BR112014021492A2 - Medidor de espessura de raios x - Google Patents

Medidor de espessura de raios x

Info

Publication number
BR112014021492A2
BR112014021492A2 BR112014021492A BR112014021492A BR112014021492A2 BR 112014021492 A2 BR112014021492 A2 BR 112014021492A2 BR 112014021492 A BR112014021492 A BR 112014021492A BR 112014021492 A BR112014021492 A BR 112014021492A BR 112014021492 A2 BR112014021492 A2 BR 112014021492A2
Authority
BR
Brazil
Prior art keywords
thickness gauge
ray thickness
ray
gauge
thickness
Prior art date
Application number
BR112014021492A
Other languages
English (en)
Other versions
BR112014021492B1 (pt
Inventor
Takeshi Kagawa
Original Assignee
Toshiba Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Kk filed Critical Toshiba Kk
Publication of BR112014021492A2 publication Critical patent/BR112014021492A2/pt
Publication of BR112014021492B1 publication Critical patent/BR112014021492B1/pt

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B15/00—Measuring arrangements characterised by the use of electromagnetic waves or particle radiation, e.g. by the use of microwaves, X-rays, gamma rays or electrons
    • G01B15/02—Measuring arrangements characterised by the use of electromagnetic waves or particle radiation, e.g. by the use of microwaves, X-rays, gamma rays or electrons for measuring thickness
    • G01B15/025—Measuring arrangements characterised by the use of electromagnetic waves or particle radiation, e.g. by the use of microwaves, X-rays, gamma rays or electrons for measuring thickness by measuring absorption

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Length-Measuring Devices Using Wave Or Particle Radiation (AREA)
BR112014021492-1A 2012-09-10 2012-11-16 Medidor de espessura de raios x BR112014021492B1 (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012-198531 2012-09-10
JP2012198531A JP5847674B2 (ja) 2012-09-10 2012-09-10 Ｘ線厚さ計
PCT/JP2012/007373 WO2014037984A1 (ja) 2012-09-10 2012-11-16 Ｘ線厚さ計

Publications (2)

Publication Number Publication Date
BR112014021492A2 true BR112014021492A2 (pt) 2017-06-20
BR112014021492B1 BR112014021492B1 (pt) 2021-10-05

Family

ID=50236638

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112014021492-1A BR112014021492B1 (pt) 2012-09-10 2012-11-16 Medidor de espessura de raios x

Country Status (8)

Country Link
EP (1) EP2894433B1 (pt)
JP (1) JP5847674B2 (pt)
KR (1) KR101666470B1 (pt)
CN (1) CN104136885B (pt)
BR (1) BR112014021492B1 (pt)
IN (1) IN2014DN07077A (pt)
TW (1) TWI490448B (pt)
WO (1) WO2014037984A1 (pt)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6888905B2 (ja) * 2015-12-10 2021-06-18 株式会社東芝 検出信号におけるａ／ｄコンバータの雑音を低減した厚み計装置
TWI781381B (zh) * 2020-03-06 2022-10-21 台達電子工業股份有限公司 Ｘ射線照影方法及其系統
CN116026263B (zh) * 2023-03-30 2023-06-20 杭州百子尖科技股份有限公司 测厚校准方法、装置、设备和存储介质
CN117112989B (zh) * 2023-10-23 2024-01-23 北京华力兴科技发展有限责任公司 一种测厚数据滤波优化处理方法

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4088886A (en) * 1975-09-22 1978-05-09 Nucleonic Data Systems Radiation thickness gauge for sheet material
JPS5476988A (en) * 1977-12-01 1979-06-20 Hitachi Cable Ltd Preparing parallel multicore cable
JPS56106107A (en) * 1980-01-29 1981-08-24 Toshiba Corp Radiation thickness measuring device
JPS5740604A (en) * 1980-08-25 1982-03-06 Toshiba Corp Thickness measuring apparatus with radiation
US4574387A (en) * 1981-09-18 1986-03-04 Data Measurement Corporation Apparatus and method for measuring thickness
US4510577A (en) * 1982-02-18 1985-04-09 Tokyo Shibaura Denki Kabushiki Kaisha Non-contact radiation thickness gauge
JPS58150809A (ja) 1982-02-25 1983-09-07 Toshiba Corp 非接触放射線厚み計及びその校正方法
JPH0237523A (ja) 1988-07-28 1990-02-07 Yamaha Corp 磁気記録媒体の製造方法
JP2856815B2 (ja) * 1990-02-14 1999-02-10 株式会社東芝 Ｘ線厚み計
GB9113990D0 (en) * 1991-06-28 1991-08-14 Data Measurement Corp Means of calibrating x-ray gauging systems
JP3948965B2 (ja) * 2001-03-01 2007-07-25 株式会社東芝 多点計測厚み計
JP2003219324A (ja) * 2002-01-17 2003-07-31 Olympus Optical Co Ltd 画像補正データ算出方法、画像補正データ算出装置及びマルチプロジェクションシステム
JP3991267B2 (ja) * 2002-10-08 2007-10-17 アークレイ株式会社 分析装置およびこれの製造方法
JP4087274B2 (ja) * 2003-04-01 2008-05-21 株式会社東芝 Ｘ線厚さ測定装置
JP2005017028A (ja) * 2003-06-24 2005-01-20 Toshiba Corp Ｘ線厚さ計の基準板設定装置
WO2005011502A1 (ja) * 2003-07-30 2005-02-10 Hitachi Medical Corporation 放射線断層撮影装置
JP4357923B2 (ja) * 2003-10-17 2009-11-04 名古屋電機工業株式会社 Ｘ線検査装置、ｘ線検査方法およびｘ線検査装置の制御プログラム
JP4613613B2 (ja) * 2004-12-28 2011-01-19 横河電機株式会社 物理量測定方法
JP2008128756A (ja) * 2006-11-20 2008-06-05 Yokogawa Electric Corp Ｘ線厚さ測定装置
JP2011059000A (ja) * 2009-09-11 2011-03-24 Toshiba Corp 放射線厚さ計
KR101626072B1 (ko) * 2009-11-13 2016-06-13 삼성전자주식회사 영상 보정 장치 및 영상 보정 방법
JP2011242254A (ja) * 2010-05-18 2011-12-01 Nippon Steel Corp 鋼板の板厚測定装置およびその校正方法
CN102564361B (zh) * 2011-11-18 2013-10-23 北京金自天正智能控制股份有限公司 一种射线式测厚仪及其校正方法

Also Published As

Publication number Publication date
KR20140107650A (ko) 2014-09-04
TW201411091A (zh) 2014-03-16
CN104136885B (zh) 2017-03-01
CN104136885A (zh) 2014-11-05
EP2894433A1 (en) 2015-07-15
TWI490448B (zh) 2015-07-01
WO2014037984A1 (ja) 2014-03-13
EP2894433B1 (en) 2018-09-26
BR112014021492B1 (pt) 2021-10-05
JP5847674B2 (ja) 2016-01-27
JP2014052342A (ja) 2014-03-20
KR101666470B1 (ko) 2016-10-14
EP2894433A4 (en) 2016-05-11
IN2014DN07077A (pt) 2015-04-10

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Legal Events

Date Code Title Description
B06F Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]
B06U Preliminary requirement: requests with searches performed by other patent offices: procedure suspended [chapter 6.21 patent gazette]
B09A Decision: intention to grant [chapter 9.1 patent gazette]
B16A Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]

Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 16/11/2012, OBSERVADAS AS CONDICOES LEGAIS.