BR112014010607A2 - refreador para reter um dissipador de calor - Google Patents

refreador para reter um dissipador de calor

Info

Publication number
BR112014010607A2
BR112014010607A2 BR112014010607A BR112014010607A BR112014010607A2 BR 112014010607 A2 BR112014010607 A2 BR 112014010607A2 BR 112014010607 A BR112014010607 A BR 112014010607A BR 112014010607 A BR112014010607 A BR 112014010607A BR 112014010607 A2 BR112014010607 A2 BR 112014010607A2
Authority
BR
Brazil
Prior art keywords
heat sink
cooler
component
thermal block
hold
Prior art date
Application number
BR112014010607A
Other languages
English (en)
Inventor
Jay Hunt Mickey
Hoffman Bose William
Original Assignee
Thomson Licensing
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from PCT/US2012/046466 external-priority patent/WO2013009982A1/en
Application filed by Thomson Licensing filed Critical Thomson Licensing
Publication of BR112014010607A2 publication Critical patent/BR112014010607A2/pt

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16M—FRAMES, CASINGS OR BEDS OF ENGINES, MACHINES OR APPARATUS, NOT SPECIFIC TO ENGINES, MACHINES OR APPARATUS PROVIDED FOR ELSEWHERE; STANDS; SUPPORTS
    • F16M13/00—Other supports for positioning apparatus or articles; Means for steadying hand-held apparatus or articles
    • F16M13/02—Other supports for positioning apparatus or articles; Means for steadying hand-held apparatus or articles for supporting on, or attaching to, an object, e.g. tree, gate, window-frame, cycle
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/2049—Pressing means used to urge contact, e.g. springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Abstract

resumo "refreador para reter um dissipador de calor" pelo menos uma implementação proporciona um refreador para um dispositivo eletrônico. o dispositivo eletrônico inclui um quadro de suporte, uma placa de circuito integrado acoplada ao quadro de suporte e tendo pelo menos um componente, um bloco térmico acoplado termicamente ao componente, e um dissipador de calor associado com o bloco térmico. o refreador inclui uma parte geralmente plana, adaptada para ser posicionada sobre uma superfície do dissipador de calor. o refreador também inclui várias estruturas conectáveis se estendendo angularmente da parte geralmente plana. as estruturas conectáveis são configuradas para acoplamento com o quadro de suporte, para fazer com que o refreador aplique a força de impulsão, para reter o bloco térmico contra pelo menos um do dissipador de calor ou do componente, quando o dissipador de calor e o bloco térmico são posicionados entre o refreador e o quadro de suporte. um processo é também proporcionado para fixação do refreador.
BR112014010607A 2011-11-21 2012-11-21 refreador para reter um dissipador de calor BR112014010607A2 (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161562127P 2011-11-21 2011-11-21
PCT/US2012/046466 WO2013009982A1 (en) 2011-07-14 2012-07-12 Set top box having snap-in heat sink and smart card reader with a hold down for retaining the heat sink
PCT/US2012/066175 WO2013078260A1 (en) 2011-11-21 2012-11-21 Hold down for retaining a heat sink

Publications (1)

Publication Number Publication Date
BR112014010607A2 true BR112014010607A2 (pt) 2017-04-25

Family

ID=48470275

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112014010607A BR112014010607A2 (pt) 2011-11-21 2012-11-21 refreador para reter um dissipador de calor

Country Status (7)

Country Link
US (1) US9907208B2 (pt)
EP (1) EP2783557B1 (pt)
JP (1) JP2015504240A (pt)
KR (1) KR20140097187A (pt)
CN (1) CN103988591B (pt)
BR (1) BR112014010607A2 (pt)
WO (1) WO2013078260A1 (pt)

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Also Published As

Publication number Publication date
EP2783557B1 (en) 2020-03-18
CN103988591A (zh) 2014-08-13
US20140321064A1 (en) 2014-10-30
JP2015504240A (ja) 2015-02-05
EP2783557A1 (en) 2014-10-01
WO2013078260A1 (en) 2013-05-30
US9907208B2 (en) 2018-02-27
CN103988591B (zh) 2016-08-24
KR20140097187A (ko) 2014-08-06

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Legal Events

Date Code Title Description
B06F Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]
B25G Requested change of headquarter approved

Owner name: THOMSON LICENSING (FR)

B25A Requested transfer of rights approved

Owner name: INTERDIGITAL CE PATENT HOLDINGS (FR)

B06U Preliminary requirement: requests with searches performed by other patent offices: procedure suspended [chapter 6.21 patent gazette]
B07A Application suspended after technical examination (opinion) [chapter 7.1 patent gazette]
B09B Patent application refused [chapter 9.2 patent gazette]
B350 Update of information on the portal [chapter 15.35 patent gazette]
B09B Patent application refused [chapter 9.2 patent gazette]

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