201012332 九、發明說明： 【發明所屬之技術領域】 本發明係有關於一種多種功能性之電路板結構及其製造方 法，特別是有關於-種具有㈣層及絕緣層之電路板結構及其製 造方法。 【先前技術】201012332 IX. Description of the Invention: [Technical Field] The present invention relates to a multi-functional circuit board structure and a manufacturing method thereof, and more particularly to a circuit board structure having a (four) layer and an insulating layer and manufacturing thereof method. [Prior Art]
隨著通訊系統及超大型積體電路（Very Large Integration ’ VLSI)技術的迅速發展，使得通訊與電腦設備的速度 大幅提升。現今電子裝置對高速訊號傳輸的需求越來越大，體= 微小之電子元件於執行高賴作過程中，將產生大量的熱能，而 習用電路板又多以電木或是玻璃纖維製成，其整體散 佳’使得單位面制賴量相錢人。 ”^ 若是電路板無法快速散除電子元件所產生之熱能，過 度雜得制電路板產生彎曲、變形等劣化現象。為了改善此二 1題、年來開始研發多孔喊電路板之技術，於 娜543 帽咖 板上被覆-供電子疋件電性連接之導電層。 ^ ^難6543號專利案麵由多孔喊基板所具備的大表面 使用壽Γ快魏除電子元件所產生的熱能，並可延長電路板之 卻麟_題，但 板上之過財，導電層流人卩=7使得導電層形成於陶莞基 陶光基板之孔洞内，而將基板表面上 201012332 的孔洞完全填滿，如此將極有可能造成導電層漏電流的問題。再 者’若是電性設置於導電層上之走線(lay〇ut)的間距過於接近時， 亦容易產生短路的問題。 另外’目前所使用的塑膝材質之印刷電路板或是铭質之基 f，並無法適·高溫(例如超過攝氏25〇度)的環境下使用，若 是印路板或是_基板長時間處在如此高溫的I作環境，極 易造成材料的舰或是氧化，導致印概路钱是_基板的使 ©用哥命大幅縮短。 右疋使用_材料製成之基板，由於陶£材料的結構特性， 比起塑膠材質之印刷電路板或是紹製基板而言，嫌生較差而較 =易破損，晴也造成陶絲板之尺寸無法過大的關。如此一 來:陶絲板上的佈線（layQut)將受限於材料雜及製程的限制 而热法4輕複雜的線路，其魏性受到相當大的舰，並且 佈線的斷線率亦過高而無法改善。 ❹4些問題對於使用者而言，都將造成相當大的不便及困擾。 因此'’如何使電路板同時兼具高散熱效率與良好的電性導通特 i·生以及改善電路佈線的斷線率，是相關領域技術人 的問題。 - 所六 【發明内容】 豆t以上的問題’本發明提供一種多種功能性之電路板結構 〜:製k方法，藉以改良習知多孔喊電路板的多孔性結構，使 得"X置於電路板上之導電層容易產生漏電流，一般電路板所選用 的材料特㈣受限於溫度關及結構支撐性及金屬基板直接披覆 201012332 絕緣層走線容易斷線而造成短路等問題。 本發明多種功能性之電路板結構，係與複數個電子元件電性 ^丄電路板結構包括有-金屬基板、—黏著層、—絕緣層、及 置π黏#者層係设置於金屬基板上，絕緣層係設 黏者層上，走線層係設置於絕緣層上，並與電子元件電性連 本發明所揭露婦魏性之電_之製造枝 ❹=將著層形成於—金屬基板上，接著形成—絕緣層於二 :，讀軸—走線層於絕'上，觸成本购之電路板結 本發明之功效在於，金屬基板及絕緣層之間設置—黏著層， 2增加金屬層和職叙結合性，並且贱祕層直接與基錢 觸，改善金屬基板直接披覆絕緣層，走 LV w“ ㈣紐谷易斷線及造成短路， ^及走線層易因材料結合性的不同而產生斷線問題及改善習用多 _孔陶£電路板職生的漏電流及短路的問題。 树明之板結構可_之範廣泛咖 娜触，編观、W效率、及使 並且’金屬基板吸收外力之能力較佳，且基 =作成較大尺寸，因此具傷不易破裂、不受材料特性限制、 及各易辦較之電路舰#伽。糾，在 2選用陶莞基板及多孔陶隸板)之電路板結構 層之-，可域-餘良率，觸層 搭配’使本剌之f路·有多麵化及魏性。 201012332 以上之關於本發明内容之說明及以下之實施方式之說明係用 以不範與解釋本發明之原理，並且提供本發明之專利申請範圍更 進一步之解釋。 【實施方式】 第1圖」及「第2圖」所示為本發明之剖面示意圖及步驟 ^私圖本u所揭路之電路板結構係用以電性連接複數個 電子元件(財絲），峨行賊之魏，本發明之錄功能性之 電路板結構100適用於研至鮮C之溫度範圍内，並且具備高 散熱與高可靠度之優點。 本發明之電路板⑽包括有一金屬基板110、一黏著層120' —絕緣層130、以及—4- a 1 走、，泉層140。金屬基板110可為鋼、銅、鋁 及其匕合金所製成，或是1 首先對金屬基板no之上;面问隹導金屬或非金屬材料。 之前處理，接著錢結、其他使表面祕 π 、土戍Ρ刷方式形成一黏著層120於金 屬基板110上(步驟2〇〇)，再 驟210)。 、者層120试成一絶緣層130(步 層作為金屬層與介i20係為-緩衝層，此-緩衝 屬基板及介電材料而有所擇會因金 氣化鐵或氧化鱗各種氧 ^ =、玻璃' 料，也爾叫求切物；之其中一材 130係由介電·㈣成 *讀。本發明之絕緣層 ,.^ 如為氣化鐵(Fe2〇i)式早_ 或其他氧化金屬等材料 3)次疋氣化鋁(Ai2〇3) 、、巴緣層也可因實際製作上的需求而可製 201012332 作多層。 走線層140係由銅(Cu)、銀(Ag)、金(Au)或是其他可導電之金 屬及合金材料所製成，走線層14〇係以印刷塗覆方式形成於絕緣 層1—30上(步驟220) ’再經由洪烤或高溫燒結製程，使走線層_ 固著於絕緣層。藉由黏著層12〇之設置，而大幅增加絕曰緣層 130與金屬基板110之間的結合性，使得絕緣層⑼不易自金屬 基板no上脫落，並且設置於絕緣層13〇上之姐層⑽亦不易 因材料膨脹係數差異過大，而產生斷線問題。 絕緣層130可選用高導熱係數(Κ)之介電材料或是低導敎之介 電材料。當絕緣層13G翻高導熱係數之介電材料，本㈣ 路板刚可做為具有高散熱效能之基板；當絕緣層⑽選用低導 熱係數之介電材料時，本發明之電路板刚可做為加献板之用， 當黏著層UG及絕緣層13G _高阻抗之介電材料，阻抗值 ❹ (Ik〜H)0M)可因實際需求藉由材料參配作調整，本發明之電路板 100亦可做為防靜電(ESD)之電路結構。 露於空氣巾而產生氧化侧，因此可被覆―保護層⑼於走 線層140上(步驟250)，_保走線層14〇維持良好的導電特性， 而保護層150可選賴金屬(Ni)，並藉由讀方式被覆於走線層 140上，但並不以此方式為限。於保護们％上更被覆有一助焊 層1零驟260)，而助焊層160之材質可選自錫(Sn)、錯㈣、锡 錯合金(Sn-Pballoy)、或是金(Au)所製成，並於電性連接電子元件 (圖中未示则程巾’受熱親融狀態，以使電子元件與走線声 140電性連接。 曰 201012332 本發明電路板100與電子元件電性連接之方式，可選擇以插 ^m(through hole technology，THT) ^ ^^#t^#(surface mounted technology，SMT)、或是低溫共燒陶瓷技術fl〇w tempemurcco_firedceramic ’ LTCC)等方式，惟此部份之技術並非 本專利之標的，且為熟悉該項技術者經常採用之技術，故不費叙。 ❹ 「第3圖」及「第4圖」所示為本發明多層電路板結構之剖 面示意圖及步驟流程圖。如圖所示，首先於金屬基板ιι〇上依序 形成-黏著層！20、-絕緣層⑽及—走線層，步驟·、21〇、 220) ’接著藉由燒結、喷塗、或是印刷方式，於走線層⑽上形 成魏緣層⑽相同材質及触之第二魏層m(步驟2坤，並 於第-、％緣層m上形成—第二走線層⑽(步驟網，最後於第 -走線層18G上依序形成保護層15G及助痒層⑽(步驟勝 260) ’以得到具有多層走線之電路板結構⑽。 其中，本發明所揭露之黏著層、絕緣層、及走線層可於基板 ::面上’或者是基板之兩相對側面j^複堆疊多層結構，以 雔厚使㈣求’並不以本發明實施例揭露之單"'側面堆疊 雙層結構為限。另外，太路as λ β W所揭路之金屬基板係為-平面結構， 然而基板結構亦可為非平而j χ 面形狀’例如球面、曲面或任何幾何圖 b ’並不以本發明揭露之實施例為限。 本發明之電路板結構，藉由設置於基板與走線層之間的絕緣 :二==多：€電路板與採用金屬類材料為基板之電路 之間設置黏著二問題。且本發明於金屬基板與絕緣層 s 曰加絕緣層之結合性，使得絕緣層不易於 201012332 =屬基板上脫洛’同時改錢線層輯料雜絲差距過 易造成斷線的問題。 爾獅嫩(研至 w、门政，，，、放率、向可靠度、良好的電性導通掊 且強度。另外，本發明之金屬基板吸收外力的能力較佳，、 =板，較大的尺寸，因此具備不易破裂 特性限制、及容易設外单 η 之電路佈線箄伽D ' t平面、球面、或是任何幾何型態 n咨其η、’另外’在金屬基板（或是選用陶兗基板及多孔 Μ 土板)之電路板結構及其製作方法，藉由黏著層之妙，可少 :改善製程良率，並藉_著層與絕緣層之搭配，使本發明之電 路板具有多種變化及功能性。 乃之電 之辑板藉姆著層及躲㈣料之選擇調整，將可 有夕種氣化，例如為耐高溫電 路板及防靜電電路柘。祐曰W 電路板加熱用電 板亚且，本發明之電路板具有高度結構性， ❹ 並不限疋於本發明圖式所揭示之平面型態。 發明之實施例揭露如上所述，然並非用以限定本發 凡林技藝者’在不脫離本發明之精神和範圍内，舉 發仅專縣·麵縣_書_之申請專 利範圍所界定者為準。 【圖式簡單說明】 第1圖為本㈣之剖面示意圖； 第2圖為本發明之步驟流程圖； 201012332 第3圖為本發明之多層電路板結構之剖面示意圖；以及 第4圖為本發明製造多層電路板結構之步驟流程圖。 【主要元件符號說明】 100 電路板 110 金屬基板 120 黏著層 130 絕緣層 140 〇 走線層 150 保護層 160 助焊層 170 第二絕緣層 180 第二走線層 步驟200 形成#纟著層於金屬基板上 步驟210 形成絕緣層於黏著層上 步驟220 形成走線層於絕緣層上 ⑬步驟230 形成第二絕緣層於走線層上 步驟240 形成第二走線層於第二絕緣層上 步驟250 形成保護層於走線層上 步驟260 形成助焊層於保護層上 12With the rapid development of communication systems and Very Large Integration (VLSI) technology, the speed of communication and computer equipment has increased dramatically. Today's electronic devices are increasingly demanding high-speed signal transmission. The body of tiny electronic components will generate a large amount of heat during the high-performance process, and the conventional circuit boards are made of bakelite or fiberglass. Its overall goodness makes the unit system a lot of money. ” ^ If the circuit board can not quickly dissipate the thermal energy generated by the electronic components, the excessively miscellaneous circuit board will be deteriorated by bending, deformation, etc. In order to improve the two questions, the technology of the porous shouting circuit board has been developed over the years, Yu Na 543 Cover on the cap board - the conductive layer for the electrical connection of the electronic components. ^ ^ The difficulty of the 6543 patent surface is made up of the large surface of the porous substrate, which uses the thermal energy generated by the electronic components and can be extended. The circuit board is lining _ question, but the board is too rich, the conductive layer flow 卩 = 7 so that the conductive layer is formed in the hole of the pottery base ceramic light substrate, and the hole of the 201012332 on the surface of the substrate is completely filled, so the pole There is a possibility that the leakage current of the conductive layer may be caused. In addition, if the pitch of the traces which are electrically disposed on the conductive layer is too close, the problem of short circuit is also likely to occur. The printed circuit board of the material or the base of the name f can not be used in an environment suitable for high temperature (for example, more than 25 degrees Celsius). If the printed circuit board or the _ substrate is in such a high temperature environment for a long time, It is very easy to cause the ship of the material to be oxidized, which leads to the printing of the money. The substrate is greatly shortened by the use of the material. The right 疋 is made of _ material, because of the structural characteristics of the material, compared to the plastic material. For printed circuit boards or substrates, the suspicion is poor and the damage is easy to break. The size of the ceramic board cannot be too large. Therefore, the wiring on the ceramic board (layQut) will be limited. The material is complicated and the process is limited, and the thermal method is light and complicated. The Wei is affected by a fairly large ship, and the wire breakage rate is too high to be improved. ❹4 Some problems will be caused to the user. It is a big inconvenience and trouble. Therefore, how to make the circuit board have both high heat dissipation efficiency and good electrical conduction and improve the disconnection rate of the circuit wiring is a problem of the technical person in the related field. SUMMARY OF THE INVENTION Problems Between Beans and T' The present invention provides a multi-functional circuit board structure~: a k-making method for improving the porous structure of a conventional porous circuit board, so that "X is placed on the circuit board Easy layer The leakage current, the material selected for the general board (4) is limited by the temperature and structural support and the metal substrate directly covering the 201012332 insulation layer is easy to break the wire and cause short circuit, etc. The multi-function circuit board of the present invention The structure, the system and the plurality of electronic components, the circuit board structure comprises a metal substrate, an adhesive layer, an insulating layer, and a layer of π-stick is disposed on the metal substrate, and the insulating layer is provided with an adhesive layer The wiring layer is disposed on the insulating layer and electrically connected to the electronic component. The manufacturing method disclosed in the present invention is that the layer is formed on the metal substrate, and then the insulating layer is formed on the second layer: The read axis-the trace layer is on the top, and the circuit board is purchased at a cost. The effect of the invention is that an adhesive layer is provided between the metal substrate and the insulating layer, 2 the metal layer and the combination of the functions and the like are added, and the secret is secreted. The layer directly touches the base money to improve the direct coating of the insulating layer on the metal substrate, and the LV w" (4) New Valley easy to break the line and cause a short circuit, and the wiring layer is easy to cause disconnection problems and improve the use of the material.多_孔陶Leakage current and short circuit of the circuit board. The structure of the tree plate can be widely used, the texture, the W efficiency, and the ability of the metal substrate to absorb external force, and the base = made of a larger size, so the damage is not easy to break, not subject to material properties Restrictions, and easy to do compared to the circuit ship #伽. Correction, in the selection of the circuit board structure layer of the pottery Wan substrate and the porous ceramic plate), the domain-to-the-bene rate, the contact layer can be used to make the b-way of the Bengbu multi-faceted and Wei-like. The description of the present invention and the following description of the embodiments of the present invention are intended to be illustrative of the principles of the invention and the scope of the invention. [Embodiment] FIG. 1 and FIG. 2 are a cross-sectional view and a step of the present invention. The circuit board structure of the method disclosed in the present invention is for electrically connecting a plurality of electronic components (Finance). The functional circuit board structure 100 of the present invention is suitable for researching into the temperature range of fresh C, and has the advantages of high heat dissipation and high reliability. The circuit board (10) of the present invention comprises a metal substrate 110, an adhesive layer 120'-insulating layer 130, and a 4-a1 walking, spring layer 140. The metal substrate 110 may be made of steel, copper, aluminum or a tantalum alloy, or 1 first on the metal substrate no; the surface may be a metal or non-metal material. The previous processing, then the money knot, the other surface π, the soil brushing method forms an adhesive layer 120 on the metal substrate 110 (step 2 〇〇), and then step 210). The layer 120 is tested into an insulating layer 130 (the step layer acts as a metal layer and the dielectric layer is a buffer layer, and the buffer layer is a substrate and a dielectric material, and may be selected by gold gasification iron or oxidized scale various oxygen ^ = , glass 'materials, also called cutting objects; one of the 130 series is read by dielectric · (four) into *. The insulating layer of the invention, . ^ such as gasified iron (Fe2〇i) type _ or other Materials such as oxidized metal 3) Alumina (Ai2〇3), and the edge layer can also be made into a multilayer by 201012332 due to actual production requirements. The wiring layer 140 is made of copper (Cu), silver (Ag), gold (Au) or other electrically conductive metal and alloy material, and the wiring layer 14 is formed by printing on the insulating layer 1 - 30 (step 220) 'By the bake or high temperature sintering process, the trace layer _ is fixed to the insulating layer. By the arrangement of the adhesive layer 12, the bonding between the insulating layer 130 and the metal substrate 110 is greatly increased, so that the insulating layer (9) is not easily peeled off from the metal substrate no, and is disposed on the insulating layer 13 (10) It is also not easy to cause disconnection due to excessive difference in material expansion coefficient. The insulating layer 130 may be selected from a dielectric material having a high thermal conductivity (Κ) or a dielectric material having a low conductivity. When the insulating layer 13G turns over the dielectric material of the thermal conductivity, the (four) board can be used as the substrate with high heat dissipation performance; when the insulating layer (10) selects the dielectric material with low thermal conductivity, the circuit board of the invention can be used. For the purpose of adding a board, when the adhesive layer UG and the insulating layer 13G_high-impedance dielectric material, the impedance value ❹(Ik~H)0M) can be adjusted by the material arrangement due to actual needs, the circuit board of the present invention 100 can also be used as an anti-static (ESD) circuit structure. It is exposed to the air towel to produce an oxidized side, so that the protective layer (9) can be coated on the wiring layer 140 (step 250), the _preserving layer 14 〇 maintains good electrical conductivity, and the protective layer 150 can be selected from a metal (Ni). ), and is overlaid on the trace layer 140 by reading, but is not limited thereto. The protection layer % is further covered with a solder layer 1 step 260), and the material of the solder layer 160 may be selected from tin (Sn), wrong (four), tin-pballoy, or gold (Au). The electrical component is electrically connected to the electronic component (the process towel is not shown in the figure to be heated and intimate, so that the electronic component is electrically connected to the routing sound 140. 曰201012332 The circuit board 100 and the electronic component of the invention are electrically connected. The connection method can be selected by inserting through hole technology (THT) ^ ^^#t^# (surface mounted technology, SMT) or low temperature co-fired ceramic technology fl〇w tempemurcco_firedceramic ' LTCC) This part of the technology is not the subject of this patent, and is familiar to those skilled in the art, so it is not necessary to describe. 「 "Fig. 3" and "Fig. 4" show a schematic cross-sectional view and a flow chart of the steps of the multilayer circuit board structure of the present invention. As shown in the figure, firstly form an adhesive layer on the metal substrate ιι! 20, -Insulation layer (10) and - trace layer, step ·, 21〇, 220) ' Then the same material and contact layer of the Wei edge layer (10) is formed on the wiring layer (10) by sintering, spraying or printing. The second Wei layer m (step 2 Kun, and formed on the first -, % edge layer m - the second trace layer (10) (step net, finally formed on the first - trace layer 18G sequentially to form a protective layer 15G and itching Layer (10) (step wins 260) 'to obtain a circuit board structure (10) having a plurality of traces. The adhesive layer, the insulating layer, and the trace layer disclosed in the present invention may be on the substrate:: surface or two of the substrate The opposite side j ^ stacks the multi-layer structure, so that the thickness of the (4) is not limited to the single-layered double-layer structure disclosed in the embodiment of the present invention. In addition, the metal of the road as the as λ β W The substrate is a planar structure, but the substrate structure may also be non-flat and the shape of the surface, such as a sphere, a curved surface or any geometric figure b', is not limited to the embodiment disclosed by the present invention. The circuit board structure of the present invention, By the insulation between the substrate and the trace layer: two == more: € circuit board and metal materials There is a problem of adhesion between the circuits of the substrate, and the combination of the metal substrate and the insulating layer s with the insulating layer makes the insulating layer not easy to be 201012332 = the substrate is detached from the substrate while changing the money layer The wire gap is easy to cause the problem of wire breakage. Ershien (research to w, gate,,,, rate, reliability, good electrical conductivity and strength. In addition, the metal substrate of the present invention absorbs external force The ability is better, = plate, larger size, so it has the limitation of not easy to break the characteristics, and it is easy to set the outer circuit η circuit wiring 箄 D D't plane, spherical surface, or any geometric type n η, ' In addition, the circuit board structure and the manufacturing method of the metal substrate (or the ceramic substrate and the porous earth plate) can be improved by the adhesive layer: the process yield is improved, and the layer and the insulating layer are used. The combination of the circuit board of the present invention has various changes and functions. The electric board of the board is adjusted by the selection of the layer and the hiding material, and the gas can be vaporized, for example, a high temperature resistant circuit board and Electrostatic circuit 柘. 曰 W circuit board The circuit board of the present invention has a high degree of structure, and is not limited to the planar form disclosed in the drawings of the present invention. The embodiments of the invention are as described above, but are not intended to limit the present invention. Fanlin Artists's shall not be divorced from the spirit and scope of the present invention, and shall be subject to the definition of the scope of application for patents only in the county/county county. [Simplified illustration] Figure 1 is the section of (4) 2 is a cross-sectional view showing the structure of a multilayer circuit board of the present invention; and FIG. 4 is a flow chart showing the steps of manufacturing a multilayer circuit board according to the present invention. Description] 100 circuit board 110 metal substrate 120 adhesive layer 130 insulating layer 140 〇 trace layer 150 protective layer 160 solder layer 170 second insulating layer 180 second wiring layer step 200 forming #纟 layer on the metal substrate step 210 Forming an insulating layer on the adhesive layer on step 220 to form a trace layer on the insulating layer. Step 13: Form a second insulating layer on the trace layer. Step 240: Form a second trace layer on the second insulation. The step of forming the protective layer 250 on the flux layer on the protective layer 12 down to the upper wiring layer 260 formed in step