AU745396B2 - Porous region removing method and semiconductor substrate manufacturing method - Google Patents

Porous region removing method and semiconductor substrate manufacturing method Download PDF

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Publication number
AU745396B2
AU745396B2 AU98188/98A AU9818898A AU745396B2 AU 745396 B2 AU745396 B2 AU 745396B2 AU 98188/98 A AU98188/98 A AU 98188/98A AU 9818898 A AU9818898 A AU 9818898A AU 745396 B2 AU745396 B2 AU 745396B2
Authority
AU
Australia
Prior art keywords
substrate
porous
layer
etchant
ultrasonic wave
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
AU98188/98A
Other languages
English (en)
Other versions
AU9818898A (en
Inventor
Kiyofumi Sakaguchi
Kazutaka Yanagita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Publication of AU9818898A publication Critical patent/AU9818898A/en
Application granted granted Critical
Publication of AU745396B2 publication Critical patent/AU745396B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
    • H10P90/19—Preparing inhomogeneous wafers
    • H10P90/1904—Preparing vertically inhomogeneous wafers
    • H10P90/1906—Preparing SOI wafers
    • H10P90/1914—Preparing SOI wafers using bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/60—Wet etching
    • H10P50/64—Wet etching of semiconductor materials
    • H10P50/642—Chemical etching
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
    • H10P90/19—Preparing inhomogeneous wafers
    • H10P90/1904—Preparing vertically inhomogeneous wafers
    • H10P90/1906—Preparing SOI wafers
    • H10P90/1924—Preparing SOI wafers with separation/delamination along a porous layer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
    • H10W10/10—Isolation regions comprising dielectric materials
    • H10W10/181—Semiconductor-on-insulator [SOI] isolation regions, e.g. buried oxide regions of SOI wafers

Landscapes

  • Weting (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Recrystallisation Techniques (AREA)
  • Drying Of Semiconductors (AREA)
AU98188/98A 1998-01-09 1998-12-24 Porous region removing method and semiconductor substrate manufacturing method Ceased AU745396B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP10-003397 1998-01-09
JP00339798A JP3847935B2 (ja) 1998-01-09 1998-01-09 多孔質領域の除去方法及び半導体基体の製造方法

Publications (2)

Publication Number Publication Date
AU9818898A AU9818898A (en) 1999-07-29
AU745396B2 true AU745396B2 (en) 2002-03-21

Family

ID=11556241

Family Applications (1)

Application Number Title Priority Date Filing Date
AU98188/98A Ceased AU745396B2 (en) 1998-01-09 1998-12-24 Porous region removing method and semiconductor substrate manufacturing method

Country Status (9)

Country Link
US (1) US6127281A (https=)
EP (1) EP0938132B1 (https=)
JP (1) JP3847935B2 (https=)
KR (1) KR100354918B1 (https=)
AT (1) ATE293284T1 (https=)
AU (1) AU745396B2 (https=)
DE (1) DE69829738T2 (https=)
SG (1) SG75147A1 (https=)
TW (1) TW440950B (https=)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7148119B1 (en) * 1994-03-10 2006-12-12 Canon Kabushiki Kaisha Process for production of semiconductor substrate
US6391067B2 (en) 1997-02-04 2002-05-21 Canon Kabushiki Kaisha Wafer processing apparatus and method, wafer convey robot, semiconductor substrate fabrication method, and semiconductor fabrication apparatus
JPH10223585A (ja) * 1997-02-04 1998-08-21 Canon Inc ウェハ処理装置及びその方法並びにｓｏｉウェハの製造方法
US6767840B1 (en) * 1997-02-21 2004-07-27 Canon Kabushiki Kaisha Wafer processing apparatus, wafer processing method, and semiconductor substrate fabrication method
JP3218564B2 (ja) 1998-01-14 2001-10-15 キヤノン株式会社 多孔質領域の除去方法及び半導体基体の製造方法
AU5210300A (en) * 1999-04-27 2000-11-10 Gebruder Decker Gmbh & Co. Kg Device for treating silicon wafers
JP3810968B2 (ja) * 1999-12-03 2006-08-16 東京エレクトロン株式会社 液処理装置および液処理方法
JP2004228150A (ja) * 2003-01-20 2004-08-12 Canon Inc エッチング方法
US7040330B2 (en) * 2003-02-20 2006-05-09 Lam Research Corporation Method and apparatus for megasonic cleaning of patterned substrates
TWI227932B (en) * 2003-06-23 2005-02-11 Promos Technologies Inc Method for forming a bottle-shaped trench
US20050132332A1 (en) * 2003-12-12 2005-06-16 Abhay Sathe Multi-location coordinated test apparatus
US20050181572A1 (en) * 2004-02-13 2005-08-18 Verhoeven Tracy B. Method for acoustically isolating an acoustic resonator from a substrate
JP2005327856A (ja) * 2004-05-13 2005-11-24 Komatsu Electronic Metals Co Ltd 半導体ウェーハのエッチング装置
JP4955264B2 (ja) 2005-03-11 2012-06-20 エルピーダメモリ株式会社 多孔質単結晶層を備えた半導体チップおよびその製造方法
US8327861B2 (en) * 2006-12-19 2012-12-11 Lam Research Corporation Megasonic precision cleaning of semiconductor process equipment components and parts
DE102008003453A1 (de) * 2008-01-08 2009-07-09 Robert Bosch Gmbh Verfahren zur Herstellung poröser Mikrostrukturen, nach diesem Verfahren hergestellte poröse Mikrostrukturen sowie deren Verwendung
CN102125921B (zh) * 2010-01-20 2012-09-05 常州瑞择微电子科技有限公司 一种光掩模在清洗过程中的传输方法
JP7276036B2 (ja) * 2019-09-19 2023-05-18 大日本印刷株式会社 エッチング装置およびエッチング方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5374329A (en) * 1992-01-31 1994-12-20 Canon Kabushiki Kaisha Process for producing a semiconductor wafer
EP0740331A2 (en) * 1995-04-19 1996-10-30 MEMC Electronic Materials, Inc. Apparatus and method for cleaning semiconductor wafers
EP0801420A2 (en) * 1996-04-08 1997-10-15 Canon Kabushiki Kaisha Method for production of a SOI substrate by hydrophobic washing and pasting and SOI substrate thereby produced

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3352340B2 (ja) * 1995-10-06 2002-12-03 キヤノン株式会社 半導体基体とその製造方法
US6103598A (en) * 1995-07-13 2000-08-15 Canon Kabushiki Kaisha Process for producing semiconductor substrate

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5374329A (en) * 1992-01-31 1994-12-20 Canon Kabushiki Kaisha Process for producing a semiconductor wafer
EP0740331A2 (en) * 1995-04-19 1996-10-30 MEMC Electronic Materials, Inc. Apparatus and method for cleaning semiconductor wafers
EP0801420A2 (en) * 1996-04-08 1997-10-15 Canon Kabushiki Kaisha Method for production of a SOI substrate by hydrophobic washing and pasting and SOI substrate thereby produced

Also Published As

Publication number Publication date
US6127281A (en) 2000-10-03
JP3847935B2 (ja) 2006-11-22
EP0938132A2 (en) 1999-08-25
DE69829738D1 (de) 2005-05-19
TW440950B (en) 2001-06-16
DE69829738T2 (de) 2006-02-09
KR100354918B1 (ko) 2002-11-18
SG75147A1 (en) 2000-09-19
KR19990066873A (ko) 1999-08-16
AU9818898A (en) 1999-07-29
ATE293284T1 (de) 2005-04-15
EP0938132A3 (en) 1999-12-22
EP0938132B1 (en) 2005-04-13
JPH11204494A (ja) 1999-07-30

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