BR112014010725A2 - placa de circuitos impressos de ain com estruturas de cobre - Google Patents
placa de circuitos impressos de ain com estruturas de cobreInfo
- Publication number
- BR112014010725A2 BR112014010725A2 BR112014010725A BR112014010725A BR112014010725A2 BR 112014010725 A2 BR112014010725 A2 BR 112014010725A2 BR 112014010725 A BR112014010725 A BR 112014010725A BR 112014010725 A BR112014010725 A BR 112014010725A BR 112014010725 A2 BR112014010725 A2 BR 112014010725A2
- Authority
- BR
- Brazil
- Prior art keywords
- ceramic substrate
- printed circuit
- adhesive paste
- combustion
- ain
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H05K3/4061—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in inorganic insulating substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/086—Using an inert gas
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
- H05K3/1291—Firing or sintering at relative high temperatures for patterns on inorganic boards, e.g. co-firing of circuits on green ceramic sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
- H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
Abstract
resumo patente de invenção: "placa de circuitos impressos de ain com estruturas de cobre". a presente invenção refere-se a um processo para preparação de uma placa de cerâmica de circuitos impressos com trilhas condutoras elétricas e pontos de contactação em pelo menos um dos dois lados e com pelo menos um orifício de contactação (via). são realizadas as seguintes etapas de processo: a) preparação de um substrato cerâmico de nitreto de alumínio e realização dos orifícios nos locais previstos para as vias, b) preenchimento dos orifícios com uma pasta adesiva e, c) sobreimpressão única com um 1º processo serigráfico em um lado do substrato cerâmico com o layout desejado das trilhas condutoras e pontos de contactação com uma 2ª pasta adesiva, d) repetição completa ou parcial da sobreimpressão com a 2ª pasta adesiva, e) combustão do substrato cerâmico impresso em um forno de combustão com n2 (nitrogênio), f) impressão com um 2º processo serigráfico de uma pasta de cobertura pobre em vidro sobre uma 2ª pasta adesiva até que a espessura desejada seja atingida, g) combustão do substrato cerâmico impresso em um forno de combustão com n2 (nitrogênio).
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102011117538 | 2011-11-03 | ||
DE102012210555 | 2012-06-22 | ||
DE102012012692 | 2012-06-27 | ||
PCT/EP2012/071547 WO2013064531A1 (de) | 2011-11-03 | 2012-10-31 | Leiterplatte aus ain mit kupferstrukturen |
Publications (1)
Publication Number | Publication Date |
---|---|
BR112014010725A2 true BR112014010725A2 (pt) | 2017-05-02 |
Family
ID=47191712
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR112014010725A BR112014010725A2 (pt) | 2011-11-03 | 2012-10-31 | placa de circuitos impressos de ain com estruturas de cobre |
Country Status (11)
Country | Link |
---|---|
US (1) | US9717149B2 (pt) |
EP (1) | EP2774461B1 (pt) |
JP (1) | JP6207517B2 (pt) |
KR (1) | KR102029901B1 (pt) |
CN (1) | CN103891421B (pt) |
BR (1) | BR112014010725A2 (pt) |
DE (1) | DE102012219904A1 (pt) |
IN (1) | IN2014CN04038A (pt) |
RU (1) | RU2014122255A (pt) |
TW (1) | TWI566657B (pt) |
WO (1) | WO2013064531A1 (pt) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102014107217A1 (de) | 2014-05-19 | 2015-11-19 | Ceram Tec Gmbh | Leistungshalbleitermodul |
JP5941588B2 (ja) * | 2014-09-01 | 2016-06-29 | Dowaエレクトロニクス株式会社 | 接合材およびそれを用いた接合方法 |
KR101740453B1 (ko) | 2015-06-30 | 2017-05-26 | 주식회사 코멧네트워크 | 세라믹 회로 기판의 제조방법 |
KR20170029481A (ko) | 2017-03-08 | 2017-03-15 | 주식회사 코멧네트워크 | 세라믹 회로 기판의 제조방법 |
DE102017114891A1 (de) * | 2017-07-04 | 2019-01-10 | Rogers Germany Gmbh | Verfahren zur Herstellung einer Durchkontaktierung in einer aus einer Keramik gefertigten Trägerschicht und Trägerschicht mit Durchkontaktierung |
KR102212836B1 (ko) | 2020-05-19 | 2021-02-05 | 주식회사 코멧네트워크 | 세라믹 회로 기판의 제조방법 |
KR102293181B1 (ko) | 2020-08-27 | 2021-08-25 | 주식회사 코멧네트워크 | 양면 냉각형 파워 모듈용 세라믹 회로 기판, 그 제조방법 및 이를 구비한 양면 냉각형 파워 모듈 |
KR102557990B1 (ko) | 2021-01-28 | 2023-07-21 | 주식회사 알엔투세라믹스 | 냉각 핀을 구비한 양면 냉각형 파워 모듈용 세라믹 회로 기판, 그 제조방법 및 이를 구비한 양면 냉각형 파워 모듈 |
KR102492742B1 (ko) | 2021-08-11 | 2023-01-31 | 주식회사 알엔투세라믹스 | 인쇄 패턴의 트리밍 방법 및 이를 이용한 세라믹 회로 기판의 제조방법 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06196831A (ja) * | 1992-12-24 | 1994-07-15 | Tokin Corp | AlN基板用導電パターンの製造方法 |
JPH06297680A (ja) * | 1993-04-19 | 1994-10-25 | Hitachi Ltd | スクリーン印刷方法、スクリーン印刷装置、及び電子回路 |
JP3401102B2 (ja) * | 1994-12-21 | 2003-04-28 | 株式会社日立製作所 | 回路基板およびその製造方法、電子デバイス実装体、グリーンシート |
DE19514018C1 (de) * | 1995-04-13 | 1996-11-28 | Hoechst Ceram Tec Ag | Verfahren zur Herstellung eines metallbeschichteten, metallisierten Substrats aus Aluminiumnitridkeramik und damit erhaltenes metallbeschichtetes Substrat |
JPH1021744A (ja) * | 1996-06-28 | 1998-01-23 | Mitsuboshi Belting Ltd | 銅導体ペースト及び該銅導体ペーストを印刷した基板 |
EP1339271B1 (en) * | 2000-11-30 | 2011-07-27 | Tokuyama Corporation | Substrate and production method therefor |
JP3683891B2 (ja) * | 2003-01-31 | 2005-08-17 | Tdk株式会社 | セラミックグリーンシートの製造方法および当該セラミックグリーンシートを用いた電子部品の製造方法 |
JP4407199B2 (ja) * | 2003-08-13 | 2010-02-03 | 旭硝子株式会社 | 結晶化無鉛ガラス、ガラスセラミックス組成物、グリーンシートおよび電子回路基板 |
JP2005268672A (ja) * | 2004-03-22 | 2005-09-29 | Mitsubishi Electric Corp | 基板 |
WO2006019090A1 (ja) * | 2004-08-18 | 2006-02-23 | Tokuyama Corporation | 発光素子搭載用セラミックス基板およびその製造方法 |
KR100727451B1 (ko) * | 2005-04-26 | 2007-06-13 | 주식회사 잉크테크 | 금속 잉크 조성물 |
US7388296B2 (en) | 2005-06-09 | 2008-06-17 | Ngk Spark Plug Co., Ltd. | Wiring substrate and bonding pad composition |
JP2007201346A (ja) * | 2006-01-30 | 2007-08-09 | Mitsuboshi Belting Ltd | セラミックス回路基板及びその製造方法 |
JP4291857B2 (ja) * | 2007-01-24 | 2009-07-08 | 三ツ星ベルト株式会社 | 銅導体ペースト、導体回路板及び電子部品 |
TW200911071A (en) * | 2007-08-24 | 2009-03-01 | Delta Electronics Inc | Ceramic circuit board and manufacturing method thereof |
KR101194713B1 (ko) * | 2007-10-03 | 2012-10-25 | 가부시키가이샤후지쿠라 | 모듈, 배선판 및 모듈의 제조 방법 |
JP2010027637A (ja) * | 2008-07-15 | 2010-02-04 | Panasonic Corp | 導体ペースト及びそれを用いたセラミック基板の製造方法 |
TW201012332A (en) * | 2008-09-10 | 2010-03-16 | United Innovate Techology Corp | Multifunctional circuit board structure and manufacturing method thereof |
-
2012
- 2012-10-31 EP EP12787675.3A patent/EP2774461B1/de active Active
- 2012-10-31 WO PCT/EP2012/071547 patent/WO2013064531A1/de active Application Filing
- 2012-10-31 JP JP2014540397A patent/JP6207517B2/ja active Active
- 2012-10-31 US US14/354,740 patent/US9717149B2/en active Active
- 2012-10-31 BR BR112014010725A patent/BR112014010725A2/pt not_active Application Discontinuation
- 2012-10-31 DE DE102012219904A patent/DE102012219904A1/de not_active Withdrawn
- 2012-10-31 KR KR1020147014998A patent/KR102029901B1/ko active IP Right Grant
- 2012-10-31 IN IN4038CHN2014 patent/IN2014CN04038A/en unknown
- 2012-10-31 CN CN201280053683.6A patent/CN103891421B/zh active Active
- 2012-10-31 RU RU2014122255/07A patent/RU2014122255A/ru not_active Application Discontinuation
- 2012-11-02 TW TW101140923A patent/TWI566657B/zh active
Also Published As
Publication number | Publication date |
---|---|
DE102012219904A1 (de) | 2013-05-08 |
JP6207517B2 (ja) | 2017-10-04 |
CN103891421B (zh) | 2018-06-22 |
EP2774461A1 (de) | 2014-09-10 |
TW201340809A (zh) | 2013-10-01 |
TWI566657B (zh) | 2017-01-11 |
US9717149B2 (en) | 2017-07-25 |
JP2014532996A (ja) | 2014-12-08 |
KR102029901B1 (ko) | 2019-10-08 |
US20140284087A1 (en) | 2014-09-25 |
IN2014CN04038A (pt) | 2015-07-10 |
KR20140095083A (ko) | 2014-07-31 |
WO2013064531A1 (de) | 2013-05-10 |
CN103891421A (zh) | 2014-06-25 |
EP2774461B1 (de) | 2018-09-12 |
RU2014122255A (ru) | 2015-12-10 |
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Legal Events
Date | Code | Title | Description |
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B11A | Dismissal acc. art.33 of ipl - examination not requested within 36 months of filing | ||
B11Y | Definitive dismissal acc. article 33 of ipl - extension of time limit for request of examination expired | ||
B350 | Update of information on the portal [chapter 15.35 patent gazette] |