BR0211381A - Estabelecimento de contato de chips semicondutores em cartões de chips - Google Patents

Estabelecimento de contato de chips semicondutores em cartões de chips

Info

Publication number
BR0211381A
BR0211381A BR0211381-3A BR0211381A BR0211381A BR 0211381 A BR0211381 A BR 0211381A BR 0211381 A BR0211381 A BR 0211381A BR 0211381 A BR0211381 A BR 0211381A
Authority
BR
Brazil
Prior art keywords
contact
chip
conductors
semiconductor chips
semiconductor chip
Prior art date
Application number
BR0211381-3A
Other languages
English (en)
Inventor
Erik Heinemann
Frank Pueschner
Original Assignee
Infineon Technologies Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies Ag filed Critical Infineon Technologies Ag
Publication of BR0211381A publication Critical patent/BR0211381A/pt

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01067—Holmium [Ho]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01068—Erbium [Er]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Credit Cards Or The Like (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

"ESTABELECIMENTO DE CONTATO DE CHIPS SEMICONDUTORES EM CARTõES DE CHIPS". A presente invenção refere-se a um cartão de chip com um corpo de cartão de chip (1), um chip semicondutor (3) e um substrato de suporte (2), onde o substrato de suporte (2) está provido nos dois lados (11, 12) com superfícies de contato (4, 5) e, entre elas, é provido com condutores de perfuração de contato (vias) (6) que ligam as superfícies de contato superiores e inferiores eletricamente entre si. Como as condutores de perfuração de contato (6) apresentam o interior oco, pode penetrar umidade do ar através dos espaços ocos para o interior (20) do cartão de chip e prejudicar o chip semicondutor no caso em que as condutores de perfuração de contato (6) não forem cobertas. A fabricação de condutores de perfuração de contato (6) cobertas é, porém, dispendiosa. De acordo com a invenção, é proposto dispor as condutores de perfuração de contato (6) tão próximas do bordo do substrato de suporte (2) que as suas extremidades inferiores desembocam na base de uma cavidade externa (10) e ali são fechadas. Com isso, é evitada uma penetração de umidade na cavidade interna (20) na qual se encontra o chip semicondutor (3), sem haver necessidade de uma cobertura própria das condutores de perfuração de contato (6) na fabricação.
BR0211381-3A 2001-08-10 2002-08-09 Estabelecimento de contato de chips semicondutores em cartões de chips BR0211381A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10139395A DE10139395A1 (de) 2001-08-10 2001-08-10 Kontaktierung von Halbleiterchips in Chipkarten
PCT/DE2002/002935 WO2003017196A1 (de) 2001-08-10 2002-08-09 Kontaktierung von halbleiterchips in chipkarten

Publications (1)

Publication Number Publication Date
BR0211381A true BR0211381A (pt) 2004-08-17

Family

ID=7695072

Family Applications (1)

Application Number Title Priority Date Filing Date
BR0211381-3A BR0211381A (pt) 2001-08-10 2002-08-09 Estabelecimento de contato de chips semicondutores em cartões de chips

Country Status (13)

Country Link
US (1) US7019981B2 (pt)
EP (1) EP1415271B1 (pt)
JP (1) JP3896115B2 (pt)
KR (1) KR100549177B1 (pt)
AT (1) ATE308084T1 (pt)
BR (1) BR0211381A (pt)
CA (1) CA2453156A1 (pt)
DE (2) DE10139395A1 (pt)
MX (1) MXPA04001225A (pt)
RU (1) RU2265886C1 (pt)
TW (1) TWI222200B (pt)
UA (1) UA75424C2 (pt)
WO (1) WO2003017196A1 (pt)

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DE10311965A1 (de) * 2003-03-18 2004-10-14 Infineon Technologies Ag Flip-Chip Anordnung auf einem Substratträger
DE10311964A1 (de) * 2003-03-18 2004-10-07 Infineon Technologies Ag Chipmodul und Herstellungsverfahren
US7205649B2 (en) * 2003-06-30 2007-04-17 Intel Corporation Ball grid array copper balancing
JP4066929B2 (ja) * 2003-10-08 2008-03-26 株式会社日立製作所 電子装置及びその製造方法
DE102004010715B4 (de) * 2004-03-04 2009-10-01 Infineon Technologies Ag Chipkarte zur kontaktlosen Datenübertragung sowie Verfahren zum Herstellen einer Chipkarte zur kontaktlosen Datenübertragung
DE102004025911B4 (de) * 2004-05-27 2008-07-31 Infineon Technologies Ag Kontaktbehaftete Chipkarte, Verfahren zur Herstellung einer solchen
DE102005061553B4 (de) * 2005-12-22 2013-07-11 Infineon Technologies Ag Chipmodul
DE102006008937B4 (de) 2006-02-27 2019-02-28 Infineon Technologies Ag Chipkartenmodul
US8837159B1 (en) * 2009-10-28 2014-09-16 Amazon Technologies, Inc. Low-profile circuit board assembly
US20120009973A1 (en) * 2010-07-12 2012-01-12 Sony Ericsson Mobile Communications Ab Module Connection in a Printed Wiring Board
EP2463809A1 (fr) 2010-12-07 2012-06-13 NagraID S.A. Carte électronique à contact électrique comprenant une unité électronique et/ou une antenne
US8476115B2 (en) * 2011-05-03 2013-07-02 Stats Chippac, Ltd. Semiconductor device and method of mounting cover to semiconductor die and interposer with adhesive material
US8649820B2 (en) 2011-11-07 2014-02-11 Blackberry Limited Universal integrated circuit card apparatus and related methods
USD703208S1 (en) 2012-04-13 2014-04-22 Blackberry Limited UICC apparatus
US8936199B2 (en) 2012-04-13 2015-01-20 Blackberry Limited UICC apparatus and related methods
USD701864S1 (en) 2012-04-23 2014-04-01 Blackberry Limited UICC apparatus
CA2873503A1 (fr) 2012-05-16 2013-11-21 Francois Droz Process for the production of an electronic card having an external connector and such an external connector
US8991711B2 (en) 2012-07-19 2015-03-31 Infineon Technologies Ag Chip card module
USD758372S1 (en) * 2013-03-13 2016-06-07 Nagrastar Llc Smart card interface
USD729808S1 (en) 2013-03-13 2015-05-19 Nagrastar Llc Smart card interface
USD759022S1 (en) * 2013-03-13 2016-06-14 Nagrastar Llc Smart card interface
US9647997B2 (en) 2013-03-13 2017-05-09 Nagrastar, Llc USB interface for performing transport I/O
US9888283B2 (en) 2013-03-13 2018-02-06 Nagrastar Llc Systems and methods for performing transport I/O
CN104102941B (zh) * 2013-04-11 2023-10-13 德昌电机(深圳)有限公司 智能卡、身份识别卡、银行卡、智能卡触板及表面抗氧化方法
CN105684000B (zh) * 2013-10-22 2019-03-15 凸版印刷株式会社 Ic模块以及ic卡、ic模块基板
DE102014005142A1 (de) * 2014-04-07 2015-10-08 Giesecke & Devrient Gmbh Chipmodul mit Umverdrahtungsschicht
USD780763S1 (en) 2015-03-20 2017-03-07 Nagrastar Llc Smart card interface
USD864968S1 (en) 2015-04-30 2019-10-29 Echostar Technologies L.L.C. Smart card interface
WO2016197935A1 (zh) * 2015-06-11 2016-12-15 飞天诚信科技股份有限公司 一种智能卡及其制造方法
US20230245993A1 (en) * 2022-02-03 2023-08-03 Ciena Corporation Enhanced Thermal Control of a Hybrid Chip Assembly

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Also Published As

Publication number Publication date
CA2453156A1 (en) 2003-02-27
RU2004107125A (ru) 2005-10-10
KR100549177B1 (ko) 2006-02-03
JP3896115B2 (ja) 2007-03-22
DE50204698D1 (de) 2005-12-01
KR20040024881A (ko) 2004-03-22
US20040150962A1 (en) 2004-08-05
UA75424C2 (en) 2006-04-17
TWI222200B (en) 2004-10-11
EP1415271B1 (de) 2005-10-26
MXPA04001225A (es) 2004-06-03
US7019981B2 (en) 2006-03-28
RU2265886C1 (ru) 2005-12-10
ATE308084T1 (de) 2005-11-15
JP2004538588A (ja) 2004-12-24
EP1415271A1 (de) 2004-05-06
WO2003017196A1 (de) 2003-02-27
DE10139395A1 (de) 2003-03-06

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Legal Events

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B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE A 6A,7A E 8A ANUIDADES.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: REFERENTE AO DESPACHO 8.6 DA RPI 2060 DE 29/06/2010.