IN2014CN04038A - - Google Patents

Info

Publication number
IN2014CN04038A
IN2014CN04038A IN4038CHN2014A IN2014CN04038A IN 2014CN04038 A IN2014CN04038 A IN 2014CN04038A IN 4038CHN2014 A IN4038CHN2014 A IN 4038CHN2014A IN 2014CN04038 A IN2014CN04038 A IN 2014CN04038A
Authority
IN
India
Prior art keywords
ceramic substrate
adhesive paste
overprinting
conductor traces
stoving
Prior art date
Application number
Inventor
Alexander Dohn
Roland Leneis
Klaus Herrmann
Dietmar Jähnig
Original Assignee
Ceramtec Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ceramtec Gmbh filed Critical Ceramtec Gmbh
Publication of IN2014CN04038A publication Critical patent/IN2014CN04038A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4061—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in inorganic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/086—Using an inert gas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
    • H05K3/1291—Firing or sintering at relative high temperatures for patterns on inorganic boards, e.g. co-firing of circuits on green ceramic sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Ceramic Products (AREA)

Abstract

2222The invention relates to a process for producing a ceramic circuit board with electrical conductor traces and contacting points on at least one of the two sides and with at least one through hole contact (via). According to the invention the following successive process steps are performed: a) Production of a ceramic substrate made of aluminium nitride and drilling of holes at the intended locations for the vias b) Filling the holes with a first adhesive paste made of copper tungsten molybdenum or alloys thereof or mixtures thereof and c) Single pass overprinting with a second adhesive paste using a first screen printing operation on at least one side of the ceramic substrate with the desired layout of the conductor traces and contact points d) Optionally a full or partial repeat of overprinting with the second adhesive paste e) Stoving the printed ceramic substrate in an oven with N (nitrogen) wherein the oxygen content is kept controlled to 0 50 ppm O f) Overprinting using a second screen printing process with a low glass cover paste over the second adhesive paste until the desired thickness of the conductor traces and contact points is achieved g) Stoving the printed ceramic substrate in an oven with N (nitrogen) wherein the oxygen content is kept controlled to 0 50 ppm O.
IN4038CHN2014 2011-11-03 2012-10-31 IN2014CN04038A (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE102011117538 2011-11-03
DE102012210555 2012-06-22
DE102012012692 2012-06-27
PCT/EP2012/071547 WO2013064531A1 (en) 2011-11-03 2012-10-31 Circuit board made of ain with copper structures

Publications (1)

Publication Number Publication Date
IN2014CN04038A true IN2014CN04038A (en) 2015-07-10

Family

ID=47191712

Family Applications (1)

Application Number Title Priority Date Filing Date
IN4038CHN2014 IN2014CN04038A (en) 2011-11-03 2012-10-31

Country Status (11)

Country Link
US (1) US9717149B2 (en)
EP (1) EP2774461B1 (en)
JP (1) JP6207517B2 (en)
KR (1) KR102029901B1 (en)
CN (1) CN103891421B (en)
BR (1) BR112014010725A2 (en)
DE (1) DE102012219904A1 (en)
IN (1) IN2014CN04038A (en)
RU (1) RU2014122255A (en)
TW (1) TWI566657B (en)
WO (1) WO2013064531A1 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014107217A1 (en) 2014-05-19 2015-11-19 Ceram Tec Gmbh The power semiconductor module
JP5941588B2 (en) * 2014-09-01 2016-06-29 Ｄｏｗａエレクトロニクス株式会社 Bonding material and bonding method using the same
KR101740453B1 (en) 2015-06-30 2017-05-26 주식회사 코멧네트워크 Method of manufacturing ceramic circuit board
KR20170029481A (en) 2017-03-08 2017-03-15 주식회사 코멧네트워크 Method of manufacturing ceramic circuit board
DE102017114891A1 (en) * 2017-07-04 2019-01-10 Rogers Germany Gmbh Process for producing a via in a carrier layer made of a ceramic and carrier layer with plated through hole
KR102212836B1 (en) * 2020-05-19 2021-02-05 주식회사 코멧네트워크 Method of manufacturing ceramic circuit board
KR102293181B1 (en) 2020-08-27 2021-08-25 주식회사 코멧네트워크 Ceramic circuit board for power module of double-faced cooling, manufacturing method thereof, power module of double-faced cooling with the same
KR102557990B1 (en) 2021-01-28 2023-07-21 주식회사 알엔투세라믹스 Ceramic circuit board with cooling fin for power module of double-faced cooling, manufacturing method thereof, power module of double-faced cooling with the same
KR102492742B1 (en) 2021-08-11 2023-01-31 주식회사 알엔투세라믹스 Trimming method of printed pattern and manufacturing method of ceramic circuit board using the same

Family Cites Families (18)

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JPH06196831A (en) * 1992-12-24 1994-07-15 Tokin Corp Manufacture of conductive pattern for aln substrate
JPH06297680A (en) * 1993-04-19 1994-10-25 Hitachi Ltd Screen printing method and apparatus and electronic circuit
JP3401102B2 (en) 1994-12-21 2003-04-28 株式会社日立製作所 Circuit board and method of manufacturing the same, electronic device package, green sheet
DE19514018C1 (en) * 1995-04-13 1996-11-28 Hoechst Ceram Tec Ag Process for producing a metal-coated, metallized substrate made of aluminum nitride ceramic and metal-coated substrate obtained therewith
JPH1021744A (en) * 1996-06-28 1998-01-23 Mitsuboshi Belting Ltd Copper conductor paste and substrate printed therewith
CA2398613C (en) * 2000-11-30 2006-09-12 Tokuyama Corporation Substrate and production method therefor
JP3683891B2 (en) * 2003-01-31 2005-08-17 Ｔｄｋ株式会社 Method for manufacturing ceramic green sheet and method for manufacturing electronic component using ceramic green sheet
JP4407199B2 (en) * 2003-08-13 2010-02-03 旭硝子株式会社 Crystallized lead-free glass, glass ceramic composition, green sheet and electronic circuit board
JP2005268672A (en) 2004-03-22 2005-09-29 Mitsubishi Electric Corp Substrate
JP5140275B2 (en) * 2004-08-18 2013-02-06 株式会社トクヤマ Ceramic substrate for mounting light emitting element and method for manufacturing the same
KR100727451B1 (en) * 2005-04-26 2007-06-13 주식회사 잉크테크 Metal-based inks
US7388296B2 (en) * 2005-06-09 2008-06-17 Ngk Spark Plug Co., Ltd. Wiring substrate and bonding pad composition
JP2007201346A (en) * 2006-01-30 2007-08-09 Mitsuboshi Belting Ltd Ceramics circuit board and its manufacturing method
JP4291857B2 (en) * 2007-01-24 2009-07-08 三ツ星ベルト株式会社 Copper conductor paste, conductor circuit board and electronic components
TW200911071A (en) * 2007-08-24 2009-03-01 Delta Electronics Inc Ceramic circuit board and manufacturing method thereof
KR101194713B1 (en) * 2007-10-03 2012-10-25 가부시키가이샤후지쿠라 Module, wiring board and module manufacturing method
JP2010027637A (en) * 2008-07-15 2010-02-04 Panasonic Corp Conductor paste, and method of manufacturing ceramic substrate using the same
TW201012332A (en) * 2008-09-10 2010-03-16 United Innovate Techology Corp Multifunctional circuit board structure and manufacturing method thereof

Also Published As

Publication number Publication date
WO2013064531A1 (en) 2013-05-10
TW201340809A (en) 2013-10-01
US9717149B2 (en) 2017-07-25
TWI566657B (en) 2017-01-11
CN103891421A (en) 2014-06-25
BR112014010725A2 (en) 2017-05-02
KR20140095083A (en) 2014-07-31
JP2014532996A (en) 2014-12-08
KR102029901B1 (en) 2019-10-08
RU2014122255A (en) 2015-12-10
CN103891421B (en) 2018-06-22
DE102012219904A1 (en) 2013-05-08
JP6207517B2 (en) 2017-10-04
US20140284087A1 (en) 2014-09-25
EP2774461B1 (en) 2018-09-12
EP2774461A1 (en) 2014-09-10

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