 Electronic component and method for the production thereof Abandoned AU5410399A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19833039 1998-07-22
DE1998133039 DE19833039A1 (en) 1998-07-22 1998-07-22 Opto-electronic components encapsulated in transparent plastic to make e.g. displays, are rear-injected individually through holes in substrate to prevent undesirable segment cross-illumination
PCT/EP1999/004839 WO2000005758A1 (en) 1998-07-22 1999-07-09 Electronic component and method for the production thereof

Publications (1)

Publication Number Publication Date
AU5410399A true AU5410399A (en) 2000-02-14

Family

ID=7874966

Family Applications (1)

Application Number Title Priority Date Filing Date
AU54103/99A Abandoned AU5410399A (en) 1998-07-22 1999-07-09 Electronic component and method for the production thereof

Country Status (4)

Country Link
AU (1) AU5410399A (en)
DE (1) DE19833039A1 (en)
TW (1) TW417260B (en)
WO (1) WO2000005758A1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10012880A1 (en) * 2000-03-16 2001-09-27 Infineon Technologies Ag Process for encapsulating semiconductor chips comprises applying an adhering film on the lower side of the system carrier before injecting a pressed composition
US6743069B2 (en) * 2001-07-12 2004-06-01 Intel Corporation Facilitating the spread of encapsulant between surfaces of electronic devices
EP1795323A1 (en) * 2005-12-09 2007-06-13 Siemens Schweiz AG Method for producing a signal plate and traffic signal with such a signal plate
KR101349605B1 (en) 2007-09-27 2014-01-09 삼성전자주식회사 Method for forming the light emitting device package
EP3100915B2 (en) 2015-06-03 2022-09-28 WEIDPLAS GmbH Component
WO2017121516A1 (en) 2016-01-14 2017-07-20 Weidplas Gmbh Component comprising a flat decorative element and a housing
US20190263036A1 (en) * 2016-12-09 2019-08-29 Weidplas Gmbh Component comprising a cover layer and method for producing a component of this kind
CN107399041B (en) * 2017-06-05 2019-04-16 湖北久祥电子科技有限公司 A kind of LED packaging technology of riveted sealing

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2542095A1 (en) * 1975-09-20 1977-03-24 Licentia Gmbh SEMI-CONDUCTOR ARRANGEMENT FOR THE NUMERAL DISPLAY
DE3039796A1 (en) * 1980-10-22 1982-05-06 Battenfeld Maschinenfabriken Gmbh, 5882 Meinerzhagen Composite thermoplastic injection mouldings prodn. - by injecting first polymer and enlarging cavity for injecting second polymer on it
JPS611067A (en) * 1984-06-13 1986-01-07 Stanley Electric Co Ltd Molding method of led chip mounted on printed board
JPS61237485A (en) * 1985-04-12 1986-10-22 Takiron Co Ltd Manufacture of light-emission display body
JPS62160216A (en) * 1986-01-08 1987-07-16 Mazda Motor Corp Method and device for in-mold coat
JPH0343750U (en) * 1989-09-04 1991-04-24
US5200362A (en) * 1989-09-06 1993-04-06 Motorola, Inc. Method of attaching conductive traces to an encapsulated semiconductor die using a removable transfer film
JP2503782B2 (en) * 1990-12-21 1996-06-05 住友化学工業株式会社 Molding method for multi-layer molded products
WO1992020205A1 (en) * 1991-04-26 1992-11-12 Motorola, Inc. Tapered semiconductor device package
US5254501A (en) * 1992-09-11 1993-10-19 Cypress Semiconductor Corporation Same-side gated process for encapsulating semiconductor devices
EP0632511A3 (en) * 1993-06-29 1996-11-27 Mitsubishi Cable Ind Ltd A light emitting diode aggregate module and a method for manufacturing a light emitting diode aggregate module.
JPH08227637A (en) * 1994-02-23 1996-09-03 Matsushita Electric Works Ltd Control switch and manufactur thereof
DE19508509A1 (en) * 1995-03-09 1996-09-12 Juergen Sooth Mould for successive injections

Also Published As

Publication number Publication date
DE19833039A1 (en) 2000-01-27
WO2000005758A1 (en) 2000-02-03
TW417260B (en) 2001-01-01

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase