WO2016197935A1 - 一种智能卡及其制造方法 - Google Patents

一种智能卡及其制造方法 Download PDF

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Publication number
WO2016197935A1
WO2016197935A1 PCT/CN2016/085201 CN2016085201W WO2016197935A1 WO 2016197935 A1 WO2016197935 A1 WO 2016197935A1 CN 2016085201 W CN2016085201 W CN 2016085201W WO 2016197935 A1 WO2016197935 A1 WO 2016197935A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
security chip
module
pads
pad
Prior art date
Application number
PCT/CN2016/085201
Other languages
English (en)
French (fr)
Inventor
陆舟
于华章
Original Assignee
飞天诚信科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201510319241.7A external-priority patent/CN104866895A/zh
Priority claimed from CN201510317641.4A external-priority patent/CN104881701B/zh
Application filed by 飞天诚信科技股份有限公司 filed Critical 飞天诚信科技股份有限公司
Priority to US15/577,399 priority Critical patent/US10275699B2/en
Publication of WO2016197935A1 publication Critical patent/WO2016197935A1/zh

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/0723—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts

Definitions

  • the invention relates to a smart card and a manufacturing method thereof, and belongs to the field of electronic technology.
  • the smart card encrypts and decrypts data through its internal security chip, and interacts with the card reader terminal through the contacts on the card surface.
  • the above contacts are usually soldered to the main circuit board in the smart card, and each contact is connected to the security chip through a wire on the main circuit board.
  • the point and security chip are usually integrated into the security chip module, and the security chip module is soldered to the main board of the smart card.
  • the main circuit board in the smart card Since the position of each contact is usually fixed, the main circuit board in the smart card must reserve a fixed pad position for each contact, thus causing a great limitation on the wiring of the main circuit board, and the welding process is proposed. A higher requirement.
  • a method of manufacturing a smart card comprising the steps of:
  • Assembling the security chip onto the module circuit board to obtain a security chip module wherein one layer of the module circuit board is provided with a plurality of mutually insulated contacts; the solder ball is implanted on the security chip pad of the main circuit board, according to a position of the security chip pad in the main circuit board, a groove is milled on the substrate filled with the main circuit board, so that the solder ball on the safety chip pad is visible at the bottom of the groove;
  • the security chip module is filled into the recess and the security chip module is assembled to the main circuit board through a solder ball on the security chip pad.
  • the module circuit board is provided with a plurality of internal pads
  • the security chip is assembled on the module circuit board to obtain a security chip module, specifically:
  • the security chip is assembled to the module circuit board by a cooperation between a pin of the security chip and an internal pad on the module circuit board to obtain the security chip module.
  • the security chip is assembled to the module circuit board by a cooperation between a pin of the security chip and an internal pad on the module circuit board to obtain the security chip module, specifically :
  • the disk is aligned such that the security chip is soldered to the module circuit board, and a security chip module composed of the security chip and the module circuit board is obtained, wherein different pins of the security chip respectively correspond to Different internal pads.
  • the security chip is assembled to the module circuit board by a cooperation between a pin of the security chip and an internal pad on the module circuit board to obtain the security chip module, specifically :
  • a security chip module composed of a module circuit board, wherein different pins of the security chip respectively correspond to different internal pads.
  • each contact on the module circuit board is respectively connected to a corresponding internal pad on the module circuit board through a via hole in the module circuit board, and different contacts respectively correspond to different internal pads .
  • the module circuit board is provided with a plurality of external pads, each of which is respectively connected to its corresponding external pad, and different internal pads respectively correspond to different external pads;
  • the security chip module is assembled to the main circuit board by a fit between a solder ball on the security chip pad and an external pad on the module circuit board.
  • the security chip module is assembled to the main circuit board by a cooperation between a solder ball on the security chip pad and an external pad on the module circuit board, specifically:
  • soldering paste on each of the external pads on the module circuit board and/or the respective solder balls at the bottom of the groove, and each external pad on the module circuit board and the bottom of the groove The cross-section of the corresponding solder balls is aligned such that the security chip modules are soldered to the main circuit board, wherein different outer pads respectively correspond to different solder balls.
  • the security chip module is assembled to the main circuit board by a cooperation between a solder ball on the security chip pad and an external pad on the module circuit board, specifically:
  • each contact on the module circuit board is respectively connected to a corresponding external pad through a via hole in the module circuit board, and different contacts respectively correspond to different external pads.
  • the contacts are disposed on a top layer of the module circuit board.
  • the number of the security chip pads is the same as the number of external pads connected to the internal pads on the module circuit board, and the respective security chip pads are insulated from each other.
  • a groove is milled on the substrate filled with the main circuit board, so that the solder ball on the security chip pad is in the groove Visible at the bottom, specifically:
  • the groove is milled on the substrate filled with the main circuit board for the solder ball on the security chip pad in the main circuit board, the groove
  • the bottom portion includes a section through which the solder balls on the security chip pad are milled.
  • the depths of the grooves are the same everywhere;
  • the security chip module is assembled to the main circuit board by a cooperation between a solder ball on the security chip pad and an external pad on the module circuit board, specifically:
  • Anisotropic conductive paste is coated on each of the external pads of the module circuit board and/or the respective solder balls at the bottom of the groove, and each external pad on the module circuit board is respectively The cross-section of the corresponding solder balls at the bottom of the groove is aligned such that the security chip module is bonded to the main circuit board, wherein different outer pads respectively correspond to different solder balls.
  • the depth of the central portion of the groove is greater than the depth of the edge portion, the cross section of the groove is stepped, and the horizontal bottom area of the central portion of the groove is smaller than the module circuit in the security chip module The bottom area of the board;
  • the security chip module is assembled to the main circuit board by a cooperation between a solder ball on the security chip pad and an external pad on the module circuit board, specifically:
  • soldering a solder paste on a cross section of each of the external pads on the module circuit board and/or the respective solder balls at the bottom of the recess, and the module circuit board in the security chip module and the edge portion of the recess Cooperating, soldering the security chip module to the main circuit board according to a manner in which each external pad on the module circuit board is aligned with a corresponding cross section of the solder ball at the bottom of the groove, wherein different The outer pads correspond to different solder balls; or,
  • Anisotropic conductive paste is coated on each of the external pads of the module circuit board and/or the respective solder balls at the bottom of the groove, and the module circuit board in the security chip module is recessed
  • the edge portions of the slots are mated to align the respective outer pads on the module circuit board with the cross-sections of the solder balls corresponding to the bottoms of the recesses, such that the security chip modules are bonded to the main circuit board Among them, different external pads correspond to different solder balls.
  • a depth of a central portion of the groove is greater than a depth of the edge portion, the groove has a stepped shape, and a central portion of the groove matches a security chip in the security chip module;
  • the security chip module is assembled to the main circuit board by a cooperation between a solder ball on the security chip pad and an external pad on the module circuit board, specifically:
  • solder paste on a cross section of each of the external pads on the module circuit board and/or the respective solder balls at the bottom of the recess, and matching the security chip in the security chip module with the central portion of the recess Soldering the security chip module to the main circuit board according to the respective outer pads of the module circuit board being aligned with the cross sections of the corresponding solder balls at the bottom of the groove, wherein different The external pads correspond to different solder balls; or,
  • Anisotropic conductive paste is coated on each of the external pads of the module circuit board and/or the respective solder balls at the bottom of the groove, and the security chip and the groove in the security chip module are coated
  • the central portion cooperates to align each of the external pads on the module circuit board with the cross section of the corresponding solder ball at the bottom of the groove, so that the security chip module is bonded to the main circuit board.
  • different external pads correspond to different solder balls.
  • the depth of the central portion of the groove is greater than the depth of the edge portion, the cross section of the groove is stepped, and the central portion of the groove matches the security chip in the security chip module;
  • the bottom of the groove also has a plurality of pits, the number of the pits being the same as the number of security chip pads in the main circuit board, and the bottom of each pit includes the safety chip pad.
  • the cross section of the solder ball is milled, and the horizontal bottom area of each pit is not less than the area of the outer pad on the module circuit board;
  • the security chip module is assembled to the main circuit board by a cooperation between a solder ball on the security chip pad and an external pad on the module circuit board, specifically:
  • a smart card including a substrate and a main circuit board filled in the substrate, wherein the safety chip pad in the main circuit board is coated with a solder ball, in the substrate a groove corresponding to the position of the security chip pad, the solder ball on the security chip pad is in the The bottom of the groove is visible; the groove is filled with a security chip module, and the security chip module is mounted on the main circuit board through a solder ball on the security chip pad; the security chip module includes a module circuit And a security chip mounted on the module circuit board, wherein one of the module circuit boards is provided with a plurality of mutually insulated contacts.
  • the module circuit board is provided with a plurality of internal pads
  • the security chip is mounted on the module circuit board by a cooperation between its own pins and internal pads on the module circuit board.
  • each pin of the security chip respectively passes through a solder ball implanted by itself and/or a solder ball implanted on an internal pad on the module circuit board, and corresponding internal soldering on the module circuit board Disk bonding, wherein different pins of the security chip respectively correspond to different internal pads.
  • each pin of the security chip respectively passes through a conductive paste coated by itself and/or a conductive paste coated on an internal pad on the module circuit board, corresponding to the module circuit board.
  • Internal pad bonding wherein different pins of the security chip respectively correspond to different internal pads.
  • each contact on the module circuit board is respectively connected to a corresponding internal pad on the module circuit board through a via hole in the module circuit board, and different contacts respectively correspond to different internal pads .
  • the module circuit board is provided with a plurality of external pads, each of which is respectively connected to its corresponding external pad, and different internal pads respectively correspond to different external pads;
  • the security chip module The main circuit board is mounted by a fit between a solder ball on the security chip pad and an external pad on the module circuit board.
  • each external pad on the module circuit board passes through a solder paste on itself and/or a solder paste on a cross section of each solder ball at the bottom of the groove, respectively, and a corresponding solder ball at the bottom of the groove Cross-section soldering in which different external pads correspond to different solder balls.
  • each external pad on the module circuit board passes through a conductive paste on itself and/or a conductive paste on a cross section of each solder ball at the bottom of the groove, respectively, and a corresponding solder ball at the bottom of the groove.
  • Cross-section bonding in which different external pads correspond to different solder balls.
  • each contact on the module circuit board is respectively connected to a corresponding external pad through a via hole in the module circuit board, and different contacts respectively correspond to different external pads.
  • the contacts are disposed on a top layer of the module circuit board.
  • the number of the security chip pads is the same as the number of external pads connected to the internal pads on the module circuit board, and the respective security chip pads are insulated from each other.
  • the recess is matched to the volume and structure of the security chip module, the bottom of the recess containing a cross section of the solder ball on the security chip pad being milled out.
  • each external pad on the module circuit board passes through an anisotropic conductive paste on itself and/or a cross section of each solder ball at the bottom of the groove
  • the anisotropic conductive paste is respectively bonded to the cross section of the corresponding solder ball at the bottom of the groove, wherein different external pads respectively correspond to different solder balls.
  • the depth of the central portion of the groove is greater than the depth of the edge portion, the cross section of the groove is stepped, and the horizontal bottom area of the central portion of the groove is smaller than the module circuit in the security chip module a bottom area of the board; a module circuit board in the security chip module mates with an edge portion of the recess; each external pad on the module circuit board passes an anisotropic conductive paste on itself and/or The anisotropic conductive paste on the cross section of each of the solder balls at the bottom of the groove is respectively bonded to the cross section of the corresponding solder ball at the bottom of the groove, wherein different external pads respectively correspond to different solder balls.
  • the depth of the central portion of the groove is greater than the depth of the edge portion, the cross section of the groove is stepped, and the central portion of the groove matches the security chip in the security chip module; a security chip in the security chip module mates with a central portion of the recess; each external pad on the module circuit board passes through an anisotropic conductive paste on itself and/or a respective solder ball at the bottom of the recess
  • the anisotropic conductive paste on the cross section is respectively bonded to the cross section of the corresponding solder ball at the bottom of the groove, wherein different outer pads respectively correspond to different solder balls.
  • the depth of the central portion of the groove is greater than the depth of the edge portion, the cross section of the groove is stepped, and the central portion of the groove matches the security chip in the security chip module;
  • the bottom of the groove also has a plurality of pits, the number of the pits being the same as the number of security chip pads in the main circuit board, and the bottom of each pit includes the safety chip pad a cross section of the solder ball that is milled, and a horizontal bottom area of each pit is not less than an area of an outer pad on the module circuit board; a security chip in the security chip module and a central portion of the recess
  • each of the external pads on the module circuit board is respectively aligned with the cross section of the solder ball at the bottom of the corresponding pit.
  • a method of manufacturing a smart card comprising the steps of:
  • a contact module is filled into the recess and the contact module is assembled to the main circuit board through a solder ball on a pad in the second predetermined area.
  • the security chip is flip-chip bonded into the first preset area of the main circuit board, specifically:
  • the security chip is bonded to the first predetermined area of the main circuit board using a conductive paste.
  • a plurality of pads are disposed in the first preset area of the main circuit board, the number of pads in the first preset area is the same as the number of pins of the security chip, and the number Each of the pads in a predetermined area is insulated from each other;
  • Corresponding pads in the first predetermined area are aligned such that the security chip is soldered into the first predetermined area of the main circuit board, wherein different pins of the security chip respectively correspond to the first pre- Set different pads in the area.
  • a plurality of pads are disposed in the first preset area of the main circuit board, the number of pads in the first preset area is the same as the number of pins of the security chip, and the number Each of the pads in a predetermined area is insulated from each other;
  • a conductive adhesive specifically:
  • each of the pads in the first predetermined area is respectively connected to a corresponding pad in the second preset area by a wire on the main circuit board, and the first preset area is different.
  • the pads respectively correspond to different pads in the second predetermined area, and the pads in the second preset area are insulated from each other.
  • the method further includes:
  • An adhesive is applied to the surface on which the groove is placed, and the adhesive is smoothed.
  • the groove is milled on the substrate according to the position of the pad in the second preset area, so that the solder ball on the pad in the second preset area is at the bottom of the groove Visible, specifically:
  • a groove is milled on the substrate for the solder ball on the pad in the second predetermined area, and the bottom of the groove includes the second pre- Set the cross section of the solder balls on the pads in the area to be milled out.
  • the contact module comprises a plurality of mutually insulated contacts and pins corresponding to the respective contacts, the number of pins in the contact module and the number of pads in the second predetermined area the same;
  • a solder ball is implanted on a pin of the contact module, and each pin of the contact module is respectively aligned with a solder ball on a corresponding pad in the second predetermined area through a solder ball. Filling the contact module into the recess such that the contact module is soldered to the main circuit board, wherein different pins of the contact module respectively correspond to the second preset area Different pads.
  • the contact module comprises a plurality of mutually insulated contacts and pins corresponding to the respective contacts, the number of pins in the contact module and the number of pads in the second predetermined area the same;
  • the contact module is pressurized and heated to cure the conductive paste adhered to the contact module.
  • the contact module is heated by pressure, specifically:
  • the contact module is placed in the recess by a placement machine with a predetermined pressure and the contact module is heated.
  • the depths of the grooves are the same everywhere, and the conductive paste is an anisotropic conductive paste.
  • the bottom of the groove has a plurality of pits, the number of the pits is the same as the number of pads in the second preset area, and the bottom of each pit includes the second preset a section of the solder ball on the pad in the area is milled, and the horizontal bottom area of each pit is not less than the area of the corresponding pin in the contact module;
  • a smart card includes a substrate and a main circuit board filled in the substrate, and the first predetermined area of the main circuit board is flip-chip bonded with a security chip.
  • a plurality of pads in the second predetermined area of the main circuit board are implanted with solder balls, and the substrate has a groove at a position corresponding to the pads in the second predetermined area, the second A solder ball on the pad in the predetermined area is visible at the bottom of the groove; the groove is filled with a contact module, and the contact module passes through the tin on the pad in the second predetermined area
  • the ball is mounted on the main circuit board.
  • the security chip is soldered in a first predetermined area of the main circuit board;
  • the security chip is bonded to the first predetermined area of the main circuit board by a conductive adhesive.
  • a plurality of pads are disposed in the first preset area of the main circuit board, the number of pads in the first preset area is the same as the number of pins of the security chip, and the number Each of the pads in a predetermined area is insulated from each other;
  • Each of the pins of the security chip respectively passes through a solder ball implanted by itself and/or a solder ball implanted on a corresponding pad in the first predetermined area, and the corresponding solder in the first predetermined area Disk bonding, wherein different pins of the security chip respectively correspond to different pads in the first predetermined area.
  • a plurality of pads are disposed in the first preset area of the main circuit board, the number of pads in the first preset area is the same as the number of pins of the security chip, and the number Each of the pads in a predetermined area is insulated from each other;
  • Each of the pins of the security chip respectively passes through the conductive paste coated by itself and/or the conductive paste coated on the corresponding pad in the first predetermined area, and the first preset area Corresponding pad bonding, wherein different pins of the security chip respectively correspond to different pads in the first preset area.
  • each of the pads in the first predetermined area is respectively connected to a corresponding pad in the second preset area by a wire on the main circuit board, and the first preset area is different.
  • the pads respectively correspond to different pads in the second predetermined area, and the pads in the second preset area are insulated from each other.
  • the surface on which the substrate is grooved is coated with an adhesive.
  • the groove matches the volume and structure of the contact module, and the bottom of the groove includes a section in which the solder balls on the pads in the second predetermined area are milled.
  • the contact module comprises a plurality of mutually insulated contacts and pins corresponding to the respective contacts, the number of pins in the contact module and the number of pads in the second predetermined area a solder ball is implanted on the pin of the contact module, and each pin of the contact module is soldered to a solder ball on a corresponding pad in the second predetermined area by a solder ball, wherein The different pins of the contact module respectively correspond to different pads in the second preset area.
  • the contact module comprises a plurality of mutually insulated contacts and pins corresponding to the respective contacts, the number of pins in the contact module and the number of pads in the second predetermined area the same;
  • Each of the pins of the contact module passes through a conductive paste coated by itself and/or a conductive paste coated on a solder ball on a corresponding pad in the second predetermined area, and the second The solder balls on the corresponding pads in the preset area are bonded, wherein different pins of the contact module respectively correspond to different pads in the second preset area.
  • the depths of the grooves are the same everywhere, and the conductive paste is an anisotropic conductive paste.
  • the bottom of the groove has a plurality of pits, the number of the pits is the same as the number of pads in the second preset area, and the bottom of each pit includes the second preset a section of the solder ball on the pad in the area is milled, and the horizontal bottom area of each pit is not less than the area of the corresponding pin in the contact module;
  • Each of the pins of the contact module respectively passes through the conductive paste coated by itself and/or the conductive paste coated on the cross section of the solder ball at the bottom of the corresponding pit, and the cross section of the solder ball at the bottom of the corresponding pit Bonding, wherein different pins of the contact module respectively correspond to different pits.
  • the invention assembles the contact module and the security chip to the main circuit board respectively, and can extend the electronic circuit level of the contact module and the security chip, thereby improving the scalability of the smart card.
  • the invention assembles the security chip to the module circuit board provided with a plurality of contacts, and assembles the obtained security chip module as a whole to the main circuit board, thereby reducing the contact of the contacts on the surface of the smart card to the main circuit board. Limitations, which in turn improve the wiring quality of the main board.
  • FIG. 1 is a flowchart of a method for manufacturing a smart card according to an embodiment of the present invention
  • FIG. 2 is a top plan view of a module circuit board in an embodiment of the present invention.
  • FIG. 3 is a bottom view of a module circuit board in an embodiment of the present invention.
  • FIG. 4 is a cross-sectional view of a module circuit board in an embodiment of the present invention.
  • FIG. 5 is a bottom view of a security chip module in an embodiment of the present invention.
  • FIG. 6 is a cross-sectional view of a security chip module in an embodiment of the present invention.
  • FIG. 7 is another cross-sectional view of a security chip module in an embodiment of the present invention.
  • FIG. 8 is still another cross-sectional view of the security chip module in the embodiment of the present invention.
  • FIG. 9 is a schematic structural diagram of a main circuit board according to an embodiment of the present invention.
  • FIG. 10 is a schematic structural diagram of an electronic component according to an embodiment of the present invention.
  • FIG. 11 is a schematic structural view of a substrate according to an embodiment of the present invention.
  • FIG. 12 is a top plan view of a substrate filled with an electronic component in an embodiment of the present invention.
  • Figure 13 is a cross-sectional view showing a substrate filled with an electronic component in an embodiment of the present invention.
  • Figure 14 is a top plan view of a substrate after milling a groove according to an embodiment of the present invention.
  • Figure 15 is a cross-sectional view showing a substrate after milling a groove in an embodiment of the present invention.
  • Figure 16 is a top plan view of another substrate after milling the groove in the embodiment of the present invention.
  • Figure 17 is a cross-sectional view showing another substrate after milling the groove in the embodiment of the present invention.
  • Figure 18 is a top plan view of another substrate after milling the groove in the embodiment of the present invention.
  • Figure 19 is a cross-sectional view showing still another substrate after milling the groove in the embodiment of the present invention.
  • Figure 20 is a top plan view of a substrate after another milling in the embodiment of the present invention.
  • Figure 21 is a cross-sectional view showing another substrate after milling the groove in the embodiment of the present invention.
  • FIG. 22 is a schematic diagram of welding of a main circuit board and a security chip module according to an embodiment of the present invention.
  • FIG. 23 is a schematic diagram of bonding of a main circuit board and a security chip module according to an embodiment of the present invention.
  • 24 is a schematic diagram of welding of another main circuit board and a security chip module according to an embodiment of the present invention.
  • 25 is a schematic diagram of bonding of another main circuit board and a security chip module according to an embodiment of the present invention.
  • 26 is a schematic diagram of welding of another main circuit board and a security chip module according to an embodiment of the present invention.
  • FIG. 27 is a schematic diagram of bonding of another main circuit board and a security chip module according to an embodiment of the present invention.
  • FIG. 29 is a schematic structural diagram of a smart card in an embodiment of the present invention.
  • FIG. 30 is a flowchart of a method for manufacturing a smart card according to an embodiment of the present invention.
  • Figure 31 is a schematic view showing a pad on a main circuit board in an embodiment of the present invention.
  • 32 is a top plan view of a security chip and a main circuit board in an embodiment of the present invention.
  • Figure 33 is a cross-sectional view showing a security chip and a main circuit board in an embodiment of the present invention.
  • Figure 34 is another cross-sectional view showing the security chip and the main circuit board in the embodiment of the present invention.
  • Figure 35 is a cross-sectional view showing still another aspect of the security chip and the main circuit board in the embodiment of the present invention.
  • 36 is a schematic diagram of an electronic component in an embodiment of the present invention.
  • FIG. 37 is a schematic view of a substrate in an embodiment of the present invention.
  • FIG. 38 is a top plan view of a substrate filled with an electronic component in an embodiment of the present invention.
  • Figure 39 is a cross-sectional view showing a substrate filled with an electronic component in an embodiment of the present invention.
  • Figure 40 is a top plan view of a smart card after milling the slot in the embodiment of the present invention.
  • Figure 41 is a cross-sectional view showing a smart card after milling the slot in the embodiment of the present invention.
  • Figure 42 is a top plan view of another smart card after milling the slot in the embodiment of the present invention.
  • Figure 43 is a cross-sectional view showing another smart card after milling the slot in the embodiment of the present invention.
  • Figure 44 is a top plan view of the contact module in the embodiment of the present invention.
  • Figure 45 is a cross-sectional view showing a contact module in an embodiment of the present invention.
  • FIG. 46 is a schematic diagram of a contact module and a main circuit board according to an embodiment of the present invention.
  • 47 is a schematic diagram of another contact module and a main circuit board according to an embodiment of the present invention.
  • FIG. 48 is a schematic diagram of still another contact module and a main circuit board according to an embodiment of the present invention.
  • 49 is a schematic diagram of still another contact module and a main circuit board according to an embodiment of the present invention.
  • Figure 50 is a schematic diagram of a smart card manufactured in an embodiment of the present invention.
  • the embodiment of the invention provides a method for manufacturing a smart card. As shown in FIG. 1 , the method includes the following steps:
  • step 101 the security chip is assembled on the module circuit board to obtain a security chip module.
  • the security chip can be obtained by fitting a security chip to the module circuit board by a cooperation between a pin of the security chip and an internal pad on the module circuit board.
  • the module circuit board is provided with a plurality of internal pads and a plurality of external pads, each of which is respectively connected to its corresponding external pad, and different internal pads respectively correspond to different external pads.
  • the security chip can be soldered to the module circuit board to obtain the security chip module; the security chip can also be bonded to the module circuit board by using the conductive glue to obtain the security chip module.
  • the conductive adhesive may be an anisotropic conductive adhesive or an isotropic conductive adhesive;
  • the module circuit board 210 is a double-sided PCB or a multilayer PCB, as shown in FIG. 2, FIG. 3 and FIG. 4, the module circuit board 210
  • One of the layers is provided with a plurality of mutually insulated contacts 220, and the other layer includes a first predetermined area 211.
  • the first predetermined area 211 is provided with a plurality of mutually insulated internal pads 212.
  • a plurality of mutually insulated external pads 213 are disposed on the outer surface of the region 211.
  • the number of the inner pads 212 is the same as the number of the outer pads 213, and is respectively the same as the number of pins of the security chip 230.
  • All of the internal pads 212 and all of the external pads 213 are located in the same layer of the module circuit board 210, and each of the internal pads 212 is connected to the corresponding external pad 213 by the wires of the layer in which it is located, and the different internal pads 212 Corresponding to different external pads 213, respectively.
  • the number and arrangement of the internal pads 212 and the external pads 213 in the module circuit board 210 are not limited to the form shown in FIG. 3, that is, the number of the internal pads 212 and the external pads 213 are at least 5, it can be 5, it can be 6, 7, or even more, and its arrangement can be two rows, or three or more rows, or it can be a circle or a trapezoid. Arrangements such as triangles are within the scope of the present invention.
  • the top layer of the module circuit board 210 is provided with a contact 220, and the bottom layer of the module circuit board 210 includes a first preset area 211.
  • the respective contacts 220 on the module circuit board 210 can be connected to the corresponding internal pads 212 through via holes in the module circuit board 210, respectively, and the different contacts 220 respectively correspond to different internal pads 212; 220 may also be connected to a corresponding external pad 213 on the module circuit board 210 through via holes in the module circuit board 210, and different contacts 220 respectively correspond to different external pads 213.
  • Each contact 220 on the module circuit board 210 is used for communication and data interaction with the card reading device, and may be a component soldered to the module circuit board 210, or may be preset on the module circuit board by copper plating. Pad.
  • the solder balls 240 may be implanted on the pins of the security chip 230 and/or the internal pads 212 on the module circuit board 210.
  • the respective pins of the security chip 230 are respectively passed through the solder balls 240 and the module circuit board 210.
  • the corresponding inner pads 212 are aligned such that the security chip 230 is soldered to the module circuit board 210, resulting in a security chip module consisting of the security chip 230 and the module circuit board 210, as shown in FIGS. 5 and 6, wherein security Different pins of chip 230 respectively Corresponding to different internal pads 212.
  • the conductive paste 260 may also be coated on the pins of the security chip 230 and/or the internal pads 212 on the module circuit board 210.
  • the security chip 230 is subjected to pressure heating to cure the conductive paste 260 bonded to the security chip 230, so that the security chip 230 is bonded to the module circuit board 210, resulting in the security chip 230 and the module circuit board 210.
  • the conductive adhesive 260 may be an anisotropic conductive adhesive or an isotropic conductive adhesive, and the corresponding safety chip module is respectively shown in FIG. 7 and FIG. 8 , wherein different pins of the security chip 230 respectively correspond to different internals. Pad 212.
  • the security chip module obtained by performing this step may be a separate module, or may be included in a security chip carrier tape composed of a plurality of security chip modules, and the foregoing embodiments are all within the protection scope of the present invention. .
  • step 102 a solder ball is implanted on the security chip pad of the main circuit board.
  • the security chip pad 311 is located in the second predetermined area 310 of the main circuit board 300. As shown in FIG. 9, the number of the security chip pads 311 and the external pads connected to the internal pads 212 on the module circuit board 210. The number of 213 is the same, and each of the security chip pads 311 is insulated from each other.
  • step 103 the main circuit board is respectively connected to the display, the button and the battery to obtain an electronic component.
  • buttons 400 may be mounted on the pads of the main circuit board 300, and the main circuit board 300 is respectively connected to the display 500 and the battery 600 through the edge connector 320, and the main circuit board 300 and the security chip module are obtained.
  • the electronic components of display 500, button 400, and battery 600 are shown in FIG.
  • step 104 the electronic component is filled into the slot of the substrate, an adhesive is applied to the surface on which the slot is located, and the adhesive is smoothed.
  • the main circuit board in the electronic component can be filled to the bottom of the slot of the substrate, the adhesive is uniformly applied to the surface on which the slot is formed using an automatic coating device, and the adhesive is used with the flexible roller Smooth out.
  • the structure of the substrate 700 is as shown in FIG. 11 and has a slit 710.
  • step 105 the substrate is coated and laminated.
  • the substrate may be coated with a flexible roller, and the substrate may be subjected to high temperature lamination or intermediate temperature lamination, and top and cross-sectional views thereof are as shown in FIGS. 12 and 13, respectively.
  • the area corresponding to the display in the coated film may be transparent or hollow; the area of the coated film corresponding to the button may be transparent or opaque.
  • Step 106 according to the position of the security chip pad in the main circuit board, the groove is milled on the substrate filled with the main circuit board, so that the solder ball on the security chip pad is visible at the bottom of the groove.
  • the groove 800 may be milled on the substrate filled with the main circuit board 300 for the solder ball 250 on the security chip pad in the main circuit board 300 according to the volume and structure of the security chip module, the groove 800 The bottom portion includes a cross section of the solder ball 250 on the security chip pad 311 that is milled out. Wherein, the maximum depth of the groove 800 is not less than the maximum thickness of the security chip module.
  • the depths of the grooves 800 milled on the substrate are the same, and the top and cross-sectional views are shown in Figures 14 and 15, respectively.
  • the depth of the central portion of the groove 800 milled on the substrate is greater than the depth of the edge portion, the cross section of the groove 800 is stepped, and the horizontal bottom area of the central portion of the groove 800 Less than the bottom area of the module circuit board 210 in the security chip module, the top view and the cross-sectional view are as shown in FIGS. 16 and 17, respectively.
  • the depth of the central portion of the groove 800 milled on the substrate is greater than the depth of the edge portion, the cross section of the groove 800 is stepped, and the central portion of the groove 800 and the security chip module
  • the security chip 230 is matched, and its top view and cross-sectional view are as shown in Figs. 18 and 19, respectively.
  • the horizontal bottom area of the central portion of the recess 800 may be greater than the bottom area of the security chip 230 in the security chip module, or may be equal to the bottom area of the security chip 230 in the security chip module.
  • the bottom of the groove 800 milled on the substrate further has a plurality of pits 270, the number of pits 270 and the main
  • the security chip pads 311 in the circuit board 300 are identical, and the bottom of each pit 270 includes a cross section in which the solder balls 250 on the security chip pads 311 are milled, and the horizontal bottom area of each pit 270 is not
  • the area of the outer pad 213 on the module circuit board 210 is smaller, and its top view and cross-sectional view are as shown in Figs. 20 and 21, respectively.
  • step 107 the security chip module is filled into the recess of the substrate, and the security chip module is assembled to the main circuit board through the solder ball on the security chip pad.
  • the security chip module can be assembled to the main circuit board by the cooperation between the solder balls on the security chip pads and the external pads on the module circuit board.
  • the security chip module may be filled into the recess of the substrate, and the security chip module is soldered to the main circuit board through the solder ball on the security chip pad; or the security chip module may be filled into the substrate.
  • the security chip module is bonded to the main circuit board in the recess and through the solder balls on the security chip pad.
  • a solder paste may be applied on each of the external pads 213 on the module circuit board and/or a cross section of each of the solder balls 250 at the bottom of the recess of the substrate, and each of the external pads 213 on the module circuit board is respectively associated with the substrate.
  • the cross-section of the corresponding solder balls 250 at the bottom of the groove is aligned such that the security chip module is soldered to the main circuit board 300; each of the external pads 213 on the module circuit board and/or the respective tin at the bottom of the groove of the substrate
  • the conductive paste is coated on the cross section of the ball 250, and each of the external pads 213 on the module circuit board is respectively aligned with the cross section of the solder ball 250 corresponding to the bottom of the groove of the substrate, so that the security chip module is bonded to the main circuit board 300. on.
  • the different external pads 213 on the module circuit board respectively correspond to different solder balls 250.
  • the security chip 230 in the security chip module is located between the main circuit board 300 and the module circuit board 210, and is aligned with the security chip pad 311. External pads 213 are all connected to the internal pads 212 of the module circuit board 210;
  • the conductive paste may be an anisotropic conductive paste or an isotropic conductive paste.
  • the outer pads 213 and/or the recesses of the substrate may be on the module circuit board.
  • a solder paste is applied to the cross section of the solder ball 250 corresponding to the bottom of the groove, and the security chip module is soldered to each of the external pads 213 on the module circuit board in alignment with the cross section of each solder ball 250 at the bottom of the groove of the substrate.
  • the main circuit board 300 as shown in FIG.
  • an anisotropic conductive paste 260 may also be coated on each of the external pads 213 on the module circuit board and/or the cross section of each of the solder balls 250 at the bottom of the groove of the substrate, Aligning each of the external pads 213 on the module circuit board with the cross section of the solder ball 250 corresponding to the bottom of the groove of the substrate, respectively, so that the security chip module is bonded to the main circuit board 300, as shown in FIG.
  • the different outer pads 213 on the module board correspond to different solder balls 250, respectively.
  • each of the external pads 213 and/or the substrate on the module circuit board may be A solder paste is applied to the cross section of each of the solder balls 250 at the bottom of the recess, and the module circuit board 210 in the security chip module is matched with the edge portion of the recess, according to the respective external pads 213 on the module circuit board and the recesses of the substrate.
  • the safety chip module is soldered to the main circuit board 300 in a manner in which the cross-corresponding solder balls 250 are aligned in a cross-section, as shown in FIG.
  • the anisotropic conductive paste 260 is coated on the cross section of each of the solder balls 250 at the bottom of the slot, and the module circuit board 210 in the security chip module is matched with the edge portion of the recess, and each external pad 213 on the module circuit board is respectively
  • the cross-section of the corresponding solder balls 250 at the bottom of the bottom of the substrate is aligned such that the security chip module is bonded to the main circuit board 300, as shown in FIG. 25, wherein different external pads 213 on the module circuit board respectively correspond to Different solder balls 250 .
  • the external pads 213 and/or the substrate of the module circuit board may be A solder paste is applied to the cross section of each solder ball 250 at the bottom of the groove, and the security chip 230 in the security chip module is matched with the central portion of the recess, according to each external pad 213 on the module circuit board and the bottom of the groove of the substrate.
  • the security chip module is soldered to the main circuit board 300 in a manner that the cross-section of the corresponding solder balls 250 is aligned, as shown in FIG. 26; and the external pads 213 and/or the grooves of the substrate may also be on the module circuit board.
  • An anisotropic conductive paste 260 is coated on the cross section of each of the solder balls 250 at the bottom, and the security chip 230 in the security chip module is matched with the central portion of the recess, and each external pad 213 on the module circuit board is respectively associated with the substrate.
  • the cross-section of the corresponding solder balls 250 at the bottom of the groove is aligned such that the security chip module is bonded to the main circuit board 300, as shown in FIG. 27, wherein different external pads 213 on the module circuit board respectively correspond to different ones. Tin ball 250.
  • each of the external pads 213 and/or the substrate on the module circuit board may be A solder paste is applied to the cross section of each solder ball 250 at the bottom of the groove, and the security chip 230 in the security chip module is matched with the central portion of the recess, according to each external pad 213 on the module circuit board and the bottom of the groove of the substrate.
  • the security chip module is soldered to the main circuit board 300 in a manner that the cross-section of the corresponding solder balls 250 is aligned; or each of the external pads 213 on the module circuit board and/or the respective solder balls 250 at the bottom of the groove of the substrate
  • the conductive paste 261 is coated on the cross section, and the security chip 230 in the security chip module is matched with the central portion of the groove, and each external pad 213 on the module circuit board is respectively matched with the solder ball 250 corresponding to the bottom of the groove of the substrate.
  • the cross-section is aligned such that the security chip module is bonded to the main circuit board 300 as shown in FIG.
  • the conductive adhesive 261 may be an anisotropic conductive adhesive or an isotropic conductive adhesive.
  • the different external pads 213 on the module circuit board respectively correspond to different solder balls 250.
  • the obtained smart card is as shown in FIG.
  • the security chip is assembled on the module circuit board by the cooperation between the pin of the security chip and the internal pad on the module circuit board, and the security chip module is obtained, and passes through the security chip pad of the main circuit board.
  • the cooperation between the solder ball and the external pad on the module circuit board assembles the security chip module onto the main circuit board. Since the position of the external pad on the module circuit board can be adjusted as needed, the main circuit board The position of the upper security chip pad can also be adjusted according to the wiring requirements, thereby reducing the limitation of the wiring on the surface of the smart card to the main circuit board, thereby improving the wiring quality of the main circuit board.
  • the main circuit board is respectively connected to the display, the button and the battery to obtain an electronic component, and the electronic component is filled into the slot of the substrate; in other embodiments of the present invention, The main circuit board is separately filled into the slots of the substrate, and the object of the invention can also be achieved.
  • the substrate may be subjected to film removal and lamination before the groove is milled on the substrate filled with the main circuit board according to the position of the security chip pad in the main circuit board.
  • Other treatments other than the same can achieve the object of the invention.
  • the embodiment of the present invention further provides a smart card, including a substrate and a main circuit board filled in the substrate, wherein the safety chip pad in the main circuit board is coated with a solder ball, and the substrate is There is a groove at a position corresponding to the security chip pad, and a solder ball on the security chip pad is visible at the bottom of the groove.
  • the recess is filled with a security chip module, and the security chip module is mounted on the main circuit board through a solder ball on the security chip pad; the security chip module includes a module circuit board and is mounted on the module circuit board The security chip has a plurality of mutually insulated contacts disposed on one of the layers of the module circuit board.
  • the above contacts may be disposed on the top layer of the module circuit board.
  • a plurality of internal pads are disposed on the module circuit board, and the security chip is mounted on the module circuit board by the cooperation between the own pins and the internal pads on the module circuit board.
  • the security chip may be soldered on the module circuit board or bonded to the module circuit board by a conductive adhesive.
  • each of the pins of the security chip can be soldered to the corresponding internal pad of the module circuit board through the solder balls implanted on the solder balls and/or the internal pads on the module circuit board.
  • the different pins of the security chip respectively correspond to different internal pads.
  • Each of the pins of the security chip may also be bonded to a corresponding internal pad on the module circuit board by using a conductive paste applied thereto and/or a conductive paste coated on an internal pad on the module circuit board.
  • the different pins of the security chip respectively correspond to different internal pads.
  • Each of the contacts on the module circuit board is respectively connected to a corresponding internal pad on the module circuit board through a via hole in the module circuit board, and different contacts respectively correspond to different internal pads.
  • the module circuit board is further provided with a plurality of external pads, each of which is respectively connected to its corresponding external pad, and different internal pads respectively correspond to different external pads; the security chip module passes the security The cooperation between the solder balls on the chip pads and the external pads on the module board is mounted on the main circuit board.
  • the above security chip module is soldered or bonded to the main circuit board by solder balls on the security chip pad.
  • each external pad on the above-mentioned module circuit board can be soldered to the cross section of the corresponding solder ball at the bottom of the groove by the solder paste on the solder paste and/or the solder paste on the cross section of each solder ball at the bottom of the groove.
  • different external pads correspond to different solder balls.
  • Each of the external pads on the module circuit board may also be bonded to the cross section of the corresponding solder ball at the bottom of the groove by the conductive paste on the surface of the solder ball and/or the conductive paste on the bottom of each of the solder balls at the bottom of the groove, wherein Different external pads correspond to different solder balls.
  • each contact on the module circuit board is respectively connected to a corresponding external pad through a via hole in the module circuit board, and different contacts respectively correspond to different external pads.
  • the number of security chip pads is the same as the number of external pads connected to the internal pads on the module circuit board, and the respective security chip pads are insulated from each other.
  • the recess is matched with the volume and structure of the security chip module, and the bottom of the recess includes a cross section of the solder ball on the security chip pad.
  • each external pad on the above-mentioned module circuit board passes through an anisotropic conductive paste on itself and/or a cross section of each solder ball at the bottom of the groove
  • the anisotropic conductive paste is respectively bonded to the cross section of the corresponding solder ball at the bottom of the groove, wherein different external pads respectively correspond to different solder balls.
  • the depth of the central portion of the groove may be greater than the depth of the edge portion, the cross section of the groove is stepped, and the horizontal bottom area of the central portion of the groove is smaller than the bottom area of the module circuit board in the security chip module;
  • the module circuit board in the security chip module cooperates with the edge portion of the groove; each external pad on the module circuit board passes through the anisotropic conductive glue on itself and/or the cross section of each solder ball at the bottom of the groove
  • the anisotropic conductive paste is respectively bonded to the cross section of the corresponding solder ball at the bottom of the groove, wherein different external pads respectively correspond to different solder balls.
  • the depth of the central portion of the groove may be greater than the depth of the edge portion, the cross section of the groove is stepped, and the central portion of the groove matches the security chip in the security chip module; the security in the security chip module
  • the chip is mated with the central portion of the recess; each external pad on the module circuit board passes through an anisotropic conductive paste on itself and/or an anisotropic conductive paste on a cross section of each solder ball at the bottom of the recess, respectively
  • the cross section of the corresponding solder ball at the bottom of the groove is bonded, wherein different outer pads correspond to different solder balls.
  • the depth of the central portion of the groove is greater than the depth of the edge portion, the cross section of the groove is stepped, and the central portion of the groove matches the security chip in the security chip module;
  • the number of pits and pits is the same as the number of security chip pads in the main board.
  • the bottom of each pit contains the cross section of the solder ball on the security chip pad, and the level of each pit.
  • the bottom area is not less than the area of the external pad on the module circuit board; the security chip in the security chip module cooperates with the central portion of the groove, and the external pads on the module circuit board respectively correspond to the solder balls at the bottom of the corresponding pit
  • the cross section is aligned.
  • the security chip is assembled on the module circuit board by the cooperation between the pin of the security chip and the internal pad on the module circuit board, and the security chip module is obtained, and passes through the security chip pad of the main circuit board.
  • the cooperation between the solder ball and the external pad on the module circuit board assembles the security chip module onto the main circuit board. Since the position of the external pad on the module circuit board can be adjusted as needed, the main circuit board The position of the upper security chip pad can also be adjusted according to the wiring requirements, thereby reducing the limitation of the wiring on the surface of the smart card to the main circuit board, thereby improving the wiring quality of the main circuit board.
  • the embodiment of the invention provides a method for manufacturing a smart card. As shown in FIG. 30, the method includes the following steps:
  • step 101' the security chip is flip-chip bonded into the first predetermined area of the main circuit board.
  • the security chip may be soldered into the first predetermined area of the main circuit board; the conductive chip may also be bonded to the first predetermined area of the main circuit board using conductive adhesive.
  • a plurality of pads are disposed in the first preset area 110' of the main circuit board 100'. As shown in FIG. 31, the number of pads in the first preset area 110' and the pins of the security chip 200' The number of 210' is the same, and the respective pads in the first predetermined region 110' are insulated from each other.
  • the solder balls may be implanted on the pads 210' of the security chip 200' and/or the pads in the first predetermined area 110', and the respective pins 210' of the security chip 200' are respectively passed through the solder balls.
  • the corresponding pads in the first predetermined area 110' are aligned such that the security chip 200' is soldered into the first predetermined area 110' of the main circuit board 100', its top view and cross-sectional view, respectively, as shown in FIG. 32 and As shown in FIG. 33, different pins 210' of the security chip 200' respectively correspond to different pads in the first predetermined region 110'.
  • the conductive paste may also be coated on the pads 210' of the security chip 200' and/or the pads in the first predetermined area 110', and the respective pins 210' of the security chip 200' are respectively passed through the conductive adhesive and the first
  • the corresponding pads in the preset area 110' are aligned, and the security chip 200' is pressurized and heated, so that the conductive paste adhered to the security chip 200' is solidified, so that the security chip 200' is soldered to the main circuit board 100'.
  • the different pins 210' of the security chip 200' respectively correspond to different pads in the first predetermined region 110'; the conductive paste may be an anisotropic conductive adhesive or an isotropic conductive adhesive.
  • the conductive adhesive is an anisotropic conductive adhesive
  • the corresponding top view and cross-sectional view are respectively shown in FIG. 32 and FIG. 34;
  • the conductive adhesive is an isotropic conductive adhesive, corresponding top view and cross-sectional view, See Figure 32 and Figure 35, respectively.
  • Step 102' implanting a solder ball on a plurality of pads in a second predetermined area of the main circuit board.
  • a plurality of pads are disposed in the second predetermined region 120' of the main circuit board 100', and the respective pads in the second predetermined region 120' are insulated from each other.
  • Each of the pads in the first predetermined region 110' is respectively connected to a corresponding pad in the second predetermined region 120' through a wire on the main circuit board 100', and different pads in the first predetermined region 110' Corresponding to different pads in the second preset area 120', respectively, as shown in FIG.
  • step 103' the main circuit board is respectively connected to the display, the button and the battery to obtain an electronic component.
  • buttons 400' may be mounted on the pads in the third predetermined area of the main circuit board 100', and the main circuit board 100' is respectively connected to the display 500' and the battery 600 through the edge connector 130'. 'Connecting, an electronic component including the main circuit board 100', the security chip 200', the display 500', the button 400', and the battery 600' is obtained, as shown in FIG.
  • step 104' the electronic component is filled into the slot of the substrate, an adhesive is applied to the surface on which the slot is placed, and the adhesive is smoothed.
  • the main circuit board in the electronic component can be filled to the bottom of the slot of the substrate, the adhesive is uniformly applied to the surface on which the slot is formed using an automatic coating device, and the adhesive is used with the flexible roller Smooth out.
  • the structure of the substrate 700' is as shown in Fig. 37, and has a slit 710'.
  • step 105' the substrate is coated and laminated.
  • the substrate may be coated with a flexible roller, and the substrate may be subjected to high temperature lamination or intermediate temperature lamination.
  • the second predetermined area 120' of the main circuit board 100' is provided with a plurality of pads, each of which is implanted with a solder ball 140', a top view and a cross-sectional view thereof, as shown in FIG. 38 and FIG. 39 respectively. Show.
  • the area corresponding to the display in the coated film may be transparent or hollow; the area of the coated film corresponding to the button may be transparent or opaque.
  • Step 106' according to the position of the pad in the second preset area, the groove is milled on the substrate such that the solder ball on the pad in the second predetermined area is visible at the bottom of the groove.
  • the groove 800' can be milled on the substrate for the solder ball 140' on the pad in the second preset region 120', the groove 800'
  • the bottom portion includes a section through which the solder balls 140' on the pads in the second predetermined region 120' are milled.
  • the bottom surface of the groove 800' is not smaller than the bottom area of the contact module 300', and the maximum depth of the groove 800' is not less than the maximum thickness of the contact module 300'.
  • the depths of the grooves 800' may be the same, and the top and cross-sectional views thereof are as shown in Figs. 40 and 41, respectively.
  • the bottom of the recess 800' has a plurality of pits 810', the number of pits 810' being the same as the number of pads in the second predetermined region 120', each pit 810
  • the bottom of each of the bottoms includes a section in which the solder balls 140' on the pads in the second predetermined area 120' are milled, and the horizontal bottom area of each of the pits 810' is not less than the corresponding one of the contact modules 300'.
  • the area of the pin 320', its top view and cross-sectional view, are shown in Figures 42 and 43, respectively.
  • Step 107' filling the contact module into the recess and assembling the contact module to the main circuit board through the solder balls on the pads in the second predetermined area of the main circuit board.
  • the contact module 300' includes a plurality of mutually insulated contacts 310' and pins 320' corresponding to the respective contacts 310'.
  • the contacts 310' are insulated from each other, and each of the contacts 310' respectively corresponds thereto.
  • the pins 320' are connected, and the different contacts 310' correspond to different pins 320'.
  • the number of pins 320' in the contact module 300' is within the second predetermined area 120' of the main circuit board 100'.
  • the number of pads is the same, and the top view and the cross-sectional view are shown in Figures 44 and 45, respectively.
  • a solder ball can be implanted on the pin 320' of the contact module 300', and each pin 320' of the contact module 300' is respectively passed through the solder ball and the corresponding pad in the second preset area 120'.
  • the solder balls are aligned, filling the contact module 300' into the recess 800' such that the contact module 300' is soldered to the main circuit board 100', wherein the different pins 320' of the contact module 300' Corresponding to different pads in the second preset area 120' respectively.
  • the conductive paste may also be coated on the solder balls on the pads 320' of the contact module 300' and/or the second preset region 120', and the respective pins 320' of the contact module 300' are respectively Aligning with the solder balls on the corresponding pads in the second preset region 120', filling the contact module 300' into the recess 800', and heating and heating the contact module 300 to make the contact module
  • the 300'-bonded conductive paste is cured, wherein the different pins 320' of the contact module 300 respectively correspond to different pads in the second predetermined region 120'.
  • the top view and the cross-sectional view of the recess 800' are as shown in Figures 40 and 41, respectively, at the pin 320' and/or the second predetermined area of the contact module 300'.
  • the anisotropic conductive paste is coated on the solder ball 140' on the inner pad, and each pin 320' of the contact module 300' is respectively and according to a preset correspondence relationship using a positioning device or a video amplification system.
  • the solder balls 140' on the corresponding pads in the two preset regions 120' are aligned one by one, and the contact module 300' is placed in the recess 800' by a preset pressure by the mounter, and is touched.
  • the dot module 300' is heated so that the anisotropic conductive paste adhered to the contact module 300' is cured, and its structure is as shown in FIG.
  • a solder ball is implanted on the pin 320' of the contact module 300' and used.
  • the positioning device or the video amplifying system according to the preset correspondence, respectively, the respective pins 320' of the contact module 300' are aligned with the solder balls on the corresponding pads in the second preset region 120' through the solder balls.
  • the contact module 300' is then filled into the recess 800' such that the contact module 300' is soldered to the main circuit board 100', the structure of which is shown in FIG.
  • the respective pins 320' and/or recesses of the contact module 300' may be present.
  • the conductive paste is coated on the cross section of the solder ball 140' at the bottom of the point 810', and the respective pins 320' of the contact module 300' are respectively associated with the corresponding ones according to a preset correspondence relationship using a positioning device or a video amplification system.
  • the cross section of the solder ball 140' at the bottom of the pit 810' is aligned, and the contact module 300' is placed in the recess 800' by a preset pressure by a mounter, and the contact module 300' is heated, so that The conductive paste bonded to the contact module 300' is cured so that the contact module 300' is bonded to the main circuit board 100', and its structure is as shown in FIG. Wherein, the different pins 320' of the contact module 300' correspond to different pits 810', respectively.
  • a solder ball is implanted on the pin 320' of the contact module 300' and used.
  • the positioning device or the video amplifying system passes the respective pins 320' of the contact module 300' through the solder ball and the first according to the preset correspondence relationship.
  • the solder balls on the corresponding pads in the two preset regions 120' are aligned, thereby filling the contact module 300' into the recess 800', so that the contact module 300' is soldered to the main circuit board 100',
  • the structure is shown in Figure 49.
  • the obtained smart card is as shown in FIG.
  • the contact module and the security chip are respectively assembled on the main circuit board, and the electronic circuit level expansion of the contact module and the security chip can be performed, thereby improving the scalability of the smart card.
  • the main circuit board is respectively connected to the display, the button and the battery to obtain an electronic component, and the electronic component is filled into the slot of the substrate; in other embodiments of the present invention, The main circuit board is separately filled into the slots of the substrate, and the object of the invention can also be achieved.
  • the substrate may be masked before the groove is milled on the substrate filled with the main circuit board according to the position of the pad in the second predetermined area of the main circuit board.
  • the object of the present invention can also be achieved by other processes than lamination.
  • the embodiment of the present invention further provides a smart card, comprising: a substrate and a main circuit board filled in the substrate, wherein the first predetermined area of the main circuit board is flip-chip bonded with a security chip, and the main a plurality of pads in the second predetermined area of the circuit board are implanted with solder balls, wherein the substrate has a groove corresponding to the pad in the second predetermined area, and the pad in the second predetermined area
  • the upper solder ball is visible at the bottom of the recess; the recess is filled with a contact module that is mounted on the main circuit board by solder balls on the pads in the second predetermined area.
  • the surface on which the substrate is grooved may be coated with an adhesive.
  • the security chip may be soldered in the first predetermined area of the main circuit board, or may be bonded to the first preset area of the main circuit board by a conductive adhesive.
  • a plurality of pads are disposed in the first preset area of the main circuit board, and the number of the pads in the first preset area is the same as the number of the pins of the security chip, and each of the first preset areas The pads are insulated from each other.
  • each pin of the security chip can be soldered to the corresponding pad in the first predetermined area by the solder ball implanted by itself and/or the solder ball implanted on the corresponding pad in the first predetermined area. Or bonding the corresponding pads in the first predetermined area by using the conductive paste coated by itself and/or the conductive adhesive coated on the corresponding pads in the first predetermined area, wherein The different pins of the security chip respectively correspond to different pads in the first preset area.
  • Each of the pads in the first predetermined area is connected to a corresponding pad in the second predetermined area by a wire on the main circuit board, and different pads in the first preset area respectively correspond to the second preset Different pads in the area, and the pads in the second predetermined area are insulated from each other.
  • the recess in the substrate is matched with the volume and structure of the contact module, and the bottom of the recess includes a cross section of the solder ball on the pad in the second predetermined area.
  • the contact module includes a plurality of mutually insulated contacts and pins corresponding to the respective contacts, the number of pins in the contact module being the same as the number of pads in the second predetermined area.
  • solder ball is implanted on the pin of the contact module, and each pin of the contact module can be respectively soldered to the solder ball on the corresponding pad in the second predetermined area through the solder ball, wherein the contact module Different pins respectively correspond to different pads in the second predetermined area.
  • Each pin of the contact module may also pass through the conductive adhesive coated by itself and/or the conductive adhesive coated on the solder ball on the corresponding pad in the second predetermined area, and the second preset area The solder balls on the corresponding pads are bonded, wherein different pins of the contact module respectively correspond to different pads in the second predetermined area.
  • the conductive adhesive is an anisotropic conductive adhesive.
  • each pin of the contact module passes through the conductive paste coated by itself and/or The conductive paste coated on the cross section of the solder ball at the bottom of the corresponding pit is bonded to the cross section of the solder ball at the bottom of the corresponding pit, wherein different pins of the contact module respectively correspond to different pits.
  • the contact module and the security chip are respectively assembled on the main circuit board, and the electronic circuit level expansion of the contact module and the security chip can be performed, thereby improving the scalability of the smart card.

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Abstract

一种智能卡的制造方法，包括：将安全芯片（230）装配到模块电路板（210）上，得到安全芯片模块，该模块电路板（210）的其中一层上设置有多个互相绝缘的触点（220）；在主电路板（300）的安全芯片焊盘（311）上植锡球（240），根据主电路板（300）中的安全芯片焊盘（311）的位置，在填充有主电路板（300）的基板（700）上铣出凹槽（800），使得安全芯片焊盘（311）上的锡球（240）在凹槽（800）底部可见；将安全芯片模块填充到凹槽（800）中，并通过安全芯片焊盘（311）上的锡球（240），将安全芯片模块装配到主电路板（300）上。该方法减少了智能卡表面上的触点对主电路板的布线造成的限制，进而改善了主电路板的布线质量，并且可对触点模块和安全芯片进行电子电路级别的扩展，提高了智能卡的可扩展性。

Description

一种智能卡及其制造方法 技术领域
本发明涉及一种智能卡及其制造方法，属于电子技术领域。
背景技术
随着电子技术的发展，智能卡凭借其存储信息量大和安全性高的优势，广泛应用于金融、交通、通讯、商业、教育、医疗、社保和旅游娱乐等多个行业领域。智能卡通过其内部的安全芯片进行数据加解密，并通过卡表面上的触点与读卡终端进行数据交互。
现有的智能卡封装工艺中，通常将上述触点焊接到智能卡中的主电路板上，各个触点通过主电路板上的导线与安全芯片连接。或者，通常将出点和安全芯片集成到安全芯片模块中，再将安全芯片模块焊接到智能卡的主电路板上。
发明人在实现本发明的过程中，发现现有技术至少存在以下缺陷：
由于各个触点的位置通常是固定的，智能卡中的主电路板必须为各个触点预留出固定的焊盘位置，因而对主电路板的布线造成了很大的限制，且对焊接工艺提出了较高的要求。
而且，由于触点和安全芯片被集成到同一模块中，无法进行电子电路级别的扩展，局限了智能卡的可扩展性。
发明内容
本发明的目的是提供一种智能卡及其制造方法，用以解决现有技术中智能卡表面上的触点限制主电路板布线的缺陷。
为此，根据本发明的一个方面，提供了一种智能卡的制造方法，包括以下步骤：
将安全芯片装配到模块电路板上，得到安全芯片模块，所述模块电路板的其中一层上设置有多个互相绝缘的触点；在主电路板的安全芯片焊盘上植锡球，根据所述主电路板中的安全芯片焊盘的位置，在填充有所述主电路板的基板上铣出凹槽，使得所述安全芯片焊盘上的锡球在所述凹槽底部可见；
将所述安全芯片模块填充到所述凹槽中，并通过所述安全芯片焊盘上的锡球，将所述安全芯片模块装配到所述主电路板上。
优选地，所述模块电路板上布设有多个内部焊盘；
将安全芯片装配到模块电路板上，得到安全芯片模块，具体为：
通过所述安全芯片的管脚与所述模块电路板上的内部焊盘之间的配合，将所述安全芯片装配到所述模块电路板上，得到所述安全芯片模块。
优选地，通过所述安全芯片的管脚与所述模块电路板上的内部焊盘之间的配合，将所述安全芯片装配到所述模块电路板上，得到所述安全芯片模块，具体为：
在所述安全芯片的管脚和/或所述模块电路板上的内部焊盘上植锡球，将所述安全芯片的各个管脚分别通过锡球与所述模块电路板上对应的内部焊盘对准，使得所述安全芯片被焊接到所述模块电路板上，得到由所述安全芯片和所述模块电路板组成的安全芯片模块，其中，所述安全芯片的不同的管脚分别对应不同的内部焊盘。
优选地，通过所述安全芯片的管脚与所述模块电路板上的内部焊盘之间的配合，将所述安全芯片装配到所述模块电路板上，得到所述安全芯片模块，具体为：
在所述安全芯片的管脚和/或所述模块电路板上的内部焊盘上涂布导电胶，将所述安全芯片的各个管脚分别与所述模块电路板上对应的内部焊盘对准，并对所述安全芯片进行加压加热，使得与所述安全芯片贴合的导电胶固化，使得所述安全芯片被粘接到所述模块电路板上，得到由所述安全芯片和所述模块电路板组成的安全芯片模块，其中，所述安全芯片的不同的管脚分别对应不同的内部焊盘。
优选地，所述模块电路板上的各个触点分别通过所述模块电路板中的过孔与所述模块电路板上对应的内部焊盘连接，且不同的触点分别对应不同的内部焊盘。
优选地，所述模块电路板上布设有多个外部焊盘，每个内部焊盘分别与其对应的外部焊盘连接，且不同的内部焊盘分别对应不同的外部焊盘；
通过所述安全芯片焊盘上的锡球，将所述安全芯片模块装配到所述主电路板上，具体为：
通过所述安全芯片焊盘上的锡球与所述模块电路板上的外部焊盘之间的配合，将所述安全芯片模块装配到所述主电路板上。
优选地，通过所述安全芯片焊盘上的锡球与所述模块电路板上的外部焊盘之间的配合，将所述安全芯片模块装配到所述主电路板上，具体为：
在所述模块电路板上的各个外部焊盘和/或所述凹槽底部的各个锡球的截面上点锡膏，将所述模块电路板上的各个外部焊盘分别与所述凹槽底部的对应锡球的截面对准，使得所述安全芯片模块被焊接到所述主电路板上，其中，不同的外部焊盘分别对应不同的锡球。
优选地，通过所述安全芯片焊盘上的锡球与所述模块电路板上的外部焊盘之间的配合，将所述安全芯片模块装配到所述主电路板上，具体为：
在所述模块电路板上的各个外部焊盘和/或所述凹槽底部的各个锡球的截面上涂布导电胶，将所述模块电路板上的各 个外部焊盘分别与所述凹槽底部的对应锡球的截面对准，使得所述安全芯片模块被粘接到所述主电路板上，其中，不同的外部焊盘分别对应不同的锡球。
优选地，所述模块电路板上的各个触点分别通过所述模块电路板中的过孔与对应的外部焊盘连接，且不同的触点分别对应不同的外部焊盘。
优选地，所述模块电路板的顶层上设置有所述触点。
优选地，所述安全芯片焊盘的数量与所述模块电路板上与内部焊盘连接的外部焊盘的数量相同，且各个安全芯片焊盘之间互相绝缘。
优选地，根据所述主电路板中的安全芯片焊盘的位置，在填充有所述主电路板的基板上铣出凹槽，使得所述安全芯片焊盘上的锡球在所述凹槽底部可见，具体为：
根据所述安全芯片模块的体积和结构，针对所述主电路板中的安全芯片焊盘上的锡球，在填充有所述主电路板的基板上铣出所述凹槽，所述凹槽的底部包含所述安全芯片焊盘上的锡球被铣出的截面。
优选地，所述凹槽各处的深度均相同；
通过所述安全芯片焊盘上的锡球与所述模块电路板上的外部焊盘之间的配合，将所述安全芯片模块装配到所述主电路板上，具体为：
在所述模块电路板上的各个外部焊盘和/或所述凹槽底部的各个锡球的截面上点锡膏，按照所述模块电路板上的各个外部焊盘分别与所述凹槽底部对应的锡球的截面对准的方式，将所述安全芯片模块焊接到所述主电路板上，其中，不同的外部焊盘分别对应不同的锡球；或者，
在所述模块电路板上的各个外部焊盘和/或所述凹槽底部的各个锡球的截面上涂布各向异性导电胶，将所述模块电路板上的各个外部焊盘分别与所述凹槽底部对应的锡球的截面对准，使得所述安全芯片模块被粘接到所述主电路板上，其中，不同的外部焊盘分别对应不同的锡球。
优选地，所述凹槽的中央部分的深度大于边缘部分的深度，所述凹槽的剖面呈阶梯状，且所述凹槽的中央部分的水平底面积小于所述安全芯片模块中的模块电路板的底面积；
通过所述安全芯片焊盘上的锡球与所述模块电路板上的外部焊盘之间的配合，将所述安全芯片模块装配到所述主电路板上，具体为：
在所述模块电路板上的各个外部焊盘和/或所述凹槽底部的各个锡球的截面上点锡膏，将所述安全芯片模块中的模块电路板与所述凹槽的边缘部分配合，按照所述模块电路板上的各个外部焊盘分别与所述凹槽底部对应的锡球的截面对准的方式，将所述安全芯片模块焊接到所述主电路板上，其中，不同的外部焊盘分别对应不同的锡球；或者，
在所述模块电路板上的各个外部焊盘和/或所述凹槽底部的各个锡球的截面上涂布各向异性导电胶，将所述安全芯片模块中的模块电路板与所述凹槽的边缘部分配合，将所述模块电路板上的各个外部焊盘分别与所述凹槽底部对应的锡球的截面对准，使得所述安全芯片模块被粘接到所述主电路板上，其中，不同的外部焊盘分别对应不同的锡球。
优选地，所述凹槽的中央部分的深度大于边缘部分的深度，所述凹槽的剖面呈阶梯状，且所述凹槽的中央部分与所述安全芯片模块中的安全芯片相匹配；
通过所述安全芯片焊盘上的锡球与所述模块电路板上的外部焊盘之间的配合，将所述安全芯片模块装配到所述主电路板上，具体为：
在所述模块电路板上的各个外部焊盘和/或所述凹槽底部的各个锡球的截面上点锡膏，将所述安全芯片模块中的安全芯片与所述凹槽的中央部分配合，按照所述模块电路板上的各个外部焊盘分别与所述凹槽底部对应的锡球的截面对准的方式，将所述安全芯片模块焊接到所述主电路板上，其中，不同的外部焊盘分别对应不同的锡球；或者，
在所述模块电路板上的各个外部焊盘和/或所述凹槽底部的各个锡球的截面上涂布各向异性导电胶，将所述安全芯片模块中的安全芯片与所述凹槽的中央部分配合，将所述模块电路板上的各个外部焊盘分别与所述凹槽底部对应的锡球的截面对准，使得所述安全芯片模块被粘接到所述主电路板上，其中，不同的外部焊盘分别对应不同的锡球。
优选地，所述凹槽的中央部分的深度大于边缘部分的深度，所述凹槽的剖面呈阶梯状，且所述凹槽的中央部分与所述安全芯片模块中的安全芯片相匹配；所述凹槽的底部还具有多个凹点，所述凹点的数量与所述主电路板中的安全芯片焊盘的数量相同，每个凹点的底部均包含所述安全芯片焊盘上的锡球被铣出的截面，且每个凹点的水平底面积均不小于所述模块电路板上的外部焊盘的面积；
通过所述安全芯片焊盘上的锡球与所述模块电路板上的外部焊盘之间的配合，将所述安全芯片模块装配到所述主电路板上，具体为：
在所述模块电路板上的各个外部焊盘和/或各个凹点底部的锡球的截面上点锡膏，将所述安全芯片模块中的安全芯片与所述凹槽的中央部分配合，按照所述模块电路板上的各个外部焊盘分别与对应的凹点底部的锡球的截面对准的方式，将所述安全芯片模块焊接到所述主电路板上，其中，不同的外部焊盘分别对应不同的锡球；或者，
在所述模块电路板上的各个外部焊盘和/或各个凹点底部的锡球的截面上涂布导电胶，将所述安全芯片模块中的安全芯片与所述凹槽的中央部分配合，将所述模块电路板上的各个外部焊盘分别与对应的凹点底部的锡球的截面对准，使得所述安全芯片模块被粘接到所述主电路板上，其中，不同的外部焊盘分别对应不同的锡球。
根据本发明的另外一个方面，还提供了一种智能卡，包括基板以及填充在所述基板中的主电路板，所述主电路板中的安全芯片焊盘上植有锡球，所述基板中与所述安全芯片焊盘对应的位置上具有凹槽，所述安全芯片焊盘上的锡球在所 述凹槽底部可见；所述凹槽中填充有安全芯片模块，所述安全芯片模块通过所述安全芯片焊盘上的锡球装配在所述主电路板上；所述安全芯片模块包括模块电路板以及装配在所述模块电路板上的安全芯片，所述模块电路板的其中一层上设置有多个互相绝缘的触点。
优选地，所述模块电路板上布设有多个内部焊盘，所述安全芯片通过自身的管脚与所述模块电路板上的内部焊盘之间的配合，装配在所述模块电路板上。
优选地，所述安全芯片的各个管脚分别通过自身所植的锡球和/或所述模块电路板上的内部焊盘上所植的锡球，与所述模块电路板上对应的内部焊盘焊接，其中，所述安全芯片的不同的管脚分别对应不同的内部焊盘。
优选地，所述安全芯片的各个管脚分别通过自身所涂布的导电胶和/或所述模块电路板上的内部焊盘上所涂布的导电胶，与所述模块电路板上对应的内部焊盘粘接，其中，所述安全芯片的不同的管脚分别对应不同的内部焊盘。
优选地，所述模块电路板上的各个触点分别通过所述模块电路板中的过孔与所述模块电路板上对应的内部焊盘连接，且不同的触点分别对应不同的内部焊盘。
优选地，所述模块电路板上布设有多个外部焊盘，每个内部焊盘分别与其对应的外部焊盘连接，且不同的内部焊盘分别对应不同的外部焊盘；所述安全芯片模块通过所述安全芯片焊盘上的锡球与所述模块电路板上的外部焊盘之间的配合，装配在所述主电路板上。
优选地，所述模块电路板上的各个外部焊盘通过自身上的锡膏和/或所述凹槽底部的各个锡球的截面上的锡膏，分别与所述凹槽底部的对应锡球的截面焊接，其中，不同的外部焊盘分别对应不同的锡球。
优选地，所述模块电路板上的各个外部焊盘通过自身上的导电胶和/或所述凹槽底部的各个锡球的截面上的导电胶，分别与所述凹槽底部的对应锡球的截面粘接，其中，不同的外部焊盘分别对应不同的锡球。
优选地，所述模块电路板上的各个触点分别通过所述模块电路板中的过孔与对应的外部焊盘连接，且不同的触点分别对应不同的外部焊盘。
优选地，所述触点设置在所述模块电路板的顶层上。
优选地，所述安全芯片焊盘的数量与所述模块电路板上与内部焊盘连接的外部焊盘的数量相同，且各个安全芯片焊盘之间互相绝缘。
优选地，所述凹槽与所述安全芯片模块的体积和结构匹配，所述凹槽的底部包含所述安全芯片焊盘上的锡球被铣出的截面。
优选地，所述凹槽各处的深度均相同；所述模块电路板上的各个外部焊盘通过自身上的各向异性导电胶和/或所述凹槽底部的各个锡球的截面上的各向异性导电胶，分别与所述凹槽底部的对应锡球的截面粘接，其中，不同的外部焊盘分别对应不同的锡球。
优选地，所述凹槽的中央部分的深度大于边缘部分的深度，所述凹槽的剖面呈阶梯状，且所述凹槽的中央部分的水平底面积小于所述安全芯片模块中的模块电路板的底面积；所述安全芯片模块中的模块电路板与所述凹槽的边缘部分配合；所述模块电路板上的各个外部焊盘通过自身上的各向异性导电胶和/或所述凹槽底部的各个锡球的截面上的各向异性导电胶，分别与所述凹槽底部的对应锡球的截面粘接，其中，不同的外部焊盘分别对应不同的锡球。
优选地，所述凹槽的中央部分的深度大于边缘部分的深度，所述凹槽的剖面呈阶梯状，且所述凹槽的中央部分与所述安全芯片模块中的安全芯片相匹配；所述安全芯片模块中的安全芯片与所述凹槽的中央部分配合；所述模块电路板上的各个外部焊盘通过自身上的各向异性导电胶和/或所述凹槽底部的各个锡球的截面上的各向异性导电胶，分别与所述凹槽底部的对应锡球的截面粘接，其中，不同的外部焊盘分别对应不同的锡球。
优选地，所述凹槽的中央部分的深度大于边缘部分的深度，所述凹槽的剖面呈阶梯状，且所述凹槽的中央部分与所述安全芯片模块中的安全芯片相匹配；所述凹槽的底部还具有多个凹点，所述凹点的数量与所述主电路板中的安全芯片焊盘的数量相同，每个凹点的底部均包含所述安全芯片焊盘上的锡球被铣出的截面，且每个凹点的水平底面积均不小于所述模块电路板上的外部焊盘的面积；所述安全芯片模块中的安全芯片与所述凹槽的中央部分配合，所述模块电路板上的各个外部焊盘分别与对应的凹点底部的锡球的截面对准。
根据本发明的另外一个方面，提供了一种智能卡的制造方法，包括以下步骤：
将安全芯片倒装压合到主电路板的第一预设区域内，在所述主电路板的第二预设区域内的多个焊盘上植锡球；
将所述主电路板填充到基板的开槽中，并根据所述第二预设区域内的焊盘的位置，在所述基板上铣出凹槽，使得所述第二预设区域内的焊盘上的锡球在所述凹槽底部可见；
将触点模块填充到所述凹槽中，并通过所述第二预设区域内的焊盘上的锡球，将所述触点模块装配到所述主电路板上。
优选地，将安全芯片倒装压合到主电路板的第一预设区域内，具体为：
将所述安全芯片焊接到所述主电路板的第一预设区域内；或者，
使用导电胶将所述安全芯片粘接到所述主电路板的第一预设区域内。
优选地，所述主电路板的第一预设区域内设置有多个焊盘，所述第一预设区域内的焊盘的数量与所述安全芯片的管脚数量相同，且所述第一预设区域内各个焊盘之间互相绝缘；
所述将所述安全芯片焊接到所述主电路板的第一预设区域内，具体为：
在所述安全芯片的管脚和/或所述第一预设区域内的焊盘上植锡球，将所述安全芯片的各个管脚通过锡球分别与所述 第一预设区域内对应的焊盘对准，使得所述安全芯片被焊接到所述主电路板的第一预设区域内，其中，所述安全芯片的不同的管脚分别对应第一预设区域内不同的焊盘。
优选地，所述主电路板的第一预设区域内设置有多个焊盘，所述第一预设区域内的焊盘的数量与所述安全芯片的管脚数量相同，且所述第一预设区域内各个焊盘之间互相绝缘；
所述使用导电胶将所述安全芯片粘接到所述主电路板的第一预设区域内，具体为：
在所述安全芯片的管脚和/或所述第一预设区域内的焊盘上涂布导电胶，将所述安全芯片的各个管脚通过导电胶分别与所述第一预设区域内对应的焊盘对准，并对所述安全芯片进行加压加热，使得与所述安全芯片贴合的导电胶固化，使得所述安全芯片被粘接到所述主电路板的第一预设区域内，其中，所述安全芯片的不同的管脚分别对应第一预设区域内不同的焊盘。
优选地，所述第一预设区域内的各个焊盘分别通过所述主电路板上的导线与所述第二预设区域内对应的焊盘连接，且所述第一预设区域内不同的焊盘分别对应所述第二预设区域内不同的焊盘，所述第二预设区域内各个焊盘之间互相绝缘。
优选地，将所述主电路板填充到基板的开槽中之后，还包括：
在所述开槽所在的表面上涂敷粘结剂，并对所述粘结剂进行抚平。
优选地，根据所述第二预设区域内的焊盘的位置，在所述基板上铣出凹槽，使得所述第二预设区域内的焊盘上的锡球在所述凹槽底部可见，具体为：
根据所述触点模块的体积和结构，针对所述第二预设区域内的焊盘上的锡球，在所述基板上铣出凹槽，所述凹槽的底部包含所述第二预设区域内的焊盘上的锡球被铣出的截面。
优选地，所述触点模块包含多个互相绝缘的触点以及对应各个触点的管脚，所述触点模块中的管脚的数量与所述第二预设区域内的焊盘的数量相同；
通过所述第二预设区域内的焊盘上的锡球，将所述触点模块装配到所述主电路板上，具体为：
在所述触点模块的管脚上植锡球，将所述触点模块的各个管脚分别通过锡球与所述第二预设区域内对应的焊盘上的锡球对准，将所述触点模块填充到所述凹槽中，使得所述触点模块被焊接到所述主电路板上，其中，所述触点模块的不同的管脚分别对应所述第二预设区域内的不同的焊盘。
优选地，所述触点模块包含多个互相绝缘的触点以及对应各个触点的管脚，所述触点模块中的管脚的数量与所述第二预设区域内的焊盘的数量相同；
通过所述第二预设区域内的焊盘上的锡球，将所述触点模块装配到所述主电路板上，具体为：
在所述触点模块的管脚和/或所述第二预设区域内的焊盘上的锡球上涂布导电胶，将所述触点模块的各个管脚分别与所述第二预设区域内对应的焊盘上的锡球对准，将所述触点模块填充到所述凹槽中，其中，所述触点模块的不同的管脚分别对应所述第二预设区域内的不同的焊盘；
对所述触点模块进行加压加热，使得与所述触点模块贴合的导电胶固化。
优选地，对所述触点模块进行加压加热，具体为：
通过贴片机用预设的压力将所述触点模块贴装在所述凹槽中，并对所述触点模块加热。
优选地，所述凹槽各处的深度均相同，所述导电胶为各向异性导电胶。
优选地，所述凹槽的底部具有多个凹点，所述凹点的数量与所述第二预设区域内的焊盘数量相同，每个凹点的底部均包含所述第二预设区域内的焊盘上的锡球被铣出的截面，且每个凹点的水平底面积均不小于所述触点模块中对应的管脚的面积；
在所述触点模块的管脚和/或所述第二预设区域内的焊盘上的锡球上涂布导电胶，将所述触点模块的管脚与所述第二预设区域内的焊盘上的锡球对准，将所述触点模块填充到所述凹槽中，具体为：
在所述触点模块的各个管脚和/或各个凹点底部的锡球的截面上涂布导电胶，将所述触点模块的各个管脚分别与对应的凹点底部的锡球的截面对准，使得所述触点模块被粘接到所述主电路板上，其中，所述触点模块的不同管脚分别对应不同的凹点。
根据本发明的另外一个方面，还提供了一种智能卡，包括基板以及填充在所述基板中的主电路板，所述主电路板的第一预设区域内倒装压合有安全芯片，所述主电路板的第二预设区域内的多个焊盘上植有锡球，所述基板中与所述第二预设区域内的焊盘对应的位置上具有凹槽，所述第二预设区域内的焊盘上的锡球在所述凹槽底部可见；所述凹槽中填充有触点模块，所述触点模块通过所述第二预设区域内的焊盘上的锡球装配在所述主电路板上。
优选地，所述安全芯片焊接在所述主电路板的第一预设区域内；或者，
所述安全芯片通过导电胶粘接在所述主电路板的第一预设区域内。
优选地，所述主电路板的第一预设区域内设置有多个焊盘，所述第一预设区域内的焊盘的数量与所述安全芯片的管脚数量相同，且所述第一预设区域内各个焊盘之间互相绝缘；
所述安全芯片的各个管脚分别通过自身所植的锡球和/或所述第一预设区域内对应的焊盘上所植的锡球，与所述第一预设区域内对应的焊盘焊接，其中，所述安全芯片的不同的管脚分别对应第一预设区域内不同的焊盘。
优选地，所述主电路板的第一预设区域内设置有多个焊盘，所述第一预设区域内的焊盘的数量与所述安全芯片的管脚数量相同，且所述第一预设区域内各个焊盘之间互相绝缘；
所述安全芯片的各个管脚分别通过自身所涂布的导电胶和/或所述第一预设区域内的对应的焊盘上所涂布的导电胶，与所述第一预设区域内对应的焊盘粘接，其中，所述安全芯片的不同的管脚分别对应第一预设区域内不同的焊盘。
优选地，所述第一预设区域内的各个焊盘分别通过所述主电路板上的导线与所述第二预设区域内对应的焊盘连接，且所述第一预设区域内不同的焊盘分别对应所述第二预设区域内不同的焊盘，所述第二预设区域内各个焊盘之间互相绝缘。
优选地，所述基板的开槽所在的表面上涂敷有粘结剂。
优选地，所述凹槽与所述触点模块的体积和结构匹配，所述凹槽的底部包含所述第二预设区域内的焊盘上的锡球被铣出的截面。
优选地，所述触点模块包含多个互相绝缘的触点以及对应各个触点的管脚，所述触点模块中的管脚的数量与所述第二预设区域内的焊盘的数量相同；所述触点模块的管脚上植有锡球，所述触点模块的各个管脚分别通过锡球与所述第二预设区域内对应的焊盘上的锡球焊接，其中，所述触点模块的不同的管脚分别对应所述第二预设区域内的不同的焊盘。
优选地，所述触点模块包含多个互相绝缘的触点以及对应各个触点的管脚，所述触点模块中的管脚的数量与所述第二预设区域内的焊盘的数量相同；
所述触点模块的各个管脚分别通过自身所涂布的导电胶和/或所述第二预设区域内对应的焊盘上的锡球上所涂布的导电胶，与所述第二预设区域内对应的焊盘上的锡球粘接，其中，所述触点模块的不同的管脚分别对应所述第二预设区域内的不同的焊盘。
优选地，所述凹槽各处的深度均相同，所述导电胶为各向异性导电胶。
优选地，所述凹槽的底部具有多个凹点，所述凹点的数量与所述第二预设区域内的焊盘数量相同，每个凹点的底部均包含所述第二预设区域内的焊盘上的锡球被铣出的截面，且每个凹点的水平底面积均不小于所述触点模块中对应的管脚的面积；
所述触点模块的各个管脚分别通过自身所涂布的导电胶和/或对应的凹点底部的锡球的截面上所涂布的导电胶，与对应的凹点底部的锡球的截面粘接，其中，所述触点模块的不同管脚分别对应不同的凹点。
本发明将触点模块和安全芯片分别装配到主电路板上，可对触点模块和安全芯片进行电子电路级别的扩展，提高了智能卡的可扩展性。
本发明将安全芯片装配到设置有多个触点的模块电路板上，将得到的安全芯片模块作为整体装配到主电路板上，减少了智能卡表面上的触点对主电路板的布线造成的限制，进而改善了主电路板的布线质量。
附图说明
图1为本发明实施例中的智能卡的制造方法流程图；
图2为本发明实施例中的模块电路板的顶视图；
图3为本发明实施例中的模块电路板的底视图；
图4为本发明实施例中的模块电路板的剖面图；
图5为本发明实施例中的安全芯片模块的底视图；
图6为本发明实施例中的安全芯片模块的一种剖面图；
图7为本发明实施例中的安全芯片模块的另一种剖面图；
图8为本发明实施例中的安全芯片模块的又一种剖面图；
图9为本发明实施例中的主电路板的结构示意图；
图10为本发明实施例中的电子组件的结构示意图；
图11为本发明实施例中的基板的结构示意图；
图12为本发明实施例中的填充有电子组件的基板的顶视图；
图13为本发明实施例中的填充有电子组件的基板的剖面图；
图14为本发明实施例中的一种铣槽后的基板的顶视图；
图15为本发明实施例中的一种铣槽后的基板的剖面图；
图16为本发明实施例中的另一种铣槽后的基板的顶视图；
图17为本发明实施例中的另一种铣槽后的基板的剖面图；
图18为本发明实施例中的又一种铣槽后的基板的顶视图；
图19为本发明实施例中的又一种铣槽后的基板的剖面图；
图20为本发明实施例中的再一种铣槽后的基板的顶视图；
图21为本发明实施例中的再一种铣槽后的基板的剖面图；
图22为本发明实施例中的一种主电路板和安全芯片模块的焊接示意图；
图23为本发明实施例中的一种主电路板和安全芯片模块的粘接示意图；
图24为本发明实施例中的另一种主电路板和安全芯片模块的焊接示意图；
图25为本发明实施例中的另一种主电路板和安全芯片模块的粘接示意图；
图26为本发明实施例中的又一种主电路板和安全芯片模块的焊接示意图；
图27为本发明实施例中的又一种主电路板和安全芯片模块的粘接示意图；
图28为本发明实施例中的再一种主电路板和安全芯片模块的粘接示意图；
图29为本发明实施例中的智能卡的结构示意图。
图30为本发明实施例中的智能卡的制造方法流程图；
图31为本发明实施例中的主电路板上的焊盘示意图；
图32为本发明实施例中的安全芯片和主电路板的顶视图；
图33为本发明实施例中的安全芯片和主电路板的一种剖面图；
图34为本发明实施例中的安全芯片和主电路板的另一种剖面图；
图35为本发明实施例中的安全芯片和主电路板的又一种剖面图；
图36为本发明实施例中的电子组件的示意图；
图37为本发明实施例中的基板的示意图；
图38为本发明实施例中的填充有电子组件的基板的顶视图；
图39为本发明实施例中的填充有电子组件的基板的剖面图；
图40为本发明实施例中的一种铣槽后的智能卡的顶视图；
图41为本发明实施例中的一种铣槽后的智能卡的剖面图；
图42为本发明实施例中的另一种铣槽后的智能卡的顶视图；
图43为本发明实施例中的另一种铣槽后的智能卡的剖面图；
图44为本发明实施例中的触点模块的顶视图；
图45为本发明实施例中的触点模块的剖面图；
图46为本发明实施例中的一种触点模块和主电路板的示意图；
图47为本发明实施例中的另一种触点模块和主电路板的示意图；
图48为本发明实施例中的又一种触点模块和主电路板的示意图；
图49为本发明实施例中的再一种触点模块和主电路板的示意图；
图50为本发明实施例中制造得到的智能卡的示意图。
具体实施方式
下面将结合附图，对本发明的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域的技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
本发明实施例提供了一种智能卡的制造方法，如图1所示，包括以下步骤：
步骤101，将安全芯片装配到模块电路板上，得到安全芯片模块。
具体地，可以通过安全芯片的管脚与模块电路板上的内部焊盘之间的配合，将安全芯片装配到所述模块电路板上，得到所述安全芯片模块。其中，模块电路板上布设有多个内部焊盘和多个外部焊盘，每个内部焊盘分别与其对应的外部焊盘连接，且不同的内部焊盘分别对应不同的外部焊盘。
本实施例中，可以将安全芯片焊接到模块电路板上，得到安全芯片模块；也可以使用导电胶将安全芯片粘接到模块电路板上，得到安全芯片模块。
其中，导电胶可以为各向异性导电胶，也可以为各向同性导电胶；模块电路板210为双面PCB或多层PCB，如图2、图3和图4所示，模块电路板210的其中一层上设置有多个互相绝缘的触点220，另一层上包含第一预设区域211，第一预设区域211内布设有多个互相绝缘的内部焊盘212，第一预设区域211外布设有多个互相绝缘的外部焊盘213，内部焊盘212的数量与外部焊盘213的数量相同，均分别与安全芯片230的管脚数量相同。所有内部焊盘212和所有外部焊盘213均位于模块电路板210的同一层，每个内部焊盘212均通过其所在层的导线与对应的外部焊盘213连接，且不同的内部焊盘212分别对应不同的外部焊盘213。
需要说明的是，模块电路板210中的内部焊盘212和外部焊盘213的数量和排布方式并不限于图3所示的形式，即，内部焊盘212和外部焊盘213的数量至少为5个，也可以是5个，也可以是6个、7个，甚至更多个，其排布方式可以是两排，也可以是三排或三排以上，还可以是圆周、梯形、三角形等排列方式，均在本发明的保护范围内。
优选地，模块电路板210的顶层上设置有触点220，模块电路板210的底层上包含第一预设区域211。
此外，模块电路板210上的各个触点220可以分别通过模块电路板210中的过孔与对应的内部焊盘212连接，且不同的触点220分别对应不同的内部焊盘212；各个触点220也可以分别通过模块电路板210中的过孔与模块电路板210上对应的外部焊盘213连接，且不同的触点220分别对应不同的外部焊盘213。模块电路板210上的各个触点220用于与读卡设备进行通信和数据交互，可以是焊接到模块电路板210上的元器件，也可以是以敷铜的方式预置在模块电路板上的焊盘。
本步骤中，可以在安全芯片230的管脚和/或模块电路板210上的内部焊盘212上植锡球240，将安全芯片230的各个管脚通过锡球240分别与模块电路板210上对应的内部焊盘212对准，使得安全芯片230被焊接到模块电路板210上，得到由安全芯片230和模块电路板210组成的安全芯片模块，如图5和图6所示，其中，安全芯片230的不同管脚分别 对应不同的内部焊盘212。
也可以在安全芯片230的管脚和/或模块电路板210上的内部焊盘212上涂布导电胶260，将安全芯片230的各个管脚分别与模块电路板210上对应的内部焊盘212对准，并对安全芯片230进行加压加热，使得与安全芯片230贴合的导电胶260固化，使得安全芯片230被粘接到模块电路板210上，得到由安全芯片230和模块电路板210组成的安全芯片模块。导电胶260可以为各向异性导电胶，也可以为各向同性导电胶，对应的安全芯片模块，分别如图7和图8所示，其中，安全芯片230的不同管脚分别对应不同的内部焊盘212。
需要说明的是，通过执行本步骤得到的安全芯片模块可以是一个独立的模块，也可以包含在由多个安全芯片模块组成的安全芯片载带中，上述实施方式均在本发明的保护范围内。
步骤102，在主电路板的安全芯片焊盘上植锡球。
其中，安全芯片焊盘311位于主电路板300的第二预设区域310内，如图9所示，安全芯片焊盘311的数量与模块电路板210上与内部焊盘212连接的外部焊盘213的数量相同，且各个安全芯片焊盘311之间互相绝缘。
步骤103，将主电路板分别与显示器、按键和电池连接，得到电子组件。
具体地，可以在主电路板300的焊盘上安装一个或多个按键400，并通过边接头320将主电路板300分别与显示器500和电池600连接，得到包含主电路板300、安全芯片模块、显示器500、按键400和电池600的电子组件，如图10所示。
步骤104，将电子组件填充到基板的开槽中，在该开槽所在的表面上涂敷粘结剂，并对粘结剂进行抚平。
具体地，可以将电子组件中的主电路板填充到基板的开槽的底部，使用自动涂敷设备将粘结剂均匀地涂敷到开槽所在的表面上，并使用柔性滚筒对粘结剂进行抚平。
其中，基板700的结构如图11所示，具有开槽710。
步骤105，对基板进行覆膜和层压。
具体地，可以使用柔性滚筒对基板进行覆膜，再对基板进行高温层压或中温层压，其顶视图和剖面图分别如图12和图13所示。其中，上述涂覆的覆膜中与显示器对应的区域可以是透明的，也可以是镂空的；上述涂覆的覆膜中与按键对应的区域可以是透明的，也可以是不透明的。
步骤106，根据主电路板中的安全芯片焊盘的位置，在填充有主电路板的基板上铣出凹槽，使得安全芯片焊盘上的锡球在凹槽底部可见。
具体地，可以根据安全芯片模块的体积和结构，针对主电路板300中的安全芯片焊盘上的锡球250，在填充有主电路板300的基板上铣出凹槽800，该凹槽800的底部包含安全芯片焊盘311上的锡球250被铣出的截面。其中，凹槽800的最大深度不小于安全芯片模块的最大厚度。
本发明的一种实现方式中，在基板上铣出的凹槽800各处的深度均相同，其顶视图和剖面图分别如图14和图15所示。
本发明的另一种实现方式中，在基板上铣出的凹槽800的中央部分的深度大于边缘部分的深度，凹槽800的剖面呈阶梯状，且凹槽800的中央部分的水平底面积小于安全芯片模块中的模块电路板210的底面积，其顶视图和剖面图分别如图16和图17所示。
本发明的又一种实现方式中，在基板上铣出的凹槽800的中央部分的深度大于边缘部分的深度，凹槽800的剖面呈阶梯状，且凹槽800的中央部分与安全芯片模块中的安全芯片230相匹配，其顶视图和剖面图分别如图18和图19所示。具体地，凹槽800的中央部分的水平底面积可以大于安全芯片模块中的安全芯片230的底面积，也可以等于安全芯片模块中的安全芯片230的底面积。
本发明的再一种实现方式中，在上述图18和图19所示结构的基础上，在基板上铣出的凹槽800的底部还具有多个凹点270，凹点270的数量与主电路板300中的安全芯片焊盘311的相同，每个凹点270的底部均包含安全芯片焊盘311上的锡球250被铣出的截面，且每个凹点270的水平底面积均不小于模块电路板210上的外部焊盘213的面积，其顶视图和剖面图分别如图20和图21所示。
步骤107，将安全芯片模块填充到基板的凹槽中，并通过安全芯片焊盘上的锡球，将安全芯片模块装配到主电路板上。
具体地，可以通过安全芯片焊盘上的锡球与模块电路板上的外部焊盘之间的配合，将安全芯片模块装配到主电路板上。
本实施例中，可以将安全芯片模块填充到基板的凹槽中，并通过安全芯片焊盘上的锡球，将安全芯片模块焊接到主电路板上；也可以将安全芯片模块填充到基板的凹槽中，并通过安全芯片焊盘上的锡球，将安全芯片模块粘接到主电路板上。
进一步地，可以在模块电路板上的各个外部焊盘213和/或基板的凹槽底部的各个锡球250的截面上点锡膏，将模块电路板上的各个外部焊盘213分别与基板的凹槽底部对应的锡球250的截面对准，使得安全芯片模块被焊接到主电路板300上；也可以在模块电路板上的各个外部焊盘213和/或基板的凹槽底部的各个锡球250的截面上涂布导电胶，将模块电路板上的各个外部焊盘213分别与基板的凹槽底部对应的锡球250的截面对准，使得安全芯片模块被粘接到主电路板300上。其中，模块电路板上的不同的外部焊盘213分别对应不同的锡球250，安全芯片模块中的安全芯片230位于主电路板300和模块电路板210之间，与安全芯片焊盘311对准的外部焊盘213，均与模块电路板210的内部焊盘212连接； 导电胶可以为各向异性导电胶，也可以为各向同性导电胶。
本发明的一种实现方式中，当铣槽后的基板的顶视图和剖面图分别如图14和图15所示时，可以在模块电路板上的各个外部焊盘213和/或基板的凹槽底部对应的锡球250的截面上点锡膏，按照模块电路板上的各个外部焊盘213分别与基板的凹槽底部的各个锡球250的截面对准的方式，将安全芯片模块焊接到主电路板300上，如图22所示；也可以在模块电路板上的各个外部焊盘213和/或基板的凹槽底部的各个锡球250的截面上涂布各向异性导电胶260，将模块电路板上的各个外部焊盘213分别与基板的凹槽底部对应的锡球250的截面对准，使得安全芯片模块被粘接到主电路板300上，如图23所示，其中，模块电路板上的不同的外部焊盘213分别对应不同的锡球250。
本发明的另一种实现方式中，当铣槽后的基板的顶视图和剖面图分别如图16和图17所示时，可以在模块电路板上的各个外部焊盘213和/或基板的凹槽底部的各个锡球250的截面上点锡膏，将安全芯片模块中的模块电路板210与凹槽的边缘部分配合，按照模块电路板上的各个外部焊盘213分别与基板的凹槽底部对应的锡球250的截面对准的方式，将安全芯片模块焊接到主电路板300上，如图24所示；也可以在模块电路板上的各个外部焊盘213和/或基板的凹槽底部的各个锡球250的截面上涂布各向异性导电胶260，将安全芯片模块中的模块电路板210与凹槽的边缘部分配合，将模块电路板上的各个外部焊盘213分别与基板的凹槽底部对应的锡球250的截面对准，使得安全芯片模块被粘接到主电路板300上，如图25所示，其中，模块电路板上的不同的外部焊盘213分别对应不同的锡球250。
本发明的又一种实现方式中，当铣槽后的基板的顶视图和剖面图分别如图18和图19所示时，可以在模块电路板上的各个外部焊盘213和/或基板的凹槽底部的各个锡球250的截面上点锡膏，将安全芯片模块中的安全芯片230与凹槽的中央部分配合，按照模块电路板上的各个外部焊盘213分别与基板的凹槽底部对应的锡球250的截面对准的方式，将安全芯片模块焊接到主电路板300上，如图26所示；也可以在模块电路板上的各个外部焊盘213和/或基板的凹槽底部的各个锡球250的截面上涂布各向异性导电胶260，将安全芯片模块中的安全芯片230与凹槽的中央部分配合，将模块电路板上的各个外部焊盘213分别与基板的凹槽底部对应的锡球250的截面对准，使得安全芯片模块被粘接到主电路板300上，如图27所示，其中，模块电路板上的不同的外部焊盘213分别对应不同的锡球250。
本发明的再一种实现方式中，当铣槽后的基板的顶视图和剖面图分别如图20和图21所示时，可以在模块电路板上的各个外部焊盘213和/或基板的凹槽底部的各个锡球250的截面上点锡膏，将安全芯片模块中的安全芯片230与凹槽的中央部分配合，按照模块电路板上的各个外部焊盘213分别与基板的凹槽底部对应的锡球250的截面对准的方式，将安全芯片模块焊接到主电路板300上；也可以在模块电路板上的各个外部焊盘213和/或基板的凹槽底部的各个锡球250的截面上涂布导电胶261，将安全芯片模块中的安全芯片230与凹槽的中央部分配合，将模块电路板上的各个外部焊盘213分别与基板的凹槽底部对应的锡球250的截面对准，使得安全芯片模块被粘接到主电路板300上，如图28所示。其中，导电胶261可以为各向异性导电胶，也可以为各向同性导电胶，模块电路板上的不同的外部焊盘213分别对应不同的锡球250。
通过执行上述步骤后，得到的智能卡如图29所示。
本发明实施例通过安全芯片的管脚与模块电路板上的内部焊盘之间的配合，将安全芯片装配到模块电路板上，得到安全芯片模块，并通过主电路板的安全芯片焊盘上的锡球与模块电路板上的外部焊盘之间的配合，将安全芯片模块装配到主电路板上，由于模块电路板上的外部焊盘的位置可根据需要进行调整，因此，主电路板上的安全芯片焊盘的位置也可根据布线需求进行调整，从而减少了智能卡表面上的触点对主电路板的布线造成的限制，进而改善了主电路板的布线质量。
需要说明的是，本发明实施例将主电路板分别与显示器、按键和电池连接，得到电子组件，并将电子组件填充到基板的开槽中；在本发明的其他实施方式中，也可以将主电路板单独填充到基板的开槽中，同样能够实现本发明的发明目的。
在本发明的其他实施方式中，在根据主电路板中的安全芯片焊盘的位置，在填充有主电路板的基板上铣出凹槽之前，还可以对基板进行除覆膜和层压之外的其他处理，同样能够实现本发明的发明目的。
基于上述智能卡的制造方法，本发明实施例还提供了一种智能卡，包括基板以及填充在该基板中的主电路板，该主电路板中的安全芯片焊盘上植有锡球，上述基板中与该安全芯片焊盘对应的位置上具有凹槽，该安全芯片焊盘上的锡球在上述凹槽底部可见。
其中，上述凹槽中填充有安全芯片模块，该安全芯片模块通过上述安全芯片焊盘上的锡球装配在上述主电路板上；上述安全芯片模块包括模块电路板以及装配在该模块电路板上的安全芯片，上述模块电路板的其中一层上设置有多个互相绝缘的触点。
进一步地，上述触点可以设置在模块电路板的顶层上。
进一步地，上述模块电路板上布设有多个内部焊盘，安全芯片通过自身的管脚与模块电路板上的内部焊盘之间的配合，装配在模块电路板上。
具体地，上述安全芯片可以焊接在上述模块电路板上，也可以通过导电胶粘接在上述模块电路板上。
本实施例中，上述安全芯片的各个管脚可以分别通过自身所植的锡球和/或模块电路板上的内部焊盘上所植的锡球，与模块电路板上对应的内部焊盘焊接，其中，安全芯片的不同的管脚分别对应不同的内部焊盘。
上述安全芯片的各个管脚也可以分别通过自身所涂布的导电胶和/或模块电路板上的内部焊盘上所涂布的导电胶，与模块电路板上对应的内部焊盘粘接，其中，安全芯片的不同的管脚分别对应不同的内部焊盘。
其中，模块电路板上的各个触点分别通过模块电路板中的过孔与模块电路板上对应的内部焊盘连接，且不同的触点分别对应不同的内部焊盘。
进一步地，上述模块电路板上还布设有多个外部焊盘，每个内部焊盘分别与其对应的外部焊盘连接，且不同的内部焊盘分别对应不同的外部焊盘；安全芯片模块通过安全芯片焊盘上的锡球与模块电路板上的外部焊盘之间的配合，装配在主电路板上。
具体地，上述安全芯片模块通过安全芯片焊盘上的锡球焊接或者粘接到主电路板上。
相应地，上述模块电路板上的各个外部焊盘可以通过自身上的锡膏和/或凹槽底部的各个锡球的截面上的锡膏，分别与凹槽底部的对应锡球的截面焊接，其中，不同的外部焊盘分别对应不同的锡球。
上述模块电路板上的各个外部焊盘还可以通过自身上的导电胶和/或凹槽底部的各个锡球的截面上的导电胶，分别与凹槽底部的对应锡球的截面粘接，其中，不同的外部焊盘分别对应不同的锡球。
其中，模块电路板上的各个触点分别通过该模块电路板中的过孔与对应的外部焊盘连接，且不同的触点分别对应不同的外部焊盘。
进一步地，安全芯片焊盘的数量与模块电路板上与内部焊盘连接的外部焊盘的数量相同，且各个安全芯片焊盘之间互相绝缘。
进一步地，上述凹槽与上述安全芯片模块的体积和结构匹配，上述凹槽的底部包含安全芯片焊盘上的锡球被铣出的截面。
进一步地，上述凹槽各处的深度可以均相同；相应地，上述模块电路板上的各个外部焊盘通过自身上的各向异性导电胶和/或凹槽底部的各个锡球的截面上的各向异性导电胶，分别与凹槽底部的对应锡球的截面粘接，其中，不同的外部焊盘分别对应不同的锡球。
进一步地，上述凹槽的中央部分的深度也可以大于边缘部分的深度，凹槽的剖面呈阶梯状，且凹槽的中央部分的水平底面积小于安全芯片模块中的模块电路板的底面积；相应地，安全芯片模块中的模块电路板与凹槽的边缘部分配合；模块电路板上的各个外部焊盘通过自身上的各向异性导电胶和/或凹槽底部的各个锡球的截面上的各向异性导电胶，分别与凹槽底部的对应锡球的截面粘接，其中，不同的外部焊盘分别对应不同的锡球。
进一步地，上述凹槽的中央部分的深度也可以大于边缘部分的深度，凹槽的剖面呈阶梯状，且凹槽的中央部分与安全芯片模块中的安全芯片相匹配；安全芯片模块中的安全芯片与凹槽的中央部分配合；模块电路板上的各个外部焊盘通过自身上的各向异性导电胶和/或凹槽底部的各个锡球的截面上的各向异性导电胶，分别与凹槽底部的对应锡球的截面粘接，其中，不同的外部焊盘分别对应不同的锡球。
进一步地，上述凹槽的中央部分的深度大于边缘部分的深度，凹槽的剖面呈阶梯状，且凹槽的中央部分与安全芯片模块中的安全芯片相匹配；凹槽的底部还具有多个凹点，凹点的数量与主电路板中的安全芯片焊盘的数量相同，每个凹点的底部均包含安全芯片焊盘上的锡球被铣出的截面，且每个凹点的水平底面积均不小于模块电路板上的外部焊盘的面积；安全芯片模块中的安全芯片与凹槽的中央部分配合，模块电路板上的各个外部焊盘分别与对应的凹点底部的锡球的截面对准。
本发明实施例通过安全芯片的管脚与模块电路板上的内部焊盘之间的配合，将安全芯片装配到模块电路板上，得到安全芯片模块，并通过主电路板的安全芯片焊盘上的锡球与模块电路板上的外部焊盘之间的配合，将安全芯片模块装配到主电路板上，由于模块电路板上的外部焊盘的位置可根据需要进行调整，因此，主电路板上的安全芯片焊盘的位置也可根据布线需求进行调整，从而减少了智能卡表面上的触点对主电路板的布线造成的限制，进而改善了主电路板的布线质量。
本发明实施例提供了一种智能卡的制造方法，如图30所示，包括以下步骤：
步骤101’，将安全芯片倒装压合到主电路板的第一预设区域内。
具体地，可以将安全芯片焊接到主电路板的第一预设区域内；也可以使用导电胶将安全芯片粘接到主电路板的第一预设区域内。
其中，主电路板100’的第一预设区域110’内设置有多个焊盘，如图31所示，第一预设区域110’内的焊盘的数量与安全芯片200’的管脚210’数量相同，且第一预设区域110’内的各个焊盘之间互相绝缘。
本步骤中，可以在安全芯片200’的管脚210’和/或第一预设区域110’内的焊盘上植锡球，将安全芯片200’的各个管脚210’通过锡球分别与第一预设区域110’内对应的焊盘对准，使得安全芯片200’被焊接到主电路板100’的第一预设区域110’内，其顶视图和剖面图，分别如图32和图33所示，其中，安全芯片200’的不同的管脚210’分别对应第一预设区域110’内不同的焊盘。
也可以在安全芯片200’的管脚210’和/或第一预设区域110’内的焊盘上涂布导电胶，将安全芯片200’的各个管脚210’通过导电胶分别与第一预设区域110’内对应的焊盘对准，并对安全芯片200’进行加压加热，使得与安全芯片200’贴合的导电胶固化，使得安全芯片200’被焊接到主电路板100’的第一预设区域110’内。其中，安全芯片200’的不同的管脚210’分别对应第一预设区域110’内不同的焊盘；上述导电胶可以为各向异性导电胶，也可以为各向同性导电胶。当上述导电胶为各向异性导电胶时，对应的顶视图和剖面图，分别如图32和图34所示；当上述导电胶为各向同性导电胶时，对应的顶视图和剖面图，分别如图32和图35所示。
步骤102’，在主电路板的第二预设区域内的多个焊盘上植锡球。
其中，主电路板100’的第二预设区域120’内设置有多个焊盘，第二预设区域120’内的各个焊盘之间互相绝缘。第一预设区域110’内的各个焊盘分别通过主电路板100’上的导线与第二预设区域120’内对应的焊盘连接，且第一预设区域110’内不同的焊盘分别对应第二预设区域120’内不同的焊盘，如图31所示。
步骤103’，将主电路板分别与显示器、按键和电池连接，得到电子组件。
具体地，可以在主电路板100’的第三预设区域内的焊盘上安装一个或多个按键400’，并通过边接头130’将主电路板100’分别与显示器500’和电池600’连接，得到包含主电路板100’、安全芯片200’、显示器500’、按键400’和电池600’的电子组件，如图36所示。
步骤104’，将电子组件填充到基板的开槽中，在该开槽所在的表面上涂敷粘结剂，并对粘结剂进行抚平。
具体地，可以将电子组件中的主电路板填充到基板的开槽的底部，使用自动涂敷设备将粘结剂均匀地涂敷到开槽所在的表面上，并使用柔性滚筒对粘结剂进行抚平。
其中，基板700’的结构如图37所示，具有开槽710’。
步骤105’，对基板进行覆膜和层压。
具体地，可以使用柔性滚筒对基板进行覆膜，再对基板进行高温层压或中温层压。其中，主电路板100’的第二预设区域120’内设置有多个焊盘，每个焊盘上植有锡球140’，其顶视图和剖面图，分别如图38和图39所示。其中，上述涂覆的覆膜中与显示器对应的区域可以是透明的，也可以是镂空的；上述涂覆的覆膜中与按键对应的区域可以是透明的，也可以是不透明的。
步骤106’，根据第二预设区域内的焊盘的位置，在基板上铣出凹槽，使得第二预设区域内的焊盘上的锡球在凹槽底部可见。
具体地，可以根据触点模块300’的体积和结构，针对第二预设区域120’内的焊盘上的锡球140’，在基板上铣出凹槽800’，该凹槽800’的底部包含第二预设区域120’内的焊盘上的锡球140’被铣出的截面。
其中，上述凹槽800’的底面积不小于触点模块300’的底面积，上述凹槽800’的最大深度不小于触点模块300’的最大厚度。
本发明的一种实现方式中，凹槽800’各处的深度可以均相同，其顶视图和剖面图，分别如图40和图41所示。
本发明的另一种实现方式中，凹槽800’的底部具有多个凹点810’，凹点810’的数量与第二预设区域120’内的焊盘数量相同，每个凹点810’的底部均包含第二预设区域120’内的焊盘上的锡球140’被铣出的截面，且每个凹点810’的水平底面积均不小于触点模块300’中对应的管脚320’的面积，其顶视图和剖面图，分别如图42和图43所示。
步骤107’，将触点模块填充到凹槽中，并通过主电路板的第二预设区域内的焊盘上的锡球，将触点模块装配到主电路板上。
其中，触点模块300’包含多个互相绝缘的触点310’以及对应各个触点310’的管脚320’，各个触点310’之间互相绝缘，每个触点310’分别与其对应的管脚320’连接，且不同的触点310’对应不同的管脚320’，触点模块300’中的管脚320’的数量与主电路板100’的第二预设区域120’内的焊盘的数量相同，其顶视图和剖面图，分别如图44和图45所示。
相应地，可以在触点模块300’的管脚320’上植锡球，将触点模块300’的各个管脚320’分别通过锡球与第二预设区域120’内对应的焊盘上的锡球对准，将触点模块300’填充到凹槽800’中，使得触点模块300’被焊接到主电路板100’上，其中，触点模块300’的不同的管脚320’分别对应第二预设区域120’内的不同的焊盘。
也可以在触点模块300’的管脚320’和/或第二预设区域120’内的焊盘上的锡球上涂布导电胶，将触点模块300’的各个管脚320’分别与第二预设区域120’内对应的焊盘上的锡球对准，将触点模块300’填充到凹槽800’中，并对触点模块300进行加压加热，使得与触点模块300’贴合的导电胶固化，其中，触点模块300的不同的管脚320’分别对应第二预设区域120’内的不同的焊盘。
本发明的一种实现方式中，当凹槽800’的顶视图和剖面图分别如图40和图41所示时，在触点模块300’的管脚320’和/或第二预设区域内的焊盘上的锡球140’上涂布各向异性导电胶，并使用定位装置或视频放大系统，按照预设的对应关系，将触点模块300’的各个管脚320’分别与第二预设区域120’内对应的焊盘上的锡球140’一一对准，再通过贴片机用预设的压力将触点模块300’贴装在凹槽800’中，并对触点模块300’加热，使得与触点模块300’贴合的各向异性导电胶固化，其结构如图46所示。
本发明的另一种实现方式中，当凹槽800’的顶视图和剖面图分别如图40和图41所示时，在触点模块300’的管脚320’上植锡球，并使用定位装置或视频放大系统，按照预设的对应关系，将触点模块300’的各个管脚320’分别通过锡球与第二预设区域120’内对应的焊盘上的锡球对准，进而将触点模块300’填充到凹槽800’中，使得触点模块300’被焊接到主电路板100’上，其结构如图47所示。
本发明的又一种实现方式中，当凹槽800’的顶视图和剖面图分别如图42和图43所示时，可以在触点模块300’的各个管脚320’和/或各个凹点810’底部的锡球140’的截面上涂布导电胶，并使用定位装置或视频放大系统，按照预设的对应关系，将触点模块300’的各个管脚320’分别与与对应的凹点810’底部的锡球140’的截面对准，再通过贴片机用预设的压力将触点模块300’贴装在凹槽800’中，并对触点模块300’加热，使得与触点模块300’贴合的导电胶固化，使得触点模块300’被粘接到主电路板100’上，其结构如图48所示。其中，触点模块300’的不同管脚320’分别对应不同的凹点810’。
本发明的再一种实现方式中，当凹槽800’的顶视图和剖面图分别如图42和图43所示时，在触点模块300’的管脚320’上植锡球，并使用定位装置或视频放大系统，按照预设的对应关系，将触点模块300’的各个管脚320’分别通过锡球与第 二预设区域120’内对应的焊盘上的锡球对准，进而将触点模块300’填充到凹槽800’中，使得触点模块300’被焊接到主电路板100’上，其结构如图49所示。
通过执行上述步骤后，得到的智能卡如图50所示。
本发明实施例将触点模块和安全芯片分别装配到主电路板上，可对触点模块和安全芯片进行电子电路级别的扩展，提高了智能卡的可扩展性。
需要说明的是，本发明实施例将主电路板分别与显示器、按键和电池连接，得到电子组件，并将电子组件填充到基板的开槽中；在本发明的其他实施方式中，也可以将主电路板单独填充到基板的开槽中，同样能够实现本发明的发明目的。
在本发明的其他实施方式中，在根据主电路板的第二预设区域内的焊盘的位置，在填充有主电路板的基板上铣出凹槽之前，还可以对基板进行除覆膜和层压之外的其他处理，同样能够实现本发明的发明目的。
基于上述智能卡的制造方法，本发明实施例还提供了一种智能卡，包括基板以及填充在该基板中的主电路板，主电路板的第一预设区域内倒装压合有安全芯片，主电路板的第二预设区域内的多个焊盘上植有锡球，上述基板中与第二预设区域内的焊盘对应的位置上具有凹槽，第二预设区域内的焊盘上的锡球在该凹槽底部可见；上述凹槽中填充有触点模块，该触点模块通过上述第二预设区域内的焊盘上的锡球装配在主电路板上。
其中，基板的开槽所在的表面上可涂敷有粘结剂。
进一步地，上述安全芯片可以焊接在主电路板的第一预设区域内，也可以通过导电胶粘接在主电路板的第一预设区域内。
进一步地，上述主电路板的第一预设区域内设置有多个焊盘，第一预设区域内的焊盘的数量与上述安全芯片的管脚数量相同，且第一预设区域内各个焊盘之间互相绝缘。
相应地，安全芯片的各个管脚可以分别通过自身所植的锡球和/或第一预设区域内对应的焊盘上所植的锡球，与第一预设区域内对应的焊盘焊接；也可以分别通过自身所涂布的导电胶和/或第一预设区域内的对应的焊盘上所涂布的导电胶，与第一预设区域内对应的焊盘粘接，其中，安全芯片的不同的管脚分别对应第一预设区域内不同的焊盘。
其中，第一预设区域内的各个焊盘分别通过主电路板上的导线与第二预设区域内对应的焊盘连接，且第一预设区域内不同的焊盘分别对应第二预设区域内不同的焊盘，第二预设区域内各个焊盘之间互相绝缘。
进一步地，上述基板中的凹槽与触点模块的体积和结构匹配，该凹槽的底部包含第二预设区域内的焊盘上的锡球被铣出的截面。
进一步地，触点模块包含多个互相绝缘的触点以及对应各个触点的管脚，所述触点模块中的管脚的数量与所述第二预设区域内的焊盘的数量相同。
相应地，触点模块的管脚上植有锡球，触点模块的各个管脚可以分别通过锡球与第二预设区域内对应的焊盘上的锡球焊接，其中，触点模块的不同的管脚分别对应第二预设区域内的不同的焊盘。
触点模块的各个管脚也可以分别通过自身所涂布的导电胶和/或第二预设区域内对应的焊盘上的锡球上所涂布的导电胶，与第二预设区域内对应的焊盘上的锡球粘接，其中，触点模块的不同的管脚分别对应第二预设区域内的不同的焊盘。
其中，当凹槽各处的深度均相同时，导电胶为各向异性导电胶。
当凹槽的底部具有多个凹点，凹点的数量与第二预设区域内的焊盘数量相同，每个凹点的底部均包含所述第二预设区域内的焊盘上的锡球被铣出的截面，且每个凹点的水平底面积均不小于触点模块中对应的管脚的面积时，触点模块的各个管脚分别通过自身所涂布的导电胶和/或对应的凹点底部的锡球的截面上所涂布的导电胶，与对应的凹点底部的锡球的截面粘接，其中，触点模块的不同管脚分别对应不同的凹点。
本发明实施例将触点模块和安全芯片分别装配到主电路板上，可对触点模块和安全芯片进行电子电路级别的扩展，提高了智能卡的可扩展性。
以上所述仅为本发明的具体实施方式，但本发明的保护范围并不局限于此，本领域的技术人员在本发明揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本发明的保护范围之内。因此，本发明的保护范围应以所附权利要求为准。

Claims (23)

  1. 一种智能卡的制造方法，其特征在于，包括以下步骤：
    将安全芯片装配到模块电路板上，得到安全芯片模块，所述模块电路板的其中一层上设置有多个互相绝缘的触点；在主电路板的安全芯片焊盘上植锡球，根据所述主电路板中的安全芯片焊盘的位置，在填充有所述主电路板的基板上铣出凹槽，使得所述安全芯片焊盘上的锡球在所述凹槽底部可见；
    将所述安全芯片模块填充到所述凹槽中，并通过所述安全芯片焊盘上的锡球，将所述安全芯片模块装配到所述主电路板上。
  2. 如权利要求1所述的方法，其特征在于，所述模块电路板上布设有多个内部焊盘；
    将安全芯片装配到模块电路板上，得到安全芯片模块，具体为：
    通过所述安全芯片的管脚与所述模块电路板上的内部焊盘之间的配合，将所述安全芯片装配到所述模块电路板上，得到所述安全芯片模块。
  3. 如权利要求2所述的方法，其特征在于，通过所述安全芯片的管脚与所述模块电路板上的内部焊盘之间的配合，将所述安全芯片装配到所述模块电路板上，得到所述安全芯片模块，具体为：
    在所述安全芯片的管脚和/或所述模块电路板上的内部焊盘上植锡球，将所述安全芯片的各个管脚分别通过锡球与所述模块电路板上对应的内部焊盘对准，使得所述安全芯片被焊接到所述模块电路板上，得到由所述安全芯片和所述模块电路板组成的安全芯片模块，其中，所述安全芯片的不同的管脚分别对应不同的内部焊盘；或者，
    在所述安全芯片的管脚和/或所述模块电路板上的内部焊盘上涂布导电胶，将所述安全芯片的各个管脚分别与所述模块电路板上对应的内部焊盘对准，并对所述安全芯片进行加压加热，使得与所述安全芯片贴合的导电胶固化，使得所述安全芯片被粘接到所述模块电路板上，得到由所述安全芯片和所述模块电路板组成的安全芯片模块，其中，所述安全芯片的不同的管脚分别对应不同的内部焊盘。
  4. 如权利要求2所述的方法，其特征在于，所述模块电路板上布设有多个外部焊盘，每个内部焊盘分别与其对应的外部焊盘连接，且不同的内部焊盘分别对应不同的外部焊盘；
    通过所述安全芯片焊盘上的锡球，将所述安全芯片模块装配到所述主电路板上，具体为：
    通过所述安全芯片焊盘上的锡球与所述模块电路板上的外部焊盘之间的配合，将所述安全芯片模块装配到所述主电路板上。
  5. 如权利要求4所述的方法，其特征在于，所述凹槽各处的深度均相同；
    通过所述安全芯片焊盘上的锡球与所述模块电路板上的外部焊盘之间的配合，将所述安全芯片模块装配到所述主电路板上，具体为：
    在所述模块电路板上的各个外部焊盘和/或所述凹槽底部的各个锡球的截面上点锡膏，按照所述模块电路板上的各个外部焊盘分别与所述凹槽底部对应的锡球的截面对准的方式，将所述安全芯片模块焊接到所述主电路板上，其中，不同的外部焊盘分别对应不同的锡球；或者，
    在所述模块电路板上的各个外部焊盘和/或所述凹槽底部的各个锡球的截面上涂布各向异性导电胶，将所述模块电路板上的各个外部焊盘分别与所述凹槽底部对应的锡球的截面对准，使得所述安全芯片模块被粘接到所述主电路板上，其中，不同的外部焊盘分别对应不同的锡球。
  6. 如权利要求4所述的方法，其特征在于，所述凹槽的中央部分的深度大于边缘部分的深度，所述凹槽的剖面呈阶梯状，且所述凹槽的中央部分的水平底面积小于所述安全芯片模块中的模块电路板的底面积；
    通过所述安全芯片焊盘上的锡球与所述模块电路板上的外部焊盘之间的配合，将所述安全芯片模块装配到所述主电路板上，具体为：
    在所述模块电路板上的各个外部焊盘和/或所述凹槽底部的各个锡球的截面上点锡膏，将所述安全芯片模块中的模块电路板与所述凹槽的边缘部分配合，按照所述模块电路板上的各个外部焊盘分别与所述凹槽底部对应的锡球的截面对准的方式，将所述安全芯片模块焊接到所述主电路板上，其中，不同的外部焊盘分别对应不同的锡球；或者，
    在所述模块电路板上的各个外部焊盘和/或所述凹槽底部的各个锡球的截面上涂布各向异性导电胶，将所述安全芯片模块中的模块电路板与所述凹槽的边缘部分配合，将所述模块电路板上的各个外部焊盘分别与所述凹槽底部对应的锡球的截面对准，使得所述安全芯片模块被粘接到所述主电路板上，其中，不同的外部焊盘分别对应不同的锡球。
  7. 如权利要求4所述的方法，其特征在于，所述凹槽的中央部分的深度大于边缘部分的深度，所述凹槽的剖面呈阶梯状，且所述凹槽的中央部分与所述安全芯片模块中的安全芯片相匹配；
    通过所述安全芯片焊盘上的锡球与所述模块电路板上的外部焊盘之间的配合，将所述安全芯片模块装配到所述主电路板上，具体为：
    在所述模块电路板上的各个外部焊盘和/或所述凹槽底部的各个锡球的截面上点锡膏，将所述安全芯片模块中的安全芯片与所述凹槽的中央部分配合，按照所述模块电路板上的各个外部焊盘分别与所述凹槽底部对应的锡球的截面对准的方式，将所述安全芯片模块焊接到所述主电路板上，其中，不同的外部焊盘分别对应不同的锡球；或者，
    在所述模块电路板上的各个外部焊盘和/或所述凹槽底部的各个锡球的截面上涂布各向异性导电胶，将所述安全芯片模块中的安全芯片与所述凹槽的中央部分配合，将所述模块电路板上的各个外部焊盘分别与所述凹槽底部对应的锡球的截面对准，使得所述安全芯片模块被粘接到所述主电路板上，其中，不同的外部焊盘分别对应不同的锡球。
  8. 如权利要求4所述的方法，其特征在于，所述凹槽的中央部分的深度大于边缘部分的深度，所述凹槽的剖面呈阶 梯状，且所述凹槽的中央部分与所述安全芯片模块中的安全芯片相匹配；所述凹槽的底部还具有多个凹点，所述凹点的数量与所述主电路板中的安全芯片焊盘的数量相同，每个凹点的底部均包含所述安全芯片焊盘上的锡球被铣出的截面，且每个凹点的水平底面积均不小于所述模块电路板上的外部焊盘的面积；
    通过所述安全芯片焊盘上的锡球与所述模块电路板上的外部焊盘之间的配合，将所述安全芯片模块装配到所述主电路板上，具体为：
    在所述模块电路板上的各个外部焊盘和/或各个凹点底部的锡球的截面上点锡膏，将所述安全芯片模块中的安全芯片与所述凹槽的中央部分配合，按照所述模块电路板上的各个外部焊盘分别与对应的凹点底部的锡球的截面对准的方式，将所述安全芯片模块焊接到所述主电路板上，其中，不同的外部焊盘分别对应不同的锡球；或者，
    在所述模块电路板上的各个外部焊盘和/或各个凹点底部的锡球的截面上涂布导电胶，将所述安全芯片模块中的安全芯片与所述凹槽的中央部分配合，将所述模块电路板上的各个外部焊盘分别与对应的凹点底部的锡球的截面对准，使得所述安全芯片模块被粘接到所述主电路板上，其中，不同的外部焊盘分别对应不同的锡球。
  9. 一种智能卡的制造方法，其特征在于，包括以下步骤：
    将安全芯片倒装压合到主电路板的第一预设区域内，在所述主电路板的第二预设区域内的多个焊盘上植锡球；
    将所述主电路板填充到基板的开槽中，并根据所述第二预设区域内的焊盘的位置，在所述基板上铣出凹槽，使得所述第二预设区域内的焊盘上的锡球在所述凹槽底部可见；
    将触点模块填充到所述凹槽中，并通过所述第二预设区域内的焊盘上的锡球，将所述触点模块装配到所述主电路板上。
  10. 如权利要求9所述的方法，其特征在于，将安全芯片倒装压合到主电路板的第一预设区域内，具体为：
    将所述安全芯片焊接到所述主电路板的第一预设区域内；或者，
    使用导电胶将所述安全芯片粘接到所述主电路板的第一预设区域内，
    其中，所述主电路板的第一预设区域内设置有多个焊盘，所述第一预设区域内的焊盘的数量与所述安全芯片的管脚数量相同，且所述第一预设区域内各个焊盘之间互相绝缘；
    所述将所述安全芯片焊接到所述主电路板的第一预设区域内，具体为：
    在所述安全芯片的管脚和/或所述第一预设区域内的焊盘上植锡球，将所述安全芯片的各个管脚通过锡球分别与所述第一预设区域内对应的焊盘对准，使得所述安全芯片被焊接到所述主电路板的第一预设区域内，其中，所述安全芯片的不同的管脚分别对应第一预设区域内不同的焊盘，
    所述使用导电胶将所述安全芯片粘接到所述主电路板的第一预设区域内，具体为：
    在所述安全芯片的管脚和/或所述第一预设区域内的焊盘上涂布导电胶，将所述安全芯片的各个管脚通过导电胶分别与所述第一预设区域内对应的焊盘对准，并对所述安全芯片进行加压加热，使得与所述安全芯片贴合的导电胶固化，使得所述安全芯片被粘接到所述主电路板的第一预设区域内，其中，所述安全芯片的不同的管脚分别对应第一预设区域内不同的焊盘。
  11. 如权利要求9所述的方法，其特征在于，所述触点模块包含多个互相绝缘的触点以及对应各个触点的管脚，所述触点模块中的管脚的数量与所述第二预设区域内的焊盘的数量相同；
    通过所述第二预设区域内的焊盘上的锡球，将所述触点模块装配到所述主电路板上，具体为：
    在所述触点模块的管脚上植锡球，将所述触点模块的各个管脚分别通过锡球与所述第二预设区域内对应的焊盘上的锡球对准，将所述触点模块填充到所述凹槽中，使得所述触点模块被焊接到所述主电路板上，其中，所述触点模块的不同的管脚分别对应所述第二预设区域内的不同的焊盘。
  12. 如权利要求9所述的方法，其特征在于，所述触点模块包含多个互相绝缘的触点以及对应各个触点的管脚，所述触点模块中的管脚的数量与所述第二预设区域内的焊盘的数量相同；
    通过所述第二预设区域内的焊盘上的锡球，将所述触点模块装配到所述主电路板上，具体为：
    在所述触点模块的管脚和/或所述第二预设区域内的焊盘上的锡球上涂布导电胶，将所述触点模块的各个管脚分别与所述第二预设区域内对应的焊盘上的锡球对准，将所述触点模块填充到所述凹槽中，其中，所述触点模块的不同的管脚分别对应所述第二预设区域内的不同的焊盘；
    对所述触点模块进行加压加热，使得与所述触点模块贴合的导电胶固化。
  13. 如权利要求12所述的方法，其特征在于，所述凹槽的底部具有多个凹点，所述凹点的数量与所述第二预设区域内的焊盘数量相同，每个凹点的底部均包含所述第二预设区域内的焊盘上的锡球被铣出的截面，且每个凹点的水平底面积均不小于所述触点模块中对应的管脚的面积；
    在所述触点模块的管脚和/或所述第二预设区域内的焊盘上的锡球上涂布导电胶，将所述触点模块的管脚与所述第二预设区域内的焊盘上的锡球对准，将所述触点模块填充到所述凹槽中，具体为：
    在所述触点模块的各个管脚和/或各个凹点底部的锡球的截面上涂布导电胶，将所述触点模块的各个管脚分别与对应的凹点底部的锡球的截面对准，使得所述触点模块被粘接到所述主电路板上，其中，所述触点模块的不同管脚分别对应不同的凹点。
  14. 一种智能卡，其特征在于，包括基板以及填充在所述基板中的主电路板，所述主电路板中的安全芯片焊盘上植有锡球，所述基板中与所述安全芯片焊盘对应的位置上具有凹槽，所述安全芯片焊盘上的锡球在所述凹槽底部可见；所述凹槽中填充有安全芯片模块，所述安全芯片模块通过所述安全芯片焊盘上的锡球装配在所述主电路板上；所述安全芯片模块包括模块电路板以及装配在所述模块电路板上的安全芯片，所述模块电路板的其中一层上设置有多个互相绝缘的 触点。
  15. 如权利要求14所述的智能卡，其特征在于，所述模块电路板上布设有多个内部焊盘，所述安全芯片通过自身的管脚与所述模块电路板上的内部焊盘之间的配合，装配在所述模块电路板上；或者，所述安全芯片的各个管脚分别通过自身所植的锡球和/或所述模块电路板上的内部焊盘上所植的锡球，与所述模块电路板上对应的内部焊盘焊接，其中，所述安全芯片的不同的管脚分别对应不同的内部焊盘。
  16. 如权利要求15所述的智能卡，其特征在于，所述安全芯片的各个管脚分别通过自身所涂布的导电胶和/或所述模块电路板上的内部焊盘上所涂布的导电胶，与所述模块电路板上对应的内部焊盘粘接，其中，所述安全芯片的不同的管脚分别对应不同的内部焊盘。
  17. 如权利要求15所述的智能卡，其特征在于，所述模块电路板上布设有多个外部焊盘，每个内部焊盘分别与其对应的外部焊盘连接，且不同的内部焊盘分别对应不同的外部焊盘；所述安全芯片模块通过所述安全芯片焊盘上的锡球与所述模块电路板上的外部焊盘之间的配合，装配在所述主电路板上。
  18. 如权利要求14所述的智能卡，其特征在于，所述凹槽各处的深度均相同；所述模块电路板上的各个外部焊盘通过自身上的各向异性导电胶和/或所述凹槽底部的各个锡球的截面上的各向异性导电胶，分别与所述凹槽底部的对应锡球的截面粘接，其中，不同的外部焊盘分别对应不同的锡球；或者，所述凹槽的中央部分的深度大于边缘部分的深度，所述凹槽的剖面呈阶梯状，且所述凹槽的中央部分的水平底面积小于所述安全芯片模块中的模块电路板的底面积；所述安全芯片模块中的模块电路板与所述凹槽的边缘部分配合；所述模块电路板上的各个外部焊盘通过自身上的各向异性导电胶和/或所述凹槽底部的各个锡球的截面上的各向异性导电胶，分别与所述凹槽底部的对应锡球的截面粘接，其中，不同的外部焊盘分别对应不同的锡球；或者，所述凹槽的中央部分的深度大于边缘部分的深度，所述凹槽的剖面呈阶梯状，且所述凹槽的中央部分与所述安全芯片模块中的安全芯片相匹配；所述安全芯片模块中的安全芯片与所述凹槽的中央部分配合；所述模块电路板上的各个外部焊盘通过自身上的各向异性导电胶和/或所述凹槽底部的各个锡球的截面上的各向异性导电胶，分别与所述凹槽底部的对应锡球的截面粘接，其中，不同的外部焊盘分别对应不同的锡球；或者，所述凹槽的中央部分的深度大于边缘部分的深度，所述凹槽的剖面呈阶梯状，且所述凹槽的中央部分与所述安全芯片模块中的安全芯片相匹配；所述凹槽的底部还具有多个凹点，所述凹点的数量与所述主电路板中的安全芯片焊盘的数量相同，每个凹点的底部均包含所述安全芯片焊盘上的锡球被铣出的截面，且每个凹点的水平底面积均不小于所述模块电路板上的外部焊盘的面积；所述安全芯片模块中的安全芯片与所述凹槽的中央部分配合，所述模块电路板上的各个外部焊盘分别与对应的凹点底部的锡球的截面对准。
  19. 一种智能卡，其特征在于，包括基板以及填充在所述基板中的主电路板，所述主电路板的第一预设区域内倒装压合有安全芯片，所述主电路板的第二预设区域内的多个焊盘上植有锡球，所述基板中与所述第二预设区域内的焊盘对应的位置上具有凹槽，所述第二预设区域内的焊盘上的锡球在所述凹槽底部可见；所述凹槽中填充有触点模块，所述触点模块通过所述第二预设区域内的焊盘上的锡球装配在所述主电路板上。
  20. 如权利要求19所述的智能卡，其特征在于，
    所述安全芯片焊接在所述主电路板的第一预设区域内；或者，
    所述安全芯片通过导电胶粘接在所述主电路板的第一预设区域内。
    其中，所述主电路板的第一预设区域内设置有多个焊盘，所述第一预设区域内的焊盘的数量与所述安全芯片的管脚数量相同，且所述第一预设区域内各个焊盘之间互相绝缘；
    所述安全芯片的各个管脚分别通过自身所植的锡球和/或所述第一预设区域内对应的焊盘上所植的锡球，与所述第一预设区域内对应的焊盘焊接，其中，所述安全芯片的不同的管脚分别对应第一预设区域内不同的焊盘；
    所述安全芯片的各个管脚分别通过自身所涂布的导电胶和/或所述第一预设区域内的对应的焊盘上所涂布的导电胶，与所述第一预设区域内对应的焊盘粘接，其中，所述安全芯片的不同的管脚分别对应第一预设区域内不同的焊盘。
  21. 如权利要求19所述的智能卡，其特征在于，所述触点模块包含多个互相绝缘的触点以及对应各个触点的管脚，所述触点模块中的管脚的数量与所述第二预设区域内的焊盘的数量相同；所述触点模块的管脚上植有锡球，所述触点模块的各个管脚分别通过锡球与所述第二预设区域内对应的焊盘上的锡球焊接，其中，所述触点模块的不同的管脚分别对应所述第二预设区域内的不同的焊盘。
  22. 如权利要求19所述的智能卡，其特征在于，所述触点模块包含多个互相绝缘的触点以及对应各个触点的管脚，所述触点模块中的管脚的数量与所述第二预设区域内的焊盘的数量相同；
    所述触点模块的各个管脚分别通过自身所涂布的导电胶和/或所述第二预设区域内对应的焊盘上的锡球上所涂布的导电胶，与所述第二预设区域内对应的焊盘上的锡球粘接，其中，所述触点模块的不同的管脚分别对应所述第二预设区域内的不同的焊盘。
  23. 如权利要求22所述的智能卡，其特征在于，所述凹槽的底部具有多个凹点，所述凹点的数量与所述第二预设区域内的焊盘数量相同，每个凹点的底部均包含所述第二预设区域内的焊盘上的锡球被铣出的截面，且每个凹点的水平底面积均不小于所述触点模块中对应的管脚的面积；
    所述触点模块的各个管脚分别通过自身所涂布的导电胶和/或对应的凹点底部的锡球的截面上所涂布的导电胶，与对应的凹点底部的锡球的截面粘接，其中，所述触点模块的不同管脚分别对应不同的凹点。
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